JP2007109775A - Case-molded capacitor - Google Patents

Case-molded capacitor Download PDF

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Publication number
JP2007109775A
JP2007109775A JP2005297503A JP2005297503A JP2007109775A JP 2007109775 A JP2007109775 A JP 2007109775A JP 2005297503 A JP2005297503 A JP 2005297503A JP 2005297503 A JP2005297503 A JP 2005297503A JP 2007109775 A JP2007109775 A JP 2007109775A
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case
external connection
hole
capacitor element
filling resin
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JP4736694B2 (en
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Takeshi Imamura
武志 今村
Satoshi Hosokawa
聡 細川
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce the height of a case-molded capacitor which has a capacitor element stored inside an outer-packaging case and is resin-molded in the outer-packaging case. <P>SOLUTION: The case-molded capacitor comprises the case 1 having an opening in the top face, the capacitor element 2 which is stored inside the case 1 and has electrodes on both ends; a pair of bus bars 4 each having an external connection terminal 4a on one end with the other ends of the bus bars 4 connected to the ends of the capacitor element 2, respectively, and with the external connection terminal 4a protruded from the upper face of the case 1; and a filling resin 5 injected into a space between the case 1 and the capacitor element 2. The external connection terminal 4a of each bus bar 4 is so bent as to have a connection plane 4b nearly parallel to the top face 5a of the filling resin 5. The connection plane 4b is formed with a through-hole 4c. Immediately below the through-holes 4c, tubes 8 with a bottom whose top is opened opposite to the through-hole 4c are embedded in the filling resin 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、コンデンサ素子を外装ケース内に備え、外装ケース内に樹脂モールドされてなるケースモールド型コンデンサに関するものである。   The present invention relates to a case mold type capacitor that includes a capacitor element in an outer case and is resin-molded in the outer case.

図４は従来のケースモールド型コンデンサを示す図であり、（ａ）は正面図、（ｂ）は側面図を示す。   4A and 4B are diagrams showing a conventional case mold type capacitor. FIG. 4A is a front view, and FIG. 4B is a side view.

図４において、２１は開口部を有する樹脂製の外装ケースである。２２はコンデンサ素子で、金属化フィルムを巻回または積層してなり、素子両端面には、亜鉛等の金属を溶射するなどの方法により、メタリコン部２３を形成している。   In FIG. 4, reference numeral 21 denotes a resin exterior case having an opening. Reference numeral 22 denotes a capacitor element, which is formed by winding or laminating a metallized film. Metallicon portions 23 are formed on both ends of the element by a method such as spraying a metal such as zinc.

２４は銅などからなる平板状のバスバーであり、一方の端部はコンデンサ素子２２に接続され、他方の端部はケース２１の外方へ引き出され、貫通孔を有した外部接続端子部２４ａを備えている。   Reference numeral 24 denotes a flat bus bar made of copper or the like, one end of which is connected to the capacitor element 22, and the other end is drawn out of the case 21 to connect the external connection terminal portion 24 a having a through hole. I have.

さらに２５はコンデンサ素子２２と外部接続端子部２４ａを除くバスバー２４を埋め込むため、ケース２１に注型される熱硬化性のエポキシ樹脂などからなる充填樹脂であり、ケース２１の開口部にて注型面２５ａを形成している。   Further, reference numeral 25 denotes a filling resin made of a thermosetting epoxy resin or the like that is cast into the case 21 in order to embed the bus bar 24 excluding the capacitor element 22 and the external connection terminal portion 24a. A surface 25a is formed.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２００５−１０８９５７号公報 As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2005-108957 A

ところが、このような従来の構成においては、外部接続端子部２４ａがケース２１の外方へ注型面２５ａに対して垂直に表出している。これによって、外部接続端子部２４ａ分の高さが増してしまい、コンデンサ製品として高さが増してしまうという問題があった。   However, in such a conventional configuration, the external connection terminal portion 24a is exposed to the outside of the case 21 perpendicularly to the casting surface 25a. As a result, the height of the external connection terminal portion 24a increases, and there is a problem that the height of the capacitor product increases.

