JP2007158252A - Substrate working apparatus, and substrate working method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate working method whose working accuracy and working efficiency of a substrate to be treated is excellent and a substrate working apparatus applying the substrate working method. <P>SOLUTION: The substrate working apparatus includes a holding base 11 on which a substrate to be treated 30 with a plurality of positioning marks 30a is mounted, a working means of working the substrate to be treated, a detecting means 13 of detecting the position of the positioning marks, a movable means 12 of moving the holding base, and a controlling means 10A of controlling the position of the holding base. The detecting means are plurally formed correspondent to the positioning marks, and the controlling means controls the position of the holding base in order so that the working means works a plurality of working points on the substrate to be treated in order, correspondent to the positions of the positioning marks detected by the plurality of detecting means. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for processing a substrate to be processed placed on a holding table, and a substrate processing method.

  In a processing apparatus that processes a substrate to be processed, such as a laser processing apparatus (laser annealing apparatus), it is necessary to ensure the accuracy of the processing position, and the relative position between the processing means (laser irradiation unit) and the substrate to be processed is accurate. Need to control.

  FIG. 10 is a diagram schematically showing a laser processing apparatus which is an example of a conventional substrate processing apparatus. Referring to FIG. 10, a laser processing apparatus 100 shown in the figure includes a holding base 101 on which a substrate to be processed 300 is placed, and a processing means for processing the substrate to be processed 300, such as a laser irradiation unit. 103.

  Laser beam is supplied to the processing means 103 from an oscillation unit 105 that oscillates a laser through a laser supply line 104. The processing means 103 has a structure in which a necessary optical process is performed on the supplied laser beam, and the target substrate 300 is irradiated with the laser beam 103A to perform laser processing (for example, laser annealing). Yes.

  The holding table 101 is provided with a movable means 102, and the holding table 101 is arranged in the X direction which is one of the directions parallel to the substrate to be processed and the X direction which is parallel to the substrate to be processed. It is comprised so that it can operate | move to the Y direction (not shown) orthogonal to.

  In processing the substrate to be processed 300, it is necessary to accurately control the position of the substrate to be processed 300 with respect to the processing means 103. For example, in the case of the substrate processing apparatus 100 described above, a positioning mark 300 a is formed on the substrate to be processed 300. Further, on the holding table 101, a detecting means 106 made of, for example, a CCD camera for detecting the position of the positioning mark 300a is installed.

  The substrate to be processed 300 is transferred by, for example, the transfer robot 200 and placed on the holding table 101. Thereafter, before the substrate to be processed 300 is processed, the movable table 102 first operates the holding table 101 in the X direction or the Y direction, and the detection unit 106 detects the position of the positioning mark 300a. Therefore, the position where the substrate to be processed 300 is placed on the holding table 101 is confirmed, and so-called alignment operation is performed.

  Next, the holding table 101 is operated by the movable means 102, the substrate to be processed 300 is moved to a position necessary for processing, and the processing substrate 106 is processed by the processing means 106. ing.

For example, in the processing apparatus 100 described above, when laser processing is performed on a substrate to be processed, laser annealing is performed by sequentially irradiating a plurality of processing points on the substrate to be processed with laser. In this case, the holding table 101 is moved by the movable means 102, and laser is sequentially irradiated onto the processing points.
Japanese Patent No. 3023320

  However, when the substrate to be processed is processed, the substrate to be processed may be deformed due to the influence of heat, and there may be a problem that the accuracy of the processing position decreases as the processing proceeds.

  For example, when laser processing is performed on a plurality of processing points (devices), the processing points are becoming narrower and higher density due to recent miniaturization and higher density of devices. In such a case, the influence of the deformation of the substrate to be processed may be particularly great due to heat generated by laser processing.

  FIG. 11 schematically shows a deformation state of the substrate to be processed 300a when the substrate to be processed 300a is processed using the processing apparatus 100 described above.

  Referring to FIG. 11, the substrate to be processed 300a before processing is rectangular. For example, after processing a plurality of processing points so as to scan from the lower row to the upper row, as shown in FIG. It will be deformed. In the figure, the state of deformation is highlighted, and the deformation rate may be different from the illustrated case.

  As described above, when the substrate to be processed is deformed, it is difficult to accurately process a desired processing point even though the substrate alignment operation is performed before processing, and the processing accuracy is lowered. May occur.

