JP2007101789A5 - - Google Patents
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- JP2007101789A5 JP2007101789A5 JP2005289870A JP2005289870A JP2007101789A5 JP 2007101789 A5 JP2007101789 A5 JP 2007101789A5 JP 2005289870 A JP2005289870 A JP 2005289870A JP 2005289870 A JP2005289870 A JP 2005289870A JP 2007101789 A5 JP2007101789 A5 JP 2007101789A5
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- Prior art keywords
- substrate
- optical
- light
- transmission module
- electro
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- 230000003287 optical Effects 0.000 claims 60
- 239000000758 substrate Substances 0.000 claims 54
- 230000005540 biological transmission Effects 0.000 claims 20
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000004065 semiconductor Substances 0.000 claims 5
- 238000005452 bending Methods 0.000 claims 4
- 238000009413 insulation Methods 0.000 claims 2
Claims (20)
前記第1基板が接続されている基板であって前記第1基板の平面方向が該基板の平面方向に対して直交するように該接続がなされている第2基板と、
前記第1基板に配置されている電気光学素子であって該第1基板の平面に直交する方向に発光又は受光の光軸が設定されている電気光学素子と、
前記第2基板に配置されていて光伝播路の構成要素となる光学部材であって該第2基板の平面に平行に光軸が設定されている光学部材と、を有し、
前記電気光学素子の光軸が前記光透過部材を貫くように該電気光学素子及び光透過部材が配置されていることを特徴とする光伝送モジュール。 A first substrate;
A second substrate to which the first substrate is connected, the second substrate being connected such that the planar direction of the first substrate is orthogonal to the planar direction of the substrate;
An electro-optical element disposed on the first substrate, wherein an optical axis of light emission or reception is set in a direction perpendicular to the plane of the first substrate;
An optical member that is disposed on the second substrate and serves as a component of the light propagation path, the optical axis being set in parallel to the plane of the second substrate,
An optical transmission module, wherein the electro-optic element and the light transmission member are arranged so that an optical axis of the electro-optic element penetrates the light transmission member.
前記リング形状の中心点が前記マイクロレンズの中心軸上に位置していることを特徴とする請求項7に記載の光伝送モジュール。 The base is a ring-shaped part formed in a convex shape on the plane of the second substrate,
The optical transmission module according to claim 7, wherein a center point of the ring shape is located on a central axis of the microlens.
前記基板上に配置された複数のマイクロレンズと、を有し、
前記複数のマイクロレンズは、それぞれが少なくとも他の1つのマイクロレンズと光結合するように配置されているとともに、1つの前記マイクロレンズの透過光のみが単独で通るように配置されている枝マイクロレンズと、少なくとも2つの前記マイクロレンズの透過光が合波して通るように配置されている幹マイクロレンズとを有することを特徴とする光伝送モジュール。 A substrate,
A plurality of microlenses arranged on the substrate,
Each of the plurality of microlenses is arranged so as to be optically coupled with at least one other microlens, and the branch microlens is arranged so that only the transmitted light of the one microlens passes alone. And a trunk microlens arranged so that the transmitted light of at least two of the microlenses is combined and passed therethrough.
前記半導体基板に配置されている複数の電気光学素子であって該半導体基板の平面に直交する方向に発光又は受光の光軸が設定されている複数の電気光学素子と、を有し、
前記複数の電気光学素子それぞれの光軸が前記枝マイクロレンズのいずれかを貫くように該複数の電気光学素子及び枝マイクロレンズが配置されていることを特徴とする請求項9に記載の光伝送モジュール。 A semiconductor substrate connected to the substrate, the semiconductor substrate being connected such that the planar direction of the substrate is orthogonal to the planar direction of the semiconductor substrate;
A plurality of electro-optical elements arranged on the semiconductor substrate, the light-emitting or light-receiving optical axes being set in a direction perpendicular to the plane of the semiconductor substrate, and
10. The optical transmission according to claim 9, wherein the plurality of electro-optic elements and the branch microlenses are arranged so that the optical axes of the plurality of electro-optic elements penetrate any one of the branch microlenses. module.
前記基板の平面に平行に光軸が位置する光学部材を該基板に形成する工程と、
前記基板を割る又は折り曲げることにより、該基板の側面をL字形状にして、前記電気光学素子の光軸が前記光透過部材を貫くように、該電気光学素子に対する光透過部材の向きを変更する工程とを有することを特徴とする光伝送モジュールの製造方法。 Forming an electro-optic element on the substrate in which an optical axis of light emission or reception is positioned in a direction perpendicular to the plane of the substrate;
Forming on the substrate an optical member having an optical axis positioned parallel to the plane of the substrate;
By splitting or bending the substrate, the side surface of the substrate is L-shaped, and the direction of the light transmitting member relative to the electro-optical element is changed so that the optical axis of the electro-optical element penetrates the light transmitting member. A method of manufacturing an optical transmission module.
