JP2007114344A - Method for manufacturing substrate for electronic device, substrate for electronic device, liquid crystal panel, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate for an electronic device in which the substrate for the electronic device with an organic alignment film having superior durability (light fastness) and, for example, a superior function of restricting an alignment state of liquid crystal molecules can easily be manufactured, the substrate for the electronic device manufactured by the method for manufacturing the electronic device, a liquid crystal panel with reliability, and electronic equipment. <P>SOLUTION: The inorganic alignment film 3 is formed of a plurality of prismatic inorganic particles 5 arranged having long axes almost in a fixed direction. This inorganic alignment film 3 is formed by forming an underlayer 6, provided with a plurality of grooves 61 whose width is smaller than a mean length of the inorganic particles 5 in the long-axis direction on the opposite side from a TFT substrate 17, on the TFT substrate 17, supplying the inorganic particles 5 onto the underlayer 6, and arranging the inorganic particles so that the inorganic particles 5 have the long-axis directions almost in the extending direction of the grooves 61. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic device substrate, an electronic device substrate, a liquid crystal panel, and an electronic apparatus.

In recent years, various liquid crystal display elements (liquid crystal panels) have been put into practical use in liquid crystal televisions (direct-view display devices), liquid crystal projectors (projection display devices), and the like.
In these liquid crystal display elements, as a method of aligning liquid crystal molecules, for example, an alignment film having anisotropy is provided so as to be in contact with the liquid crystal layer, and the alignment state of the liquid crystal molecules is regulated by the interface with the alignment film. There is.

As a method for forming such an alignment film, for example, I: an organic film is formed, and then a rubbing method in which the organic film is oriented by rubbing treatment, II: an oblique deposition method in which an inorganic material is obliquely deposited, III : Various methods are known such as a transfer method (for example, refer to Patent Documents 1 and 2) in which a mold having a fine uneven shape is pressed against a substrate and the uneven shape is transferred.
However, the alignment film formed by rubbing the organic film tends to be relatively non-uniform in the alignment by the rubbing process, so this alignment film meets the demand for fine alignment control associated with downsizing and high definition of the panel. I can't. Moreover, since it is an organic film, there also exists a problem that light resistance is inferior compared with an inorganic film.

In addition, since the obliquely deposited film uses an inorganic material, excellent light resistance can be obtained. However, when the panel is enlarged, it is difficult to produce a uniform and homogeneous film. is there.
In addition, the minimum dimension of the concavo-convex shape that can be formed by the transfer method is that the minimum pitch interval is about 0.1 μm and the minimum step is about 0.01 μm. Accordingly, considering that the size of the liquid crystal molecules is about 10 to 25 nm in the major axis direction and about 5 nm in the minor axis direction, the size of the above-described irregularities is too large, and the alignment state of the liquid crystal molecules is effective. Is difficult to regulate.

JP-A-5-249465 JP-A-8-22007

  An object of the present invention is an electronic device substrate that can be easily produced as an electronic device substrate having an inorganic alignment film that is excellent in durability (light resistance) and has an excellent function of regulating the alignment state of liquid crystal molecules, for example. An object of the present invention is to provide a manufacturing method, an electronic device substrate manufactured by the manufacturing method of the electronic device substrate, a highly reliable liquid crystal panel, and an electronic apparatus.

Such an object is achieved by the present invention described below.
The method for manufacturing an electronic device substrate of the present invention comprises a substrate and a plurality of prismatic inorganic particles provided on one surface side of the substrate and arranged such that the major axis is oriented in a substantially constant direction. A method for producing an electronic device substrate having an inorganic alignment film,
A first step of forming a plurality of grooves having a width smaller than the average length of the inorganic particles in the major axis direction on the substrate, a base layer provided on a surface opposite to the substrate, substantially in parallel,
And a second step of supplying the inorganic particles onto the underlayer and arranging the inorganic particles so that the major axis direction of the inorganic particles and the extending direction of the grooves substantially coincide with each other.
Thereby, while being excellent in durability (light resistance), the board | substrate for electronic devices provided with the inorganic alignment film which is excellent in the function which regulates the orientation state of a liquid crystal molecule, for example can be manufactured simply.

In the electronic device substrate manufacturing method of the present invention, in the first step, the groove is preferably formed by transferring from a base material.
By using such a transfer method, it is possible to form fine grooves uniformly in the surface direction and with high accuracy. Further, the transfer method is preferable because the operation is easy and the reproducibility is high.

In the method for manufacturing an electronic device substrate according to the present invention, it is preferable that a bottom surface of the groove is inclined in one direction.
Thereby, the inorganic particles can be efficiently arranged so that the major axis direction thereof substantially coincides with the extending direction of the groove (uniaxially oriented).
In the method for manufacturing an electronic device substrate according to the present invention, the pitch of the grooves is preferably smaller than the average length of the inorganic particles in the major axis direction.
Thereby, the number of inorganic particles uniaxially oriented can be increased only by supplying inorganic particles onto the underlayer.

In the method for manufacturing an electronic device substrate according to the present invention, it is preferable that the base layer is composed mainly of the same kind of material as the inorganic particles.
Thereby, adjustment of the dielectric constant etc. as a whole of an inorganic alignment film and a base layer is easy, and fixation to the base layer of an inorganic particle can be performed more easily and reliably.
In the method for manufacturing a substrate for an electronic device according to the present invention, in the second step, the number of the inorganic particles supplied onto the base layer is 2 × 10 ⁹ to 2 × 10 ¹³ particles / cm ^2. preferable.
As a result, a sufficient number of corners of the inorganic particles appear on the surface of the inorganic alignment film opposite to the substrate. For this reason, in such an inorganic alignment film, for example, liquid crystal molecules are more reliably aligned (vertical alignment or horizontal alignment).

In the method for manufacturing an electronic device substrate of the present invention, in the second step, the inorganic particles are preferably arranged by applying vibration to the substrate.
Thereby, most of the inorganic particles can be in a state in which the major axis direction thereof substantially coincides with the extending direction of the groove.
In the method for manufacturing an electronic device substrate according to the present invention, the aspect ratio of the inorganic particles is preferably 0.03 to 0.5.
By using inorganic particles having such dimensions, the molecular anisotropy generated by the corners of the inorganic particles can be increased, so that the alignment (control) of the liquid crystal molecules can be reliably controlled. An inorganic alignment film is obtained.

In the method for manufacturing an electronic device substrate of the present invention, it is preferable that the inorganic particles are composed mainly of SiO ₂ or Al ₂ O ₃ .
SiO ₂ and Al ₂ O ₃ are preferable because they have a particularly low dielectric constant and high durability (light stability).
In the method for manufacturing an electronic device substrate of the present invention, the inorganic particles are preferably obtained by pulverizing an inorganic film formed by oblique deposition.
According to such a method, inorganic particles can be produced easily, reliably and with a good yield.

In the manufacturing method of the board | substrate for electronic devices of this invention, it is preferable to have a fixing process which fixes the said inorganic particle on the said base layer after a said 2nd process.
Thereby, peeling of the inorganic alignment film from the substrate can be prevented.
In the method for manufacturing a substrate for an electronic device of the present invention, it is preferable that in the fixing step, the inorganic particles are fixed on the base layer with a fixing agent.
By fixing the inorganic particles using the fixing agent, the inorganic particles can be fixed on the base layer while reliably preventing the orientation state of the inorganic particles from being disturbed (broken).

In the method for manufacturing an electronic device substrate of the present invention, it is preferable that the fixing agent has a function of connecting the inorganic particles.
Thereby, the mechanical strength of the inorganic alignment film can be improved, and peeling from the substrate can be reliably prevented.
In the method for manufacturing an electronic device substrate according to the present invention, it is preferable that the fixing agent contains a coupling agent as a main component.
The coupling agent is preferable because the same molecule can perform both functions of fixing the inorganic particles on the base layer and linking the inorganic particles.

The electronic device substrate of the present invention is manufactured by the method for manufacturing an electronic device substrate of the present invention.
Thereby, while being excellent in durability (light resistance), the board | substrate for electronic devices provided with the inorganic alignment film which is excellent in the function which regulates the orientation state of a liquid crystal molecule, for example is obtained.
The liquid crystal panel of the present invention includes an electronic device substrate of the present invention,
And a liquid crystal layer provided on the opposite side of the inorganic alignment film from the substrate.
Thereby, a highly reliable liquid crystal panel is obtained.
An electronic apparatus according to the present invention includes the liquid crystal panel according to the present invention.
Thereby, a highly reliable electronic device can be obtained.