  In addition, in order to perform the above-described alignment operation, it takes time to operate the holding table, and the substrate processing time becomes long, which may reduce the processing efficiency.

  Therefore, in the present invention, it is a general object to provide a new and useful substrate processing apparatus and substrate processing method that solve the above-described problems.

  A specific problem of the present invention is to provide a substrate processing method in which processing accuracy and processing efficiency of a substrate to be processed are good, and a substrate processing apparatus that performs the substrate processing method.

  In the first aspect of the present invention, the above-described problem is solved by a holding table on which a substrate to be processed on which a plurality of positioning marks are formed, a processing means for processing the substrate to be processed, Detection means for detecting a position, movable means for moving the holding table, and control means for controlling the position of the holding table, and a plurality of the detection means are formed corresponding to the positioning marks, The control means corresponds to the position of the holding table so that the processing means sequentially processes a plurality of processing points on the substrate to be processed, corresponding to the positions of the positioning marks detected by the plurality of detection means. A substrate processing apparatus characterized by sequentially controlling. To solve.

  The substrate processing apparatus has a feature that processing accuracy and processing efficiency of a substrate to be processed are good.

  When the plurality of processing points are sequentially processed, the control unit sequentially controls the position of the holding table corresponding to a change in the position of the positioning mark, and controls the position of the substrate to be processed with respect to the processing unit. Then, the positioning accuracy of the holding base when processing the processing point is improved.

  Further, when the processing means is a laser irradiation means, it becomes possible to perform laser processing on the substrate to be processed efficiently and with high accuracy.

  Further, if the detection means is installed so as to be embedded in the holding table, the detection means can be installed in a space-saving manner.

  The detection means may include a CCD camera or a CMOS camera.

  Further, when the substrate to be processed is made of a light-transmitting material and the positioning mark is formed on a processed surface of the substrate to be processed, the positioning mark is detected by the detecting means from the holding stand side. Easy to do.

  Moreover, if the illumination means for facilitating the recognition of the positioning mark is embedded in the holding table, the positioning mark detection accuracy is good.

  Further, if the filter for limiting the wavelength of light incident on the detection means is installed on the holding table, the detection accuracy of the positioning mark becomes good.

  According to a second aspect of the present invention, there is provided a substrate processing method using a substrate processing apparatus for processing a substrate to be processed having a plurality of processing points and a plurality of positioning marks. A first step of determining a processing position of the first processing point corresponding to the position of the first processing point, and processing of the first processing point, and a change in the positions of the plurality of positioning marks after the first step And a second step of processing the second processing point by determining the processing position of the second processing point corresponding to the above.

  The substrate processing method is characterized by good processing accuracy and processing efficiency of the substrate to be processed.

  Further, when the processing of the substrate to be processed is laser processing, it is possible to efficiently perform laser processing on the substrate to be processed with high accuracy.

  Further, when the positions of the plurality of positioning marks are detected by a plurality of detection means corresponding to the plurality of positioning marks embedded in a holding table that holds the substrate to be processed, the positioning marks are accurately displayed. It becomes possible to detect.

  ADVANTAGE OF THE INVENTION According to this invention, the substrate processing method which the processing precision of a to-be-processed substrate is favorable, the alignment time of a to-be-processed substrate is short, the accuracy and efficiency of substrate processing are good, and the substrate processing which implements the said substrate processing method An apparatus can be provided.

  Next, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram schematically illustrating a laser processing apparatus which is a substrate processing apparatus according to the first embodiment. Referring to FIG. 1, a laser processing apparatus 10 shown in this figure includes a holder 11 on which a substrate 30 to be processed is placed, and a processing means for processing the substrate 30 to be processed, such as a laser irradiation unit. 13.

  Laser beam is supplied to the processing means 13 from the oscillation unit 15 that oscillates the laser through the laser supply line 14. The processing means 13 has a structure in which a necessary optical process is performed on the supplied laser light, and the target substrate 30 is irradiated with the laser light 13A to perform laser processing (for example, laser annealing). Yes.

  For example, as an example of laser processing, it is possible to perform processing for crystallizing amorphous silicon (α-Si) formed on a substrate into polycrystalline silicon (Poly-Si). Such processing is used, for example, for processing a channel region of a TFT (thin film transistor) used in a switching circuit of a display device.

  The holding table 11 is provided with movable means 12, and the holding table 11 is arranged in the X direction which is one of the directions parallel to the substrate to be processed and the X direction which is parallel to the substrate to be processed. It is comprised so that it can operate | move to the Y direction (not shown) orthogonal to.

