JP2007090460A - Method of cutting film material having adhesive material layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of cutting a film material having an adhesive material layer, which can prevent an adhesive material forming its layer, from running over from a substrate when cutting a film material having the adhesive material layer to a narrow width, can continuously cut with high width accuracy without adhering to the back surface side of the substrate, and does not have an adverse effect on the quality of the film material wound up after being cut. <P>SOLUTION: The film material 20 having the adhesive material layer continuously let out is cut while wetting a contact portion of at least cutting blade 31 with the adhesive material layer by organic fluorinated liquid having a boiling point of 50 to 130°C and a vapor pressure of 30 to 2 kMPa filled in a tray 33. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  In the present invention, when the film material provided with the adhesive material layer is wound while being cut into a narrow width, the adhesive material does not protrude from the base material, or the adhesive material does not adhere to the back surface side of the base material. The present invention relates to a method for cutting a film material provided with an adhesive layer that can be continuously and stably cut with high width accuracy.

In general, a tape-like member such as an adhesive tape is manufactured by coating an adhesive material layer on a wide film substrate and then winding it into a roll while cutting it into a narrow tape. Yes.
Moreover, when manufacturing an adhesive tape in this way, as an apparatus for cut | disconnecting a film material thinly, the slit apparatus as disclosed by patent document 1 etc. is known, for example.

  The slit device disclosed in Patent Document 1 has an upper unit in which disk-shaped upper blades and upper spacer rings are alternately assembled on a shaft, and a disk-shaped lower blade and lower spacer rings are alternately assembled on a shaft. In a block blade type slitting device composed of a lower unit, the peripheral surface of the upper blade and the peripheral surface of the lower blade are opposed to each other, and the upper blade and the lower blade of the diagonally opposite blade are in sliding contact with each other and adjacent to each other. By setting the gap between the matching upper blades or the gap between the adjacent lower blades to a predetermined width, it is possible to reduce the difference in thickness between the center portion and both edge portions of the slit adhesive tape and the warpage of the edge portions. It is said.

JP 2000-326284 A

  However, as a result of extensive studies by the present inventors, it is still an improvement to produce a pressure-sensitive adhesive tape by cutting a film material having a pressure-sensitive adhesive layer into a narrow width by means of a slit device as in Patent Document 1. There is still a problem to be solved, and when cutting, the adhesive material that forms the adhesive layer sticks to the upper blade and the lower blade and sticks out of the base material. It has been found that there is a problem in that the sticking adhesive material sticks to the back side of the base material.

  In particular, in recent years, anisotropic conductive films in which conductive fine particles are contained in an adhesive layer formed on a substrate have been widely used for circuit connections such as liquid crystal displays. In the same way as described above, the directionally conductive film is usually manufactured and supplied by being wound into a reel in the form of a tape. And since the thickness of the adhesive material layer formed in such an anisotropic conductive film, the content of conductive fine particles, etc. are strictly controlled, in the process of manufacturing the anisotropic conductive film, the adhesive material If some of the defects that stick out of the base material or adhere to the back side of the base material occur, the reel in which such a problem has occurred must be discarded, causing a reduction in manufacturing yield. End up.

  In addition, it is conceivable that the blade (cutting blade) that cuts the film material is moistened to prevent adhesion of the adhesive material and solve the above problem. In this case, the cutting blade is moistened. The wetting liquid used for the adhesion may adhere to the film material and remain on the film material wound up after cutting to swell the adhesive material, which may adversely affect the quality of the film material. For this reason, simply moistening the cutting blade did not provide a fundamental solution to the problem.

  The present invention has been made on the basis of the above-described studies by the present inventors, and the adhesive material for forming the adhesive material layer is a base material when the film material provided with the adhesive material layer is cut into a narrow width. Adhesive that can be continuously cut with high width accuracy without protruding or sticking to the back side of the base material, and has no adverse effect on the quality of the film material wound up after cutting. It aims at providing the cutting method of the film material provided with the material layer.

  The cutting method of the film material provided with the adhesive material layer according to the present invention that solves the above-mentioned problem is to cut the film material provided with the adhesive material layer on the base material with a cutting blade while continuously feeding the film material. As a method for cutting the film material after at least a contact portion of the cutting blade with the adhesive layer is immersed in an organic fluorinated liquid having a boiling point of 50 to 130 ° C. and a vapor pressure of 2 to 35 kPa. is there.

