JP2007106809A - Heat-conductive grease composition - Google Patents
Heat-conductive grease composition Download PDFInfo
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- JP2007106809A JP2007106809A JP2005297034A JP2005297034A JP2007106809A JP 2007106809 A JP2007106809 A JP 2007106809A JP 2005297034 A JP2005297034 A JP 2005297034A JP 2005297034 A JP2005297034 A JP 2005297034A JP 2007106809 A JP2007106809 A JP 2007106809A
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- 239000000203 mixture Substances 0.000 title claims abstract description 81
- 239000004519 grease Substances 0.000 title claims abstract description 49
- 238000002844 melting Methods 0.000 claims abstract description 26
- 230000008018 melting Effects 0.000 claims abstract description 26
- 239000002245 particle Substances 0.000 claims abstract description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- 239000011231 conductive filler Substances 0.000 claims abstract description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 229910000743 fusible alloy Inorganic materials 0.000 abstract 1
- -1 2-methyl-2-phenylethyl group Chemical group 0.000 description 8
- 229910001297 Zn alloy Inorganic materials 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000002199 base oil Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 150000008282 halocarbons Chemical group 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明は、熱伝導性に優れた熱伝導性グリース組成物に関する。 The present invention relates to a thermally conductive grease composition having excellent thermal conductivity.
例えば、ＣＰＵ等の発熱性電子部品の多くには、使用時の温度上昇による損傷や性能低下等を防止するため、ヒートシンク等の放熱体が広く用いられている。発熱性電子部品から発生する熱を放熱体に効率よく伝導させるため、一般に発熱性電子部品と放熱体との間に熱伝導性材料が使用される。 For example, in many heat-generating electronic components such as CPUs, a heat radiator such as a heat sink is widely used in order to prevent damage due to temperature rise during use, performance degradation, and the like. In order to efficiently conduct heat generated from the heat-generating electronic component to the heat radiator, a heat conductive material is generally used between the heat-generating electronic component and the heat radiator.
熱伝導性材料としては、放熱シートや放熱グリースが一般に知られている。放熱シートは、手軽にマウントすることができるが、例えば発熱性電子部品や放熱体との界面に空隙が生じるため、界面熱抵抗が大きくなり熱伝導性能が不十分になる。一方、放熱グリースは、その性状が液体に近いため、発熱性電子部品や放熱体表面の凹凸に影響されることなく両者に密着して界面熱抵抗を小さくすることができるが、長時間使用するとグリース中の液状オイル成分が流出し易い。 As the heat conductive material, a heat radiating sheet and a heat radiating grease are generally known. Although the heat radiation sheet can be easily mounted, for example, since a gap is generated at the interface with the heat-generating electronic component or the heat radiator, the interfacial thermal resistance is increased and the heat conduction performance is insufficient. On the other hand, since the properties of heat dissipation grease are close to liquid, it is possible to reduce the interfacial thermal resistance by adhering to both of them without being affected by the unevenness of the heat generating electronic parts and the surface of the heat dissipation body. Liquid oil component in grease is likely to flow out.
そこで、例えば特許文献１、２には、熱伝導性を付与する成分として低融点金属や金属フィラー等を配合した付加反応硬化型の熱伝導性シリコーン組成物が提案されている。また、例えば特許文献３、４には、シリコーン樹脂に低融点金属等の熱伝導性充填剤を配合し、これをシート状に成形した放熱シートが提案されている。
Thus, for example,
しかしながら、このような従来の熱伝導性材料は、熱伝導性充填剤を高充填すると熱伝導性能が改善されることが一般に知られているが、製造過程において作業性の低下を招く傾向にあり、その配合量の上限は制限されていた。したがって、近年の発熱性電子部品の高集積化、高速化にともなう発熱量のさらなる増大により、従来の熱伝導性材料では十分な熱伝導性効果を得られない。
本発明の目的は、このような課題に対処するためになされたもので、熱伝導性に優れた熱伝導性グリース組成物を提供することにある。 An object of the present invention is to address such problems, and to provide a thermally conductive grease composition having excellent thermal conductivity.
本発明者らは、上記目的を達成するために鋭意検討した結果、オイル状のポリオルガノシロキサンに、熱伝導性に優れた成分としてモース硬度が５以下の粒状熱伝導性フィラーと融点が０〜１００℃の低融点合金を配合した熱伝導性グリース組成物を、発熱性電子部品と放熱体との間に設置し０．２ＭＰａ以上で押圧することによって、界面熱抵抗が著しく低減され、優れた熱伝導性能を発揮することを見出し、本発明をなすに至った。 As a result of intensive studies to achieve the above object, the present inventors have found that the oily polyorganosiloxane has a granular heat conductive filler having a Mohs hardness of 5 or less and a melting point of 0 to 0 as a component having excellent heat conductivity. By installing a heat conductive grease composition containing a low melting point alloy at 100 ° C. between the heat-generating electronic component and the heat sink and pressing at 0.2 MPa or more, the interfacial thermal resistance is remarkably reduced and excellent. It has been found that the thermal conductivity performance is exhibited, and the present invention has been made.