  In processing the substrate to be processed 30, it is necessary to accurately control the position of the substrate to be processed 30 with respect to the processing means 13. For example, when a substrate to be processed is supplied to the substrate processing apparatus, the substrate to be processed 30 is transferred by the transfer robot 20 having a transfer arm and placed on the holding table 11.

  For example, when the display device is formed, the size of the substrate to be processed is a rectangular or square glass substrate with a side of several meters, and the accuracy of conveyance by the conveyance robot (variation in the conveyance position) is about several millimeters. is there. The accuracy of the above-mentioned conveyance is insufficient for fine processing such as TFT. Therefore, the conventional substrate processing apparatus requires a so-called alignment operation of the substrate to be processed, which causes a problem of reducing the processing efficiency.

  In addition, when processing a plurality of processing points, as the processing progresses, the substrate to be processed may be deformed due to heat, and the accuracy of the processing position of the processing points may be reduced. .

  Therefore, in the processing apparatus according to the present embodiment, in order to solve these problems, the detection means 16 that detects the position of the substrate to be processed 30 placed on the holding table 11 by the transfer robot 20 includes A plurality are provided on the holding table 11 side. In this case, a plurality of detection means 16 are formed in correspondence with a plurality of positioning marks 30a formed on the substrate to be processed 30, as will be described below.

  The holding table 11 has a plurality of openings 11 </ b> A corresponding to the plurality of positioning marks 30 a formed on the substrate to be processed 30. Detection means 16 capable of detecting an image, such as a CCD camera or a CMOS camera, is provided so as to be embedded in the plurality of openings 11A. The detection means 16 detects a positioning mark 30a formed on the substrate to be processed 30, and a position where the substrate to be processed 30 is placed on the holding table 11 (the holding table 11 and the substrate to be processed). 30 relative positional relationships) are detected with high accuracy.

  The substrate to be processed 30 has a processing surface (front surface) 30A on which laser processing is performed and a transport surface (back surface) 30B opposite to the processing surface 30A and facing the holding table 11, The positioning mark 30a is formed on the processed surface 30A. When the positioning mark 30a is formed, it is generally formed on the processed surface 30A and is easy to form.

  For example, in the case of laser processing of a display device, the substrate to be processed 30 is usually made of a light transmissive material such as a glass substrate. Therefore, the detection means 16 installed so as to be embedded in the holding table 11 can detect (recognize) the positioning mark 30a from the transport surface 30B side.

  The movable means 12 according to the present embodiment corresponds to the position of the substrate to be processed 30 with respect to the holding table 11 (relative positional relationship between the holding table 11 and the substrate to be processed 30). It is possible to control the position of the substrate 30 to be processed with respect to the processing means 13.

  The movable unit 12 includes a driving unit such as a stepping motor, and is configured to be able to accurately control the positional relationship between the processing unit 13 and the holding table 11 in advance. The movable means 12 may be called an XY table, for example.

  The movable means 12 is controlled by the control means 10A. The control means 10A is connected to the movable means 12 and the detection means 16 via an interface. The control means 10A includes a position detection means 10a, a storage unit 10b, and a position control means 10c.

  The position detection unit 10 a calculates the position of the substrate to be processed 30 with respect to the holding table 11 based on the image information transmitted from the detection unit 16. The storage unit 10b stores a positional relationship between the processing unit 13 and the holding table 11 when the holding table 11 is operated by a driving unit such as a stepping motor. The position control means 10c includes information on the position of the substrate to be processed 30 with respect to the holding base 11 calculated by the position detecting means 10a, and the processing means 13 and the holding base 11 stored in the storage unit. Based on the positional relationship information, the amount of movement of the holding table 12 is calculated and the movable means 12 is controlled.

  For this reason, in the substrate processing apparatus 10 described above, the step of operating the holding table for alignment, which is required in the conventional substrate processing apparatus, is shortened, and substantially no alignment time is required.

  For example, when the substrate 30 is placed on the holding table 11 by the transfer robot 20, the holding table 11 is moved to the transfer robot 20 side. After the substrate to be processed 30 is placed on the holding table 11, the movable table 12 moves the holding table 11, and the relative positional relationship between the processing unit 13 and the substrate to be processed 30 is changed. It is controlled so as to achieve the required positional relationship. In this case, as described above, the relative positional relationship between the processing means 13 and the substrate to be processed 30 is the same as the relative positional relationship between the holding base 11 and the substrate to be processed 30 (conveyance deviation or the like). It has become compatible.