  By adopting such a method, it is possible to prevent the adhesive material from sticking to the cutting blade without adversely affecting the quality of the film material to be wound after cutting, so that the adhesive material protrudes from the base material. The film material can be continuously and stably cut with high width accuracy without adhering to the back side of the material.

  Moreover, in the cutting method of the film material provided with such an adhesive material layer according to the present invention, the vapor density of the organic fluorinated liquid is 5 to 20 from the viewpoint of optimizing the evaporation rate. Is preferred.

  Moreover, in the cutting method of the film material provided with the adhesive material layer according to the present invention, in order to avoid dissolving the adhesive material or causing a chemical reaction with the adhesive material, etc. An organic fluorinated liquid is used as a wetting liquid for wetting the blade. As the organic fluorinated liquid, a liquid mainly composed of a fluorinated material having 3 to 9 carbon atoms is preferably used. It is preferable to use one having a fully fluorinated product of 8 or a hydrofluoroether.

Further, in the method for cutting a film material provided with the adhesive layer according to the present invention, the cutting blade supports a plurality of disk-shaped upper blades having a tapered blade edge portion at a peripheral end at predetermined intervals. It consists of an upper blade assembly assembled to the shaft and a lower blade assembly formed by assembling a plurality of disk-shaped lower blades having a flat surface substantially parallel to the shaft center at the peripheral end to the support shaft at predetermined intervals. The film material can be inserted and cut between the upper blade connecting body and the lower blade connecting body rotating in synchronization with the feeding of the film material.
With such a method, it is possible to accurately cut the film material while suppressing the positional deviation of the film material at the time of cutting.

Further, in the method for cutting a film material provided with the adhesive material layer according to the present invention, the film material is fed out so that the adhesive material layer faces the upper blade connecting body, and the cutting edge side of the upper blade is A method of wetting with the organic fluorinated liquid can be employed.
With such a method, it is possible to more effectively avoid adhesion of the adhesive material to the cutting blade by reducing the contact area between the adhesive material layer and the cutting blade.

  Such a method for cutting a film material provided with an adhesive material layer according to the present invention is particularly suitable when the film material is an anisotropic conductive film, and the adhesive force of the adhesive material layer is 0. The effect of the present invention becomes remarkable when the ratio is 15N or more.

According to the present invention, when a film material provided with an adhesive material layer is cut into a narrow width, the adhesive material forming the adhesive material layer adheres to the cutting blade by wetting the cutting blade with a specific organic fluorinated liquid. Can be prevented. For this reason, when cutting the film material, the adhesive material can be continuously and stably cut with high width accuracy without protruding from the base material or adhering to the back side of the base material.
In addition, the organic fluorinated liquid that wets the cutting blade disappears before the cut film material is wound up, so that the quality of the film material is not adversely affected.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view showing an example of a slit device suitable for carrying out the method for cutting a film material provided with the adhesive material layer according to the present invention.

  In the slit device 10 shown in FIG. 1, a roll 21 around which a film material 20 having an adhesive material layer is wound is attached to the unwinding shaft 11. The film material 20 is fed from the roll 21 to the cutting blade unit 30 via the feed roller 12.

  As the film material 20 provided with the adhesive material layer to be cut in the present embodiment, for example, polyethylene terephthalate, tetrafluoroethylene, tetrafluoroethylene-ethylene copolymer, which has been subjected to release treatment as necessary, is used. Adhesives made by mixing epoxy resin, urethane resin, acrylic resin, etc., alone or as appropriate, with various additives as required, on a base made of polymer, polyimide, etc. The thing formed by coating is mentioned.

In the present embodiment, the cutting blade unit 30 includes an upper blade connecting body 31 and a lower blade connecting body 32.
As shown in FIG. 2, the upper blade connecting body 31 has a plurality of disk-shaped upper blades 311 having a tapered blade edge portion at the peripheral end, and a spacer 312 on a support shaft 313 at a predetermined interval. It is assembled. On the other hand, a plurality of disk-shaped lower blades 321 having a flat surface substantially parallel to the axis at the peripheral end are assembled to the support shaft 323 at predetermined intervals via spacers 322. . And the edge part of each upper blade 311 assembled | attached to the upper blade coupling body 32 is inserted between each lower blade 321 assembled | attached to the lower blade coupling body 32, and each upper blade 311 and corresponding lower blade The relative positional relationship such as the axial distance between the upper blade connecting body 31 and the lower blade connecting body 32 is adjusted so that the film material 20 can be cut by the 321.