すなわち、本発明の熱伝導性グリース組成物は、（Ａ）下記一般式：
Ｒ１ ａＳｉＯ（４−ａ）／２
（Ｒ1はメチル基、フェニル基及び炭素数６〜１４のアルキル基から選ばれる少なくとも１種であり、ａは１．８≦ａ≦２．２である。）で表されるポリオルガノシロキサン １００重量部、（Ｂ）モース硬度が５以下であり、平均粒径が０．１〜１００μｍの粒状熱伝導性フィラー ５〜７００重量部及び（Ｃ）融点が０〜１００℃の低融点合金 ２００〜６００重量部を含有する熱伝導性グリース組成物であり、０．２ＭＰａ以上で押圧された状態で発熱性電子部品と放熱体との間に設置されることを特徴とする。
That is, the thermally conductive grease composition of the present invention has (A) the following general formula:
R 1 a SiO (4-a) / 2
(R 1 is at least one selected from a methyl group, a phenyl group, and an alkyl group having 6 to 14 carbon atoms, and a is 1.8 ≦ a ≦ 2.2) 100 Parts by weight, (B) 5 to 700 parts by weight of a granular thermally conductive filler having a Mohs hardness of 5 or less and an average particle size of 0.1 to 100 μm, and (C) a low melting point alloy having a melting point of 0 to 100 ° C. 200 to 200 parts by weight It is a thermally conductive grease composition containing 600 parts by weight, and is characterized in that it is placed between a heat-generating electronic component and a heat radiator while being pressed at 0.2 MPa or more.
上記構成により、熱伝導性に優れた熱伝導性グリース組成物を提供することが可能となる。 With the above configuration, it is possible to provide a thermally conductive grease composition having excellent thermal conductivity.
以下、本発明の熱伝導性グリース組成物について説明する。 Hereinafter, the thermally conductive grease composition of the present invention will be described.
［（Ａ）成分］
本発明に用いられる（Ａ）成分には、下記一般式：
Ｒ１ ａＳｉＯ（４−ａ）／２
で表されるオイル状のポリオルガノシロキサンが用いられる。これによって、良好な耐熱性及び安定性を得ることができる。上記式中において、Ｒ1は、独立に炭素数１〜１８の一価炭化水素基から選択される１種もしくは２種以上の基である。ただし、アルケニル基を除く。Ｒ1としては、例えばメチル基、エチル基、プロピル基、ヘキシル基、オクチル基、デシル基、ドデシル基、テトラデシル基、ヘキサデシル基、オクタデシル基等のアルキル基、シクロペンチル基、シクロヘキシル基等のシクロヘキシル基、フェニル基、トリル基等のアリール基、２−フェニルエチル基、２−メチル−２−フェニルエチル基等のアラルキル基、３，３，３−トリフロロプロピル基、２−（パーフロロブチル）エチル基、２−（パーフロロオクチル）エチル基、ｐ−クロロフェニル基等のハロゲン化炭化水素基などが挙げられるが、特にメチル基、フェニル基、炭素数６〜１４のアルキル基が好ましい。ａは、液状シリコーンの合成のし易さから、１．８〜２．２の範囲がよく、特に１．９〜２．１が好ましい。
[(A) component]
The component (A) used in the present invention includes the following general formula:
R 1 a SiO (4-a) / 2
An oily polyorganosiloxane represented by the formula is used. Thereby, good heat resistance and stability can be obtained. In the above formula, R 1 is independently one or more groups selected from monovalent hydrocarbon group having 1 to 18 carbon atoms. However, an alkenyl group is excluded. R 1 is, for example, an alkyl group such as a methyl group, an ethyl group, a propyl group, a hexyl group, an octyl group, a decyl group, a dodecyl group, a tetradecyl group, a hexadecyl group, an octadecyl group, a cyclohexyl group such as a cyclopentyl group, a cyclohexyl group, Aryl group such as phenyl group, tolyl group, aralkyl group such as 2-phenylethyl group, 2-methyl-2-phenylethyl group, 3,3,3-trifluoropropyl group, 2- (perfluorobutyl) ethyl group , 2- (perfluorooctyl) ethyl group, halogenated hydrocarbon group such as p-chlorophenyl group, and the like, among which a methyl group, a phenyl group, and an alkyl group having 6 to 14 carbon atoms are particularly preferable. From the viewpoint of easy synthesis of liquid silicone, a is preferably in the range of 1.8 to 2.2, particularly preferably 1.9 to 2.1.
また、（Ａ）成分の粘度は、２３℃において０．０５〜１０Ｐａ・ｓ、特に０．１〜５Ｐａ・ｓであることが好ましい。０．０５Ｐａ・ｓ未満であると、得られる組成物の安定性が悪化しオイル分離が起こり易くなる。一方、１０Ｐａ・ｓを越えると、得られる組成物の流動性が乏しくなる。 Moreover, it is preferable that the viscosity of (A) component is 0.05-10 Pa.s, especially 0.1-5 Pa.s in 23 degreeC. If it is less than 0.05 Pa · s, the stability of the resulting composition is deteriorated and oil separation tends to occur. On the other hand, when it exceeds 10 Pa · s, the fluidity of the resulting composition becomes poor.
