JP2007163847A - Flat display apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal display apparatus with high reliability, while improving productivity. <P>SOLUTION: A flexible printed circuit (FPC) 22 is provided on a glass substrate so that substrate side wiring sections 22a to 22d may be electrically connected to panel inner wiring sections 18a to 18d in a crossing way, which are drawn from a signal line driving IC 15 for driving a plurality of pixels provided on a glass substrate 11 on the glass substrate 11. As positioning of the substrate side wiring sections 22a to 22d with reference to the signal line driving IC 15 becomes easy, and an array substrate 3 side and a circuit substrate 29 side are electrically connected with only one tip section of the substrate side wiring sections 22a to 22d, connection man power is reduced and the productivity is improved. By reducing distance of the panel inner wiring sections 18a to 18d on the glass substrate 11 whose wiring resistance is comparatively large, and by preventing malfunction associated with voltage drop due to increase of the wiring resistance, reliability is improved. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a flat display device including a driving unit that drives a plurality of pixels provided on an insulating substrate.

Conventionally, in such a liquid crystal display device as a flat display device or an organic EL display device, an effective display portion having a plurality of pixels in a matrix is formed on a glass substrate as an insulating substrate, and one side of the effective display portion A so-called COG (Chip On Glass) mounting in which a plurality of driving ICs as driving units for driving a plurality of pixels are arranged in parallel is employed. From each driving IC, a plurality of terminals such as a power supply line and a signal line are led out to the side of the glass substrate on the glass substrate, and each terminal of the driving IC is connected to each driving IC. In the corresponding part, a so-called ACF (Anisotropic Conductive Film) connection is made between the side of the insulating substrate and the substrate provided with an external circuit via TCP (Tape Carrier Package) or FPC (Flexible Printed Circuit). (For example, refer to Patent Document 1).
JP 2000-172193 A

  In recent years, demands for higher definition and higher reliability are increasing in liquid crystal display devices. And, as the definition and reliability increase as described above, the number of drive ICs to be mounted tends to increase.

  For this reason, in the above-described flat display device, each driving IC is connected to the substrate via ACF or TCP or ACF, so that the number of times the TCP or FPC is crimped increases, and the driving IC is derived from the driving IC. Since the wiring part of each TCP or FPC is connected along the wiring part, it is not easy to align the wiring part of the driving IC and the wiring part of each TCP or FPC. There is a problem that man-hours are required and improvement of manufacturability is not easy.

  Furthermore, it is also conceivable to wire each wiring portion of the plurality of driving ICs only on the glass substrate. However, in this case, the wiring resistance increases, and a voltage drop may occur, resulting in a malfunction of the circuit. is there.

  The present invention has been made in view of these points, and an object of the present invention is to provide a flat display device that ensures reliability while improving manufacturability.

  The present invention includes an insulating substrate, a plurality of pixels provided on the insulating substrate, and a plurality of first wiring portions led out on the insulating substrate, and is disposed on the insulating substrate and the pixels And a plurality of second wiring portions corresponding to the plurality of first wiring portions, and these second wiring portions are electrically crossed with respect to the plurality of first wiring portions. A portion of the plurality of first wiring portions excluding a connection portion between the plurality of first wiring portions and the plurality of second wiring portions so as to be connected to each other. And an insulating film.

  Then, with respect to a plurality of first wiring portions led out on the insulating substrate from a driving unit that drives a plurality of pixels provided on the insulating substrate, a plurality of first wiring portions corresponding to the plurality of first wiring portions are provided. At least a portion of the substrate is disposed on the insulating substrate so that the two wiring portions are electrically connected in a crossing manner.

  According to the present invention, the positioning of the second wiring portion of the substrate with respect to the plurality of first wiring portions of the driving portion can be facilitated, and the number of man-hours for connecting the second wiring portion and other portions can be suppressed, and manufacturing In addition, the distance between the first wiring portions on the insulating substrate having a relatively large wiring resistance can be suppressed, and a malfunction due to a voltage drop due to an increase in the wiring resistance can be prevented, thereby improving the reliability.

  The configuration of the flat display device according to the first embodiment of the present invention will be described below with reference to FIGS.