Hereinafter, a method for manufacturing an electronic device substrate, an electronic device substrate, a liquid crystal panel, and an electronic apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a longitudinal sectional view schematically showing an embodiment of the liquid crystal panel of the present invention, and FIG. 2 is a diagram schematically showing an enlarged inorganic alignment film provided in the liquid crystal panel shown in FIG. ) Is a longitudinal sectional view, and (b) is a top view. In FIG. 1, the description of the sealing material, the wiring, etc. is omitted. In the following description, the upper side in FIGS. 1 and 2A is referred to as “upper” and the lower side is referred to as “lower”.

  A liquid crystal panel (TFT liquid crystal panel) 1 shown in FIG. 1 includes a TFT substrate (liquid crystal driving substrate) 17, an inorganic alignment film 3 bonded to the inner surface (lower surface) side of the TFT substrate 17, and a liquid crystal panel counter substrate 12. And an inorganic alignment film 4 bonded to the inner surface (upper surface) side of the counter substrate 12 for the liquid crystal panel, and a liquid crystal layer 2 containing liquid crystal molecules sealed in a gap between the inorganic alignment film 3 and the inorganic alignment film 4 And a polarizing film 7 bonded to the outer surface (upper surface) side of the TFT substrate (liquid crystal driving substrate) 17 and a polarizing film 8 bonded to the outer surface (lower surface) side of the counter substrate 12 for liquid crystal panel. Yes.

The counter substrate 12 for the liquid crystal panel is provided on the microlens substrate 11, the surface layer 114 of the microlens substrate 11, the black matrix 13 in which the opening 131 is formed, and the black matrix 13 on the surface layer 114 so as to cover the black matrix 13. A transparent conductive film (common electrode) 14.
The microlens substrate 11 includes a substrate 111 with a microlens recess provided with a plurality of (many) recesses (microlens recesses) 112 having a concave curved surface, and a recess 112 of the substrate 111 with a microlens recess. And a surface layer 114 bonded to the other surface via a resin layer (adhesive layer) 115.

In the resin layer 115, the microlens 113 is formed of a resin filled in the recess 112.
The substrate with concave portions for microlenses 111 is manufactured from a flat base material (transparent substrate), and a plurality of (many) concave portions 112 are formed on the surface thereof.
The recess 112 can be formed by, for example, a dry etching method, a wet etching method, or the like using a mask.

The substrate with concave portions 111 for microlenses is made of glass, for example.
The thermal expansion coefficient of the base material is preferably approximately the same as the thermal expansion coefficient of the glass substrate 171 (for example, the ratio of the thermal expansion coefficients of the two is about 1/10 to 10). As a result, in the liquid crystal panel 1 obtained, warpage, deflection, peeling, and the like caused by the difference in thermal expansion coefficient between the two when the temperature changes are prevented.

From this point of view, it is preferable that the substrate 111 with concave portions for microlenses and the glass substrate 171 are made of the same type of material. This effectively prevents warpage, deflection, peeling, and the like due to differences in the thermal expansion coefficient when the temperature changes.
In particular, for the TFT substrate 17 to be described later, quartz glass whose characteristics are not easily changed by the environment during manufacture is preferably used. For this reason, it is preferable that the substrate 111 with concave portions for microlenses is made of quartz glass correspondingly. As a result, it is possible to obtain the liquid crystal panel 1 that is less likely to be warped or bent and has excellent stability.

A resin layer (adhesive layer) 115 that covers the recess 112 is provided on the upper surface of the substrate with recesses 111 for microlenses.
The concave portion 112 is filled with the constituent material of the resin layer 115 to form the microlens 113.
The resin layer 115 can be made of, for example, a resin (adhesive) having a refractive index higher than the refractive index of the constituent material of the substrate 111 with concave portions for microlenses. For example, acrylic resin, epoxy resin, acrylic epoxy It can be suitably configured with an ultraviolet curable resin or the like.

A flat surface layer 114 is provided on the upper surface of the resin layer 115.
The surface layer (glass layer) 114 can be made of glass, for example. In this case, it is preferable that the thermal expansion coefficient of the surface layer 114 is substantially equal to the thermal expansion coefficient of the substrate 111 with concave portions for microlenses (for example, the ratio of the thermal expansion coefficients of the two is about 1/10 to 10). As a result, warpage, deflection, peeling, and the like caused by the difference in thermal expansion coefficient between the substrate 111 with concave portions for microlenses and the surface layer 114 are prevented. Such an effect can be more effectively obtained when the substrate with concave portions for microlenses 111 and the surface layer 114 are made of the same material.

The average thickness of the surface layer 114 is generally about 5 to 1000 μm, more preferably about 10 to 150 μm, from the viewpoint of obtaining necessary optical characteristics.
In addition, the surface layer (barrier layer) 114 can also be comprised, for example with ceramics. Examples of ceramics include nitride ceramics such as AlN, SiN, TiN, and BN, oxide ceramics such as Al ₂ O ₃ and TiO ₂ , and carbide ceramics such as WC, TiC, ZrC, and TaC. Can be mentioned.
When the surface layer 114 is made of ceramics, the average thickness of the surface layer 114 is not particularly limited, but is preferably about 20 nm to 20 μm, and more preferably about 40 nm to 1 μm.
Such a surface layer 114 can be omitted if necessary.

The black matrix 13 has a light blocking function and is made of, for example, a metal such as Cr, Al, Al alloy, Ni, Zn, Ti, or a resin in which carbon, titanium, or the like is dispersed.
The transparent conductive film 14 has conductivity and is made of, for example, indium tin oxide (ITO), indium oxide (IO), tin oxide (SnO ₂ ), or the like.
The TFT substrate 17 is a substrate that drives (alignment control) the liquid crystal molecules contained in the liquid crystal layer 2. The TFT substrate 17 is provided on the glass substrate 171 and the glass substrate 171, and is arranged in a matrix (matrix). It has (many) pixel electrodes 172 and a plurality (many) thin film transistors (TFTs) 173 corresponding to the pixel electrodes 172.

The glass substrate 171 is preferably made of quartz glass for the reasons described above.
The pixel electrode 172 drives the liquid crystal molecules of the liquid crystal layer 2 by charging and discharging with the transparent conductive film (common electrode) 14. The pixel electrode 172 is made of, for example, the same material as that of the transparent conductive film 14 described above.
The thin film transistor 173 is connected to the corresponding pixel electrode 172 in the vicinity. The thin film transistor 173 is connected to a control circuit (not shown) and controls a current supplied to the pixel electrode 172. Thereby, charging / discharging of the pixel electrode 172 is controlled.

A polarizing film (polarizing plate, polarizing film) 7 is disposed on the outer surface (upper surface in FIG. 1) side of the TFT substrate 17. Similarly, a polarizing film (polarizing plate, polarizing film) 8 is disposed on the outer surface (lower surface in FIG. 1) side of the counter substrate 12 for liquid crystal panel.
Examples of the constituent material of the polarizing films 7 and 8 include polyvinyl alcohol (PVA). Moreover, as a polarizing film, you may use what doped the said material with iodine.

As a polarizing film, what extended | stretched the film comprised with the said material to the uniaxial direction can be used, for example.
By disposing the polarizing films 7 and 8 as described above, it is possible to more reliably control the light transmittance by adjusting the energization amount.
The direction of the polarization axis of the polarizing films 7 and 8 is usually determined according to the alignment direction of the inorganic alignment films 3 and 4 (in the present embodiment, when a voltage is applied).

The TFT substrate 17 is provided with the inorganic alignment film 3 bonded to the inner surface side of the pixel electrode 172, and the liquid crystal panel counter substrate 12 is bonded to the inner surface side of the transparent conductive film 14 to be inorganic aligned. A membrane 4 is provided.
In the present embodiment, the TFT substrate 17 and the inorganic alignment film 3, and the liquid crystal panel counter substrate 12 and the inorganic alignment film 4 constitute the electronic device substrate of the present invention.