［（Ｂ）成分］
本発明に用いられる（Ｂ）成分は、得られる組成物に熱伝導性を付与する成分である。（Ｂ）成分には、モース硬度が５以下のものが使用される。モース硬度が５を超えると、得られた組成物を発熱性電子部品の表面に塗布し放熱体で押圧した際に、（Ｂ）成分の粒子が潰れ難くなり優れた熱伝導性能を発揮し難くなる。
[Component (B)]
(B) component used for this invention is a component which provides thermal conductivity to the composition obtained. As the component (B), those having a Mohs hardness of 5 or less are used. When the Mohs hardness exceeds 5, when the obtained composition is applied to the surface of the heat-generating electronic component and pressed with a heat radiator, the particles of the component (B) are not easily crushed and it is difficult to exhibit excellent heat conduction performance. Become.
また、（Ｂ）成分の平均粒径は、０．１〜１００μｍ、好ましくは、０．１〜８０μｍのものが使用される。０．１μｍ未満であると、得られる組成物において所望の稠度が得られ難い。一方、１００μｍを超えると、得られる組成物の安定性が悪化し、オイル分離等が起こり易くなる。 Moreover, the average particle diameter of (B) component is 0.1-100 micrometers, Preferably, the thing of 0.1-80 micrometers is used. When it is less than 0.1 μm, it is difficult to obtain a desired consistency in the obtained composition. On the other hand, when it exceeds 100 μm, the stability of the resulting composition is deteriorated, and oil separation or the like easily occurs.
（Ｂ）成分としては、モース硬度が５以下で、熱伝導率が良好なものであればよく、例えば窒化ホウ素粉末、酸化亜鉛粉末、アルミニウム粉末、銀粉末、銅粉末、鉄粉末等が挙げられ、１種単独または２種以上を混合して用いてもよい。特に窒化ホウ素粉末、酸化亜鉛粉末、アルミニウム粉末を用いることが好ましい。 As the component (B), it is sufficient that the Mohs hardness is 5 or less and the thermal conductivity is good. Examples thereof include boron nitride powder, zinc oxide powder, aluminum powder, silver powder, copper powder, and iron powder. You may use individually by 1 type or in mixture of 2 or more types. In particular, boron nitride powder, zinc oxide powder, and aluminum powder are preferably used.
また、（Ｂ）成分の形状が粒状または球状のものを用いる。その形状は、アスペクト比が１３を超えるような、例えば樹枝状、燐片状、針状、不規則形状等では界面熱抵抗を低減する上で不適である。 The component (B) has a granular or spherical shape. For example, a dendritic shape, a flake shape, a needle shape, an irregular shape or the like having an aspect ratio exceeding 13 is not suitable for reducing the interfacial thermal resistance.
（Ｂ）成分の配合量は、（Ａ）成分であるポリオルガノシロキサン１００重量部に対して、５〜７００重量部、好ましくは１０〜７００重量部である。５重量部未満であると、得られる組成物の熱伝導率が低下し易くなる。一方、７００重量部を越えると、得られる組成物の流動性が低下して作業性が悪化し易くなる。 (B) The compounding quantity of component is 5-700 weight part with respect to 100 weight part of polyorganosiloxane which is (A) component, Preferably it is 10-700 weight part. If it is less than 5 parts by weight, the thermal conductivity of the resulting composition tends to decrease. On the other hand, when it exceeds 700 parts by weight, the fluidity of the resulting composition is lowered and the workability is liable to deteriorate.
［（Ｃ）成分］
本発明に用いられる（Ｃ）成分は、得られる組成物に熱伝導性を付与する成分である。（Ｃ）成分には、融点が０〜１００℃、特に０〜５０℃の低融点合金が使用される。融点が０℃未満であると、得られた組成物を、例えば−３０〜−１０℃で長期保存又は輸送する際に、液状化した微粒子同士が凝集し易くなり良好な分散状態を保持することが困難になる。一方、１００℃を越えると、本組成物の製造時に、速やかに溶融し難くなるため作業性の低下を招く。なお、（Ｃ）成分としては、常温で液状の合金を使用することが好ましい。これによって、発熱性電子部品と放熱体との間に本組成物を設置し押圧した際に、（Ｃ）成分の液状微粒子が発熱性電子部品や放熱体表面に密着し、界面熱抵抗を著しく低下させて高い放熱性を発揮することができる。
[Component (C)]
(C) component used for this invention is a component which provides thermal conductivity to the composition obtained. As the component (C), a low melting point alloy having a melting point of 0 to 100 ° C., particularly 0 to 50 ° C. is used. When the melting point is less than 0 ° C., for example, when the obtained composition is stored or transported for a long time at −30 to −10 ° C., the liquefied fine particles tend to aggregate and maintain a good dispersion state. Becomes difficult. On the other hand, when the temperature exceeds 100 ° C., it becomes difficult to melt quickly during the production of the present composition, resulting in a decrease in workability. As the component (C), it is preferable to use a liquid alloy at room temperature. As a result, when the present composition is placed and pressed between the heat-generating electronic component and the heat sink, the liquid fine particles of component (C) are in close contact with the surface of the heat-generating electronic component or heat sink, and the interfacial thermal resistance is remarkably increased. It can be reduced to exhibit high heat dissipation.