  1 and 2, reference numeral 1 denotes a liquid crystal display device as a flat display device. The liquid crystal display device 1 includes a liquid crystal display panel 2 which is a liquid crystal display element as an active matrix type panel. This liquid crystal display panel 2 includes an array substrate 3 as a first substrate, a counter substrate 4 as a second substrate, and a liquid crystal layer 5 sandwiched and held between the array substrate 3 and the counter substrate 4. Have. At the center of the liquid crystal display panel 2, a rectangular effective display portion 6 is provided as an image display area capable of displaying an image. In the effective display unit 6, a plurality of pixels (not shown) are arranged in a matrix along the vertical direction and the horizontal direction of the liquid crystal display panel 2. Further, the liquid crystal display panel 2 holds the liquid crystal layer 5 composed of a liquid crystal composition as a light modulation layer between the array substrate 3 and the counter substrate 4 through an alignment film (not shown). The substrate 3 and the counter substrate 4 are bonded together with a sealant 8. In addition, polarizing plates (not shown) are arranged on the outer surfaces of the array substrate 3 and the counter substrate 4 so that their polarization axes are orthogonal to each other.

  On the other hand, the array substrate 3 includes a glass substrate 11 as a light-transmitting insulating substrate. On the inner surface which is one main surface of the glass substrate 11, signal lines and scanning lines (not shown) are substantially omitted. It arrange | positions so that it may orthogonally cross. Further, the pixels of the effective display unit 6 are located in each of the regions partitioned and surrounded by the scanning lines and the signal lines. Each of these pixels is provided with a thin film transistor (TFT) as a switching element and a pixel electrode. These pixel electrodes are electrically connected to and controlled by the thin film transistors in the same pixel.

  Further, the glass substrate 11 has one side edge and both end edges projecting from the effective display portion 6 of the liquid crystal display panel 2, and the projected one side edge and one end edge are each a frame as an elongated rectangular COG portion. IC mounting parts 13 and 14 which are parts. The IC mounting portions 13 and 14 are formed with a drawing line group (not shown) drawn from one side edge of the effective display portion 6 of the liquid crystal display panel 2.

  Further, on the surface of the IC mounting unit 13, a plurality of, for example, six signal line driving ICs 15 serving as integrated circuits for driving the pixels of the effective display unit 6 of the liquid crystal display panel 2 to display an image are effective. The display unit 6 is sequentially mounted along one side edge, that is, one side of the glass substrate 11, and the pixels of the effective display unit 6 of the liquid crystal display panel 2 are driven on the surface of the IC mounting unit 14 to display an image. A plurality of, for example, three scanning line driving ICs 16 which are integrated circuits to be displayed are sequentially mounted on one end edge of the effective display unit 6, that is, along the other side of the glass substrate 11. These drive ICs 15 and 16 are directly mounted on the surface of the IC mounting portion 13 of the glass substrate 11 to be COG (Chip On Glass) mounted.

  Further, each signal line driving IC 15 is arranged in a longitudinal direction along the longitudinal direction of the glass substrate 11, and a plurality of bumps which are output terminals as short-circuit terminals (not shown) and a plurality of, for example, four short-circuit terminals, Bumps 15a, 15b, 15c, and 15d that are input terminals are provided.

  These bumps 15a to 15d are spaced apart from each other in the longitudinal direction of each signal line driving IC 15, and each of the bumps 15a, 15b, 15c, and 15d has an in-panel wiring portion 18a as a first wiring portion that is a short-circuited wiring. , 18b, 18c, 18d are electrically connected.

  The in-panel wiring portions 18a to 18d are directly formed on the surface of the IC mounting portion 13 of the glass substrate 11, respectively, and are led out substantially parallel to one end side of the glass substrate 11. Further, the in-panel wiring portions 18a to 18d are formed so that the amount of protrusion toward the one end side of the glass substrate 11 is sequentially increased from the in-panel wiring portion 18a to the in-panel wiring portion 18d. For this reason, the front ends of the in-panel wiring portions 18a of the signal line driving ICs 15 are arranged in a substantially straight line in the longitudinal direction of the glass substrate 11. Similarly, the in-panel wiring portions 18b, 18c, 18d The tip is disposed substantially in a straight line in the longitudinal direction of the glass substrate 11. In the present embodiment, for example, the in-panel wiring portions 18a and 18b are power supply lines, and the in-panel wiring portions 18c and 18d are signal lines.

  Similarly, each scanning line driving IC 16 is arranged in a longitudinal direction along the short direction of the glass substrate 11, and includes a plurality of bumps as output terminals (not shown) and a plurality of, for example, two short-circuit terminals. Bumps 16a and 16b serving as input terminals are provided. The bumps 16a and 16b are spaced apart from each other in the longitudinal direction of each scanning line driving IC 16, and the in-panel wiring portions 19a and 19b serving as short-circuit wirings are electrically connected to each other. It is connected.