  That is, the series of operations of the movable means 12 does not require a step of moving the holding table 11 for alignment. For this reason, the substrate processing apparatus according to the present embodiment has a feature that the alignment time of the substrate to be processed is short (substantially substantially 0) and the processing efficiency of the substrate processing is good.

  Further, since there are a plurality of processing points to be processed on the substrate to be processed 30, the position control means 10 c sequentially controls the position of the holding table 11, and the processing means 13 and the substrate to be processed 30. The positional relationship is controlled appropriately. Accordingly, the processing means 13 sequentially processes a plurality of processing points corresponding to the controlled positions. In this case, conventionally, the substrate to be processed is deformed due to heat from a laser or the like, and the accuracy of controlling the processing position of the processing point (control of the relative positional relationship between the processing means 13 and the substrate to be processed 30) decreases. There was a problem.

  In the conventional substrate processing apparatus as shown in FIG. 10, the processing substrate is deformed by heat as the processing proceeds after alignment is performed before processing the substrate, thereby maintaining the positioning accuracy of the processing position. This is because it becomes difficult. For example, there may be a method of restarting the alignment operation every time processing of several processing points is completed, but there is a problem that it takes more time to move the holding table and takes time to process the substrate.

  On the other hand, in the substrate processing apparatus 10 of the present embodiment, a plurality of detection means 16 are installed corresponding to the plurality of positioning marks 30a, and without performing a special alignment operation, that is, without moving the holding table for alignment. The change in the relative positional relationship between the holding table 11 and the substrate to be processed 30 and the degree of deformation of the substrate to be processed 30 can be grasped at any time.

  For this reason, in the process of processing a plurality of processing points, a change in the relative positional relationship between the holding table 11 and the substrate to be processed 30 and the degree of deformation of the substrate to be processed 30 in a so-called real time. The position of the substrate 30 relative to the processing means 13 can be controlled by controlling the position of the holding table 11 in response to the above information. Yes.

  In this case, the position detecting unit 10a calculates the position of the substrate to be processed 30 with respect to the holding table 11 based on image information transmitted from the detecting unit 16 every time processing of one processing point is completed, for example. To do. The position control means 10c includes information on the position of the substrate to be processed 30 with respect to the holding base 11 calculated by the position detecting means 10a, and the processing means 13 and the holding base 11 stored in the storage unit. The amount of movement of the holding table 12 necessary for processing the next processing point is calculated from the positional relationship information, and the movable means 12 is controlled.

  For this reason, the control means 10 </ b> A responds to a shift in the relative positional relationship of the substrate to be processed 30 with respect to the holding table 11 and deformation of the substrate to be processed 30, which is considered to occur as processing progresses. By controlling the position of the holding table 11, the positional relationship between the processing means 13 and the holding table 11 can be controlled to a positional relationship necessary for processing the next processing point.

  That is, the substrate processing apparatus 10 according to the present embodiment has a feature that the processing point positioning accuracy is good in addition to the short alignment time of the substrate to be processed and the good substrate processing efficiency. . In particular, in a substrate processing apparatus that generates heat during processing, such as laser processing, the above configuration is effective for maintaining the positioning accuracy of the substrate.

  Next, an outline of processing points processed by the substrate processing apparatus will be described with reference to FIGS.

  FIG. 2 is an example of the arrangement when the processing points P1-P4 are arranged on the substrate to be processed. As shown in FIG. 2, the processing points are arranged in a straight line, and on the substrate to be processed, a plurality of straight lines on which processing points are arranged are arranged in parallel. That is, the processing points are arranged on the substrate to be processed, for example, in a substantially lattice shape. The substrate processing apparatus sequentially processes the above processing points.

  FIG. 3 is a diagram schematically showing an example of the processing order when processing a plurality of processing points on the substrate 30 to be processed. In the drawing, the positioning marks are not shown.

  Referring to FIG. 3, for example, when machining a plurality of machining points arranged in the first to fourth lines, machining is started from the machining point on the right end of the first line, and the machining is sequentially performed. When the processing of the first line is completed at the left end of the second line, the processing proceeds from the left end of the second line to the right end. In the same manner, the process proceeds with the third and fourth lines.

