JP2007149958A - Manufacturing method of wiring substrate, of electro-optical device and of electronic instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a patterning film, uniform in the thickness or the quality of film while reducing energy consumption. <P>SOLUTION: The manufacturing method of the wiring substrate comprises a process for applying liquid material (18) on a substrate to form coating film, a process for arranging the coating film between a first electrode and a second electrode opposed to the first electrode, a process for generating electric field between the first electrode and the second electrode, and a process for removing dispersion medium or solvent from the coating film to form the film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wiring board, an electro-optical device, and a method for manufacturing an electronic apparatus.

  Conventionally, in order to pattern various films such as an insulating film into a desired shape, a photolithography technique and an etching technique have been used. However, if there is any underlying material under the film to be patterned, it is necessary to carefully select the material of the underlying material in consideration of the effects of etching, and etching may be difficult depending on the underlying conditions. Thus, it may be necessary to reexamine the underlying material and structure. In addition, the above-described pattern formation technique, once formed on the entire surface of the target region, through a process of leaving a necessary part and removing an unnecessary part, even if there are few parts to be removed, A lot of energy was required for pattern formation.

  As another conventional technique related to pattern formation, there is a technique using a droplet discharge technique. In this method, a liquid material is dropped onto a place where a film is to be formed by using a droplet discharge device, and the liquid material is dried and solidified to obtain a film having a desired shape. However, a film formed by this technique is difficult to make the film thickness and film quality uniform at any position in the region, particularly when the film is formed for a large area region. For such a problem, other film forming methods such as spin coating may be more excellent.

JP 2003-309369 A

  Therefore, an object of the present invention is to provide a manufacturing technique capable of obtaining a patterning film having a uniform film thickness and film quality while reducing energy consumption.

  The method for manufacturing a wiring board according to the present invention includes a step of applying a liquid material on a substrate to form a coating film, and the coating film between a first electrode and a second electrode facing the first electrode. And a step of generating an electric field between the first electrode and the second electrode, and a step of forming a film by removing a dispersion medium or a solvent from the coating film. . Alternatively, a first step of making a part of the substrate lyophobic with respect to the liquid material and forming a lyophobic region, a second step of applying the liquid material on the substrate, and an electric field in the lyophobic region Or a third step of forming a film in a region excluding at least a part of the lyophobic region while applying a magnetic field to remove the liquid material from at least a part of the lyophobic region. It may be a thing. Here, the “wiring substrate” includes a wiring formed on the substrate, and may be one in which not only the wiring but also a switching element such as a transistor, an organic EL element, and other structures are formed. .

  According to such a method, at least a part of the liquid material in a portion where an electric field is generated or a portion where an electric field or a magnetic field is applied moves to another portion on the substrate. When moving to another part, a film is formed. As a result, a film can be formed where the liquid material has moved, and can be easily adjusted so that no film is formed at the original location of the moved liquid material.

  Preferably, in the method for manufacturing a wiring board, the third step includes removing a solvent from the liquid material to precipitate a solute, and the film includes the solute. The third step may include removing a dispersion medium from the liquid material and precipitating the dispersoid, and the membrane may include the dispersoid. The third step may include curing the liquid material to form a cured film, and the film may include the cured film. In this case, the liquid material is preferably an ultraviolet curable resin.

  Prior to the first step, the method for manufacturing a wiring board according to the present invention includes a step of forming a first electrode at least partially overlapping the lyophobic region on the substrate, and the third step. However, it is preferable that a second electrode facing the first electrode with the liquid material interposed therebetween is installed to generate an electric field between the first electrode and the second electrode. According to such a method, a local electric field can be more reliably generated in a region where the film is to be excluded, and the film can be patterned.

  Prior to the first step, the method of manufacturing a wiring board according to the present invention includes forming a first electrode and a second electrode sandwiching at least a part of the lyophobic region on the substrate, It is preferable that the third step generates an electric field between the first electrode and the second electrode. According to such a method, a local electric field can be more reliably generated in a region where the film is to be excluded, and the film can be patterned.