In such a cutting blade unit 30, the upper blade connecting body 31 and the lower blade connecting body 32 are driven by a driving means (not shown) so as to rotate in the arrow direction in FIG. 1 in synchronization with the feeding of the film material 20. It is connected. Then, by inserting the film material 20 between the upper blade connecting body 31 and the lower blade connecting body 32, the inserted film material 20 is cut into a tape having a predetermined width. The assembling intervals of 311 and the lower blade 321 become the cutting width of the film material 20.
In the present embodiment, the cutting width of the film material 20 is preferably 0.5 to 4.0 mm, more preferably 1.0 to 3.0 mm.

  As the cutting blade unit 30 used in the present embodiment, various types conventionally used in this type of slitting device can be used. However, if the cutting blade unit 30 as described above is used, the lower blade is connected. In a state where the film material 20 is supported on the flat surface of the peripheral edge of the lower blade 321 assembled to the body 32, the film material 20 will be cut, and the positional deviation of the film material 20 at the time of cutting is suppressed, It is preferable because the film material 20 can be cut with high accuracy.

  Further, when the film material 20 is cut by the cutting blade unit 30 as described above, if the film material 20 is drawn out so that the adhesive material layer of the film material 20 faces the upper blade connecting body 31, the adhesive material layer and the cutting The contact area with the blade (upper blade 311) can be reduced.

In the present embodiment, when the film material 20 is inserted and cut between the upper blade connecting body 31 and the lower blade connecting body 32, each upper member assembled to the upper blade connecting body 31 is cut. The adhesive material forming the adhesive material layer is prevented from adhering to the upper blade 311 by immersing the blade tip side of the blade 311 in the wetting liquid and moistening at least the contact portion with the adhesive material layer.
Thereby, according to this embodiment, the adhesive material which forms an adhesive material layer adheres to a cutting blade (upper blade 311), and it sticks out of a base material so that it may be dragged, or the adhesive sticks out of a base material. It is possible to effectively avoid such a problem that the material adheres to the back side of the substrate.

Here, in the example shown in FIG. 1, after the wetting liquid is filled in the receiving tray 33 provided below the upper blade connecting body 31 and the cutting edge side of the upper blade 311 is dipped in the wetting liquid and wetted, The film material 20 inserted between the lower blade continuous body 31 is cut. In the present embodiment, the wetting liquid used to wet the cutting edge portion of the upper blade 311 has a boiling point of 50 to 130 ° C, preferably 60 to 120 ° C, more preferably 70 to 110 ° C, and a vapor pressure. Is from 2 to 35 kPa, preferably from 3 to 25 kPa, more preferably from 4 to 20 kPa.
The vapor density of the organic fluorinated liquid as the wetting liquid is preferably 5 to 20, more preferably 8 to 15 when air is 1.
The boiling point is a value at normal pressure (1 atm), and the vapor pressure and the vapor density are values at normal temperature (20 to 25 ° C.).

As will be described later, the film materials 20a and 20b that have been cut narrowly by the cutting blade unit 30 are wound around the reel 50, but when the cutting blade (upper blade 311) is simply wetted, The film materials 20a and 20b are wound while the adhering wetting liquid remains, and the remaining wetting liquid may cause the adhesive material to swell, thereby adversely affecting the quality of the film materials 20a and 20b. .
However, in the present embodiment, by using the organic fluorinated liquid as described above as the wetting liquid for wetting the cutting blade (upper blade 311), the wetting liquid attached to the film materials 20a and 20b becomes the film material 20a, It is possible to evaporate and disappear sufficiently until 20b is wound up, and the quality of the film materials 20a and 20b is not adversely affected by the remaining wetting liquid.

In this embodiment, the organic fluorinated liquid that wets the cutting blade (upper blade 311) maintains the state in which the cutting blade (upper blade 311) is wet until the film material 20 is cut. Although it is ideal that it evaporates and disappears immediately after being cut, any material that disappears after the film material 20 is cut and before the film materials 20a and 20b are wound up may be used.
If the boiling point and vapor pressure of the organic fluorinated liquid used as the wetting liquid are less than the above ranges, the evaporation rate is slow, and the organic fluorinated liquid does not evaporate until the film material 20 is wound up. May remain. On the other hand, when the boiling point and vapor pressure of the organic fluorinated liquid exceed the above ranges, the evaporation rate is too high, and the dampener 33 must be frequently replenished with the wetting liquid. This is not preferable for stable cutting. From the viewpoint of optimizing the evaporation rate, the evaporation density of the organic fluorinated liquid is preferably in the above range.

