JP2007101789A5 - - Google Patents

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JP2007101789A5
JP2007101789A5 JP2005289870A JP2005289870A JP2007101789A5 JP 2007101789 A5 JP2007101789 A5 JP 2007101789A5 JP 2005289870 A JP2005289870 A JP 2005289870A JP 2005289870 A JP2005289870 A JP 2005289870A JP 2007101789 A5 JP2007101789 A5 JP 2007101789A5
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substrate
optical
light
transmission module
electro
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JP2005289870A
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JP2007101789A (en
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Claims (20)

第1基板と、
前記第1基板が接続されている基板であって前記第1基板の平面方向が該基板の平面方向に対して直交するように該接続がなされている第2基板と、
前記第1基板に配置されている電気光学素子であって該第1基板の平面に直交する方向に発光又は受光の光軸が設定されている電気光学素子と、
前記第2基板に配置されていて光伝播路の構成要素となる光学部材であって該第2基板の平面に平行に光軸が設定されている光学部材と、を有し、
前記電気光学素子の光軸が前記光透過部材を貫くように該電気光学素子及び光透過部材が配置されていることを特徴とする光伝送モジュール。
A first substrate;
A second substrate to which the first substrate is connected, the second substrate being connected such that the planar direction of the first substrate is orthogonal to the planar direction of the substrate;
An electro-optical element disposed on the first substrate, wherein an optical axis of light emission or reception is set in a direction perpendicular to the plane of the first substrate;
An optical member that is disposed on the second substrate and serves as a component of the light propagation path, the optical axis being set in parallel to the plane of the second substrate,
An optical transmission module, wherein the electro-optic element and the light transmission member are arranged so that an optical axis of the electro-optic element penetrates the light transmission member.
前記電気光学素子は、面発光レーザ又は受光素子であることを特徴とする請求項1に記載の光伝送モジュール。 The optical transmission module according to claim 1, wherein the electro-optical element is a surface emitting laser or a light receiving element. 前記光学部材は、マイクロレンズ又は導波路であることを特徴とする請求項1又は2に記載の光伝送モジュール。 The optical transmission module according to claim 1, wherein the optical member is a microlens or a waveguide. 前記第1基板は、前記第2基板を割る又は折り曲げることで構成したものであることを特徴とする請求項1から3のいずれか一項に記載の光伝送モジュール。 4. The optical transmission module according to claim 1, wherein the first substrate is configured by breaking or bending the second substrate. 5. 前記第1基板と第2基板とは、該第1基板及び第2基板の平面上に形成された弾性及び絶縁性を有する絶縁部材を有して接続されていることを特徴とする請求項1から3のいずれか一項に記載の光伝送モジュール。 2. The first substrate and the second substrate are connected to each other by having an insulating member having elasticity and insulation formed on the planes of the first substrate and the second substrate. 4. The optical transmission module according to any one of items 1 to 3. 前記第1基板と第2基板とは、該第1基板及び第2基板の平面上に形成された弾性及び絶縁性を有する第1絶縁部材と、前記第1絶縁部材上に形成された配線と、少なくとも前記配線を覆うように形成された弾性及び絶縁性を有する第2絶縁部材と、を有して接続されていることを特徴とする請求項1から3のいずれか一項に記載の光伝送モジュール。 The first substrate and the second substrate include an elastic and insulating first insulating member formed on a plane of the first substrate and the second substrate, and a wiring formed on the first insulating member. 4. The light according to claim 1, further comprising a second insulating member having elasticity and insulation formed so as to cover at least the wiring. 5. Transmission module. 前記マイクロレンズは、前記第2基板の平面に凸状に形成された土台の上に配置されていることを特徴とする請求項1から6のいずれか一項に記載の光伝送モジュール。 The optical transmission module according to claim 1, wherein the microlens is disposed on a base formed in a convex shape on a plane of the second substrate. 前記土台は、前記第2基板の平面に凸状に形成された部位がリング形状をなすものであり、
前記リング形状の中心点が前記マイクロレンズの中心軸上に位置していることを特徴とする請求項7に記載の光伝送モジュール。
The base is a ring-shaped part formed in a convex shape on the plane of the second substrate,
The optical transmission module according to claim 7, wherein a center point of the ring shape is located on a central axis of the microlens.
基板と、
前記基板上に配置された複数のマイクロレンズと、を有し、
前記複数のマイクロレンズは、それぞれが少なくとも他の1つのマイクロレンズと光結合するように配置されているとともに、1つの前記マイクロレンズの透過光のみが単独で通るように配置されている枝マイクロレンズと、少なくとも2つの前記マイクロレンズの透過光が合波して通るように配置されている幹マイクロレンズとを有することを特徴とする光伝送モジュール。
A substrate,
A plurality of microlenses arranged on the substrate,
Each of the plurality of microlenses is arranged so as to be optically coupled with at least one other microlens, and the branch microlens is arranged so that only the transmitted light of the one microlens passes alone. And a trunk microlens arranged so that the transmitted light of at least two of the microlenses is combined and passed therethrough.
前記基板に接続されている半導体基板であって前記基板の平面方向が該半導体基板の平面方向に対して直交するように該接続がなされている半導体基板と、
前記半導体基板に配置されている複数の電気光学素子であって該半導体基板の平面に直交する方向に発光又は受光の光軸が設定されている複数の電気光学素子と、を有し、
前記複数の電気光学素子それぞれの光軸が前記枝マイクロレンズのいずれかを貫くように該複数の電気光学素子及び枝マイクロレンズが配置されていることを特徴とする請求項9に記載の光伝送モジュール。
A semiconductor substrate connected to the substrate, the semiconductor substrate being connected such that the planar direction of the substrate is orthogonal to the planar direction of the semiconductor substrate;
A plurality of electro-optical elements arranged on the semiconductor substrate, the light-emitting or light-receiving optical axes being set in a direction perpendicular to the plane of the semiconductor substrate, and
10. The optical transmission according to claim 9, wherein the plurality of electro-optic elements and the branch microlenses are arranged so that the optical axes of the plurality of electro-optic elements penetrate any one of the branch microlenses. module.