  In the method for manufacturing a wiring board according to the present invention, the third step is such that the first electrode at least partially overlaps the lyophobic region, and the first electrode is opposed to the first electrode with the liquid material interposed therebetween. It is preferable to install two electrodes and generate an electric field between the first electrode and the second electrode. According to such a method, a local electric field can be more reliably generated in a region where the film is to be excluded, and the film can be patterned. In addition, this embodiment has an advantage that it is not necessary to provide an electrode for generating an electric field on the substrate.

  An electro-optical device manufacturing method according to the present invention includes any one of the above-described methods for manufacturing a wiring board. Here, the “electro-optical device” means a structure in which an electro-optical element is formed between the above-described wiring board and another substrate, or a structure in which an electro-optical element is simply formed on the above-described wiring board. Means. In the meaning described later, the structure may be synonymous with the wiring board. The “electro-optical element” includes a structure related to display or light emission such as a liquid crystal element, an organic EL element, and an electrophoretic display element. Specifically, a display unit of a mobile phone or a television, a light emitting unit of a line head of a laser printer, or the like can be given.

  The method for manufacturing an electronic device according to the present invention includes any one of the above-described methods for manufacturing a wiring board. Here, the “electronic device” means a finished product or a semi-finished product having a display function such as a liquid crystal television, a personal computer monitor, a mobile phone, or electronic paper, or a finished product having a light emitting function such as a laser printer or a lighting device. Includes semi-finished products.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a plan view showing an example of a wiring board according to the first embodiment. The wiring substrate shown in FIG. 1 includes a substrate 10, a plurality of (three in this example) wiring films 12 formed on the substrate 10, and an insulating film (details will be described later) covering the wiring film 12. , Including. The insulating film is patterned so as to expose the contact portion 12a of each wiring film 12 while covering one surface of the substrate 10.

  FIG. 2 is a process cross-sectional view illustrating the method for manufacturing the wiring board described above. Hereinafter, the manufacturing method according to the present embodiment will be described in detail with reference to FIG. The cross-sectional view shown in FIG. 2 corresponds to the cross section taken along the line II-II shown in FIG. 1 of the wiring board.

  First, the wiring film 12 (see FIG. 1) is formed over the substrate 10 (FIG. 2A). In the present embodiment, as shown in FIG. 1, the wiring film 12 and the contact portion 12a are integrally formed. Furthermore, the contact portions 12a of the respective wiring films 12 are connected to each other via the auxiliary wiring film 12b. The auxiliary electrode 14 is used for applying a voltage to each contact portion 12a in a later step, and is connected to the contact portion 12a via the auxiliary wiring film 12b. The wiring film 12, the contact portion 12a, the auxiliary wiring film 12b, and the auxiliary electrode 14 are formed by, for example, forming a conductive film such as an aluminum film on the substrate 10 by a film forming method such as a sputtering method. It is formed by patterning using a lithography technique and an etching technique.

  Next, the region where the insulating film is to be excluded, more specifically, the upper surface of each contact portion 12a is made lyophobic with respect to the liquid material (FIG. 2B). As shown in the figure, in the present embodiment, a liquid material is applied to the upper surface of each contact portion 12a using a droplet discharge device to form a lyophobic film 16. Thereby, a lyophobic region is formed on the upper surface of each contact portion 12a. Examples of the liquid material that can form the lyophobic film 16 include fluorine-based polymers (such as fluoropolymers), amine-based molecules, and silane-based molecules.

  Next, the liquid material 18 to be an insulating film is applied to the entire surface of the substrate 10 to form a coating film (FIG. 2C). An example of such a liquid material 18 is PEDOT / PSS. Moreover, as a coating method of the liquid material 18, a spin coat method etc. are mentioned.

