JP2007090583A - Manufacturing method of ceramic porous structure - Google Patents

Manufacturing method of ceramic porous structure Download PDF

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Publication number
JP2007090583A
JP2007090583A JP2005281081A JP2005281081A JP2007090583A JP 2007090583 A JP2007090583 A JP 2007090583A JP 2005281081 A JP2005281081 A JP 2005281081A JP 2005281081 A JP2005281081 A JP 2005281081A JP 2007090583 A JP2007090583 A JP 2007090583A
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ceramic
porous structure
holes
manufacturing
hole
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JP2005281081A
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Japanese (ja)
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Mitsuru Usui
充 臼井
Koji Ose
宏次 小瀬
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Hitachi Ltd
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Hitachi Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic porous structure allowing easy perforation of a large number of holes through a thick ceramic plate. <P>SOLUTION: Holes of a desired diameter are perforated at specified intervals through a thin-sheet-formed green sheet of a ceramic before sintering, and a metal paste is embedded in the holes for stopgap. The sheet is laminated twice or more to a desired thickness, and the resultant laminated sheets are sintered. Then, the metal parts are removed by etching to form a ceramic porous structure. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、プローブカード端子、コネクタなどのソケットに利用されるセラミック多孔質構造体の製造方法に関する。   The present invention relates to a method for manufacturing a ceramic porous structure used for sockets such as probe card terminals and connectors.

従来は、セラミックの板に穴を開ける方法として、焼結されたセラミックにドリルを用い研削しながら穴を開ける方法がある（特許文献１または特許文献２参照）。   Conventionally, as a method of making a hole in a ceramic plate, there is a method of making a hole while grinding a sintered ceramic using a drill (see Patent Document 1 or Patent Document 2).

特開2004-66358号公報JP 2004-66358 A 特開2003-251512号公報JP 2003-251512 A

上記背景技術におけるセラミックの穴あけ方法は、（１）ドリルによる機械的な研削のため、衝撃によりクラックを発生する場合がある。（２）ドリルの寸法・強度等により、板厚が厚く微小な穴あけを施す場合の対応が困難である。（３）加工する穴数が数百〜数千を超える場合は、ドリルの多軸による加工においてもかなりの時間がかかる。
などの問題があった。 The ceramic drilling method in the background art described above may (1) cause mechanical cracking by a drill, which may cause cracks due to impact. (2) Due to the size / strength of the drill, it is difficult to cope with drilling with a thick plate and a minute hole. (3) When the number of holes to be machined exceeds several hundred to several thousand, considerable time is required for machining with multiple axes of a drill.
There were problems such as.

本発明の目的は、板厚の厚いセラミックの板に多数の孔を容易に開けることができる多孔質構造体の製造方法を提供することにある。   An object of the present invention is to provide a method for producing a porous structure capable of easily opening a large number of holes in a thick ceramic plate.

上記目的を達成するために本発明は、セラミックの焼結前の薄いシート状のグリーンシートの状態において穴あけを施し、その穴を金属ペーストで埋め、このシートを複数積層／焼結しその後エッチングにより金属部分を除去する構成を採用した。   In order to achieve the above object, the present invention provides a hole in the state of a thin green sheet before sintering the ceramic, fills the hole with a metal paste, stacks / sinters the sheet, and then etches the sheet. A configuration for removing the metal portion was adopted.

本発明によれば、多孔セラミック板を容易に加工することができ、その後プローブカード等に利用することができるという効果がある。   According to the present invention, there is an effect that the porous ceramic plate can be easily processed and then used for a probe card or the like.

以下、本発明の一実施形態である多孔質構造体の製造方法を図面を用いて詳細に説明する。   Hereinafter, the manufacturing method of the porous structure which is one Embodiment of this invention is demonstrated in detail using drawing.

図１は、本実施例により製造される多孔質構造体の断面図である。セラミック１に孔２を形成しており、セラミックはホウ珪酸系ガラスセラミックであり、板厚は10mmとする。また、孔２の直径は0.06mmで、孔２は0.2mmピッチで形成されている。   FIG. 1 is a cross-sectional view of a porous structure manufactured according to this example. A hole 2 is formed in the ceramic 1, and the ceramic is a borosilicate glass ceramic, and the plate thickness is 10 mm. The diameter of the holes 2 is 0.06 mm, and the holes 2 are formed at a pitch of 0.2 mm.