The liquid crystal layer 2 is interposed (provided) between the inorganic alignment film 3 and the inorganic alignment film 4. The liquid crystal layer 2 contains liquid crystal molecules (liquid crystal material), and the alignment of the liquid crystal molecules changes in accordance with charge / discharge of the pixel electrode 172.
Examples of liquid crystal molecules include phenylcyclohexane derivatives, biphenyl derivatives, biphenylcyclohexane derivatives, terphenyl derivatives, phenyl ether derivatives, phenyl ester derivatives, bicyclohexane derivatives, azomethine derivatives, azoxy derivatives, pyrimidine derivatives, dioxane derivatives, cubane derivatives, These derivatives include those obtained by introducing a fluorine-based substituent such as a fluoro group, a trifluoromethyl group, a trifluoromethoxy group, and a difluoromethoxy group.
In addition, as a liquid crystal molecule suitable for vertical alignment, the compound etc. which are represented by following Chemical formula 1-Chemical formula 3 etc. are mentioned, for example.

［式中、環Ａ〜Ｉは、それぞれ独立して、シクロヘキサン環またはベンゼン環を示し、Ｒ^１〜Ｒ^６は、それぞれ独立して、アルキル基、アルコキシ基またはフッ素原子のいずれかを示し、Ｘ^１〜Ｘ^１８は、それぞれ独立して、水素原子またはフッ素原子を示す。］

[Wherein, Rings A to I each independently represent a cyclohexane ring or a benzene ring, R ^{1 to} R ⁶ each independently represent an alkyl group, an alkoxy group or a fluorine atom, and X ^{1 to} X ¹⁸ each independently represent a hydrogen atom or a fluorine atom. ]

The inorganic alignment films (vertical alignment films or horizontal alignment films) 3 and 4 have a function of regulating the alignment state (when no voltage is applied) of the liquid crystal molecules contained in the liquid crystal layer 2.
The configuration of the inorganic alignment films 3 and 4 will be described in detail later.
In such a liquid crystal panel 1, normally, one microlens 113, one opening 131 of the black matrix 13 corresponding to the optical axis Q of the microlens 113, one pixel electrode 172, and such a pixel One thin film transistor 173 connected to the electrode 172 corresponds to one pixel.

Incident light L incident from the liquid crystal panel counter substrate 12 side passes through the microlens concave substrate 111 and is condensed when passing through the microlens 113, while opening the resin layer 115, the surface layer 114, and the black matrix 13. 131, the transparent conductive film 14, the liquid crystal layer 2, the pixel electrode 172, and the glass substrate 171 are transmitted.
At this time, since the polarizing film 8 is provided on the incident side of the microlens substrate 11, the incident light L is linearly polarized when the incident light L passes through the liquid crystal layer 2.

At this time, the polarization direction of the incident light L is controlled in accordance with the alignment state of the liquid crystal molecules in the liquid crystal layer 2. Therefore, by transmitting the incident light L transmitted through the liquid crystal panel 1 to the polarizing film 7, the luminance of the emitted light can be controlled.
As described above, the liquid crystal panel 1 includes the microlens 113, and the incident light L that has passed through the microlens 113 is collected and passes through the openings 131 of the black matrix 13.

On the other hand, the incident light L is shielded in a portion where the opening 131 of the black matrix 13 is not formed. Therefore, in the liquid crystal panel 1, unnecessary light is prevented from leaking from portions other than the pixels, and attenuation of the incident light L at the pixel portions is suppressed. For this reason, the liquid crystal panel 1 has a high light transmittance in the pixel portion.
As shown in FIG. 2, each of the inorganic alignment films 3 and 4 is provided on the inner surface side of the TFT substrate 17 or the liquid crystal panel counter substrate 12 and is uniaxially oriented (so that the major axis is oriented in a substantially constant direction. Are formed of a plurality of prismatic inorganic particles 5.

Since the inorganic alignment films 3 and 4 are the same, the inorganic alignment film 3 will be described as a representative.
Specifically, as shown in FIG. 2A, an underlayer in which a plurality of grooves 61 are provided on the inner surface of the TFT substrate 17 on the surface (upper surface) opposite to the TFT substrate 17 in a substantially parallel manner. 6 is joined. A plurality of inorganic particles 5 are disposed on the underlayer 6 so that the extending direction (longitudinal direction) of the grooves 61 and the major axis direction substantially coincide with each other (uniaxially oriented), whereby the inorganic orientation is achieved. A membrane 3 is constructed.

Here, the inorganic particles 5 are uniaxially oriented, as shown in FIG. 2, that the major axes of the majority of the inorganic particles 5 are oriented in substantially the same direction (the average of the major axes of the inorganic particles 5). The plurality of inorganic particles 5 may include inorganic particles 5 whose major axis direction is different from the majority of the particles.
Thus, the inorganic alignment film 3 has a high structural regularity because the inorganic particles 5 are regularly arranged.

With such a configuration, the liquid crystal molecules contained in the liquid crystal layer 2 are easily aligned vertically or horizontally depending on the type. Therefore, the inorganic alignment film 3 having such a configuration is useful for construction of a VA (Vertical Alignment) type or IPS (In Plane Switching) type liquid crystal panel.
In addition, since the inorganic alignment film 3 has high structural regularity, the alignment direction of the liquid crystal molecules is more accurately aligned in a certain direction (vertical direction or horizontal direction). As a result, the performance (characteristics) of the liquid crystal panel 1 can be improved.

In particular, when a sharp portion (corner portion) exists in the liquid crystal molecule, the liquid crystal molecules are easily aligned at the portion. However, in the present invention, the corner portion of the inorganic particles 5 appears on the upper surface side of the inorganic alignment film 3, so The molecular orientation is further improved.
The inorganic particles 5 are preferably composed of an inorganic oxide as a main material. In general, inorganic materials have superior chemical stability (light stability) compared to organic materials. For this reason, the inorganic alignment film 3 composed of an aggregate of inorganic particles 5 has particularly excellent light resistance as compared with the alignment film composed of an organic material.

In addition, the inorganic oxide constituting the inorganic particles 5 preferably has a relatively low dielectric constant. Thereby, image sticking etc. in liquid crystal panel 1 can be prevented more effectively.
Examples of such an inorganic oxide include silicon oxide such as SiO ₂ and SiO, Al ₂ O ₃ , MgO, ZnO _, TiO ₂ , TiO ₂ , In ₂ O ₃ , Sb ₂ O ₃ , and Ta ₂ O _5. , Y ₂ O ₃ , CeO ₂ , WO ₃ , CrO ₃ , GaO ₃ , HfO ₂ , Ti ₃ O ₅ , NiO, ZnO, Nb ₂ O ₅ , ZrO ₂ , Ta ₂ O _{5 and the} like. Of these, one or a combination of two or more can be used, and those containing SiO ₂ or Al ₂ O ₃ as the main component are particularly preferred. SiO ₂ and Al ₂ O ₃ have a particularly low dielectric constant and high light stability.

In addition to the inorganic oxide, the inorganic particles 5 include, for example, an inorganic nitride such as SiN, an inorganic fluoride such as MgF ₂ , etc. as a main material, and an inorganic oxide, inorganic nitride, and inorganic fluoride. The material which combined arbitrary 2 or more types of these can be comprised as a main material.
The aspect ratio of the inorganic particles 5 is not particularly limited, but is preferably about 0.03 to 0.5, and more preferably about 0.05 to 0.4. By using the inorganic particles 5 having such dimensions, the molecular anisotropy generated by the corners of the inorganic particles can be increased, so that the alignment state of the liquid crystal molecules is reliably controlled (controlled). The resulting inorganic alignment film 3 is obtained.

Here, the aspect ratio of the inorganic particles 5 is the maximum length in the cross section of the inorganic particles 5 (in the case of a rectangular shape as illustrated, the length of the diagonal line: S in FIG. 2). It means the value divided by the length in the direction (L in FIG. 2).
The specific value of the average length Lm (average value of L) in the major axis direction of the inorganic particles 5 is preferably about 80 to 300 nm, and more preferably about 100 to 200 nm.

The number of inorganic particles 5 disposed on the underlayer 6, that is, the number of inorganic particles 5 present per unit area of the upper surface of the underlayer 6 is 2 × 10 ⁹ to 2 × 10 ¹³ particles / cm ^2. Is preferably about 5 × 10 ⁹ to 1 × 10 ¹³ pieces / cm ² . Thereby, a sufficient number of corner portions of the inorganic particles 5 appear on the upper surface side of the inorganic alignment film 3. Therefore, liquid crystal molecules are more reliably aligned (vertical alignment or horizontal alignment) in such an inorganic alignment film 3. In addition, even if the number of the inorganic particles 5 to be disposed is increased beyond the upper limit, no further increase in the effect of regulating the alignment state of the liquid crystal molecules is observed.