In this embodiment, the organic fluorinated liquid is used as the wetting liquid in order to avoid the wetting liquid from dissolving the adhesive material or causing a chemical reaction with the adhesive material. As such an organic fluorinated liquid, for example, a liquid mainly containing a fluorinated material having 3 to 9 carbon atoms is preferably used, and in particular, a fully fluorinated material having 6 to 8 carbon atoms is mainly used. And hydrofluoroethers are preferred.
More specifically, as an organic fluorinated liquid mainly composed of a fully fluorinated product having 6 to 8 carbon atoms, “Fluorinert (trade name)” manufactured by Sumitomo 3M Co., Ltd. is commercially available. However, FC-84 and FC-77 are preferred. Examples of the hydrofluoroether include methyl nonafluoroisobutyl ether, methyl nonafluorobutyl ether, ethyl nonafluoroisobutyl ether, and ethyl nonafluorobutyl ether. These can be used alone or in admixture of two or more.

In this way, the film materials 20a and 20b cut to be narrow by the cutting blade unit 30 are divided into two directions along the width direction alternately. It is sent to the roller 40a and the second widening roller 40b, respectively. And as shown in FIG. 3, each film material 20a (20b) by which the space | interval with adjacent film material 20a (20b) was expanded by each width expansion roller 40a (40b), the rough guide 13, While the tension is adjusted by the winding guide 14, the winding is wound around the reel 50 attached to the winding shaft 15.
In addition, after cutting the film material 20, the both ends of the film material 20 which become unnecessary for adjustment of a cutting | disconnection width | variety etc. can also be made to wind up to the ear winder which is not shown in figure as needed.

  According to the present embodiment as described above, when the film material 20 having the adhesive material layer is cut into a narrow width, the adhesive material does not adversely affect the quality of the film materials 20a and 20b wound up after the cutting. Can be prevented from sticking out of the base material or adhering to the back surface side of the base material, and in particular, the anisotropic where the thickness of the adhesive layer, the content of conductive fine particles, etc. are strictly controlled In the process of producing a conductive film, it is suitable for cutting such an anisotropic conductive film into a predetermined narrow width.

Further, the adhesion of the adhesive material to the cutting blade is more likely to occur as the adhesive force of the adhesive material increases. However, when this embodiment is applied when the adhesive force of the adhesive material is 0.15 N or more, An effect can be acquired notably and it is 0.2N or more more suitably.
In addition, the adhesive force of the adhesive material is that the probe is bonded to the adhesive material after contacting the 5 mm diameter probe with the adhesive material under the conditions of a contact load of 1 N / cm ² , a contact time of 1 second, and a temperature of 50 degrees. It is the force required to peel it off in the vertical direction.

  Next, specific examples will be given to describe the present invention in more detail.

[Examples 1 to 5]
A film material 20 in which an adhesive material layer mainly composed of acrylic rubber is coated and formed in a thickness of 40 μm on a base material having a width of 65 mm made of polyethylene terephthalate is wound into a roll shape, and the slit device 10 shown in FIG. It was attached to the unwinding shaft 11.
The adhesive strength of the adhesive layer was 0.25N.

On the other hand, the organic fluorinated liquid shown in Table 1 was used as the wetting liquid, and this was filled in the tray 33 so that the cutting edge side of the upper blade 311 assembled to the upper blade connecting body 31 was immersed in the wetting liquid. Then, the film material 20 is unwound so that the adhesive material layer faces the upper blade continuous body 31, the film material 20 is cut into a width of 2.0 mm, and the cut film materials 20 a and 20 b are wound around the reel 50. It was.
The time required from cutting the film material 20 to winding it on the reel 50 was 5 seconds. Moreover, the both ends of the film material 20 which became unnecessary were wound up by the ear winder.

[Comparative Examples 1-2]
The film material was cut in the same manner as in the above example except that the organic fluorinated liquid shown in Table 1 was used as the wetting liquid.

[Comparative Example 3]
The film material was cut in the same manner as in the above example except that acetone was used as the wetting liquid.

[Comparative Example 4]
The film material was cut in the same manner as in the above example except that ethanol was used as the wetting liquid.

  These Examples and Comparative Examples were evaluated according to the following evaluation criteria, and the results are also shown in Table 1.