  The in-panel wiring portions 19a and 19b are directly formed on the surface of the IC mounting portion 14 of the glass substrate 11, respectively, and are led out to the other end side of the glass substrate 11 substantially parallel to each other. Further, the in-panel wiring portions 19a and 19b are formed so that the amount of protrusion of the glass substrate 11 toward the one end side increases sequentially from the in-panel wiring portion 19a to the in-panel wiring portion 19b. For this reason, the tip of the in-panel wiring portion 19a of each scanning line driving IC 16 is arranged in a substantially straight line in the short direction of the glass substrate 11. Similarly, the tip of each in-panel wiring portion 19b is also made of glass. The substrates 11 are arranged in a substantially straight line in the short direction of the substrate 11. In the present embodiment, for example, the in-panel wiring portion 19a is a power line, and the in-panel wiring portion 19b is a signal line.

  Each signal line driving IC 15 including the in-panel wiring portions 18a to 18d is covered with an insulating film 21, respectively. The upper part of the insulating film 21 is short-circuited between the in-panel wiring portions 18a of each signal line driving IC 15, between the in-panel wiring portions 18b, between the in-panel wiring portions 18c, and between the in-panel wiring portions 18d. That is, an FPC (Flexible Printed Circuit) 22 as a board for bus wiring is attached.

  A plurality of each insulating film 21 is provided corresponding to each signal line driving IC 15, and each insulating film 21 is provided so as to continue from one side edge of the effective display section 6 to one side edge of the glass substrate 11.

  The FPC 22 is formed in an elongated rectangular shape that extends over all the signal line driving ICs 15, and a plurality of FPCs 22 corresponding to the in-panel wiring portions 18 a, 18 b, 18 c, and 18 d, that is, 4 in this embodiment are formed on the lower surface. Substrate-side wiring portions 22a, 22b, 22c, and 22d as second wiring portions, which are two short-circuited wirings, are linearly formed parallel to each other along the longitudinal direction.

  These board-side wiring portions 22a, 22b, 22c, and 22d are separated from each other in accordance with the protruding amounts of the in-panel wiring portions 18a, 18b, 18c, and 18d, and these in-panel wiring portions 18a, 18b, 18c, and 18d Are electrically connected by so-called ACF connection that is thermocompression-bonded through, for example, an ACF (Anisotropic Conductive Film) via contact portions 23a, 23b, 23c, and 23d as connection portions. That is, the board side wiring portions 22a to 22d are electrically connected to the in-panel wiring portions 18a to 18d so as to intersect with each other, in the present embodiment, substantially orthogonal to each other.

  Here, contact holes (not shown) are formed at the positions of the insulating film 21 corresponding to the positions of the contact portions 23a to 23d, respectively, at the time of ACF connection. Therefore, the insulating film 21 covers portions other than the contact portions 23a to 23d of each signal line driving IC 15 including the in-panel wiring portions 18a to 18d.

  Further, the substrate-side wiring portions 22a, 22b, 22c, and 22d serve as wiring on an insulating substrate provided in an L shape on the surface of the glass substrate 11 at one end portion on the IC mounting portion 14 side in the longitudinal direction of the FPC 22. The panel side wiring portions 24a, 24b, 24c, and 24d, which are short-circuited wirings, are electrically connected by, for example, ACF connection through contact holes (not shown).

  On the other hand, each of the in-panel wiring portions 19a and 19b is a panel-side wiring portion 25a that is a short-circuit wiring as an insulating substrate wiring provided along the short direction of the glass substrate 11 on the IC mounting portion 14 of the glass substrate 11. , 25b are electrically connected, for example, by ACF connection via contact portions 26a, 26b which are short-circuit terminals. The panel-side wiring portions 25a and 25b and the in-panel wiring portions 19a and 19b are insulated from each other on the glass substrate 11, and the respective wirings are located at positions other than the contact portions 26a and 26b. Insulated.

  The panel side wiring portions 24a to 24d and the panel side wiring portions 25a and 25b are electrically connected to the connection substrate 28 by, for example, ACF connection at one side edge on one end side of the glass substrate 11.

  The connection board 28 is, for example, an FPC, and is a connection wiring portion 28a that is a short-circuit wiring in which one end is electrically connected to the panel side wiring portions 24a, 24b, 24c, 24d and the panel side wiring portions 25a, 25b. , 28b, 28c, 28d, 28e, 28f. The other end portions of the connection wiring portions 28a to 28f supply power and signals to the drive ICs 15 and 16 to drive the drive ICs 15 and 16, for example, an ACF connection, Alternatively, they are electrically connected by connector connection.

  Next, a method of connecting the drive ICs 15 and 16 and the circuit board 29 side according to the first embodiment will be described.