第2基板に配置され、前記第2基板の表面に平行な方向に光が伝播する光学部材と、 An optical member disposed on the second substrate and transmitting light in a direction parallel to the surface of the second substrate;
を含み、Including
前記光学素子が発光または受光する光が、前記光学部材を伝播することを特徴とする光学装置。 An optical device characterized in that light emitted or received by the optical element propagates through the optical member.
前記基板に配置され、前記基板の表面に平行な方向に光が伝播する光学部材と、 An optical member disposed on the substrate and transmitting light in a direction parallel to the surface of the substrate;
を含み、Including
前記光学素子が発光または受光する光が、前記光学部材を伝播するように前記光学素子と前記光学部材とが配置されたことを特徴とする光学装置。 An optical apparatus, wherein the optical element and the optical member are arranged so that light emitted or received by the optical element propagates through the optical member.
前記基板の表面に平行な方向に光が伝播する光学部材を形成する工程と、 Forming an optical member in which light propagates in a direction parallel to the surface of the substrate;
前記基板を曲げることにより、前記光学素子が発光または受光する光が、前記光学部材を伝播するように前記光学素子と前記光学部材とを配置する工程と、 Arranging the optical element and the optical member so that light emitted or received by the optical element propagates through the optical member by bending the substrate;
を含むことを特徴とする光学装置の製造方法。A method for manufacturing an optical device, comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005289870A JP2007101789A (en) | 2005-10-03 | 2005-10-03 | Optical transmission module, its manufacturing method, optical transmission device, and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005289870A JP2007101789A (en) | 2005-10-03 | 2005-10-03 | Optical transmission module, its manufacturing method, optical transmission device, and electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007101789A JP2007101789A (en) | 2007-04-19 |
JP2007101789A5 true JP2007101789A5 (en) | 2008-11-06 |
Family
ID=38028803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005289870A Pending JP2007101789A (en) | 2005-10-03 | 2005-10-03 | Optical transmission module, its manufacturing method, optical transmission device, and electronic device |
Country Status (1)
Country | Link |
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JP (1) | JP2007101789A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010201560A (en) * | 2009-03-03 | 2010-09-16 | Fujifilm Corp | Method and apparatus for manufacturing spherical structure |
JP6053318B2 (en) * | 2012-05-14 | 2016-12-27 | 三菱電機株式会社 | Optical receiver |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04349674A (en) * | 1991-05-27 | 1992-12-04 | Fujitsu Ltd | Optical semiconductor element and mounting method therefor |
JPH04353807A (en) * | 1991-05-31 | 1992-12-08 | Nec Corp | Optical transmission and reception module |
JP2809267B2 (en) * | 1995-12-15 | 1998-10-08 | 日本電気株式会社 | Optical waveguide device and manufacturing method thereof |
JPH10223923A (en) * | 1997-02-05 | 1998-08-21 | Nec Corp | Sub-carrier of photodetective element |
JPH11337776A (en) * | 1998-05-28 | 1999-12-10 | Oki Electric Ind Co Ltd | Optical module and its production |
JP3559453B2 (en) * | 1998-06-29 | 2004-09-02 | 株式会社東芝 | Light emitting element |
JP2000067449A (en) * | 1998-08-18 | 2000-03-03 | Seiko Epson Corp | Surface light emission type semiconductor laser and its production |
JP2000121870A (en) * | 1998-10-14 | 2000-04-28 | Sharp Corp | Optical transmission and reception module, and its manufacture |
JP2001223424A (en) * | 2000-02-10 | 2001-08-17 | Sankyo Seiki Mfg Co Ltd | Light source unit |
JP3763737B2 (en) * | 2000-11-28 | 2006-04-05 | 株式会社東芝 | Semiconductor light emitting device |
JP4413417B2 (en) * | 2000-12-18 | 2010-02-10 | 古河電気工業株式会社 | Laser diode module |
JP2003101135A (en) * | 2001-09-21 | 2003-04-04 | Sumitomo Electric Ind Ltd | Light emitting module |
JP4114060B2 (en) * | 2003-02-06 | 2008-07-09 | セイコーエプソン株式会社 | Manufacturing method of light receiving element |
JP2005164909A (en) * | 2003-12-02 | 2005-06-23 | Citizen Electronics Co Ltd | Optical fiber module |
US7223619B2 (en) * | 2004-03-05 | 2007-05-29 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | VCSEL with integrated lens |
-
2005
- 2005-10-03 JP JP2005289870A patent/JP2007101789A/en active Pending
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