[Evaluation 1: Wetting effect]
When the film material was cut, the case where adhesion of the adhesive material to the cutting blade was not recognized at all was evaluated as ◯, and the case where slight adhesion was observed was evaluated as Δ.

[Evaluation 2: Quick-drying]
After the film material was cut, the wetting liquid adhering to the film material had disappeared completely until the film material was wound up, and the case where some residue was found Δ, the amount of adhering wetting liquid being large. The part which remained was set as x.

[Evaluation 3: Influence on quality of base film]
The case where the influence on the quality of the substrate film was not recognized at all was indicated by ○, the case where a slight influence was observed was indicated by Δ, and the case where the adhesive material was dissolved was indicated by ×.

[Evaluation 4: Stability]
○ which did not need to be replenished with a dampening solution frequently, replenishment frequency of dampening solution was relatively high, but △ was within an acceptable range, dampening solution had to be replenished frequently, odor etc. Those that needed countermeasures were marked as x.

  Although the present invention has been described with reference to the preferred embodiment, it is needless to say that the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention. .

  For example, in the above-described embodiment, the film material 20 is cut with the adhesive material layer facing the upper blade connecting body 31, but the film material 20 is cut with the adhesive material layer facing the lower blade connecting body 32. In this case, the portion that comes into contact with the adhesive material layer of the lower blade 321 assembled to the lower blade connecting body 32 may be wetted with the organic fluorinated liquid.

  Further, as described above, various cutting blades used in this type of slitting device can be used, but even in such a case, at least the cutting blade can be used with the organic fluorinated liquid described above. What is necessary is just to make it wet a contact site | part with the adhesive material layer.

  As described above, the present invention provides a method of continuously and stably cutting a film material provided with an adhesive material layer into a narrow width.

It is the schematic which shows an example of the slit apparatus suitable for implementation of the cutting method of the film material provided with the adhesive material layer which concerns on this invention. It is explanatory drawing which shows an example of a cutting blade unit. It is explanatory drawing which shows an example of a widening roller.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Slit apparatus 20 Film material 30 Cutting blade unit 31 Upper blade coupling body 311 Upper blade 32 Lower blade coupling body 321 Lower blade 33 Receptacle

Claims (9)

In cutting thinly with a cutting blade while continuously feeding out a film material provided with an adhesive layer on a substrate,
At least a contact part of the cutting blade with the adhesive layer,
After dipping in an organic fluorinated liquid having a boiling point of 50 to 130 ° C. and a vapor pressure of 2 to 35 kPa,
A method for cutting a film material having an adhesive layer, wherein the film material is cut.   The method for cutting a film material having an adhesive material layer according to claim 1, wherein the organic fluorinated liquid has a vapor density of 5 to 20.   The method for cutting a film material provided with the pressure-sensitive adhesive layer according to claim 1, wherein the organic fluorinated liquid contains a fluorinated material having 3 to 9 carbon atoms as a main component.   The method for cutting a film material provided with the pressure-sensitive adhesive layer according to claim 3, wherein the organic fluorinated liquid contains a fully fluorinated product having 6 to 8 carbon atoms as a main component.   The method for cutting a film material provided with the pressure-sensitive adhesive layer according to claim 3, wherein the organic fluorinated liquid is hydrofluoroether. The cutting blade is
An upper blade connecting body formed by assembling a plurality of disk-shaped upper blades having a tapered blade edge portion at a peripheral end to a support shaft at a predetermined interval;
A plurality of disk-shaped lower blades having a flat surface substantially parallel to the shaft center at the peripheral end, and a lower blade assembly formed by assembling the support shafts at predetermined intervals,
The pressure-sensitive adhesive according to any one of claims 1 to 5, wherein the film material is inserted and cut between the upper blade connecting body and the lower blade connecting body rotating in synchronization with the feeding of the film material. The cutting method of the film material provided with the material layer. While feeding the film material so that the adhesive material layer faces the upper blade continuous body,
The cutting method of the film material provided with the adhesive material layer of Claim 6 which wets the blade edge | tip part side of the said upper blade with the said organic fluorinated liquid.   The said film material is an anisotropic conductive film, The cutting method of the film material provided with the adhesive material layer of any one of Claims 1-7.   The adhesive force of the said adhesive material layer is 0.15N or more, The cutting method of the film material provided with the adhesive material layer of any one of Claims 1-8.

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