（Ｃ）成分としては、融点が０〜１００℃の各種合金であれば限定されるものではなく、例えばガリウム、インジウム、スズ、亜鉛、鉛、ビスマス、カドミウム等の低融点金属を２種以上含有する合金が挙げられる。特に、ガリウム及びインジウムを必須成分とする合金を用いることが好ましい。例えば、ガリウム−インジウム合金（例えば質量比＝７５．５：２４．５、融点１５．５℃）、ガリウム−インジウム−スズ合金（例えば質量比＝２１．５：１６．０：６２．５、融点１０．７℃）、ガリウム−インジウム−スズ−亜鉛合金（例えば質量比＝６１：２５：１３：１、融点＝７℃）、ガリウム−インジウム−スズ−ビスマス合金（例えば質量比＝９．４：４７．３：１８．６：２４．７、融点＝４８℃）等が挙げられ、１種単独または２種以上を混合して用いてもよい。 The component (C) is not limited as long as it has various melting points of 0 to 100 ° C., and includes, for example, two or more low melting point metals such as gallium, indium, tin, zinc, lead, bismuth and cadmium. Alloy to be used. In particular, an alloy containing gallium and indium as essential components is preferably used. For example, gallium-indium alloy (for example, mass ratio = 75.5: 24.5, melting point 15.5 ° C.), gallium-indium-tin alloy (for example, mass ratio = 21.5: 16.0: 62.5, melting point) 10.7 ° C.), gallium-indium-tin-zinc alloy (for example, mass ratio = 61: 25: 13: 1, melting point = 7 ° C.), gallium-indium-tin-bismuth alloy (for example, mass ratio = 9.4: 47.3: 18.6: 24.7, melting point = 48 ° C.) and the like, and one kind or a mixture of two or more kinds may be used.
（Ｃ）成分の配合量は、（Ａ）成分であるポリオルガノシロキサン１００重量部に対して、２００〜６００重量部、好ましくは２２０〜６００重量部である。２００重量部未満であると、熱伝導率が低下し易くなる。一方、６００重量部を越えると、得られる組成物において伸展性が得られ難くなる。 (C) The compounding quantity of component is 200-600 weight part with respect to 100 weight part of polyorganosiloxane which is (A) component, Preferably it is 220-600 weight part. If it is less than 200 parts by weight, the thermal conductivity tends to decrease. On the other hand, if it exceeds 600 parts by weight, it becomes difficult to obtain extensibility in the resulting composition.
本発明における熱伝導性グリース組成物は、上記（Ａ）〜（Ｃ）の各成分を基本成分とし、これらに必要に応じて、その他任意成分としてウエッター成分を配合してもよい。ウエッター成分は、（Ｂ）成分及び（Ｃ）成分をウエッター成分で処理することにより、ベースオイルである（Ａ）成分のポリオルガノポリシロキサンとの濡れ性を向上させるものである。 In the heat conductive grease composition of the present invention, the above components (A) to (C) may be used as basic components, and a wetter component may be blended as other optional components as necessary. A wetter component improves the wettability with the polyorganopolysiloxane of the (A) component which is base oil by processing a (B) component and (C) component with a wetter component.
