JP2007134150A - Microstrip connector and connecting device using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microstrip connector with high degree of freedom of structural design. <P>SOLUTION: This is the microstrip connector mounted on a substrate in which a microstrip line is formed, and provided with conductive contact members 14A to 14D for a ground, conductive contact members 13A to 13C for signal positioned between two contact members for the ground, and an insulating housing member 15 to retain the contact members 14A to 14D for the ground and the contact members 13A to 13C for signal, and this is the microstrip connector in which between respective contact members for the ground and the contact members for the signal, the housing member 15 is not interposed in a region of a prescribed distance or more from the end face of the substrate side of the respective contact members, and in which only an air layer exists. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a connector for a microstrip line.

  Conventionally, as a method of connecting the substrates of the microstrip line, a method of connecting the substrates with a coaxial cable and a coaxial connector is generally used (see, for example, FIG. 10 of Patent Document 1). When using the method of connecting between microstrip line boards with a coaxial cable and a coaxial connector, the location of the cable wiring is required, and the direction and arrangement of the connector are significantly limited, making it difficult to reduce the size of the device. There was a problem.

As a technique that can solve the above problem, for example, a microstrip connector proposed in Patent Document 1 can be cited. FIG. 8 shows a cross-sectional view of an example of the microstrip connector proposed in Patent Document 1, FIG. 9 shows a cross-sectional view of a mating connector connected to the connector shown in FIG. 8, and FIG. FIG. 10 shows a cross-sectional view of the connector shown in FIG. 8 and 9, reference numerals 101a and 101b denote signal transmission pins, reference numeral 102 denotes a ground plate, reference numeral 103 denotes a connector shell, reference numeral 104 denotes a substrate, and reference numerals 105a and 105b denote microstrips. Reference numeral 106 denotes a ground layer, and reference numerals 111a, 111b, and 112 denote connection portions made of an elastic body.
JP 2001-210432 A

  Since the microstrip connector shown in FIGS. 8 and 9 has a structure in which inclusions are sandwiched between signal transmission pins and a ground plate, the dielectric constant of inclusions (dielectric constant of general materials: 2.5 to 2.2. 6, 3.4 to 3.5 for nylon 66, etc., the coupling capacity between the signal transmission pin and the ground plate becomes high, and it is necessary to design the impedance in accordance with the dielectric constant of the inclusion. As a result, there is a problem that there is a dimensional limitation in the structural design. The distance between lines (signal lines and ground lines) formed on the substrate of the microstrip line is set to a predetermined value in inches and millimeters and cannot be changed arbitrarily. If there is, there is a possibility that it is not possible to adapt to the interval between the lines (signal lines and ground lines) formed on the substrate of the microstrip line.

  Further, as apparent from FIG. 10, the microstrip connector shown in FIG. 8 and the microstrip connector shown in FIG. 9 have a point contact structure, so that there is a problem that impedance mismatch or deterioration of high-frequency transmission characteristics is caused at the contact portion. Since the contact is made only by the pressure of the contact spring, the contact reliability is insufficient.

  In view of the above problems, an object of the present invention is to provide a microstrip connector having a high degree of freedom in structural design and a connection device using the microstrip connector.

  In order to achieve the above object, a microstrip connector according to the present invention is a microstrip connector that is attached to a substrate on which a microstrip line is formed. The microstrip connector includes a conductive first ground contact member, and a conductive first member. Two ground contact members, a conductive signal contact member positioned between the first ground contact member and the second ground contact member, the first ground contact member, A second ground contact member and an insulating housing member for holding the signal contact member, and between the first ground contact member and the signal contact member and the signal contact member. Between each of the second ground contact members When the contact member is mounted on the substrate without the housing member interposed in an area of a predetermined distance or more from the end surface on the substrate side of each contact member, the signal contact member is The first ground contact member and the second ground contact member are connected to a signal line formed on the substrate and are erected on the substrate, and each of the first ground contact member and the second ground contact member is a separate ground line formed on the substrate. And is configured to stand on the substrate.

  According to such a configuration, each of the contact members is provided between the first ground contact member and the signal contact member and between the signal contact member and the second ground contact member. Since the housing member is not present in the region beyond a predetermined distance from the end surface on the substrate side, and there is only an air layer, the coupling capacitance between the signal contact member and the first ground contact member and The coupling capacity between the signal contact member and the second ground contact member does not increase, and the degree of freedom in structural design as a connector increases. Further, according to such a configuration, the signal contact member has a stripline structure by being sandwiched between the first ground contact member and the second ground contact member, and thus formed on the substrate. Impedance matching can be achieved with the formed microstrip line. Further, since the signal contact member is sandwiched between the first ground contact member and the second ground contact member, the signal contact member is not exposed to the outside. Is difficult to mix. If the housing member can hold the first ground contact member, the second ground contact member, and the signal contact member, the housing member is interposed in the entire contact member region. A configuration in which only an air layer is present is desirable.