特に車載用においては配置スペースが限定された場所での使用となるので、製品の低背化は必要不可欠なものであった。そこで本発明は低背化を図ることを目的とするものである。   Especially for in-vehicle use, since it is used in a place where the arrangement space is limited, it is indispensable to reduce the product height. Accordingly, the object of the present invention is to reduce the height.

そしてこの目的を達成するために本発明は、バスバーの外部接続端子部を充填樹脂の上面と略平行な接続面とし、この接続面に貫通孔を備え、この貫通孔の直下に貫通孔と対向するように上部が開口する有底筒を充填樹脂に埋め込んだものである。   In order to achieve this object, the present invention has an external connection terminal portion of the bus bar as a connection surface that is substantially parallel to the upper surface of the filling resin, and has a through hole in the connection surface, facing the through hole directly below the through hole. In this way, a bottomed cylinder having an open top is embedded in a filling resin.

本発明のケースモールド型コンデンサはバスバーの外部接続端子部を充填樹脂の上面と略平行な状態にしているので高さを抑えることができ、製品の低背化が可能になるものである。また、外部接続端子部の接続面に貫通孔を備え、この貫通孔の直下に対向して、上部が開口する有底筒を充填樹脂に埋め込んだ状態にしているので、外部接続端子部にビスなどを取り付けた状態としても、ビスの先端はこの有底筒に収まることとなり、その結果充填樹脂を傷つけることなく耐湿性も低下させることがなくなるものである。   In the case mold type capacitor of the present invention, the external connection terminal portion of the bus bar is in a state substantially parallel to the upper surface of the filling resin, so that the height can be suppressed and the product can be reduced in height. In addition, a through hole is provided on the connection surface of the external connection terminal portion, and a bottomed cylinder having an opening at the top facing the direct bottom of the through hole is embedded in the filling resin. Even when attached, the tip of the screw fits in the bottomed cylinder, and as a result, the moisture resistance is not lowered without damaging the filling resin.

また、これらのケースモールド型コンデンサを取り付ける際にはケースの固定も含め上下方向にビス止めされることが多いので、接続面を充填樹脂の上面と略平行にすることによって作業の簡略化も可能になるものである。   Also, when mounting these case mold type capacitors, the screws are often screwed in the vertical direction, including fixing the case, so the work can be simplified by making the connection surface substantially parallel to the top surface of the filled resin. It will be.

以下、本発明の実施の形態１について、図を用いて説明する。   Embodiment 1 of the present invention will be described below with reference to the drawings.

（実施の形態１）
図１は本実施の形態におけるケースモールド型コンデンサの斜視図であり、図２は本実施の形態におけるケースモールド型コンデンサの断面図である。 (Embodiment 1)
FIG. 1 is a perspective view of a case mold type capacitor according to the present embodiment, and FIG. 2 is a cross-sectional view of the case mold type capacitor according to the present embodiment.

図１および図２において、１は上面に開口部を有する樹脂製のケースであり、ポリフェニレンサルファイドなどの樹脂が用いられている。   1 and 2, reference numeral 1 denotes a resin case having an opening on the upper surface, and a resin such as polyphenylene sulfide is used.

２はコンデンサ素子であり、本実施の形態においてはポリエチレンテレフタレートフィルムの片面または両面にアルミニウムなどの金属蒸着電極を形成した金属化フィルムを一対の金属蒸着電極がポリエチレンテレフタレートフィルムを介して対向するように巻回し、両端面にメタリコン電極を設けたものである。   Reference numeral 2 denotes a capacitor element. In this embodiment, a metallized film in which a metal vapor-deposited electrode such as aluminum is formed on one or both sides of a polyethylene terephthalate film is placed so that the pair of metal vapor-deposited electrodes face each other through the polyethylene terephthalate film. A metallicon electrode is provided on both end faces.