  Next, an example of the arrangement of the positioning marks on the substrate to be processed 30 is shown in FIG. However, in the figure, the same reference numerals are given to the parts described above, and the description will be omitted.

  Referring to FIG. 4, a plurality of positioning marks 30 a described above are formed on the processed surface 30 </ b> A of the substrate to be processed 30. For example, a plurality of the positioning marks 30a are formed in a lattice pattern on the processed surface 30A of the substrate 30 to be processed.

  Further, the number of the positioning marks 30a to be formed and the installation position are not limited to those shown in FIG. 4, and may be changed variously. Further, the shape of the positioning mark shown in the figure is an example, and various other shapes can be used.

  FIG. 5 is a plan view of the holding table 11 and shows a state in which the detection means 16 is installed corresponding to the positioning mark 30a shown in FIG. However, in the figure, the same reference numerals are given to the parts described above, and the description will be omitted.

  If the number of the positioning marks 30a is increased, the positioning accuracy of the substrate is improved. However, since it is necessary to increase the number of the corresponding detection means 16 to be installed, an appropriate number can be provided according to the required positioning accuracy. That's fine.

  Next, FIG. 6 shows an enlarged view of a part of the holding table 11 in which the detection means 16 is embedded. However, in the figure, the same reference numerals are given to the parts described above, and the description will be omitted.

  Referring to FIG. 6, as described above, the detection means 16 made of, for example, a CCD camera or a CMOS camera is embedded in the substantially cylindrical opening 11A formed in the holding table 11, for example. It can be seen that it is installed.

  Further, since the detection means 16 is installed so as to be embedded in the holding table 11, the distance between the positioning mark and the detection means is close, and the alignment accuracy is improved.

  FIG. 7 shows a modification of the substrate processing apparatus. However, in the figure, the same reference numerals are given to the parts described above, and the description will be omitted. Further, parts not specifically described are the same as those described above with reference to FIG.

  Referring to FIG. 7, the substrate processing apparatus shown in the figure includes a lens for facilitating recognition of the positioning mark 30 a between the detection means 16 and the substrate to be processed 30. For this reason, it becomes possible to adjust the focus when the detection means 16 detects the positioning mark 30a, and the positioning accuracy is improved.

  An opening 11B is formed so as to be adjacent to the opening 11A, and an illumination means 19 made of a light emitting element (for example, LED) is embedded in the opening 11B. For this reason, the positioning mark 30a can be easily recognized and the positioning accuracy is improved.

  Furthermore, a filter 18 for limiting the wavelength of light incident on the detection means 16 may be provided on the holding table 11. In this case, the detection accuracy of the detection means can be further improved by using a filter corresponding to the wavelength of the detection sensitivity of the detection means 16.

  In this case, the filter may be configured to limit the wavelength of light emitted from the illumination unit 19.

  As described above, various optical changes may be applied to the light incident on the detection means 16 so that the detection accuracy (alignment accuracy) becomes better.

  Next, an example of processing point correction when processing is performed using the substrate processing apparatus 10 will be described with reference to FIGS.

  FIG. 8 is a diagram schematically showing a change in the position of the positioning mark 30a when the substrate processing apparatus 10 is used for processing.

  Referring to FIG. 8, the position of the positioning mark 30a is shifted by, for example, dx in the x direction and dy in the y direction from the initial position before the machining is started. Conventionally, it has been difficult to quickly cope with such a position shift. However, in the substrate processing apparatus according to the present embodiment, such a shift is sequentially detected by the detection unit, and the holding by the position control unit 10c is performed. This is reflected in the control of the position of the table 11. For this reason, the positioning accuracy of the processing point is accurately maintained even when the processing progresses and the temperature of the substrate to be processed increases.

  FIG. 9 is a diagram schematically showing a change in position of the positioning marks 30a formed at the positions 1 to 3 before and after processing. Referring to FIG. 9, in the state before processing, the positioning marks 30a formed at the positions 1 to 3 are substantially linear. However, as the processing progresses, the glands connecting position 1 to position 3 draw a downward convex curve away from the straight line, as shown in the figure.

  For example, in the above case, the position of the processing point may be determined (corrected) as follows. For example, first, the gap between the positioning marks 30a at the positions 1 to 3 is complemented by using, for example, the least square method to obtain a curve function. Next, the position of the processing table may be calculated corresponding to the curve, and the position of the holding table may be controlled so that the positional relationship between the processing means and the substrate to be processed is appropriate.