  The connection device according to the present invention is a connection device comprising a plug-side microstrip connector and a socket-side microstrip connector, wherein the plug-side microstrip connector and the socket-side microstrip connector each have the above-described configuration. The plug contact microstrip connector signal contact member and the socket side microstrip connector signal contact member connection body, the plug side microstrip connector ground contact member and the socket side microstrip connector. A microstrip line formed on a substrate to which the plug-side microstrip connector is attached has an area of the surface of the ground contact member facing the connection body. By setting the impedance and the impedance according to the impedance of the microstrip line formed on the board to which the socket-side microstrip connector is attached, the impedance of the connection device is formed on the board to which the plug-side microstrip connector is attached. The impedance of the formed microstrip line and the impedance of the microstrip line formed on the substrate to which the socket-side microstrip connector is attached are made equal to each other. Further, the signal contact member of the plug-side microstrip connector and the connection body of the signal contact member of the socket-side microstrip connector, the ground contact member of the plug-side microstrip connector, and the ground of the socket-side microstrip connector The distance between the contact member and the connection body is the distance between the signal line and the ground line formed on the board to which the plug-side microstrip connector is attached and the signal line and the ground formed on the board to which the socket-side microstrip connector is attached. Desirably equal to each line spacing.

  The connection device according to the present invention is a connection device comprising a plug-side microstrip connector and a socket-side microstrip connector, wherein the plug-side microstrip connector and the socket-side microstrip connector each have the above-described configuration. A through-hole through which a screw passes is formed in the housing member of the plug-side microstrip connector, and a screw hole corresponding to the screw is formed in the housing member of the socket-side microstrip connector; The first ground contact member, the second ground contact member, and the signal contact member of the microstrip connector each have a leaf spring portion, and the plug-side microstrip connector and the socket When the first microstrip connector is connected, the leaf spring portion makes surface contact with the first ground contact member, the second ground contact member, and the signal contact member of the plug side microstrip connector. The configuration.

  According to such a configuration, the signal contact member of the plug-side microstrip connector and the signal contact member connection of the socket-side microstrip connector, the first ground contact member of the plug-side microstrip connector, and Coupling capacity between the socket-side microstrip connector and the first ground contact member connection body, the plug-side microstrip connector signal contact member, and the socket-side microstrip connector signal contact member connection body And a connection body between the second ground contact member of the plug-side microstrip connector and the second ground contact member of the socket-side microstrip connector has a high coupling capacity. Since not, the plug-side microstrip connector, the degree of freedom in structural design as a socket-side microstrip connector connector for both is high.

  Further, according to such a configuration, the first ground contact member, the second ground contact member, and the signal contact member of the socket-side microstrip connector are respectively connected to the first microstrip connector. Since the ground contact member, the second ground contact member, and the signal contact member are in surface contact, it is possible to prevent deterioration of high-frequency transmission due to the conduction resistance and the inductor component at the contact portion. Furthermore, since the plug-side microstrip connector and the socket-side microstrip connector are firmly connected by the screw, each contact member of the socket-side microstrip connector and each contact member of the socket-side microstrip connector The contact pressure at the surface contact portion is strengthened and maintained, and deterioration of high-frequency transmission due to the conduction resistance and inductor component at the contact portion can be permanently prevented. This increases the reliability of connector connection.

  According to the present invention, a microstrip connector having a high degree of freedom in structural design can be realized.

  Embodiments of the present invention will be described below with reference to the drawings. An example of the microstrip connector according to the present invention is shown in the perspective view of FIG. In FIG. 1, in order to prevent the plug-side microstrip connector 1 from being hidden by the substrate 3, the substrate 3 is shown in a transparent state. In FIG. 1, signal lines, ground lines, and ground layers formed on the substrates 3 and 4 are not shown.

  By connecting the plug-side microstrip connector 1 and the socket-side microstrip connector 2, the microstrip line of the substrate 3 and the microstrip line of the substrate 4 are connected.

  The screw 5 passes through a first through hole (not shown) of the substrate 3 and the through hole 11 of the plug-side microstrip connector 1 and is screwed into the screw hole 21 of the socket-side microstrip connector 2. The plug-side microstrip connector 1 is screwed into the screw hole 22 of the socket-side microstrip connector 2 through the second through-hole (not shown) of the substrate 3 and the through-hole 12 of the plug-side microstrip connector 1. And the socket-side microstrip connector 2 are firmly connected.