  Next, an electric field is locally applied to the lyophobic region (lyophobic region), more specifically, the region where the film 16 is formed (FIG. 2D), and at least the lyophobic region The liquid material 18 is excluded from a part (all in the illustrated example). As shown in the drawing, in the present embodiment, the auxiliary electrode 14 is spaced from the substrate 10 on one side of the substrate 10, and is disposed between the common electrode 20 disposed so as to face the liquid material 18. Apply voltage to As a result, an electric field is locally applied between each contact portion 12 a connected to the auxiliary electrode 14 and the common electrode 20, that is, a region where the film 16 is formed. For example, the distance between the contact portions 12a and the common electrode 20 may be about several millimeters, and a voltage of about 30V may be applied between them. At this time, an electrowetting phenomenon occurs, and the liquid material 18 is excluded from a region to which an electric field is applied. As for the electrowetting phenomenon, for example, the publicly known document “Catherin Quilliet et al., Electrowetting: a recent outbreak,“ Current Opinion in Colloid & Interface Science ”, 6 (2001), p.34-39” It is described in detail in documents such as “BJFeensta et al., Video-speed response in a reflective electrowetting display,“ IDW 2003 ”, EP2-3, p1741”. Here, although it is not always necessary to make each contact part 12a lyophobic, the effect can be improved more by making it lyophobic.

  In parallel with the above process (see FIG. 2D), the liquid material 18 is dried to be solidified. As a result, a hole 24 is formed by removing the liquid material 18 in a region to which an electric field is applied, and an insulating film is formed in a region to which no electric field is applied (a region excluding at least a part of the lyophobic region). 22 is formed (FIG. 2E). That is, by utilizing the electrowetting phenomenon, a film 22 patterned so as to expose the contact portion 12a of each wiring film 12 while covering one surface of the substrate 10 is obtained. Here, “solidification” means that when the liquid material is a solution in which a solute is dissolved in a solvent, the solvent is removed by drying or the like, and the solute is precipitated to form a film. In the case of the dispersion liquid in which the dispersoid is dispersed, the dispersion medium is removed by drying or the like, and the dispersoid is precipitated to form a film. In addition, when the liquid material contains an ultraviolet curable resin, it includes forming a film by irradiating the liquid material with ultraviolet rays to cross-link and polymerize molecules contained in the liquid material.

  In the above description, the electrowetting phenomenon is generated by applying a voltage between the contact portion 12a provided on the substrate 10 and the common electrode 20 that is disposed apart from the substrate 10. However, a similar result can be obtained by providing a pair of electrodes on the substrate 10 and applying a voltage between the pair of electrodes.

  FIG. 3 is a plan view for specifically explaining the case where a pair of electrodes (first electrode and second electrode) is provided. As shown in FIG. 3, a pair of electrodes 112 a is provided for each wiring film 12 on the substrate 10. Of each electrode 112 a, those integrated with the wiring film 12 are connected via an auxiliary wiring 112 b and further connected to an auxiliary electrode 114 provided at the end of the substrate 10. Similarly, the electrodes 112 a separated from the wiring film 12 are connected via the auxiliary wiring 112 b and further connected to the auxiliary electrode 114 provided at the end of the substrate 10. Such a pair of electrodes 112a and the like are simultaneously formed in the step of forming the wiring film 12 (see FIG. 2A). Further, the subsequent steps are basically performed in the same manner as in the above-described embodiment. However, the step of applying an electric field locally to the lyophobic region (the region where the film 16 is formed) and excluding the liquid material 18 from the region (see FIG. 2D) is common on the substrate 10. There is no need to provide the electrode 20, and as shown in FIG. 3, the auxiliary electrode 114 is used to apply a voltage between each pair of electrodes 112a. As a result, the liquid material 18 is excluded from the region sandwiched between the pair of electrodes 112a. Note that the pair of electrodes 112a does not necessarily need to sandwich the entire lyophobic region between them, and it is sufficient that at least a part of the lyophobic region is sandwiched therebetween.

  In addition, the electrode for causing the electrowetting phenomenon is not necessarily provided on the substrate 10. Hereinafter, an embodiment in this case will be described.