前記マイクロレンズは、前記基板上に形成された球形の第1部材と、前記第1部材を覆うように配置された第2部材とで構成されていることを特徴とする請求項9又は10に記載の光伝送モジュール。 The said micro lens is comprised by the spherical 1st member formed on the said board | substrate, and the 2nd member arrange | positioned so that the said 1st member may be covered, The Claim 9 or 10 characterized by the above-mentioned. The optical transmission module described. 基板の平面に直交する方向に発光又は受光の光軸が位置する電気光学素子を該基板に形成する工程と、
前記基板の平面に平行に光軸が位置する光学部材を該基板に形成する工程と、
前記基板を割る又は折り曲げることにより、該基板の側面をL字形状にして、前記電気光学素子の光軸が前記光透過部材を貫くように、該電気光学素子に対する光透過部材の向きを変更する工程とを有することを特徴とする光伝送モジュールの製造方法。
Forming an electro-optic element on the substrate in which an optical axis of light emission or reception is positioned in a direction perpendicular to the plane of the substrate;
Forming on the substrate an optical member having an optical axis positioned parallel to the plane of the substrate;
By splitting or bending the substrate, the side surface of the substrate is L-shaped, and the direction of the light transmitting member relative to the electro-optical element is changed so that the optical axis of the electro-optical element penetrates the light transmitting member. A method of manufacturing an optical transmission module.
第1基板に配置され、前記第1基板の表面に交差する方向に光を発光する発光素子、または前記第1基板の表面に交差する方向からの光を受光する受光素子を有する光学素子と、  An optical element having a light emitting element disposed on the first substrate and emitting light in a direction intersecting the surface of the first substrate, or a light receiving element receiving light from the direction intersecting the surface of the first substrate;
第2基板に配置され、前記第2基板の表面に平行な方向に光が伝播する光学部材と、  An optical member disposed on the second substrate and transmitting light in a direction parallel to the surface of the second substrate;
を含み、Including
前記光学素子が発光または受光する光が、前記光学部材を伝播することを特徴とする光学装置。  An optical device characterized in that light emitted or received by the optical element propagates through the optical member.
基板に配置され、前記基板の表面に交差する方向に光を発光する発光素子、または前記基板の表面に交差する方向からの光を受光する受光素子を有する光学素子と、  An optical element having a light emitting element disposed on a substrate and emitting light in a direction intersecting the surface of the substrate, or a light receiving element receiving light from a direction intersecting the surface of the substrate;
前記基板に配置され、前記基板の表面に平行な方向に光が伝播する光学部材と、  An optical member disposed on the substrate and transmitting light in a direction parallel to the surface of the substrate;
を含み、Including
前記光学素子が発光または受光する光が、前記光学部材を伝播するように前記光学素子と前記光学部材とが配置されたことを特徴とする光学装置。  An optical apparatus, wherein the optical element and the optical member are arranged so that light emitted or received by the optical element propagates through the optical member.
前記光学部材は導波路であることを特徴とする請求項13又は14に記載の光学装置。  15. The optical device according to claim 13, wherein the optical member is a waveguide. 前記光学部材はマイクロレンズであることを特徴とする請求項13から15のいずれか一項に記載の光学装置。  The optical device according to claim 13, wherein the optical member is a microlens. 前記光学素子と前記光学部材とが、前記基板を曲げることにより配置されたことを特徴とする請求項14に記載の光学装置。  The optical device according to claim 14, wherein the optical element and the optical member are arranged by bending the substrate. 基板に、前記基板の表面に交差する方向に光を発光する発光素子、または前記第1基板の表面に交差する方向からの光を受光する受光素子を有する光学素子を形成する工程と、  Forming a light emitting element that emits light in a direction intersecting the surface of the substrate on the substrate, or an optical element having a light receiving element that receives light from the direction intersecting the surface of the first substrate;
前記基板の表面に平行な方向に光が伝播する光学部材を形成する工程と、  Forming an optical member in which light propagates in a direction parallel to the surface of the substrate;
前記基板を曲げることにより、前記光学素子が発光または受光する光が、前記光学部材を伝播するように前記光学素子と前記光学部材とを配置する工程と、  Arranging the optical element and the optical member so that light emitted or received by the optical element propagates through the optical member by bending the substrate;
を含むことを特徴とする光学装置の製造方法。A method for manufacturing an optical device, comprising:
請求項1から11のいずれか一項に記載の光伝送モジュール、又は請求項12に記載の光伝送モジュールの製造方法を用いて製造された光伝送モジュール、又は請求項13から17のいずれか一項に記載の光学装置、又は請求項18に記載の光学装置の製造方法を用いて製造された光学装置を含むことを特徴とする光伝送装置。  The optical transmission module according to any one of claims 1 to 11, the optical transmission module manufactured by using the method for manufacturing an optical transmission module according to claim 12, or any one of claims 13 to 17. An optical transmission device comprising the optical device according to claim 18 or an optical device manufactured using the method for manufacturing an optical device according to claim 18. 請求項1から11のいずれか一項に記載の光伝送モジュール、又は請求項12に記載の光伝送モジュールの製造方法を用いて製造された光伝送モジュール、又は請求項13から17のいずれか一項に記載の光学装置、又は請求項18に記載の光学装置の製造方法を用いて製造された光学装置を含むことを特徴とする電子機器。  The optical transmission module according to any one of claims 1 to 11, the optical transmission module manufactured by using the method for manufacturing an optical transmission module according to claim 12, or any one of claims 13 to 17. An electronic apparatus comprising the optical device according to claim 18 or an optical device manufactured by using the method for manufacturing an optical device according to claim 18.
JP2005289870A 2005-10-03 2005-10-03 Optical transmission module, its manufacturing method, optical transmission device, and electronic device Pending JP2007101789A (en)