  Next, the structure of the plug-side microstrip connector 1 will be described with reference to FIG. 2A is a front view of the plug-side microstrip connector 1, FIG. 2B is a bottom view of the plug-side microstrip connector 1, and FIG. 2C is a side view of the plug-side microstrip connector 1. FIG.

  The plug-side microstrip connector 1 holds conductive signal contact members 13A to 13C, conductive ground contact members 14A to 14D, signal contact members 13A to 13C, and ground contact members 14A to 14D. And an insulating housing member 15. Through holes 11 and 12 are formed in the housing member 15.

  When the plug-side microstrip connector 1 is mounted on the substrate 3, the signal contact members 13 </ b> A to 13 </ b> C are connected to separate signal lines formed on the substrate 3 and are erected on the substrate 3. Further, when the plug-side microstrip connector 1 is mounted on the substrate 3, the ground contact members 14 </ b> A to 14 </ b> D are connected to separate ground lines formed on the substrate 3 and are erected on the substrate 3.

  The conductive signal contact member 13A is located between the ground contact member 14A and the ground contact member 14B, and the conductive signal contact member 13B is located between the ground contact member 14B and the ground contact member 14C. The conductive signal contact member 13C is located between the ground contact member 14C and the ground contact member 14D.

  Further, between the ground contact member 14A and the signal contact member 13A, between the signal contact member 13A and the ground contact member 14B, between the ground contact member 14B and the signal contact member 13B, and between the signal contact member 13B and the ground contact. A region of a predetermined distance h1 or more from the end surface of the contact member on the substrate 3 side between the members 14C, between the ground contact member 14C and the signal contact member 13C, and between the signal contact member 13C and the ground contact member 14D. There is only an air layer without a housing member.

  Next, the structure of the socket-side microstrip connector 2 will be described with reference to FIG. 3A is a top view of the socket-side microstrip connector 2, FIG. 3B is a front view of the socket-side microstrip connector 2, and FIG. 3C is a side view of the socket-side microstrip connector 2. FIG.

  The socket-side microstrip connector 2 holds conductive signal contact members 23A to 23C, conductive ground contact members 24A to 24D, signal contact members 23A to 23C, and ground contact members 24A to 24D. And an insulating housing member 25. Screw holes 21 and 22 are formed in the housing member 25.

  When the socket-side microstrip connector 2 is mounted on the substrate 4, the signal contact members 23 </ b> A to 23 </ b> C are connected to separate signal lines formed on the substrate 4 and are erected on the substrate 4. Further, when the socket-side microstrip connector 2 is mounted on the substrate 4, the ground contact members 24 </ b> A to 24 </ b> D are connected to separate ground lines formed on the substrate 4 and are erected on the substrate 4.

  The conductive signal contact member 23A is located between the ground contact member 24A and the ground contact member 24B, and the conductive signal contact member 23B is located between the ground contact member 24B and the ground contact member 24C. The conductive signal contact member 23C is located between the ground contact member 24C and the ground contact member 24D.

  Further, between the ground contact member 24A and the signal contact member 23A, between the signal contact member 23A and the ground contact member 24B, between the ground contact member 24B and the signal contact member 23B, and between the signal contact member 23B and the ground contact. A region of a predetermined distance h2 or more from the end face on the substrate 4 side of the contact member between the members 24C, between the ground contact member 24C and the signal contact member 23C, and between the signal contact member 23C and the ground contact member 24D. There is only an air layer without a housing member.

  As described above, the housing member is not interposed between the ground contact member and the signal contact member of the plug-side microstrip connector 1 at a predetermined distance h1 or more from the end surface on the substrate 3 side of the contact member, and only the air layer is present. In the region between the ground contact member and the signal contact member of the socket-side microstrip connector 2 and the end surface on the substrate 4 side of the contact member, the housing member is not interposed in the region beyond the predetermined distance h2, and only the air layer is present. Therefore, the connecting body of the signal contact member of the plug-side microstrip connector 1 and the signal contact member of the socket-side microstrip connector 2, the ground contact member of the plug-side microstrip connector 1, and the socket-side microstrip. Coupling capacitance between the connection of a ground contact member of the connector 2 is not increased, the degree of freedom in structural design as the connector is increased.

  Next, a state where the plug-side microstrip connector 1 is mounted on the substrate 4 and a state where the socket-side microstrip connector 2 is mounted on the substrate 4 will be described with reference to FIG. In FIG. 4, for simplicity of explanation, only one signal line and two ground lines are shown for each substrate. For each microstrip connector, one signal line and two ground lines for each substrate are shown. Only the contact member corresponding to is shown.