  FIG. 4 is a plan view specifically explaining the case where no electrode is provided on the substrate. As shown in FIG. 4, each wiring film 12 is formed on the substrate 10. At this time, in the illustrated example, the contact portion 12a is formed in the same manner as in the above embodiment, but this is not used for applying an electric field. That is, in this embodiment, the contact portion can be omitted. In this embodiment, a region where each contact portion 12a is formed corresponds to a region where no film is finally formed.

  FIG. 5 is a process cross-sectional view illustrating a method for manufacturing a wiring board when no electrode is provided on the board. The cross-sectional view shown in FIG. 5 corresponds to the VV line cross-section shown in FIG. 4 of the wiring board. Hereinafter, the manufacturing method according to the present embodiment will be described in detail with reference to FIG.

  First, the wiring film 12 is formed over the substrate 10 (FIG. 5A). Next, the region where the insulating film is to be excluded, more specifically, the upper surface of each contact portion 12a is made lyophobic (FIG. 5B). Next, a liquid material 18 to be an insulating film is applied over the entire substrate 10 (FIG. 5C). Since the content of each process so far is the same as that of embodiment mentioned above, description is abbreviate | omitted for details.

  Next, an electric field is locally applied to the lyophobic region, more specifically, the region where the film 16 is formed (FIG. 5D), and the liquid material 18 is excluded from the region. At this time, as shown in the drawing, in this embodiment, the electrode plate 26 having the individual electrode 26a (first electrode) associated with the region where the film 22 is to be excluded is disposed on one side of the substrate 10. The common electrode 20 (second electrode) is disposed on the other surface side of the substrate 10 so as to face the individual electrode 26a with the liquid material 18 interposed therebetween. Then, by applying a voltage between each individual electrode 26a and the common electrode 22, an electric field is locally applied to a region where the film 22 is to be excluded. The intensity of the electric field to be applied to the region is the same as in the above-described embodiment.

  In parallel with the above process (see FIG. 5D), the liquid material 18 is dried to be solidified. As a result, the hole 24 is formed in the region to which the electric field is applied by eliminating the liquid material 18, and the insulating film 22 is formed in the region to which the electric field is not applied (FIG. 2 (E)). .

  As described above, according to the first embodiment, the liquid material can be excluded from the region where the electric field is applied in the process until the liquid material is solidified. Therefore, it is possible to obtain a patterning film having a uniform film thickness and film quality while reducing energy consumption.

(Second Embodiment)
A semiconductor element such as a thin film transistor can also be formed using the same manufacturing method as in the first embodiment described above. Hereinafter, an embodiment in that case will be described by taking a thin film transistor as an example of a semiconductor element.

  FIG. 6 is a plan view schematically illustrating the structure of the thin film transistor according to the second embodiment. As shown in FIG. 6, the thin film transistor according to this embodiment includes a semiconductor film 50, source / drain electrodes 52 and 54 provided in contact with the semiconductor film 50, and an insulating film on the semiconductor film 50. And a gate electrode 56 provided. An auxiliary electrode 58 is connected to the source / drain electrode 54 through an auxiliary wiring film 60.

  7 to 9 are process cross-sectional views illustrating the method for manufacturing the thin film transistor described above. Hereinafter, the manufacturing method according to the present embodiment will be described in detail with reference to FIGS. Note that the cross-sectional views shown in FIGS. 7 to 9 correspond to the cross section taken along the line VII-VII shown in FIG. 6 of the thin film transistor.

  First, source / drain electrodes 52 and 54 are formed on a substrate 62 (FIG. 7A). Further, the auxiliary electrode 58 and the auxiliary wiring film 60 are also formed integrally with the source / drain electrode 54. The auxiliary electrode 14 is used to apply a voltage to the source / drain electrode 54 in a later step. The source / drain electrodes 52 and 54, the auxiliary wiring 58, and the auxiliary electrode 60 are formed by forming a conductive film such as an aluminum film on the substrate 62 by a film forming method such as a sputtering method, and then forming the conductive film by photolithography. It is formed by patterning using a technique and an etching technique.