４は銅板などからなるバスバーであり、コンデンサ素子２と外部接続機器等（図示せず）とを接続させるものである。バスバー４はコンデンサ素子２の一端に設けられたメタリコン電極（図示せず）に接続され、外部に引き出され外部接続端子部４ａを備えており、この外部接続端子部４ａには後述する充填樹脂５の上面５ａと略平行な接続面４ｂを有している。この接続面４ｂには貫通孔４ｃが設けられ、リード線など（図示せず）をビス６およびナット７で固定することができるようになっている。   Reference numeral 4 denotes a bus bar made of a copper plate or the like, which connects the capacitor element 2 and an external connection device or the like (not shown). The bus bar 4 is connected to a metallicon electrode (not shown) provided at one end of the capacitor element 2 and is provided outside with an external connection terminal portion 4a. The external connection terminal portion 4a includes a filling resin 5 described later. The connection surface 4b is substantially parallel to the upper surface 5a. The connection surface 4 b is provided with a through hole 4 c so that a lead wire or the like (not shown) can be fixed with a screw 6 and a nut 7.

バスバー４はコンデンサ素子２の両端からそれぞれ、Ｐ極、Ｎ極を引き出すため複数設けられている。   A plurality of bus bars 4 are provided to draw out the P pole and the N pole from both ends of the capacitor element 2, respectively.

５はケース１とコンデンサ素子２との隙間に充填されてコンデンサ素子２を固定する充填樹脂であり、エポキシ樹脂などの熱硬化性樹脂などが用いられている。この充填樹脂５はケース１に液状で注入された後、加熱することによって硬化させ、コンデンサ２を覆う形とすることで耐湿性の向上を目的として用いられている。   Reference numeral 5 denotes a filling resin for filling the gap between the case 1 and the capacitor element 2 to fix the capacitor element 2, and a thermosetting resin such as an epoxy resin is used. The filling resin 5 is injected into the case 1 in a liquid state and then cured by heating to cover the capacitor 2 and is used for the purpose of improving moisture resistance.

８は樹脂製の有底筒であり、外部接続端子部４ａの接続面４ｂに設けられた貫通孔４ｃの直下に対向してこの貫通孔４ｃの中心軸と同一になり、上部が開口するように充填樹脂５に埋め込まれている。   8 is a bottomed cylinder made of resin, facing directly below the through hole 4c provided on the connection surface 4b of the external connection terminal portion 4a, and being the same as the central axis of the through hole 4c, so that the upper part opens. Embedded in the filling resin 5.

このように上面５ａと略平行な接続面４ｂに貫通孔４ｃの下方に有底筒８を上部が開口するように充填樹脂５に埋め込むことが本発明における技術的特徴の一つであり、これによってケースモールド型コンデンサの高さを抑えることができる。その理由については図３をもってさらに説明する。   Thus, it is one of the technical features in the present invention that the bottomed tube 8 is embedded in the filling resin 5 so that the upper portion is opened below the through hole 4c on the connection surface 4b substantially parallel to the upper surface 5a. Therefore, the height of the case mold type capacitor can be suppressed. The reason will be further described with reference to FIG.

図３はバスバー４にリード線（図示せず）などをビス６およびナット７で固定した際の斜視図である。   FIG. 3 is a perspective view when a lead wire (not shown) or the like is fixed to the bus bar 4 with screws 6 and nuts 7.

このとき貫通孔４ｃの中心軸と有底筒８の中心軸が一致するのでビス６の先端は有底筒８に収納される形で収まる。このようにすることによって、従来であればビスなどでリード線等を外部接続端子部４ａに固定する際にはビスの長さ分だけ外部接続端子部４ａの接続面４ｂを高くしなければならなかったり、ビスが充填樹脂５の上面５ａを傷つけないように作業、設計などにおいて注意する必要があったりしたところ、本実施の形態によれば外部接続端子部４ａの接続面４ｂを従来のものより低くすることが可能になるものである。   At this time, since the central axis of the through hole 4c coincides with the central axis of the bottomed cylinder 8, the tip of the screw 6 is accommodated in the form of being accommodated in the bottomed cylinder 8. By doing so, conventionally, when fixing a lead wire or the like to the external connection terminal portion 4a with a screw or the like, the connection surface 4b of the external connection terminal portion 4a must be made higher by the length of the screw. In the present embodiment, the connection surface 4b of the external connection terminal portion 4a is a conventional one so that there is no need to be careful in work, design or the like so that the screw does not damage the upper surface 5a of the filling resin 5. It is possible to make it lower.