  The average thickness of the inorganic alignment film 3 is not particularly limited, but is preferably about 15 to 150 nm, and more preferably about 20 to 50 nm. If the thickness of the inorganic alignment film 3 is too thin, depending on the number of inorganic particles 5 provided on the upper surface of the underlayer 6, the liquid crystal molecules directly contact the underlayer 6, and the underlayer 6 is made of a conductive material. When configured, there is a possibility of short-circuiting. On the other hand, when the inorganic alignment film 3 is too thick, the driving voltage of the liquid crystal panel 1 becomes high and the power consumption tends to increase.

  In addition, when the inorganic alignment film 3 (inorganic particles 5) is composed of an inorganic oxide as a main material, the inorganic alignment film 3 may be subjected to a hydroxyl group reduction treatment for reducing active hydroxyl groups present on the surface. Good. As a result, it is possible to prevent various impurities from adhering to the inorganic alignment film 3 and reacting with liquid crystal molecules over time, thereby reducing the anchoring force and easily causing an alignment abnormality.

Examples of the impurities include impurities and unreacted components in the sealing material that seals the liquid crystal layer 2, impurities and moisture in the liquid crystal layer, and dirt adhered in the manufacturing process.
Examples of the hydroxyl group reducing process include a process of chemically bonding an alcohol or a coupling agent to the inorganic alignment film 3.
Examples of the constituent material of the base layer 6 on which the inorganic particles 5 are disposed include the above-described inorganic materials, insulating organic materials such as polyimide and fluororesin, and one or more of them are included. A combination (for example, as a multi-layer stack) can be used.
In particular, the underlayer 6 is preferably composed of the same kind of material as the inorganic particles 5 as a main material. Thereby, adjustment of the dielectric constant etc. as a whole of the inorganic alignment film 3 and the foundation layer 6 is easy, and the fixing of the inorganic particles 5 onto the foundation layer 6 can be performed more easily and reliably.
In this case, the base layer 6 and the inorganic alignment film can also be called.

The average thickness of the underlayer 6 is not particularly limited, but is preferably about 20 to 200 nm, and more preferably about 30 to 100 nm.
The configuration (shape, dimensions, etc.) of the groove 61 provided on the upper surface of the base layer 6 will be described in detail later.
Such a liquid crystal panel (liquid crystal cell) 1 can be manufactured as follows, for example.

[1] First, a TFT substrate 17 manufactured by a known method and a counter substrate 12 for a liquid crystal panel are prepared.
[2] Next, the inorganic alignment film 3 is formed on the TFT substrate 17 so as to cover the pixel electrode 172 and the TFT 173, while the inorganic alignment film 4 is formed on the transparent conductive film 14 of the counter substrate 12 for liquid crystal panel.

Since the formation method (formation process) of the inorganic alignment films 3 and 4 is the same, the case where the inorganic alignment film 3 is formed will be described below as a representative.
3 to 5 are views for explaining a method for forming an inorganic alignment film, wherein (a) is a schematic cross-sectional view and (b) is a schematic top view. In the following description, the side of FIGS. 3A, 4A, and 5A is referred to as “upper”, and the lower side is referred to as “lower”.
This method for forming an inorganic alignment film has a [2-1] underlayer forming step, a [2-2] inorganic particle arranging step, and a [2-3] inorganic particle fixing step. Hereinafter, each of these steps will be described sequentially.

[2-1] Underlayer forming step (first step)
A base layer 6 is formed on the TFT substrate 17.
First, as shown in FIG. 3, a film 60 is formed on the TFT substrate 17.
The coating 60 is formed by, for example, chemical vapor deposition (CVD) such as plasma CVD, thermal CVD, or laser CVD, dry plating such as vacuum deposition, sputtering, or ion plating, electrolytic plating, immersion plating, electroless plating, or the like. It can be formed using a wet plating method, a thermal spraying method, a sheet material bonding, or the like.

Further, the coating 60 is applied (supplied) on the TFT substrate 17 by using various coating methods with a liquid material containing the constituent material of the underlayer 6 or its precursor, and then applied to this coating as necessary. On the other hand, it can also be formed by subjecting it to post-treatment (for example, heating, irradiation with infrared rays, application of ultrasonic waves, etc.).
Here, the coating method includes, for example, a spin coating method, a casting method, a micro gravure coating method, a gravure coating method, a bar coating method, a roll coating method, a wire bar coating method, a dip coating method, a spray coating method, and a screen printing method. Flexographic printing method, offset printing method, ink jet printing method and the like can be used.

Next, as shown in FIG. 4, a plurality of grooves 61 are formed on the upper surface of the coating 60 (the surface opposite to the TFT substrate 17) so as to be substantially parallel. Thereby, the underlayer 6 is obtained.
The groove 61 is suitably applied by a transfer method in which the shape of the convex portion is transferred by pressing a mold (base material) on which the pattern of the groove 61 and the convex portion (ridge) of the reverse pattern are formed on the upper surface of the coating 60. Can be formed. By using such a transfer method, it is possible to form the fine grooves 61 uniformly in the surface direction with high accuracy. Further, the transfer method is preferable because the operation is easy and the reproducibility is high.

The formation of the convex portion (concave / convex pattern) on the surface of the mold can be performed by combining, for example, a photolithography method and an etching method. Thereby, a fine uneven | corrugated pattern can be precisely formed in the pressing surface of a type | mold. By using such a mold, it is possible to obtain the underlayer 6 in which the fine grooves 61 are precisely formed.
For the etching method, for example, one or more of physical etching methods such as plasma etching, reactive ion etching, beam etching, and light-assisted etching, and chemical etching methods such as wet etching are combined. Can be used.

The groove 61 may be formed by directly processing the coating 60 by combining such a photolithography method and an etching method.
The cross-sectional shape of the groove 61 is not particularly limited, and examples thereof include a polygonal shape such as a triangle, a quadrangle, and a pentagon, a semicircular shape, and a semielliptical shape.
In particular, as shown in FIG. 4A and the like, the cross-sectional shape of the groove 61 is preferably one in which the bottom surface is inclined in one direction (in the configuration shown, a right triangle having the bottom surface as a hypotenuse). In other words, the shape near the upper surface of the underlayer 6 is preferably a sawtooth shape in the cross section. The groove 61 having such a cross-sectional shape has an inclined bottom surface and an inner side surface that is substantially perpendicular to the upper surface of the TFT substrate 17, whereby the underlying layer 60 is formed in the next step [2-2]. The inorganic particles 5 supplied above roll and move along the inclined surface to reach the inside of the groove 61, and the movement of the inorganic particles 5 is restricted by coming into contact with the inner surface or the inorganic particles 5 already existing in the groove 61. Due to such behavior, the inorganic particles 5 are efficiently arranged so that the major axis direction thereof substantially coincides with the extending direction of the groove 61 (uniaxially oriented).

The width (W in FIG. 4), pitch (P in FIG. 4), and depth (D in FIG. 4) of the groove 61 are appropriately set according to the size of the inorganic particles 5, the size of the liquid crystal molecules, and the like. The width W of the groove 61 referred to here is the width of the opening of the groove 61 facing the upper surface of the foundation layer 6, and the depth D is from the deepest position of the groove 61 to the upper surface of the foundation layer 6. It is height.
First, the width W of the groove 61 is set to be smaller than the average length Lm (average value of L) of the inorganic particles 5 in the major axis direction. Accordingly, in the next step [2-2], the inorganic particles 5 are prevented from being accommodated in the grooves 61 with the major axes thereof being perpendicular to the extending direction of the grooves 61, or the number thereof is reduced. be able to. As a result, most of the inorganic particles 5 can be uniaxially oriented. For this reason, the function of regulating the alignment state of the liquid crystal molecules is further improved in the obtained inorganic alignment film 3.

  In addition, the pitch P of the grooves 61 is also preferably set smaller than the average length L of the inorganic particles 5 in the major axis direction. Thereby, the number of inorganic particles 5 that are uniaxially oriented can be increased simply by supplying the inorganic particles 5 onto the underlayer 6. For example, even when some inorganic particles 5 are arranged in a direction different from the extending direction of the grooves 61, the inorganic particles 5 straddle the grooves 61 and the protrusions (portions other than the grooves 61). Or a state straddling between adjacent convex portions and convex portions, that is, a relatively unstable state. For this reason, in the next step [2-2], the inorganic particles 5 are easily uniaxially oriented.