  Next, a semiconductor film 50 is formed on the substrate 62 so as to be in contact with the source / drain electrodes 52 and 54 (FIG. 7B). Specifically, the semiconductor film 50 is formed, for example, by dropping an appropriate amount of a liquid material containing a silicon element (cyclopentasilane solution or the like) onto the substrate 62 and solidifying it. Alternatively, the semiconductor film 50 may be formed by forming a one-sided semiconductor film on the substrate 62 by chemical vapor deposition such as LPCVD, and then patterning the semiconductor film.

  Next, a region where an electrode terminal (described later) that is electrically connected to the semiconductor film 50 on the substrate 62 is to be provided is made lyophobic (FIG. 7C). In the present embodiment, an electrode terminal that is electrically connected to the semiconductor film 50 via one source / drain electrode 54 is provided. Therefore, a liquid material is applied to the upper surface of the source / drain electrode 54 using a droplet discharge device to form a lyophobic film 64.

  Next, a liquid material 66 to be an insulating film is applied to the entire surface of the substrate 62 (FIG. 7D). An example of such a liquid material 66 is PEDOT / PSS. Examples of the method for applying the liquid material 66 include a spin coating method.

  Next, an electric field is locally applied to the lyophobic region, more specifically, the region where the film 64 is formed (FIG. 7E), and the liquid material 66 is excluded from the region. As illustrated, in the present embodiment, a voltage is applied between the auxiliary electrode 58 and the common electrode 68 that is disposed on one surface side of the substrate 62 so as to be separated from the substrate 62. As a result, an electric field is locally applied between the source / drain electrode 54 connected to the auxiliary electrode 58 and the common electrode 20, that is, the region where the film 64 is formed. For example, the distance between the source / drain electrode 54 and the common electrode 68 may be about several millimeters, and a voltage of about 30 V may be applied between them. At this time, an electrowetting phenomenon occurs, and the liquid material 66 is excluded from a region to which an electric field is applied.

  In parallel with the above process (see FIG. 7E), the liquid material 66 is dried to be solidified. Thus, the hole 72 is formed in the region to which the electric field is applied by removing the liquid material 66, and the insulating film 70 is formed in the region to which the electric field is not applied (FIG. 8A). That is, by utilizing the electrowetting phenomenon, the insulating film 70 that is patterned so as to have the hole 72 in the region where the electrode terminal is to be buried is obtained while covering one surface of the substrate 62. This insulating film 70 also functions as a gate insulating film.

  Next, the gate electrode 56 is formed at a predetermined position above the insulating film 70 and above the semiconductor film 50 (FIG. 8B). Specifically, a conductive film such as tantalum or chromium is formed on the upper surface of the insulating film 70 by a physical vapor deposition method such as sputtering, and then the conductive film is patterned to form the gate electrode 56. can get. The formation of the gate electrode 56 may be performed by a technique (liquid process) of dropping a material solution.

  Next, a liquid material 74 to be an insulating film is applied over the entire insulating film 70 (FIG. 8C). As such a liquid material 74, PEDOT / PSS is mentioned, for example. Examples of the method for applying the liquid material 74 include spin coating.

  Next, an electric field is locally applied to the lyophobic region, more specifically, the region where the film 64 is formed (FIG. 8D), and the liquid material 74 is excluded from the region. The method of applying the electric field is as described above. At this time, an electrowetting phenomenon occurs, and the liquid material 74 is excluded from a region to which an electric field is applied.

  In parallel with the above process (see FIG. 8D), the liquid material 74 is dried to be solidified. Accordingly, the hole 72 is formed in the region to which the electric field is applied by removing the liquid material 74, and the insulating film 76 is formed in the region to which the electric field is not applied (FIG. 9A).

  Next, in the above process, the liquid materials 66 and 74 are eliminated, and an electrode terminal 78 is formed by embedding a conductor in the region where the hole 72 is formed (FIG. 8B). Specifically, an electrode terminal 78 is obtained by forming a conductive film such as aluminum on the upper surface of the insulating film 74 by a physical vapor deposition method such as a sputtering method, and then patterning the conductive film. .