ウエッター成分としては、下記一般式：
Ｒ２ ｂＲ３ ｃＳｉ（ＯＲ４）４−ｂ−ｃ
で表されるアルコキシシランを用いることが好ましい。上記式中のＲ２は、炭素数６〜１５のアルキル基である。具体例としては、ヘキシル基、デシル基、ドデシル基、テトラデシル基等が挙げられる。炭素数が６未満であると、（Ｂ）成分及び（Ｃ）成分の濡れ性を十分に向上させ難くなる。一方、１５を越えると、このウエッター成分であるアルコキシシランが常温で固化するため、作業性が低下し易くなる。また、Ｒ３は、炭素数１〜８の飽和又は不飽和の一価の炭化水素基である。具体例としては、メチル基、エチル基、プロピル基、ヘキシル基、オクチル基等のアルキル基、シクロペンチル基、シクロヘキシル基等のシクロヘキシル基、ビニル基、アリル基等のアルケニル基、フェニル基、トリル基等のアリール基、２−フェニルエチル基、２−メチル−２−フェニルエチル基等のアラルキル基、３，３，３−トリフロロプロピル基、２−（パーフロロブチル）エチル基、２−（パーフロロオクチル）エチル基、ｐ−クロロフェニル基等のハロゲン化炭化水素基などが挙げられるが、特にメチル基、エチル基が好ましい。Ｒ４は、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基などの炭素数１〜６の１種もしくは２種以上のアルキル基であり、特にメチル基、エチル基が好ましい。また、ｂは１〜３の整数であるが、特に１であることが好ましい。ｃは０〜２の整数、ｂ＋ｃは１〜３の整数である。このウエッター成分は、１種単独または２種以上を混合して用いてもよい。
As a wetter component, the following general formula:
R 2 b R 3 c Si (OR 4 ) 4-b-c
It is preferable to use an alkoxysilane represented by R 2 in the above formula is an alkyl group having 6 to 15 carbon atoms. Specific examples include hexyl group, decyl group, dodecyl group, tetradecyl group and the like. When the carbon number is less than 6, it becomes difficult to sufficiently improve the wettability of the component (B) and the component (C). On the other hand, if it exceeds 15, the alkoxysilane, which is the wetter component, is solidified at room temperature, so that workability is likely to deteriorate. R 3 is a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms. Specific examples include alkyl groups such as methyl group, ethyl group, propyl group, hexyl group and octyl group, cyclohexyl groups such as cyclopentyl group and cyclohexyl group, alkenyl groups such as vinyl group and allyl group, phenyl group, tolyl group and the like. Aryl groups, aralkyl groups such as 2-phenylethyl group and 2-methyl-2-phenylethyl group, 3,3,3-trifluoropropyl group, 2- (perfluorobutyl) ethyl group, 2- (perfluoro) Examples thereof include halogenated hydrocarbon groups such as an octyl) ethyl group and a p-chlorophenyl group, and a methyl group and an ethyl group are particularly preferable. R 4 is one or more alkyl groups having 1 to 6 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, and a methyl group and an ethyl group are particularly preferable. Further, b is an integer of 1 to 3, but 1 is particularly preferable. c is an integer of 0 to 2, and b + c is an integer of 1 to 3. These wetter components may be used alone or in combination of two or more.
ウエッター成分の配合量は、（Ｂ）成分及び（Ｃ）成分と、（Ａ）成分との濡れ性を向上させる上で、（Ａ）成分１００重量部に対して、０．０１〜１０重量部の範囲が好ましい。 The blending amount of the wetter component is 0.01 to 10 parts by weight with respect to 100 parts by weight of the component (A) in order to improve the wettability between the component (B) and the component (C) and the component (A). The range of is preferable.
さらに、その他任意成分として公知の耐熱添加剤、シリカ等の粘度調整剤、着色剤、溶剤等を本発明の目的を損なわない範囲で添加してもよい。 Furthermore, other known heat-resistant additives, viscosity modifiers such as silica, colorants, solvents and the like may be added as long as they do not impair the object of the present invention.
本発明の熱伝導性グリース組成物は、上述した（Ａ）〜（Ｃ）成分及びその他任意成分を、（Ｃ）成分の融点以上の温度にてプラネタリーミキサー等の混合機で混合することにより得ることができる。このように（Ｃ）成分の融点以上の温度にすることによって、（Ｃ）成分を液状化し（Ａ）成分中に均一に分散させることができる。さらに混合後、均一仕上げのため、高剪断力下で混練操作を行うことが好ましい。混練装置としては、３本ロール、コロイドミル、サンドグラインダー等があるが、中でも３本ロールによる方法が好ましい。 The heat conductive grease composition of the present invention is obtained by mixing the above-described components (A) to (C) and other optional components with a mixer such as a planetary mixer at a temperature equal to or higher than the melting point of the component (C). Obtainable. As described above, by setting the temperature to be equal to or higher than the melting point of the component (C), the component (C) can be liquefied and uniformly dispersed in the component (A). Further, after mixing, it is preferable to perform a kneading operation under a high shearing force for uniform finishing. As a kneading apparatus, there are a three roll, a colloid mill, a sand grinder, etc. Among them, a method using a three roll is preferable.
本発明の熱伝導性グリース組成物の稠度は、１５０〜４５０であることが好ましい。なお、稠度はＪＩＳ Ｋ ２２２０に準拠した値である。２５℃における稠度が、４５０を超えると、塗布時に液ダレを起こしやすくなる。一方、１５０未満であると、例えばシリンジやディスペンサ等を用いて電子部品に塗布する際に、吐出し難くなり所望の厚さに塗布することが困難になる。 The consistency of the heat conductive grease composition of the present invention is preferably 150 to 450. The consistency is a value based on JIS K 2220. If the consistency at 25 ° C. exceeds 450, liquid dripping is likely to occur during coating. On the other hand, when it is less than 150, when applying to an electronic component using, for example, a syringe or a dispenser, it becomes difficult to discharge and difficult to apply to a desired thickness.
また、本発明の熱伝導性グリース組成物は、レーザーフラッシュ法で測定した２５℃における熱伝導率が０．５Ｗ／（ｍ・Ｋ）以上、特に１．０Ｗ／（ｍ・Ｋ）以上であることが好ましい。熱伝導率が０．５Ｗ／（ｍ・Ｋ）未満であると、熱伝導性能が不十分になる場合があり、用途が限定され易くなる。 The thermally conductive grease composition of the present invention has a thermal conductivity at 25 ° C. measured by a laser flash method of 0.5 W / (m · K) or more, particularly 1.0 W / (m · K) or more. It is preferable. When the thermal conductivity is less than 0.5 W / (m · K), the thermal conductivity may be insufficient, and the application is likely to be limited.