  In FIG. 4, the substrate 3 is illustrated in a transparent state in order to prevent the contact member of the plug-side microstrip connector 1 from being hidden by the substrate 3. Further, in FIG. 4, illustration of the ground layer and the through hole formed in the substrates 3 and 4 are omitted.

  The signal contact member 13A of the plug-side microstrip connector 1 is connected to the signal line 3A formed on the substrate 3, and the ground contact member 14A of the plug-side microstrip connector 1 is connected to the ground line 3B formed on the substrate 3. The ground contact member 14B of the plug-side microstrip connector 1 is connected to a ground line 3C formed on the substrate 3.

  Signal contact member 23A of socket side microstrip connector 2 is connected to signal line 4A formed on substrate 4, and ground contact member 24A of socket side microstrip connector 2 is connected to ground line 4B formed on substrate 4. The ground contact member 24B of the socket-side microstrip connector 2 is connected to a ground line 4C formed on the substrate 4.

  In the substrate 3, the ground layer 3D is formed on the entire surface facing the surface on which the signal line 3A and the ground lines 3B and 3C are formed, and the ground lines 3B and 3C and the ground layer 3D are formed by the through holes 3E. It is connected. In the substrate 4, a ground layer 4D is formed on the entire surface opposite to the surface on which the signal line 4A and the ground lines 4B and 4C are formed, and the ground lines 4B and 4C and the ground layer 4D are through holes. Connected by 4E. Accordingly, the cross-sectional view of the substrates 3 and 4 is as shown in FIG. 5. In FIG. 4, the illustration of the ground layer and the through hole formed in the substrates 3 and 4 is not omitted, and the outline of the substrates 3 and 4 is shown. If the illustration is omitted, the result is as shown in FIG. In the substrates 3 and 4, a microstrip line is constituted by a signal line, a ground line, a through hole, and a ground layer.

Next, the shape of the contact member of the plug-side microstrip connector 1 and the shape of the contact member of the socket-side microstrip connector 2 will be described with reference to FIG.
FIG. 7A is a view showing a contact member of the socket-side microstrip connector 2, and FIG. 7B is a connection state between the contact member of the plug-side microstrip connector 1 and the contact member of the socket-side microstrip connector 2. FIG.

  As shown in FIG. 7A, the contact member of the socket-side microstrip connector 2 has a plate spring structure on three surfaces F1 to F3. According to such a structure, the contact member of the socket side microstrip connector 2 and the contact member of the socket side microstrip connector 2 are in surface contact as shown in FIG. Deterioration of high-frequency transmission due to components can be prevented. Further, as described above, since the plug-side microstrip connector 1 and the socket-side microstrip connector 2 are firmly connected by the screws 5 and 6, the contact member of the socket-side microstrip connector 2 and the socket-side microstrip connector 2 are connected. The contact pressure at the surface contact portion with the contact member is strengthened and maintained, and the deterioration of the high frequency transmission due to the conduction resistance and the inductor component at the contact portion can be permanently prevented. This increases the reliability of connector connection.

  In addition, by changing the width dimension (= W1 + W2) of the contact member of the plug-side microstrip connector 1, the connection body of the signal contact member of the plug-side microstrip connector 1 and the signal contact member of the socket-side microstrip connector 2, and the plug The coupling capacity between the ground contact member of the side microstrip connector 1 and the connection body of the ground contact member of the socket side microstrip connector 2 can be adjusted.

  Here, under a general substrate microstrip condition (substrate dielectric constant ε = 4.5, substrate thickness 0.8 mm, substrate microstrip line impedance 50Ω), the signal line pattern width is 1.5 mm. become. In this case, the interval between the signal line and the ground line is also set to 1.5 mm. On the other hand, in the socket-side microstrip connector 1, only the air layer exists without a housing member in a region beyond a predetermined distance h 1 (see FIG. 2) from the end surface of the contact member on the substrate 3 side. 2, the housing member is not interposed in the region beyond the predetermined distance h2 (see FIG. 3) from the end surface on the substrate 4 side of the contact member, and only the air layer exists, and the dielectric constant of air is 1, so that the plug side When the width dimension (= W1 + W2) of the contact member of the microstrip connector 1 is set to 4.3 mm, impedance matching can be achieved to 50Ω with a contact member interval of 1.5 mm.