  As for the method of applying the electric field for causing the electrowetting phenomenon, a pair of electrodes is provided on the substrate 62 and a voltage is applied between the pair of electrodes, as in the first embodiment. You may do it. In this case, for example, as shown in FIG. 10, an electrode 154 is provided separately from the source / drain electrode 54, and the auxiliary electrode 58 and the source / drain electrode 54 are used as a pair of electrodes. A voltage may be applied through the auxiliary wiring film 60. Alternatively, the electric field may be applied locally by disposing the substrate 62 between the individual electrode and the common electrode and applying a voltage between the electrodes.

  As described above, according to the second embodiment, the liquid material can be excluded from the region to which the electric field or the magnetic field is applied in the process until the liquid material is solidified. Therefore, it is possible to easily obtain a semiconductor element having a uniform film thickness and film quality while reducing energy consumption.

(Third embodiment)
FIG. 11 is a schematic plan view of the wiring structure of the organic EL device. An organic EL device 100 shown in FIG. 11 includes a plurality of scanning lines 101, a plurality of signal lines 102 arranged orthogonal to the scanning lines, a plurality of power supply lines 103 extending in parallel to the signal lines 102, and each scanning line. 101 and a pixel portion A provided in the vicinity of the intersection of each signal line 102. That is, the organic EL device 100 of the present example is an active matrix display device that includes a plurality of pixel units and in which the pixel units are arranged in a matrix. The manufacturing method according to each of the above embodiments can be applied to the manufacture of such an organic EL device, for example.

  Each scanning line 101 is connected to a scanning line driving circuit 105 including a shift register and a level shifter. Each signal line is connected to a data line driving circuit 104 including a shift register, a level shifter, a video line, and an analog switch. Each pixel portion A includes a switching transistor 112 to which a scanning signal is supplied to the gate via the scanning line 101, a holding capacitor 111 for holding a pixel signal supplied from the signal line 102 via the switching transistor 112, A driving transistor 113 to which the pixel signal held by the holding capacitor 111 is supplied to the gate and a driving current from the power source line 103 when electrically connected to the power source line 103 via the driving transistor 113 are supplied. A flowing-in pixel electrode (cathode) and a functional layer 110 sandwiched between the pixel electrode and a counter electrode (anode) are provided. The pixel electrode, the counter electrode, and the functional layer 110 constitute a light emitting element (organic EL element). The functional layer 110 includes a hole transport layer, a light emitting layer, an electron injection layer, and the like. In the organic EL device 100, when the scanning line 101 is driven and the switching transistor 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor 111, and the driving is performed according to the state of the holding capacitor 111. The on / off state of the transistor 113 is determined. Then, current flows from the power supply line 103 to the pixel electrode through the channel of the driving transistor 113, and further current flows to the anode through the functional layer 110. The functional layer 110 emits light according to the amount of current that flows. By controlling the light emission state of each functional layer 110, desired image display can be performed.

  Next, a specific example of an electronic apparatus including the organic EL device 100 described above will be described.

  FIG. 12 is a perspective view showing a specific example of an electronic apparatus provided with the organic EL device 100. FIG. 12A is a perspective view illustrating a mobile phone which is an example of an electronic device. The cellular phone 1000 includes a display unit 1001 configured using the organic EL device 100 according to the present embodiment. FIG. 12B is a perspective view illustrating a wrist watch that is an example of an electronic apparatus. The wristwatch 1100 includes a display unit 1101 configured using the organic EL device 100 according to the present embodiment. FIG. 12C is a perspective view illustrating a portable information processing device 1200 which is an example of an electronic device. The portable information processing device 1200 includes an input unit 1201 such as a keyboard, a main body unit 1202 in which a calculation unit, a storage unit, and the like are stored, and a display unit 1203 configured using the organic EL device 100 according to the present embodiment. I have.

(Other embodiments)
In addition, this invention is not limited to the content of each embodiment mentioned above, A various deformation | transformation implementation is possible within the scope of the summary of this invention. For example, in the above description, an electric field is given as an external force for generating an electrowetting phenomenon, but a magnetic field can also be used as an external force. In the second embodiment, a thin film transistor is cited as an example of a semiconductor element. However, the scope of application of the present invention is not limited to this, and other various semiconductor elements (for example, thin film diodes) are also within the scope of application. May be included.