  First, the insulating film 21 is formed on each signal line driving IC 15 including the in-panel wiring portions 18a to 18d.

  Next, the FPC 22 is overlaid on the IC mounting portion 13 of the array substrate 3 so that the longitudinal directions thereof coincide with each other via the ACF, and this FPC 22 is thermocompression-bonded to the glass substrate 11 with the contact portions 23a to 23d by a laser. Thus, the in-panel wiring portions 18a to 18d and the substrate side wiring portions 22a to 22d are electrically connected through the contact holes of the insulating film 21, respectively. At the same time, one end portions of the substrate side wiring portions 22a to 22d are ACF-connected to the panel side wiring portions 24a to 24d on the glass substrate 11, respectively.

  Further, the panel side wiring portions 24a to 24d and the panel side wiring portions 25a and 25b are ACF-connected to the respective one end portions of the connection wiring portions 28a to 28f of the connection substrate 28.

  Then, the other end portions of the connection wiring portions 28a to 28f are ACF-connected or connector-connected to the circuit board 29 side, whereby the drive ICs 15 and 16 are electrically connected to the circuit board 29 side.

  As described above, in the first embodiment, the in-panel wiring portions 18a to 18d led out on the glass substrate 11 from the signal line driving IC 15 that drives the plurality of pixels provided on the glass substrate 11 are used. Thus, the FPC 22 is disposed on the IC mounting portion 13 of the glass substrate 11 so that the board side wiring portions 22a to 22d corresponding to the in-panel wiring portions 18a to 18d are electrically connected in a crossing manner. .

  For this reason, compared with the conventional case where each substrate side wiring portion is connected along each wiring portion of each signal line drive IC, the substrate side wiring portions 22a to 22a are connected to the in-panel wiring portions 18a to 18d. Since electrical connection is ensured without managing the position of 22d more strictly than necessary, the positioning of the board side wiring portions 22a to 22d with respect to the in-panel wiring portions 18a to 18d is facilitated, and the array substrate 3 side is also provided. And the circuit board 29 side can be electrically connected to one end of the board-side wiring portions 22a to 22d of the FPC 22 at only one place via the connection board 28. As compared with the conventional case of electrically connecting the two, the man-hours for connection can be suppressed, and the productivity can be improved.

  In addition, since the distance between the wiring portions 18a to 18d in the panel on the glass substrate 11 having a relatively large wiring resistance can be suppressed to the minimum, it is possible to prevent malfunction of each signal line driving IC 15 due to a voltage drop due to an increase in wiring resistance. , Can improve the reliability.

  Further, since each signal line driving IC 15 has the in-panel wiring portions 18a to 18d shifted from each other in the longitudinal direction of the signal line driving IC 15, for example, the signal line driving IC 15 is laminated without shifting in the longitudinal direction of the signal line driving IC 15 Since the distance between the contact parts 23a to 23d can be taken in the longitudinal direction of the IC mounting part 13 even if the width of the IC mounting part 13 is made narrower than when connecting to the parts 22a to 22d, The liquid crystal display device 1 can be downsized by suppressing the width of the IC mounting portion 13.

  And by electrically connecting each board side wiring part 22a-22d of FPC22 simultaneously with each wiring part 18a-18d in each panel of signal line drive IC15 arranged in parallel along one side of glass substrate 11, Bus wiring can be easily performed.

  Moreover, since the board-side wiring portions 22a to 22d of the FPC 22 are formed in a straight line only on the lower surface of the FPC 22, compared to the case where the wiring portions are provided on both surfaces or the wiring portions are provided on the FPC in a curved shape. Thus, the FPC 22 itself can be manufactured at low cost, and the bus wiring can be realized at low cost.

  Further, by providing an insulating film 21 covering the signal line driving IC 15 including the in-panel wiring portions 18a to 18d on the glass substrate 11 side, the in-panel wiring portions 18a, 18b, 18c, 18d Only 22a, 22b, 22c, 22d can be electrically connected, and other undesirable electrical contact can be reliably prevented.

  Furthermore, since the circuit board 29 can be electrically connected to the array substrate 3 side at one location via the connection board 28, the longitudinal dimension can be suppressed, and the circuit board 29 can be further downsized.

  In the first embodiment, instead of the panel-side wiring portions 24a to 24d, the board-side wiring portions 22a to 22d of the FPC 22 are extended in an L shape from one end of the FPC 22, and the connection wiring of the connection substrate 28 is used. It is also possible to electrically connect the parts 28a to 28d.