さらに、接続面４ｂを従来のものより低くすることが可能になると、コンデンサ素子２から接続面４ｂまでの距離が短くなるので、外部接続端子部４ａから発生するインダクタンス成分を低くすることが可能となり、これによってノイズの低減という効果も奏するものである。   Furthermore, when the connection surface 4b can be made lower than the conventional one, the distance from the capacitor element 2 to the connection surface 4b is shortened, so that the inductance component generated from the external connection terminal portion 4a can be reduced. This also has the effect of reducing noise.

また、従来であれば外部接続端子部４ａの接続面４ｂを上面５ａに対して垂直に表出していたところ、本実施の形態によれば接続面４ｂの分高さが増すということはなくなるものである。さらに、取り付け時の工程などにおいてはケースの固定も含め上下方向にビス止めされることが多いため、接続面４ｂを上面５ａと略平行にすることによって作業の簡略化も可能となるものである。   Further, conventionally, when the connection surface 4b of the external connection terminal portion 4a is exposed perpendicularly to the upper surface 5a, the height of the connection surface 4b is not increased according to the present embodiment. It is. Further, since the screwing is often done in the vertical direction including the fixing of the case in the mounting process, the work can be simplified by making the connection surface 4b substantially parallel to the upper surface 5a. .

なお、本実施の形態においては接続面４ｂにビス６およびナット７で固定するものとしたが事前に接続面４ａにナット７を取り付けて貫通孔４ｃをネジ穴としているものであってもよいものとする。このようにすることによって、ナット７の保持を省略できるので、さらに作業効率を向上させることができるものである。   In the present embodiment, the connection surface 4b is fixed with the screw 6 and the nut 7, but the nut 7 may be attached to the connection surface 4a in advance and the through hole 4c may be used as a screw hole. And By doing in this way, since holding | maintenance of the nut 7 can be abbreviate | omitted, working efficiency can be improved further.

また、充填樹脂５の硬化工程において真空中で脱泡する処理があり、この時にナット７の下方に充填樹脂５があると、充填樹脂５が飛散してナット７に付着してしまい、ビス６締めの際に不具合を引き起こすことになるところ、本実施の形態においてはナット７の下方には有底筒８が配置されているので、充填樹脂５のナット７への飛散を防ぐという効果も奏するものである。   Further, there is a process of defoaming in vacuum in the curing process of the filling resin 5. If the filling resin 5 exists below the nut 7 at this time, the filling resin 5 scatters and adheres to the nut 7. In the present embodiment, since the bottomed tube 8 is disposed below the nut 7, there is an effect of preventing the filling resin 5 from being scattered on the nut 7. Is.

また、複数のバスバー４の外部接続端子部４ａにおける接続面４ｂ直下に埋め込まれたそれぞれの有底筒８を一体で形成してもよいものとする。このようにすることによって、それぞれの有底筒８の配置を容易にするという効果を奏するものである。さらに、この一体に形成した有底筒８間に絶縁仕切（図示せず）などを設けることによって、安全性を向上させてもよい。   In addition, the bottomed tubes 8 embedded directly below the connection surface 4b of the external connection terminal portions 4a of the plurality of bus bars 4 may be integrally formed. By doing in this way, there exists an effect of making arrangement | positioning of each bottomed cylinder 8 easy. Furthermore, safety may be improved by providing an insulating partition (not shown) between the integrally formed bottomed cylinders 8.

さらに、この有底筒８を支持体（図示せず）によってケース１に固定することによって、位置規制も可能になるものである。   Furthermore, position control is also possible by fixing the bottomed cylinder 8 to the case 1 by a support (not shown).

また、本実施の形態においてはコンデンサ素子２を金属化フィルムによるものとしたが、これに特定されるものではなく、コンデンサを素子状にしてケース内で樹脂を充填するものであれば同様の効果を奏するものである。   In the present embodiment, the capacitor element 2 is made of a metallized film. However, the present invention is not limited to this, and the same effect can be obtained if the capacitor is made into an element shape and filled with resin in the case. It plays.

以上のように、本発明にかかるケースモールド型コンデンサによれば、コンデンサの低背化が可能になるので、スペースの小型化などが要求される自動車のモータ駆動用のインバータシステムなどに有用である。   As described above, according to the case mold type capacitor of the present invention, it is possible to reduce the height of the capacitor, which is useful for an inverter system for driving a motor of a motor vehicle that requires a reduction in space. .