Specifically, the ratio W / Lm between the width W of the groove 61 and the average length Lm in the major axis direction of the inorganic particles 5 is preferably about 0.1 to 1.0, and is preferably 0.2 to 0. More preferably, it is about .9. The ratio P / Lm between the pitch P of the grooves and the average length Lm in the major axis direction of the inorganic particles 5 is preferably about 0.1 to 2.0, and about 0.2 to 1.5. More preferably. By setting W / Lm and P / Lm within the above ranges, the inorganic particles 5 can be more easily and reliably uniaxially oriented in the next step [2-2].
Further, the ratio D / Sm between the depth D of the groove 61 and the average length Sm of the inorganic particles 5 in the minor axis direction (average value of S) is preferably about 0.5 to 20, and 0.8 More preferably, it is about -10. By setting D / Sm within the above range, it is possible to obtain the inorganic alignment film 3 in which these are surely uniaxially aligned while using the minimum amount of inorganic particles 5.

[2-2] Inorganic particle arrangement step (second step)
Next, the inorganic particles 5 are arranged on the base layer 6 so that the major axis direction thereof substantially coincides with the extending direction of the grooves 61.
First, inorganic particles 5 are prepared. The inorganic particles 5 may be produced by any method, but can be suitably obtained by pulverizing an inorganic film formed by oblique deposition. According to such a method, the inorganic particles 5 can be produced easily, reliably and with good yield. Moreover, it is easy to obtain the inorganic particles 5 having the aspect ratio as described above.

When the inorganic particles 5 are produced by forming the inorganic film by the oblique vapor deposition method, specifically, the following is performed.
In the oblique vapor deposition method, as shown in FIG. 6, a vapor deposition source 810 containing an inorganic material (raw material) 800 and an inorganic particle production substrate 170 are installed in a chamber (not shown). A slit plate 820 in which a slit 821 is formed is disposed.

The inorganic particle production substrate 170 is fixed to the driving device 830, and can be translated while maintaining a vapor deposition angle (an angle θ _{2 in} FIG. 6) described later. The inorganic particle production substrate 170 can be heated by a heating means (not shown).
In this state, the inorganic material 800 is heated and evaporated (vaporized) by a heating means (not shown) provided in the vapor deposition source 810. Then, the evaporated particles of the inorganic material 800 are allowed to reach the upper surface (the surface on which the inorganic film is formed) of the inorganic particle production substrate 170 through the slits 821 of the slit plate 820.

At this time, the inorganic particle production substrate 170 is heated to a predetermined temperature by the heating means described above, and is translated by the driving device 830 at a predetermined speed.
As a result, an inorganic film having a structure in which a large number of prismatic particles (column structure) grown in an oblique direction are gathered on the inorganic particle production substrate 170 is obtained.
Here, by appropriately setting the vapor deposition angle (angle θ _{2 in} FIG. 6) at which the inorganic material (evaporated particles) 800 evaporated from the evaporation source reaches the upper surface of the inorganic particle production substrate 170, the prismatic particles The angle with respect to the upper surface of the TFT substrate 17 can be adjusted.

The degree of vacuum in the chamber (evaporation apparatus) is preferably about 1 × 10 ⁻⁵ to 1 × 10 ⁻² Pa, and more preferably about 5 × 10 ^{−5 to} 5 × 10 ⁻³ Pa.
Moreover, it is preferable that the substrate temperature at the time of vapor deposition is about 20-150 degreeC, and it is more preferable that it is about 50-120 degreeC.
The deposition rate is preferably about 2.5 to 25 liters / second, more preferably about 4 to 20 liters / second.

In addition, the vapor deposition angle θ ₂ is preferably about 45 to 85 °, and more preferably about 50 to 75 °.
Further, the azimuth angle between the vapor deposition source 810 and the inorganic particle production substrate 170 (angle θ _{1 in} FIG. 6), the separation distance between the inorganic particle production substrate 170 and the vapor deposition source 810 (A in FIG. 6), the slit plate By appropriately setting the thickness of 820 (T in FIG. 6), the width of the slit 821 (B in FIG. 6), and the like, the size of the obtained inorganic particles 5 can be adjusted.

The inorganic particles 5 are obtained by peeling off and crushing the inorganic film thus obtained from the substrate.
As the peeling / pulverizing method, for example, first, mechanically peeling with a sharp blade, or agglomerated solid of inorganic particles peeled off by ultrasonic vibration is added to a grinding medium such as a ball mill, attritor, sand mill, or bead mill. And wet pulverization method.

Next, the inorganic particles 5 are supplied onto the underlayer 6 (upper surface).
The supply of the inorganic particles 5 may be performed by directly spreading the inorganic particles 5 on the base layer 6, and a dispersion liquid in which the inorganic particles 5 are dispersed in an appropriate dispersion medium is applied (supply) on the base layer 6. After that, the dispersion medium may be removed.
Examples of the method for supplying the dispersion include spin coating, casting, micro gravure coating, gravure coating, bar coating, roll coating, wire bar coating, dip coating, spray coating, Screen printing, flexographic printing, offset printing, ink jet printing, and the like can be used.

As shown in FIG. 5, the inorganic particles 5 supplied in this way are arranged in a state where a part of the long axis direction substantially coincides with the extending direction of the groove 61, and the rest of the inorganic particles 5 has the long axis direction in the groove 61. It is arranged in a state in which it is directed in a direction different from the extending direction.
Next, vibration is applied to the TFT substrate 17. Thereby, the inorganic particles 5 are rearranged so as to be in the most stable state. That is, among the inorganic particles 5, those arranged with the major axis direction substantially coincident with the extending direction of the groove 61 maintain that state, while the major axis direction thereof is the extending direction of the groove 61. Those arranged in a state in which the direction is different from the direction of movement moves so as to change the direction by vibration, and the major axis direction thereof substantially coincides with the extending direction of the groove 61. As a result, as shown in FIG. 2, most of the inorganic particles 5 are in a state in which the major axis direction substantially coincides with the extending direction of the groove 61, that is, in a uniaxially oriented state.

The frequency of vibration applied to the TFT substrate 17 is preferably about 1 KHz to 300 KHz, and more preferably about 10 KHz to 100 KHz. By giving such a vibration of the frequency, the inorganic particles 5 which have not been oriented can be efficiently uniaxially oriented while preventing the inorganic particles 5 once oriented from moving in an unintentional direction.
As a method for applying vibration to the TFT substrate 17, for example, a substrate on which inorganic particles are arranged on an ultrasonic vibrator is brought into contact and rearranged.

The application of vibration to the TFT substrate 17 may be performed at the same time when the inorganic particles 5 are supplied onto the TFT substrate 17.
In addition, when the inorganic particles 5 are already uniaxially oriented when the inorganic particles 5 are supplied onto the TFT substrate 17, the application of vibration to the TFT substrate 17 is omitted. You can also

[2-3] Inorganic particle fixing step Next, the inorganic particles 5 arranged (arranged) on the underlayer 6 are fixed on the underlayer 6 so as to maintain this state (uniaxially oriented state). . Thereby, peeling of the inorganic alignment film 3 from the TFT substrate 17 can be prevented.
The inorganic particles 5 may be fixed by, for example, melting the vicinity of the upper surface of the underlayer 6 and then solidifying it, but it is preferable to use a fixing agent. By fixing the inorganic particles 5 using a fixing agent, the inorganic particles 5 are fixed on the base layer 6 while preventing the orientation state of the inorganic particles 5 from being disturbed (broken). Can do.

In this case, the fixing agent used preferably has a function of connecting (crosslinking) the inorganic particles 5 to each other. Thereby, the mechanical strength of the inorganic alignment film 3 can be improved, and peeling from the TFT substrate 12 can be reliably prevented.
Examples of such a fixing agent include Ti, Li, Si, Na, K, Mg, Ca, St, Ba, Al, In, Ge, Bi, Fe, Cu, Y, Zr, and Ta as metal elements. What has a coupling agent which has as a main component is preferable, and especially what has a silane type and titanate type coupling agent as a main component is used suitably. The coupling agent is preferable because the same molecule can perform both functions of fixing the inorganic particles 5 on the base layer 6 and connecting the inorganic particles 5 to each other.