したがって、本発明の熱伝導性グリース組成物は、優れた熱伝導性能を有するため、発熱性電子部品と放熱体との間に介在される熱伝導性材料として好適である。 Therefore, since the heat conductive grease composition of the present invention has excellent heat conduction performance, it is suitable as a heat conductive material interposed between the heat-generating electronic component and the heat radiator.
次に、本発明の熱伝導性グリース組成物を適用した半導体装置について図面を参照して説明する。図１は、本発明の熱伝導性グリース組成物を適用した半導体装置の一例を示す断面図である。 Next, a semiconductor device to which the thermally conductive grease composition of the present invention is applied will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of a semiconductor device to which the thermally conductive grease composition of the present invention is applied.
図１に示すように、半導体装置１は、配線基板２に実装された例えばＣＰＵ３等の発熱性電子部品とヒートシンク４等の放熱体との間に、上述した熱伝導性グリース組成物５が介在されている。このような半導体装置１は、ＣＰＵ３の表面に、例えばシリンジ等で熱伝導性グリース組成物５を塗布し、この上にヒートシンク４を配置する。この後、例えばクランプ６等を用いて、ヒートシンク４を熱伝導性グリース組成物５を介してＣＰＵ３に０．２ＭＰａ以上で押圧して固定することによって得られる。０．２ＭＰａ未満であると、ＣＰＵ３やヒートシンク４表面の凹凸が存在する場合に、熱伝導性グリース組成物５でその隙間を均一に埋め難くなり、界面熱抵抗の低減が不十分になる。なお、ここでは、クランプ６を用いたが、これに限定されるものではなく、ねじを併用してもよい。
As shown in FIG. 1, in the
ＣＰＵ３とヒートシンク４との間に介在する熱伝導性グリース組成物５の厚さは、５〜３００μｍであることが好ましい。５μｍより薄いと、押圧の僅かなずれによりＣＰＵ３とヒートシンク４の間に隙間が生じる恐れがある。一方、３００μｍより厚いと、熱抵抗が大きくなり、十分な放熱効果を得ることができない。
The thickness of the thermally
したがって、本発明の熱伝導性グリース組成物５をＣＰＵ３表面に塗布し、ヒートシンク４を０．２ＭＰａ以上で押圧することによって、ＣＰＵ３やヒートシンク４表面の凹凸に影響されることなく熱伝導性グリース組成物５を両者に密着させることができる。これによって、界面熱抵抗が著しく低減され、優れた熱伝導性能を発揮することが可能となる。
Therefore, by applying the thermally
本発明を実施例により詳細に説明するが、本発明は実施例に限定されるものではない。なお、実施例及び比較例中の粘度は、２３℃で測定した値である。 The present invention will be described in detail with reference to examples, but the present invention is not limited to the examples. In addition, the viscosity in an Example and a comparative example is the value measured at 23 degreeC.
実施例および比較例で得られた熱伝導性グリース組成物は、以下のようにして評価し、結果を表１に示した。 The thermally conductive grease compositions obtained in the examples and comparative examples were evaluated as follows, and the results are shown in Table 1.
［熱抵抗］
得られた熱伝導性グリース組成物を、標準アルミプレートの全面に塗布し、他の標準アルミプレートを重ねて、０．７ＭＰａの圧力をかけた。このときの厚さをマイクロメーター（ミツトヨ社製）で測定し、標準アルミプレートの既知の厚さを差し引くことによって、組成物の厚さを算出した。標準アルミプレートに挟み込んだ組成物の２５℃における熱抵抗は、まず、レーザーフラッシュ法による熱拡散率測定機（ネッチゲレイテバウ社製、ＬＦＡ４４７）を用いて熱拡散率を測定した。この後、同測定機により熱伝導率を得て、得られた組成物の厚さをこの熱伝導率で割って算出した。
同様にして、得られた組成物を挟み込む圧力が０．３ＭＰａ、０．１ＭＰａのときの各熱抵抗を測定した。
[Thermal resistance]
The obtained heat conductive grease composition was applied to the entire surface of a standard aluminum plate, another standard aluminum plate was stacked, and a pressure of 0.7 MPa was applied. The thickness at this time was measured with a micrometer (manufactured by Mitutoyo Corporation), and the thickness of the composition was calculated by subtracting the known thickness of the standard aluminum plate. The thermal resistance at 25 ° C. of the composition sandwiched between the standard aluminum plates was first measured using a thermal diffusivity measuring machine (LFA447, manufactured by Netchgereitebau) by a laser flash method. Thereafter, the thermal conductivity was obtained by the same measuring device, and the thickness of the obtained composition was calculated by dividing by the thermal conductivity.
Similarly, each thermal resistance when the pressure which pinches | interposes the obtained composition is 0.3 MPa and 0.1 MPa was measured.