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JP2010201560A (en) * 2009-03-03 2010-09-16 Fujifilm Corp Method and apparatus for manufacturing spherical structure
JP6053318B2 (en) * 2012-05-14 2016-12-27 三菱電機株式会社 Optical receiver

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04349674A (en) * 1991-05-27 1992-12-04 Fujitsu Ltd Optical semiconductor element and mounting method therefor
JPH04353807A (en) * 1991-05-31 1992-12-08 Nec Corp Optical transmission and reception module
JP2809267B2 (en) * 1995-12-15 1998-10-08 日本電気株式会社 Optical waveguide device and manufacturing method thereof
JPH10223923A (en) * 1997-02-05 1998-08-21 Nec Corp Sub-carrier of photodetective element
JPH11337776A (en) * 1998-05-28 1999-12-10 Oki Electric Ind Co Ltd Optical module and its production
JP3559453B2 (en) * 1998-06-29 2004-09-02 株式会社東芝 Light emitting element
JP2000067449A (en) * 1998-08-18 2000-03-03 Seiko Epson Corp Surface light emission type semiconductor laser and its production
JP2000121870A (en) * 1998-10-14 2000-04-28 Sharp Corp Optical transmission and reception module, and its manufacture
JP2001223424A (en) * 2000-02-10 2001-08-17 Sankyo Seiki Mfg Co Ltd Light source unit
JP3763737B2 (en) * 2000-11-28 2006-04-05 株式会社東芝 Semiconductor light emitting device
JP4413417B2 (en) * 2000-12-18 2010-02-10 古河電気工業株式会社 Laser diode module
JP2003101135A (en) * 2001-09-21 2003-04-04 Sumitomo Electric Ind Ltd Light emitting module
JP4114060B2 (en) * 2003-02-06 2008-07-09 セイコーエプソン株式会社 Manufacturing method of light receiving element
JP2005164909A (en) * 2003-12-02 2005-06-23 Citizen Electronics Co Ltd Optical fiber module
US7223619B2 (en) * 2004-03-05 2007-05-29 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. VCSEL with integrated lens

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