  Among these, silane coupling agents include those having a vinyl group such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycol. Those having an epoxy group such as sidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, Those having a methacryloxy group such as 3-methacryloxypropylmethyldiethoxysilane and 3-methacryloxypropyltriethoxysilane, those having an acryloxy group such as 3-acryloxypropyltrimethoxysilane, N-2 (amino Ethyl) 3-aminopropylmethyldimethoxysilane, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- Of triethoxysilyl-N- (1,3-dimethylbutylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane Those having an amino group such as hydrochloride, special aminosilane, those having a ureido group such as 3-ureidopropyltriethoxysilane, those having a chloropropyl group such as 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxy Silane, 3-mercaptopro Those having a mercapto group such as Le trimethoxysilane, those having a sulfide group such as bis (triethoxysilylpropyl) tetrasulfide, such as those having an isocyanate group such as 3-isocyanate propyl triethoxysilane and the like.

In addition, polyhydric alcohols such as polyethylene glycol and polypropylene glycol can also be used as the fixing agent.
These fixing agents can be supplied onto the inorganic particles 5 (underlying layer 6) as they are or as a solution dissolved in an appropriate solvent (diluent).
In the case of a solution, examples of the solvent include alcohols such as isopropyl alcohol, ethyl alcohol, and methyl alcohol, dimethylformamide, hexane, tetrahydrofuran, toluene, pyridine, triethylamine, water, and acetone.

As a method for supplying the fixing agent onto the inorganic particles 5, for example, a method of applying a fixing agent or a solution onto the inorganic particles 5 (application method), a fixing agent or a solution is showered on the inorganic particles 5. And the like (spraying method) and the like.
Although the supply amount of the fixing agent is not particularly limited, it is preferably about 0.001 to 0.2 g, more preferably about 0.01 to 0.1 g with respect to 1 g of the inorganic particles. By making the supply amount of the fixing agent within the above range, the inorganic particles 5 can be fixed to the underlayer 6 or the inorganic particles 5 while suitably preventing the excessive fixing agent from adversely affecting the function of the liquid crystal layer 2. Connection between each other can be performed reliably.
Note that the fixing agent may be mixed with the inorganic particles 5 in advance, and this mixture may be supplied onto the base layer 6.

Next, the inorganic particles 5 are fixed on the base layer 6 via a fixing agent, and a treatment corresponding to the fixing agent is performed so that the inorganic particles 5 are connected to each other.
For example, when a silane coupling agent is used as the fixing agent, the reactive group of the silane coupling agent reacts with the functional group on the surface of the underlayer 6 and the functional group on the surface of the inorganic particles 5 by heating. Thus, a siloxane bond is formed. As a result, the inorganic particles 5 are fixed on the base layer 6 and the inorganic particles 5 are connected to each other.

The temperature of this heat treatment is preferably about 90 to 200 ° C, more preferably about 110 to 180 ° C.
In addition to fixing, the fixing treatment can be performed by, for example, exposing the silane coupling agent to water vapor.
According to the method as described above, the inorganic particles 5 are supplied onto the base layer 6 on which the grooves 61 are formed, and are aligned by applying vibration, so that the uniform and homogeneous inorganic alignment film 3 can be formed easily and efficiently. be able to.

In particular, according to this method, even when the TFT substrate 17 is enlarged, the uniform and homogeneous inorganic alignment film 3 can be reliably formed in the same manner. That is, the method for manufacturing an electronic device substrate of the present invention is suitable for application to the case where an inorganic alignment film is formed on a large substrate.
Through the above steps, a TFT substrate 17 (an electronic device substrate of the present invention) provided with the inorganic alignment film 3 on one surface side is obtained.

[3] Next, the inorganic alignment films 3 and 4 are opposed to each other, and the TFT substrate 17 and the liquid crystal panel counter substrate 12 are bonded to each other via a sealing material (not shown), and the void formed thereby is sealed. After injecting liquid crystal (liquid crystal composition) into the gap from a hole (not shown), the sealing hole is closed.
[4] Next, polarizing films 7 and 8 are bonded to the outer surfaces of the TFT substrate 17 and the counter substrate 12 for liquid crystal panel, respectively.

As described above, the liquid crystal panel 1 shown in FIG. 1 is obtained.
In such a liquid crystal panel 1, structural regularity is imparted to the inorganic alignment films 3 and 4 by the finely shaped inorganic particles 5 arranged (orientated) so as to substantially coincide with the extending direction of the grooves 61. Moreover, since the inorganic particle 5 is excellent in light resistance (durability) and heat resistance, its structural regularity can be maintained over a long period of time.

Therefore, the liquid crystal panel 1 can accurately regulate the alignment (vertical alignment or horizontal alignment) state of the liquid crystal molecules, and can stably obtain excellent characteristics (display characteristics).
In the liquid crystal panel 1, a TFT substrate is used as the liquid crystal drive substrate. However, a liquid crystal drive substrate other than the TFT substrate, such as a TFD substrate or an STN substrate, may be used as the liquid crystal drive substrate.

Next, an electronic apparatus (liquid crystal projector) using the liquid crystal panel 1 will be described as an example of the electronic apparatus of the present invention.
FIG. 7 is a diagram schematically showing an optical system of the electronic apparatus (projection display device) of the present invention.
As shown in the figure, the projection display apparatus 300 includes a light source 301, an illumination optical system including a plurality of integrator lenses, a color separation optical system (light guide optical system) including a plurality of dichroic mirrors, and the like. A liquid crystal light valve (liquid crystal optical shutter array) 24 corresponding to red (liquid crystal optical shutter array) 24 corresponding to red, a liquid crystal light valve (liquid crystal optical shutter array) 25 corresponding to green (liquid crystal optical shutter array) 25, and a liquid crystal light valve corresponding to blue (for blue) ) A liquid crystal light valve (liquid crystal light shutter array) 26, a dichroic prism (color combining optical system) 21 formed with a dichroic mirror surface 211 reflecting only red light and a dichroic mirror surface 212 reflecting only blue light, and projection And a lens (projection optical system) 22.

  The illumination optical system includes integrator lenses 302 and 303. The color separation optical system includes mirrors 304, 306, and 309, a dichroic mirror 305 that reflects blue light and green light (transmits only red light), a dichroic mirror 307 that reflects only green light, and a dichroic that reflects only blue light. A mirror (or a mirror that reflects blue light) 308 and condenser lenses 310, 311, 312, 313, and 314 are included.

The liquid crystal light valve 25 includes the liquid crystal panel 1 described above. The liquid crystal light valves 24 and 26 have the same configuration as the liquid crystal light valve 25. The liquid crystal panels 1 included in these liquid crystal light valves 24, 25 and 26 are connected to driving circuits (not shown).
In the projection display device 300, the dichroic prism 21 and the projection lens 22 constitute the optical block 20. The optical block 20 and liquid crystal light valves 24, 25 and 26 fixedly installed on the dichroic prism 21 constitute a display unit 23.

Hereinafter, the operation of the projection display apparatus 300 will be described.
White light (white light beam) emitted from the light source 301 passes through the integrator lenses 302 and 303. The light intensity (luminance distribution) of the white light is made uniform by the integrator lenses 302 and 303. The white light emitted from the light source 301 preferably has a relatively high light intensity. Thereby, the image formed on the screen 320 can be made clearer. In addition, since the projection display device 300 uses the liquid crystal panel 1 having excellent light resistance, excellent long-term stability can be obtained even when the intensity of light emitted from the light source 301 is large.

The white light transmitted through the integrator lenses 302 and 303 is reflected to the left side in FIG. 7 by the mirror 304, and blue light (B) and green light (G) of the reflected light are respectively reflected by the dichroic mirror 305 in FIG. The red light (R) is reflected downward and passes through the dichroic mirror 305.
The red light transmitted through the dichroic mirror 305 is reflected downward in FIG. 7 by the mirror 306, and the reflected light is shaped by the condenser lens 310 and enters the liquid crystal light valve 24 for red.

Green light out of blue light and green light reflected by the dichroic mirror 305 is reflected to the left side in FIG. 7 by the dichroic mirror 307, and the blue light passes through the dichroic mirror 307.
The green light reflected by the dichroic mirror 307 is shaped by the condenser lens 311 and enters the green liquid crystal light valve 25.