［実施例１］
粘度１．０Ｐａ・ｓのジメチルシリコーンオイル１００重量部、平均粒径が６０μｍの粒状窒化ホウ素粉末（モース硬度２）７９重量部をプラネタリー型ミキサー（ダルトン社製）に仕込み、室温にて１時間撹拌混合した。さらに、ガリウム−インジウム−スズ−亜鉛合金（質量比＝６１：２５：１３：１、融点＝７℃）３１７重量部を添加し、室温にて１時間撹拌混合して熱伝導性グリース組成物を製造した。
この組成物の特性を測定し、結果を表１に示した。
[Example 1]
100 parts by weight of dimethyl silicone oil having a viscosity of 1.0 Pa · s and 79 parts by weight of granular boron nitride powder (Mohs hardness 2) having an average particle diameter of 60 μm are charged into a planetary mixer (Dalton) for 1 hour at room temperature. Stir and mix. Further, 317 parts by weight of a gallium-indium-tin-zinc alloy (mass ratio = 61: 25: 13: 1, melting point = 7 ° C.) was added and stirred and mixed at room temperature for 1 hour to obtain a heat conductive grease composition. Manufactured.
The properties of this composition were measured and the results are shown in Table 1.
［実施例２］
粘度１．０Ｐａ・ｓのジメチルシリコーンオイル１００重量部、平均粒径が６０μｍの粒状窒化ホウ素粉末（モース硬度２）７１重量部をプラネタリー型ミキサー（ダルトン社製）に仕込み、室温にて１時間撹拌混合した。さらに、ガリウム−インジウム−スズ−亜鉛合金（質量比＝６１：２５：１３：１、融点＝７℃）４８８重量部を添加し、室温にて１時間撹拌混合して熱伝導性グリース組成物を製造した。
この組成物の特性を測定し、結果を表１に示した。
[Example 2]
100 parts by weight of dimethyl silicone oil having a viscosity of 1.0 Pa · s and 71 parts by weight of granular boron nitride powder (Mohs hardness 2) having an average particle size of 60 μm are charged into a planetary mixer (Dalton) for 1 hour at room temperature. Stir and mix. Further, 488 parts by weight of a gallium-indium-tin-zinc alloy (mass ratio = 61: 25: 13: 1, melting point = 7 ° C.) was added and stirred and mixed at room temperature for 1 hour to obtain a thermally conductive grease composition. Manufactured.
The properties of this composition were measured and the results are shown in Table 1.
［実施例３］
粘度０．６Ｐａ・ｓのＣ１０変性シリコーンオイル１００重量部、平均粒径が０．５μｍの粒状酸化亜鉛粉末（モース硬度５）２００重量部、平均粒径が２μｍの粒状アルミニウム粉末（モース硬度３）４４８重量部をプラネタリー型ミキサー（ダルトン社製）に仕込み、室温にて１時間撹拌混合した。さらに、ガリウム−インジウム−スズ−亜鉛合金（質量比＝６１：２５：１３：１、融点＝７℃）３３５重量部を添加し、室温にて１時間撹拌混合して熱伝導性グリース組成物を製造した。
この組成物の特性を測定し、結果を表１に示した。
[Example 3]
100 parts by weight of C 10 modified silicone oil having a viscosity of 0.6 Pa · s, an average particle diameter of 0.5μm particulate zinc oxide powder (Mohs hardness 5) 200 parts by weight, particulate aluminum powder having an average particle diameter of 2 [mu] m (
The properties of this composition were measured and the results are shown in Table 1.
［比較例１］
粘度０．６Ｐａ・ｓのＣ１０変性シリコーンオイル１００重量部、平均粒径が２０μｍの粒状酸化アルミニウム粉末（モース硬度９）４４８重量部をプラネタリー型ミキサー（ダルトン社製）に仕込み、室温にて１時間撹拌混合した。さらに、ガリウム−インジウム−スズ−亜鉛合金（質量比＝６１：２５：１３：１、融点＝７℃）３３５重量部を添加し、室温にて１時間撹拌混合して熱伝導性グリース組成物を製造した。
この組成物の特性を測定し、結果を表１に示した。
[Comparative Example 1]
100 parts by weight of C 10 modified silicone oil having a viscosity of 0.6 Pa · s, were charged an average particle size of 20μm granular aluminum oxide powder (Mohs hardness: 9) 448 parts by weight of a planetary type mixer (Dalton Co., Ltd.), at room temperature Stir and mix for 1 hour. Further, 335 parts by weight of a gallium-indium-tin-zinc alloy (mass ratio = 61: 25: 13: 1, melting point = 7 ° C.) was added, and the mixture was stirred and mixed at room temperature for 1 hour to obtain a thermally conductive grease composition. Manufactured.
The properties of this composition were measured and the results are shown in Table 1.