  The above correction method is an example, and the position of the machining point can be corrected using various other methods. Further, when obtaining a function of a curve of the position of the positioning point, the function is not limited to the quadratic approximation, and may be approximated using a cubic or quartic function. Further, as a method for easily determining a processing point, the processing point may be determined by connecting two positioning marks closest to the processing point to be processed with a straight line.

  In the above embodiments, the laser processing apparatus (laser annealing apparatus) that mainly processes the substrate when forming the display device has been described as an example, but the present invention is not limited to this.

  For example, the present invention can be applied to various apparatuses that perform processing by moving a holding base with respect to a processing means, such as a laser processing apparatus that processes a via hole when forming a wiring board, and other mechanical processing apparatuses. Clearly it is possible.

  Although the present invention has been described with reference to the preferred embodiments, the present invention is not limited to the specific embodiments described above, and various modifications and changes can be made within the scope described in the claims.

  According to the present invention, it is possible to provide a substrate processing method in which processing accuracy and processing efficiency of a substrate to be processed are good, and a substrate processing apparatus that performs the substrate processing method.

It is a figure which shows the board | substrate processing apparatus by Example 1. FIG. It is FIG. (1) which shows the method of processing a to-be-processed substrate. It is FIG. (2) which shows the processing method of a to-be-processed substrate. It is a figure which shows the example of arrangement | positioning of the positioning mark of a to-be-processed substrate. It is a figure which shows the example of arrangement | positioning of a detection means. FIG. 4 is a partially enlarged view (part 1) of the apparatus of FIG. It is a modification of FIG. It is the figure (the 1) which showed typically the change of the position of the positioning mark. FIG. 6 is a diagram (part 2) schematically showing a change in the position of a positioning mark. It is a figure which shows the conventional board | substrate processing apparatus. It is a schematic diagram which shows a deformation | transformation of a to-be-processed substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 10A Control apparatus 10a Position detection means 10b Memory | storage part 10c Position control means 11 Holding stand 11A Opening part 12 Movable means 13 Processing means 14 Laser supply line 15 Oscillation part 16 Detection means 17 Lens 18 Filter 19 Illumination 20 Transport robot 30 Substrate to be processed 30A Processing surface 30B Transport surface 30a Positioning mark

Claims (11)

A holding table on which a substrate to be processed on which a plurality of positioning marks are formed is placed;
Processing means for processing the substrate to be processed;
Detecting means for detecting a position of the positioning mark;
Movable means for moving the holding table;
Control means for controlling the position of the holding table,
A plurality of the detection means are formed corresponding to the positioning marks,
The control means corresponds to the position of the holding table so that the processing means sequentially processes a plurality of processing points on the substrate to be processed, corresponding to the positions of the positioning marks detected by the plurality of detection means. A substrate processing apparatus characterized by sequentially controlling.   3. The substrate processing apparatus according to claim 2, wherein when the plurality of processing points are sequentially processed, the control unit sequentially controls the position of the holding table in response to a change in the position of the positioning mark. .   The substrate processing apparatus according to claim 1, wherein the processing unit is a laser irradiation unit.   The substrate processing apparatus according to claim 1, wherein the detection unit is installed so as to be embedded in the holding table.   5. The substrate processing apparatus according to claim 4, wherein the detection means includes a CCD camera or a CMOS camera.   6. The substrate processing apparatus according to claim 4, wherein the substrate to be processed is made of a light transmissive material, and the positioning mark is formed on a processing surface of the substrate to be processed.   The substrate processing apparatus according to claim 4, wherein illumination means for facilitating recognition of the positioning mark is embedded in the holding table.   The substrate processing apparatus according to claim 1, wherein a filter that limits a wavelength of light incident on the detection unit is installed on the holding table. A substrate processing method by a substrate processing apparatus for processing a substrate to be processed having a plurality of processing points and a plurality of positioning marks,
A first step of determining a processing position of a first processing point corresponding to the position of the plurality of positioning marks, and processing the first processing point;
After the first step, there is a second step of determining a processing position of the second processing point in response to a change in the position of the plurality of positioning marks and processing the second processing point. A substrate processing method.   The substrate processing method according to claim 9, wherein the processing of the substrate to be processed is laser processing. The position of the plurality of positioning marks is detected by a plurality of detecting means corresponding to the plurality of positioning marks embedded in a holding table that holds the substrate to be processed. The board | substrate processing method of description.

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