  Next, a second embodiment will be described with reference to FIG. In addition, about the structure and effect | action similar to the said 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In this second embodiment, instead of the connection substrate 28 of the first embodiment, the protruding portion 31 protrudes from one end of the FPC 22 to one side edge of the glass substrate 11 in an L-shape. The FPC 22 is electrically connected to the circuit board 29 by the protruding portion 31 protruding to the outside of the substrate 11.

  That is, the FPC 22 is formed such that one end portions of the substrate side wiring portions 22a to 22d are bent along the protruding portion 31 in an L shape. In addition, the protruding portion 31 is provided with connection wiring portions 32a and 32b that are electrically connected to the panel side wiring portions 25a and 25b, respectively, for example by ACF connection, in parallel with the substrate side wiring portions 22a to 22d. Yes.

  Further, the board side wiring portions 22a to 22d and the connection wiring portions 32a and 32b are electrically connected to the circuit board 29 side by, for example, ACF connection or connector connection.

  And by comprising in this way, the board | substrate side wiring parts 22a-22d are electrically connected by cross shape with respect to the wiring parts 18a-18d in a panel, and the same effect as the said 1st Embodiment. In addition, the board-side wiring portions 22a to 22d are electrically connected to the circuit board 29 at the protrusions 31, so that the connection board 28 is not necessary, and the board-side wiring portions 22a to 22d are not necessary. Since the connection between 22d and the panel side wiring portions 24a to 24d and the connection between the connection substrate 28 and the panel side wiring portions 24a to 24d are not required, the productivity can be further improved.

  In addition, the panel-side wiring portions 24a to 24d formed on the glass substrate 11 and having a relatively large wiring resistance can be omitted. Instead, the substrate-side wiring portions 22a to 22d that are wired on the protruding portion 31 of the FPC 22 and have a relatively small wiring resistance. Thus, the circuit board 29 is electrically connected, so that the malfunction of the signal line driving IC 15 due to the voltage drop due to the wiring resistance can be prevented more reliably and the reliability can be further improved.

  In the above embodiments, the positions of the signal lines and the power supply lines are not limited to the above positions, and are set as appropriate according to the layout of the drive ICs 15 and 16.

  Further, the number of wirings such as signal lines and power supply lines connected from the driving ICs 15 and 16 to the circuit board 29 is not limited to the above as long as it is plural.

  Furthermore, instead of the insulating film 21, the signal line driving IC 15 including the in-panel wiring portions 18a to 18d may be insulated by a resist provided on the lower surface of the FPC 22. In this case, it is not necessary to cover the signal line driving IC 15 including the in-panel wiring portions 18a to 18d with an insulating film, and it is only necessary to attach the FPC 22, so that the productivity can be further improved. In addition, the insulating film 21 has a structure separated for each connection portion of the signal line driving IC 15, but the same effect can be obtained even if the portions other than the contact hole portion for ACF connection are uniformly insulated. Needless to say.

  The above configuration can be used not only for the liquid crystal display device 1 but also for an organic EL display device as a flat display device.

It is a top view which shows the flat display apparatus of the 1st Embodiment of this invention. It is a side view which shows a flat display apparatus same as the above. It is a top view which shows the flat display apparatus of the 2nd Embodiment of this invention.

Explanation of symbols

1 Liquid crystal display device
11 Glass substrate
15 Signal line driver IC
18a, 18b, 18c, 18d Wiring part in panel
21 Insulating film
22 FPC
22a, 22b, 22c, 22d Board side wiring part
23a, 23b, 23c, 23d Contact part
29 Circuit board
31 Protrusion

Claims (5)

An insulating substrate;
A plurality of pixels provided on the insulating substrate;
A plurality of first wiring portions led out on the insulating substrate, and a driving unit that is disposed on the insulating substrate and drives the pixels;
A plurality of second wiring portions corresponding to the plurality of first wiring portions are provided, and the second wiring portions are electrically connected to the plurality of first wiring portions in an intersecting manner. A substrate at least part of which is disposed on the insulating substrate;
A flat display device comprising: an insulating film that covers a portion of the plurality of first wiring portions excluding a connection portion with the plurality of second wiring portions. A plurality of the drive units are arranged side by side along one side of the insulating substrate,
The flat display device according to claim 1, wherein each second wiring portion of the substrate is electrically connected to each first wiring portion of the plurality of driving units. The flat display device according to claim 1, wherein the insulating film is provided on the insulating substrate side. The flat display device according to claim 1, wherein the insulating film is a resist provided on the substrate. An external circuit board,
The flat display device according to claim 1, wherein the substrate has a protruding portion that protrudes to the outside of the insulating substrate and is electrically connected to the external circuit substrate.

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