［比較例２］
粘度０．６Ｐａ・ｓのＣ１０変性シリコーンオイル１００重量部、平均粒径が２０μｍの粒状酸化マグネシウム粉末（モース硬度６）４４８重量部をプラネタリー型ミキサー（ダルトン社製）に仕込み、室温にて１時間撹拌混合した。さらに、ガリウム−インジウム−スズ−亜鉛合金（質量比＝６１：２５：１３：１、融点＝７℃）３３５重量部を添加し、室温にて１時間撹拌混合して熱伝導性グリース組成物を製造した。
この組成物の特性を測定し、結果を表１に示した。
[Comparative Example 2]
100 parts by weight of C 10 modified silicone oil having a viscosity of 0.6 Pa · s, were charged an average particle size of 20μm granular magnesium oxide powder (Mohs hardness of 6) 448 parts by weight of a planetary type mixer (Dalton Co., Ltd.), at room temperature Stir and mix for 1 hour. Further, 335 parts by weight of a gallium-indium-tin-zinc alloy (mass ratio = 61: 25: 13: 1, melting point = 7 ° C.) was added, and the mixture was stirred and mixed at room temperature for 1 hour to obtain a thermally conductive grease composition. Manufactured.
The properties of this composition were measured and the results are shown in Table 1.
［比較例３］
粘度１．０Ｐａ・ｓのジメチルシリコーンオイル１００重量部、平均粒径が８μｍの燐片状窒化ホウ素粉末（モース硬度２）４４重量部をプラネタリー型ミキサー（ダルトン社製）に仕込み、室温にて１時間撹拌混合した。さらに、ガリウム−インジウム−スズ−亜鉛合金（質量比＝６１：２５：１３：１、融点＝７℃）１４４重量部を添加し、室温にて１時間撹拌混合して熱伝導性グリース組成物を製造した。
この組成物の特性を測定し、結果を表１に示した。
100 parts by weight of dimethyl silicone oil having a viscosity of 1.0 Pa · s and 44 parts by weight of flaky boron nitride powder (Mohs hardness 2) having an average particle size of 8 μm were charged into a planetary mixer (Dalton) at room temperature. Stir and mix for 1 hour. Furthermore, 144 parts by weight of a gallium-indium-tin-zinc alloy (mass ratio = 61: 25: 13: 1, melting point = 7 ° C.) was added, and the mixture was stirred and mixed at room temperature for 1 hour to obtain a thermally conductive grease composition. Manufactured.
The properties of this composition were measured and the results are shown in Table 1.
表１から明らかなように、（Ａ）成分のベースオイルに、（Ｂ）成分のモース硬度が５以下の粒状フィラーと（Ｃ）成分の常温で液状の合金を配合した熱伝導性グリース組成物を、０．２ＭＰａ以上の圧力で基材（標準アルミプレート）間に挟み込むことによって、熱抵抗を６．５ｍｍ２−Ｋ／Ｗ以下まで低減することができる。したがって、界面熱抵抗が著しく低減され、優れた熱伝導性能を発揮するため、発熱性電子部品と放熱体との間に介在される熱伝導性材料として好適である。 As is apparent from Table 1, a thermally conductive grease composition in which (A) component base oil is blended with (B) component granular filler having a Mohs hardness of 5 or less and (C) component liquid alloy at room temperature. In addition, the thermal resistance can be reduced to 6.5 mm 2 −K / W or less by sandwiching between the substrates (standard aluminum plates) at a pressure of 0.2 MPa or more. Therefore, since the interfacial thermal resistance is remarkably reduced and excellent heat conducting performance is exhibited, it is suitable as a heat conducting material interposed between the heat generating electronic component and the heat radiating body.
１…半導体装置、２…配線基板、３…ＣＰＵ、４…ヒートシンク、５…熱伝導性グリース組成物、６…クランプ。
DESCRIPTION OF
Claims (6)
Ｒ１ ａＳｉＯ（４−ａ）／２
（Ｒ1はメチル基、フェニル基及び炭素数６〜１４のアルキル基から選ばれる少なくとも１種であり、ａは１．８≦ａ≦２．２である。）で表されるポリオルガノシロキサン １００重量部、
（Ｂ）モース硬度が５以下であり、平均粒径が０．１〜１００μｍの粒状熱伝導性フィラー ５〜７００重量部
及び
（Ｃ）融点が０〜１００℃の低融点合金 ２００〜６００重量部
を含有する熱伝導性グリース組成物であり、０．２ＭＰａ以上で押圧された状態で発熱性電子部品と放熱体との間に設置されることを特徴とする熱伝導性グリース組成物。 (A) The following general formula:
R 1 a SiO (4-a) / 2
(R 1 is at least one selected from a methyl group, a phenyl group, and an alkyl group having 6 to 14 carbon atoms, and a is 1.8 ≦ a ≦ 2.2) 100 Parts by weight,
(B) 5 to 700 parts by weight of a granular thermally conductive filler having a Mohs hardness of 5 or less and an average particle size of 0.1 to 100 μm, and (C) 200 to 600 parts by weight of a low melting point alloy having a melting point of 0 to 100 ° C. A thermally conductive grease composition comprising: a heat conductive grease composition, wherein the heat conductive grease composition is placed between a heat-generating electronic component and a heat radiator in a state of being pressed at 0.2 MPa or more.
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