Further, the blue light transmitted through the dichroic mirror 307 is reflected on the left side in FIG. 7 by the dichroic mirror (or mirror) 308, and the reflected light is reflected on the upper side in FIG. 7 by the mirror 309. The blue light is shaped by the condenser lenses 312, 313, and 314, and enters the liquid crystal light valve 26 for blue.
As described above, the white light emitted from the light source 301 is separated into the three primary colors of red, green, and blue by the color separation optical system, and is guided to the corresponding liquid crystal light valve and enters.

At this time, each pixel (the thin film transistor 173 and the pixel electrode 172 connected thereto) of the liquid crystal panel 1 included in the liquid crystal light valve 24 is subjected to switching control by a driving circuit (driving means) that operates based on a red image signal. (On / off), ie modulated.
Similarly, green light and blue light enter the liquid crystal light valves 25 and 26, respectively, and are modulated by the respective liquid crystal panels 1, thereby forming a green image and a blue image. At this time, each pixel of the liquid crystal panel 1 included in the liquid crystal light valve 25 is switching-controlled by a drive circuit that operates based on a green image signal, and each pixel of the liquid crystal panel 1 included in the liquid crystal light valve 26 is used for blue color. Switching control is performed by a drive circuit that operates based on the image signal.

As a result, red light, green light, and blue light are modulated by the liquid crystal light valves 24, 25, and 26, respectively, and a red image, a green image, and a blue image are formed, respectively.
The red image formed by the liquid crystal light valve 24, that is, the red light from the liquid crystal light valve 24, enters the dichroic prism 21 from the surface 213, is reflected by the dichroic mirror surface 211 to the left in FIG. The light passes through the surface 212 and exits from the exit surface 216.

Further, the green image formed by the liquid crystal light valve 25, that is, the green light from the liquid crystal light valve 25, enters the dichroic prism 21 from the surface 214, passes through the dichroic mirror surfaces 211 and 212, and exits. The light exits from the surface 216.
Further, the blue image formed by the liquid crystal light valve 26, that is, the blue light from the liquid crystal light valve 26 is incident on the dichroic prism 21 from the surface 215, and is reflected to the left side in FIG. 7 by the dichroic mirror surface 212. The light passes through the dichroic mirror surface 211 and exits from the exit surface 216.

  Thus, the light of each color from the liquid crystal light valves 24, 25 and 26, that is, the images formed by the liquid crystal light valves 24, 25 and 26 are synthesized by the dichroic prism 21, thereby forming a color image. Is done. This image is projected (enlarged projection) on the screen 320 installed at a predetermined position by the projection lens 22.

The projection display device 300 of the present embodiment has three liquid crystal panels, and the liquid crystal panel 1 is applied to all of them, but at least one of them is the liquid crystal panel 1. I just need it. In this case, it is preferable to apply the liquid crystal panel 1 to at least a liquid crystal light valve for blue.
In addition to the projection display device of FIG. 7, the electronic apparatus of the present invention includes, for example, a personal computer (mobile personal computer), a mobile phone (including PHS), a digital still camera, a television, a video camera, a view Finder type, monitor direct-view type video tape recorder, car navigation system, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, video phone, TV monitor for crime prevention, electronic Devices equipped with binoculars, POS terminals, touch panels (for example, cash dispensers of financial institutions, automatic ticket vending machines), medical devices (for example, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiographs, ultrasonic diagnostic devices, endoscopes) Display device), fish finder, various measuring instruments, instruments (eg, vehicle) Aircraft, gauges of a ship), such as flight simulators, and the like. Needless to say, the present invention can be applied to a liquid crystal panel included in the display unit and the monitor unit of these various electronic devices.

As mentioned above, although the manufacturing method of the board | substrate for electronic devices of this invention, the board | substrate for electronic devices, a liquid crystal panel, and an electronic device were demonstrated based on embodiment of illustration, this invention is not limited to this.
For example, in the method for manufacturing an electronic device substrate of the present invention, one or more arbitrary steps can be added.

In addition, in the electronic device substrate, the liquid crystal panel, and the electronic apparatus according to the present invention, the configuration of each part can be replaced with any configuration that exhibits the same function, and any configuration can be added. it can.
The electronic device substrate of the present invention is not limited to application to the liquid crystal panel having the configuration described in the above embodiment. For example, a configuration in which a pair of electrodes for applying a voltage to the liquid crystal layer is provided on the same substrate. It can be applied to LCD panels.
Furthermore, the electronic device substrate of the present invention is not limited to application to a liquid crystal panel, and may be applied to, for example, an organic transistor. In this case, by using such an electronic device substrate, the orientation direction of the organic semiconductor layer can be regulated to improve carrier mobility.

Next, specific examples of the present invention will be described.
1. Preparation of inorganic particles First, set to prepare a silicon substrate having a diameter of 8 inches (substrate for producing inorganic particles), the substrate surface in a chamber of a vacuum deposition apparatus with respect to the deposition source, the angle theta ₁ is 50 ° did. Also, the thickness of the slit plate is 1.5 cm, the width of the slit is 2.0 cm, the deposition angle θ ₂ is 60 °, the deposition distance is 1.5 m, and the operating speed (moving speed) of the silicon substrate is 2.5 cm / Minutes.

Next, the inside of the chamber was depressurized (1 × 10 ⁻⁴ Pa), and SiO ₂ was obliquely vapor-deposited at a silicon substrate temperature of 110 ° C. and a vapor deposition rate of 10 Å / second to form a SiO ₂ oblique vapor-deposited film.
In addition, the obtained SiO ₂ oblique deposition film had an angle of about 70 ° with respect to the upper surface of the silicon substrate and an average thickness of 40 nm.
Then, the SiO ₂ oblique deposition film was peeled off from the silicon substrate and pulverized to obtain prismatic (rectangular) SiO ₂ particles.
The size of the prismatic SiO ₂ particles was 110 nm long × 20 nm long × 15 nm wide, and the aspect ratio was about 0.23.

2. Production of liquid crystal panel (Example)
<1> First, a TFT substrate and a counter substrate for a liquid crystal panel shown in FIG. 1 were prepared, and SiO ₂ was deposited on each substrate by an evaporation method to form a SiO ₂ film. The average thickness of the SiO ₂ film was 100 nm.

<2> Next, a mold was prepared in which convex portions (projections) having a right-angled triangular cross section were provided substantially in parallel. Then, it superimposed the mold SiO ₂ film, by pressing against the SiO ₂ film was transferred the type of uneven pattern on the SiO ₂ film.
As a result, a base layer in which grooves having a right-angled triangular cross-section were provided substantially in parallel was obtained.
The dimensions of the grooves were an average width of 80 nm, an average depth of 60 nm, and an average pitch of 100 nm.

<3> Next, SiO ₂ particles were spread on the underlayer, and the substrate was vibrated at a frequency of 20 KHz.
Thereby, most of the SiO ₂ particles were arranged so that the major axis direction thereof substantially coincided with the extending direction of the groove.
<4> Next, a solution obtained by dissolving 1 g of a silane coupling agent represented by CH ₃ (CH ₂ ) ₅ Si (OCH ₃ ) ₃ (manufactured by Shin-Etsu Chemical Co., Ltd., “KBM3063”) in 200 g of isopropyl alcohol, After being supplied onto the SiO ₂ particles by a spray coating method, it was heated at 150 ° C. for 2 hours.

Thereby, while fixing inorganic particles on a base layer, inorganic particles were connected and the inorganic oriented film was obtained.
The number of SiO ₂ particles supplied on the underlayer was 1 × 10 ¹⁰ particles / cm ² , and the average thickness of the obtained inorganic alignment film was 70 nm.
Moreover, the supply amount of the silane coupling agent was 0.05 g with respect to 1 g of SiO ₂ particles.

  <5> Next, the substrate on which each inorganic alignment film is formed is placed on the bottom of a Teflon container (“Teflon” is a registered trademark) with the inorganic alignment film facing upward, Water was injected until the inorganic alignment film was immersed. And this container was carried in in the vacuum chamber, and the inside of the vacuum chamber was pressure-reduced (1 Torr), and the gas of the clearance gap between inorganic particles was substituted with the ultrapure water. Thereafter, in this state, ultrasonic cleaning was performed for 10 minutes. Subsequently, the inside of the vacuum chamber was returned to atmospheric pressure, and ultrapure water was discharged from the drain. Again, the inside of the vacuum chamber was heated at 200 ° C. for 90 minutes while reducing the pressure, and then allowed to cool. Thereby, the substrate with an inorganic alignment film was washed.