図２は、多孔質構造体の製造工程フロー図である。まず、0.2mmの焼結前のセラミックの材料であるグリーンシートに直径0.06mmポンチを用いて所望の数の穴あけを行う。このセラミックの材料は、例えばホウ珪酸系ガラスセラミック材を用いる。次にこのシートの穴に粘性のある金属ペースト、例えば球径約0.005ｍｍ銅粉末を糊系の材料であるエチルセルロースと溶剤のエチレングリコールモノヘキシルエーテルを混ぜ粘性のあるペースト状にし、これを、印刷技術を用いて穴に埋め込む。なお、この穴あけ及び穴埋めされたシートは所望の板厚になるように必要枚数同様な処理を行い、その位置合わせを行って積層加圧接着を施し、焼結処理を行う。   FIG. 2 is a manufacturing process flow diagram of the porous structure. First, a desired number of holes are punched using a 0.06 mm diameter punch in a green sheet which is a ceramic material of 0.2 mm before sintering. For example, a borosilicate glass ceramic material is used as the ceramic material. Next, a viscous metal paste, such as a copper powder with a spherical diameter of about 0.005 mm, is mixed in the hole in this sheet with ethyl cellulose, a paste-based material, and a solvent, ethylene glycol monohexyl ether, to form a viscous paste. Embed in the hole using technology. The punched and hole-filled sheets are processed in the same manner as necessary so as to have a desired plate thickness, aligned, laminated and pressure-bonded, and sintered.

この焼結されたセラミックの板を、硝酸とリン酸と酢酸を混合比２：１：３の混合液によりエッチング処理を行うことにより、焼結工程にて形成された穴埋めされた銅を選択的にエッチングし所望の孔が形成される。   This sintered ceramic plate is etched with a mixed solution of nitric acid, phosphoric acid and acetic acid in a mixing ratio of 2: 1: 3, thereby selectively filling the copper filled in the sintering process. The desired hole is formed by etching.

以上の処理により、セラミックに多数の孔を形成したセラミック多孔質構造体が完成する。なお、セラミックの材料はアルミナ、金属はタングステン等でもよい。   By the above treatment, a ceramic porous structure in which a large number of pores are formed in the ceramic is completed. The ceramic material may be alumina, and the metal may be tungsten.

この後、半導体テスト用プローブ針をこの孔に挿入することにより、プローブカードとして利用することも可能となる。また、本実施例で示したような熱収縮率がＳｉと同様な材料を選択することにより、精度変化が少なく安定したプローブカードを提供することができる。   Thereafter, a semiconductor test probe needle can be inserted into this hole to be used as a probe card. Further, by selecting a material having the same thermal shrinkage rate as Si as shown in this embodiment, it is possible to provide a stable probe card with little change in accuracy.

本発明の一実施の形態である多孔質構造体の断面図である。It is sectional drawing of the porous structure which is one embodiment of this invention. 多孔質構造体の製造工程を示すフローチャートである。It is a flowchart which shows the manufacturing process of a porous structure.

符号の説明Explanation of symbols

１：セラミック板、２：セラミック孔
1: Ceramic plate, 2: Ceramic hole

Claims (2)

セラミックを用いた多孔質構造体の製造方法であって、
所望の貫通孔を開けるために、セラミックの製造工程においてグリーンシートに穴あけを施すステップと、
この孔を金属ペーストで穴埋めを行うステップと、
この加工されたグリーンシートを複数積層し焼結するステップと、
この焼結されたセラミックの金属部分をエッチングにて除去するステップとを備えることを特徴とする多孔質構造体の製造方法。 A method for producing a porous structure using ceramic,
In order to open a desired through hole, a step of making a hole in the green sheet in the ceramic manufacturing process;
Filling the holes with metal paste,
A step of laminating and sintering a plurality of processed green sheets;
And a step of removing the metal part of the sintered ceramic by etching. 請求項１記載の製造方法によって製造された構造体。
A structure manufactured by the manufacturing method according to claim 1.
JP2005281081A 2005-09-28 2005-09-28 Manufacturing method of ceramic porous structure Pending JP2007090583A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7490589B2 (en) 2021-02-03 2024-05-27 三菱重工業株式会社 Method for forming holes in ceramic members

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7490589B2 (en) 2021-02-03 2024-05-27 三菱重工業株式会社 Method for forming holes in ceramic members

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