It is a top view which shows an example of the wiring board concerning 1st Embodiment. It is process sectional drawing explaining the manufacturing method of a wiring board. It is a top view which demonstrates concretely about the case where a pair of electrode is provided. It is a top view specifically explaining the case where an electrode is not provided on a board | substrate. It is process sectional drawing explaining the manufacturing method of a wiring board in the case of not providing an electrode on a board | substrate. It is a top view which illustrates typically the structure of the thin-film transistor concerning 2nd Embodiment. It is process sectional drawing explaining the manufacturing method of a thin-film transistor. It is process sectional drawing explaining the manufacturing method of a thin-film transistor. It is process sectional drawing explaining the manufacturing method of a thin-film transistor. It is a top view explaining the other structural example of the electrode for generating an electric field. It is a plane schematic diagram of the wiring structure of an organic EL device. It is a perspective view which shows the specific example of an electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 12a ... Contact part, 12 ... Wiring film | membrane, 12b ... Auxiliary wiring film | membrane, 14 ... Auxiliary electrode, 16 ... Film | membrane, 18 ... Liquid material, 20 ... Common electrode, 22 ... Film | membrane, 24 ... Hole, 26a ... Individual Electrode, 26 ... Electrode plate, 50 ... Semiconductor film, 52, 54 ... Source / drain electrode, 56 ... Gate electrode, 58 ... Auxiliary electrode, 60 ... Auxiliary wiring, 62 ... Substrate, 64 ... Film, 66 ... Liquid material, 68 ... Common electrode, 70 ... Insulating film, 72 ... Hole, 74 ... Liquid material, 76 ... Insulating film, 78 ... Electrode terminal, 112a ... Electrode, 112b ... Auxiliary wiring, 114 ... Auxiliary electrode, 154 ... Electrode

Claims (10)

Applying a liquid material on the substrate to form a coating film;
Disposing the coating film between a first electrode and a second electrode facing the first electrode;
Generating an electric field between the first electrode and the second electrode;
And removing the dispersion medium or solvent from the coating film to form a film. A first step of making part of the substrate lyophobic with respect to the liquid material and forming a lyophobic region;
A second step of applying the liquid material on the substrate;
Forming a film in a region excluding at least a part of the lyophobic region while applying an electric field or a magnetic field to the lyophobic region and removing the liquid material from at least a part of the lyophobic region; A method for manufacturing a wiring board, comprising: In claim 2,
The method of manufacturing a wiring board, wherein the third step includes removing a solvent from the liquid material to precipitate a solute, and the film includes the solute. In claim 2,
The method of manufacturing a wiring board, wherein the third step includes removing a dispersion medium from the liquid material to precipitate a dispersoid, and the film includes the dispersoid. In claim 2,
The method of manufacturing a wiring board, wherein the third step includes curing the liquid material to form a cured film, and the film includes the cured film. In any of claims 2 to 5,
Prior to the first step, forming a first electrode on the substrate at least partially overlapping the lyophobic region;
In the third step, a second electrode facing the first electrode with the liquid material interposed therebetween is installed, and an electric field is generated between the first electrode and the second electrode. A method for manufacturing a wiring board, comprising: In any of claims 2 to 5,
Prior to the first step, forming on the substrate a first electrode and a second electrode sandwiching at least a part of the lyophobic region,
The wiring substrate manufacturing method, wherein the third step includes generating an electric field between the first electrode and the second electrode. In any of claims 2 to 5,
In the third step, a first electrode at least partially overlapping the lyophobic region and a second electrode facing the first electrode with the liquid material interposed therebetween are installed, and the first step A method for manufacturing a wiring board, comprising: generating an electric field between an electrode and the second electrode.   A method for manufacturing an electro-optical device, comprising the method for manufacturing a wiring board according to claim 1.   A method for manufacturing an electronic device, comprising the method for manufacturing a wiring board according to claim 1.

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