本発明の実施の形態１によるケースモールド型コンデンサの斜視図The perspective view of the case mold type capacitor by Embodiment 1 of the present invention 本発明の実施の形態１によるケースモールド型コンデンサの断面図Sectional drawing of the case mold type capacitor by Embodiment 1 of the present invention 本発明の実施の形態１によるケースモールド型コンデンサの斜視図The perspective view of the case mold type capacitor by Embodiment 1 of the present invention （ａ）、（ｂ）従来のケースモールド型コンデンサの断面図(A), (b) Cross-sectional view of a conventional case mold type capacitor

符号の説明Explanation of symbols

１ ケース
２ コンデンサ素子
４ バスバー
４ａ 外部接続端子部
４ｂ 接続面
４ｃ 貫通孔
５ 充填樹脂
５ａ 上面
６ ビス
７ ナット
８ 有底筒 DESCRIPTION OF SYMBOLS 1 Case 2 Capacitor element 4 Bus bar 4a External connection terminal part 4b Connection surface 4c Through-hole 5 Filling resin 5a Upper surface 6 Screw 7 Nut 8 Bottomed cylinder

Claims (4)

上面に開口部を有するケースと、このケース内に収容され、両端に電極を有するコンデンサ素子と、一端に外部接続端子部を備え、他端を前記コンデンサ素子の両端それぞれと接続し、前記外部接続端子部を前記ケース上方より表出させた一対のバスバーと、前記ケースと前記コンデンサ素子の隙間に注入された充填樹脂とからなるケースモールド型コンデンサにおいて、前記外部接続端子部は前記充填樹脂の上面と略平行な接続面を有するように折り曲げられており、前記接続面には貫通孔を有し、前記貫通孔の直下にはこの貫通孔と対向して、上部が開口する有底筒を前記充填樹脂に埋め込んで設けたことを特徴とするケースモールド型コンデンサ。 A case having an opening on the upper surface, a capacitor element housed in the case and having electrodes at both ends, an external connection terminal portion at one end, and the other end connected to both ends of the capacitor element, the external connection In a case mold type capacitor comprising a pair of bus bars with terminal portions exposed from above the case, and a filling resin injected into a gap between the case and the capacitor element, the external connection terminal portion is an upper surface of the filling resin. A bottomed tube having a through hole in the connection surface, and a bottomed tube having an open top facing the through hole immediately below the through hole. A case mold type capacitor characterized by being embedded in a filling resin. 前記貫通孔をネジ穴としたことを特徴とする請求項１に記載のケースモールド型コンデンサ。 The case mold type capacitor according to claim 1, wherein the through hole is a screw hole. 複数の前記有底筒を一体で形成したことを特徴とする請求項１に記載のケースモールド型コンデンサ。 The case mold type capacitor according to claim 1, wherein the plurality of bottomed cylinders are integrally formed. 前記有底筒を支持体によって前記ケースに固定することを特徴とする請求項１に記載のケースモールド型コンデンサ。 The case mold type capacitor according to claim 1, wherein the bottomed cylinder is fixed to the case by a support.
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JP2014086628A (en) * 2012-10-25 2014-05-12 Shizuki Electric Co Inc Capacitor
JP2015056513A (en) * 2013-09-12 2015-03-23 ニチコン株式会社 Resin mold type capacitor
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JP2013219110A (en) * 2012-04-05 2013-10-24 Shizuki Electric Co Inc Capacitor
JP2014086628A (en) * 2012-10-25 2014-05-12 Shizuki Electric Co Inc Capacitor
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CN108140486B (en) * 2015-10-09 2019-09-27 松下知识产权经营株式会社 The manufacturing method of thin film capacitor and thin film capacitor
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EP4027360A1 (en) * 2021-01-06 2022-07-13 CapXon Electronic (Shenzhen) Co., Ltd Integrated moulded capacitor having a button-shape
WO2024190247A1 (en) * 2023-03-14 2024-09-19 パナソニックＩｐマネジメント株式会社 Capacitor and method for manufacturing capacitor

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