  Further, under the microstrip conditions of other substrates (substrate dielectric constant ε = 4.5, substrate thickness 0.6 mm, substrate microstrip line impedance 50Ω), the signal line pattern width is 1.0 mm. . In this case, the interval between the signal line and the ground line is also set to 1.0 mm. On the other hand, in the socket-side microstrip connector 1, only the air layer exists without a housing member in a region beyond a predetermined distance h 1 (see FIG. 2) from the end surface of the contact member on the substrate 3 side. 2, the housing member is not interposed in the region beyond the predetermined distance h2 (see FIG. 3) from the end surface on the substrate 4 side of the contact member, and only the air layer exists, and the dielectric constant of air is 1, so that the plug side If the width dimension (= W1 + W2) of the contact member of the microstrip connector 1 is 1.7 mm, impedance matching can be achieved to 50Ω at a contact member interval of 1.0 mm.

These are perspective views which show an example of the microstrip connector which concerns on this invention. These are figures which show the structure of the plug side microstrip connector which concerns on this invention. These are figures which show the structure of the socket side microstrip connector which concerns on this invention. These are the schematic diagrams which show the state by which the microstrip connector which concerns on this invention is mounted in the board | substrate. FIG. 3 is a sectional view of a substrate. These are the schematic diagrams which show the state by which the microstrip connector which concerns on this invention is mounted in the board | substrate. These are figures which show the contact member of the microstrip connector which concerns on this invention. These are sectional drawings which show an example of the conventional microstrip connector. These are sectional drawings of the other party connector connected to the connector shown in FIG. These are sectional drawings of the connection state of the connector shown in FIG. 8, and the connector shown in FIG.

Explanation of symbols

1 Plug side microstrip connector 2 Socket side microstrip connector 3, 4 Substrate 3A, 4A Signal line 3B, 3C, 4B, 4C Ground line 3D, 4D Ground layer 3E, 4E Through hole 5, 6 Screw 11, 12 Through hole 13A -13C, 23A-23C Signal contact member 14A-14D, 24A-24D Ground contact member 15, 25 Housing member 21, 22 Screw hole

Claims (4)

A microstrip connector attached to a substrate on which a microstrip line is formed,
A conductive first ground contact member;
A conductive second ground contact member;
A conductive signal contact member positioned between the first ground contact member and the second ground contact member;
An insulating housing member for holding the first ground contact member, the second ground contact member, and the signal contact member;
Predetermined from the end face on the substrate side of each contact member between the first ground contact member and the signal contact member and between the signal contact member and the second ground contact member. In the region of the distance of or more, there is only an air layer without the housing member interposed,
When mounted on the substrate, the signal contact member is connected to a signal line formed on the substrate, is erected on the substrate, and is connected to the first ground contact member and the second ground. Each of the contact members is connected to a separate ground line formed on the substrate, and stands upright on the substrate. A connecting device comprising a plug-side microstrip connector and a socket-side microstrip connector,
The plug-side microstrip connector and the socket-side microstrip connector are each a microstrip connector according to claim 1,
The ground contact member of the plug side microstrip connector and the ground contact of the socket side microstrip connector of the connection body of the signal contact member of the plug side microstrip connector and the signal contact member of the socket side microstrip connector The area of the surface facing the connection body of the member,
By setting the value according to the impedance of the microstrip line formed on the substrate to which the plug-side microstrip connector is attached and the impedance of the microstrip line formed on the substrate to which the socket-side microstrip connector is attached,
The impedance of the connection device is made equal to the impedance of the microstrip line formed on the substrate to which the plug-side microstrip connector is attached and the impedance of the microstrip line formed on the substrate to which the socket-side microstrip connector is attached. A connection device characterized by that. A signal contact member of the plug-side microstrip connector, a connection body of signal contact members of the socket-side microstrip connector, a ground contact member of the plug-side microstrip connector, and a ground contact member of the socket-side microstrip connector The distance from the connected body is
The distance between a signal line and a ground line formed on a substrate to which the plug-side microstrip connector is attached is equal to a distance between a signal line and a ground line formed on the substrate to which the socket-side microstrip connector is attached. The connecting device as described. A connecting device comprising a plug-side microstrip connector and a socket-side microstrip connector,
The plug-side microstrip connector and the socket-side microstrip connector are each a microstrip connector according to claim 1,
A through-hole through which a screw passes is formed in the housing member of the plug-side microstrip connector, and a screw hole corresponding to the screw is formed in the housing member of the socket-side microstrip connector,
The first ground contact member, the second ground contact member, and the signal contact member of the socket side microstrip connector each have a leaf spring portion, and the plug side microstrip connector and the socket side When the microstrip connector is connected, the leaf spring portion makes surface contact with the first ground contact member, the second ground contact member, and the signal contact member of the plug-side microstrip connector. Connection device characterized.

Images