<6> Next, a thermosetting adhesive (“ML3804P” manufactured by Nippon Kayaku Co., Ltd.) is formed along the outer peripheral portion of the inorganic alignment film of the substrate with one inorganic alignment film, except for the portion corresponding to the liquid crystal injection port. ) Was printed. This thermosetting adhesive is mainly composed of an epoxy resin mixed with silica spheres having a diameter of about 3 μm. And the solvent in a thermosetting adhesive was removed by heating the board | substrate with an inorganic alignment film at 80 degreeC for 10 minute (s).
<7> Next, the substrate with the inorganic alignment film on which the thermosetting adhesive is printed and the substrate with the other inorganic alignment film are set to the inner side of the inorganic alignment film, and the alignment direction of the inorganic alignment film is It arrange | positioned so that it might become 180 degrees. Then, the two substrates were bonded together by heating at 140 ° C. for 1 hour while being pressure-bonded with a clip.

<8> Next, a fluorine-based positive dielectric anisotropic liquid crystal (manufactured by Merck & Co., "MJ99247") was injected into the space between the inorganic alignment films from the liquid crystal injection port by a vacuum injection method. Thereafter, an acrylic UV adhesive (“LPD-204” manufactured by Henkel Japan Co., Ltd.) is supplied to the liquid crystal injection port, and the liquid crystal injection port is sealed by irradiating with a wavelength of 365 nm at 3000 mJ / cm ^2. did.
<9> Polyvinyl alcohol films (polarizing films) stretched in a uniaxial direction were bonded to the outer surfaces of the two substrates, respectively.
Through the above steps, a horizontal alignment type liquid crystal panel was manufactured.

(Comparative Example 1)
A liquid crystal panel was produced in the same manner as in the above example except that the steps <3> and <4> were omitted and the base layer was used as an inorganic alignment film.
(Comparative Example 2)
Instead of the above steps <1> to <4>, a polyimide film was formed on each of the two substrates, and a rubbing treatment was applied thereto to form an organic alignment film. A liquid crystal panel was manufactured.
The average thickness of the organic alignment film was 50 nm.

3. Evaluation 3-1. Measurement of Pretilt Angle The pretilt angle was measured for the liquid crystal panels produced in the examples and comparative examples.
The pretilt angle was measured by a crystal rotation method in which light was incident on each liquid crystal panel while changing the incident angle, and the angle change of the reflected light was observed.
As a result, the liquid crystal panel manufactured in the example had a pretilt angle of about 7 °. On the other hand, the pretilt angles of the liquid crystal panels manufactured in Comparative Example 1 and Comparative Example 2 were about 0 ° and about 5 °, respectively.

3-2. Light Resistance Test A light resistance test was performed on the liquid crystal panels produced in the examples and comparative examples.
In this light resistance test, each liquid crystal panel was set as a blue liquid crystal light valve of the projection display device shown in FIG. 7, and the light source was continuously lit while maintaining the surface temperature of the liquid crystal cell at 55 ° C. The time until display abnormality occurred was measured.
A 130 WUHP lamp (manufactured by Philips) was used as the light source.
The results are shown in Table 1 below.
Table 1 shows that the time until a display abnormality occurs in the liquid crystal panel manufactured in Comparative Example 2 is “1”, and a display abnormality occurs in the liquid crystal panel manufactured in Example and Comparative Example 1. Each time is shown as a relative value.

As shown in Table 1, it was revealed that the liquid crystal panel manufactured in the example has a longer time until display abnormality occurs than the liquid crystal panel manufactured in Comparative Example 2.
Further, a liquid crystal panel was produced in the same manner as described above except that an inorganic alignment film was formed of Al ₂ O ₃ instead of SiO ₂ , and evaluation was performed in the same manner as above. Obtained.

It is a longitudinal cross-sectional view which shows typically embodiment of the liquid crystal panel of this invention. It is a figure which expands and shows typically the inorganic alignment film with which the liquid crystal panel shown in FIG. 1 is provided. It is a figure for demonstrating the formation method of an inorganic alignment film. It is a figure for demonstrating the formation method of an inorganic alignment film. It is a figure for demonstrating the formation method of an inorganic alignment film. It is a schematic diagram which shows the structure of the vacuum evaporation system used for preparation of an inorganic particle. It is a figure which shows typically the optical system of the projection type display apparatus to which the electronic device of this invention is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid crystal panel 2 ... Liquid crystal layer 3, 4 ... Inorganic alignment film 5 ... Inorganic particle 6 ... Underlayer 61 ... Groove 60 ... Film 7, 8 ... Polarizing film 11 ... Microlens substrate 111 …… Substrate with concave portion for microlens 112 …… Concavity 113 …… Microlens 114 …… Surface layer 115 …… Resin layer 12 …… Counter substrate for liquid crystal panel 13 …… Black matrix 131 …… Opening 14 …… Transparent conductive film 17 ... TFT substrate 171 ... Glass substrate 172 ... Pixel electrode 173 ... Thin film transistor 170 ... Substrate for preparing inorganic particles 800 ... Inorganic material (raw material) 810 ... Deposition source 820 ... Slit plate 821 ... Slit 830 ... ... Drive device 300 ... Projection type display device 301 ... Light source 302, 303 ... Integral lens 304,306,309 ... Mira -305, 307, 308 ... Dichroic mirror 310-314 ... Condensing lens 320 ... Screen 20 ... Optical block 21 ... Dichroic prism 211, 212 ... Dichroic mirror surface 213-215 ... Surface 216 ... Outgoing Surface 22 …… Projection lens 23 …… Display unit 24-26 …… Liquid crystal light valve

Claims (17)

An electronic device substrate comprising: a substrate; and an inorganic alignment film formed of a plurality of prismatic inorganic particles provided on one surface side of the substrate and disposed so that a major axis thereof is oriented in a substantially constant direction. A method of manufacturing comprising:
A first step of forming a plurality of grooves having a width smaller than the average length of the inorganic particles in the major axis direction on the substrate, a base layer provided on a surface opposite to the substrate, substantially in parallel,
A second step of supplying the inorganic particles on the underlayer and arranging the inorganic particles so that the major axis direction of the inorganic particles and the extending direction of the grooves substantially coincide with each other. A method for manufacturing a device substrate.   2. The method of manufacturing an electronic device substrate according to claim 1, wherein, in the first step, the groove is formed by being transferred from a base material.   The method of manufacturing a substrate for an electronic device according to claim 1, wherein a bottom surface of the groove is inclined in one direction.   4. The method of manufacturing a substrate for an electronic device according to claim 1, wherein a pitch of the grooves is smaller than an average length of the inorganic particles in a major axis direction.   The method for manufacturing a substrate for an electronic device according to any one of claims 1 to 4, wherein the underlayer is composed of a material same as that of the inorganic particles as a main material. 6. The electronic device according to claim 1, wherein in the second step, the number of the inorganic particles supplied onto the base layer is 2 × 10 ⁹ to 2 × 10 ¹³ particles / cm ² . A method for manufacturing a substrate.   The method for manufacturing a substrate for an electronic device according to claim 1, wherein in the second step, the inorganic particles are arranged by applying vibration to the substrate.   The method for manufacturing a substrate for an electronic device according to claim 1, wherein an aspect ratio of the inorganic particles is 0.03 to 0.5. The method for manufacturing a substrate for an electronic device according to any one of claims 1 to 8, wherein the inorganic particles are composed of SiO ₂ or Al ₂ O ₃ as a main material.   The method for manufacturing a substrate for an electronic device according to claim 1, wherein the inorganic particles are obtained by pulverizing an inorganic film formed by oblique deposition.   The manufacturing method of the board | substrate for electronic devices in any one of Claim 1 thru | or 10 which has the fixing process which fixes the said inorganic particle on the said base layer after a said 2nd process.   The manufacturing method of the board | substrate for electronic devices of Claim 11 which fixes the said inorganic particle on the said base layer with a fixing agent in the said fixing process.   The method of manufacturing a substrate for an electronic device according to claim 12, wherein the fixing agent has a function of connecting the inorganic particles.   The method for manufacturing a substrate for an electronic device according to claim 13, wherein the fixing agent contains a coupling agent as a main component.   An electronic device substrate manufactured by the method for manufacturing an electronic device substrate according to claim 1. The substrate for electronic devices according to claim 15,
A liquid crystal panel comprising: a liquid crystal layer provided on a side opposite to the substrate of the inorganic alignment film. An electronic apparatus comprising the liquid crystal panel according to claim 16.

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