JP2007082016A - Temperature compensator of electronic apparatus and temperature compensation method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform stable and highly accurate temperature compensation even in activation from a cold state and to provide stable characteristics without being affected by ambient temperature change. <P>SOLUTION: Lookup tables 21 and 22 indicating the relation between a temperature and a characteristic compensation amount for each heating element and element of a large characteristic change by the temperature are prepared, monitoring is successively performed by temperature sensors 19 and 20 arranged near the individual elements, the pertinent compensation amount is read from the lookup tables 21 and 22, the respective gain and phase fluctuation of a main amplifier circuit 12 and a distortion signal amplifier circuit 17 are compensated, and thus a feed forward distortion compensation circuit is stably operated. By totaling the compensation amount and multiplying it with compensation signals for compensating the distortion components of the main amplifier circuit 12, the characteristic change accompanying the temperature is compensated simultaneously with distortion compensation to nonlinearity of the main amplifier circuit 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a temperature compensation device and a temperature compensation method for compensating a characteristic that varies depending on the temperature of a main element, for example, used in an electronic device such as a power amplifier of a broadcast transmitter.

  In a conventional power amplifier in a broadcast transmitter, since the amplification element itself generates heat and its characteristics change abruptly, temperature compensation is performed using a temperature sensor in accordance with the temperature change of the amplification element. However, since only one temperature sensor is used in the entire circuit, when the power amplifier is started in a cold state when the power is turned on, the temperature change of the entire circuit does not follow the temperature change of the amplification element itself. Excessive or insufficient temperature compensation is performed until the temperature reaches an equilibrium state, and uniform temperature compensation is not achieved. Even when the temperature of the entire power amplifier is in an equilibrium state, depending on the location of the amplifying element, a temperature difference may occur between the position of the temperature sensor and an appropriate temperature compensation value cannot be applied. There is a decrease in accuracy.

Patent Document 1 discloses a configuration in which a temperature sensor is provided in the vicinity of a heat generating component, and the fan is driven and controlled by detecting an abnormally high temperature. With this configuration, detailed temperature management is impossible and temperature compensation cannot be realized with high accuracy.
Japanese Patent Application Laid-Open No. 08-063237

  As described above, in a conventional electronic device such as a power amplifier, the temperature stability is unstable and the accuracy is low depending on the state, so that detailed temperature management cannot be performed and high-precision temperature compensation cannot be performed.

  The present invention has been made in consideration of the above circumstances, and can perform stable and highly accurate temperature compensation even when starting up from a cold state, and has stable characteristics without being affected by changes in ambient temperature. It is an object of the present invention to provide a temperature compensation device and a temperature compensation method for an electronic device obtained.

  In order to achieve the above object, a temperature compensation device for an electronic device according to the present invention includes a lookup table in which a relationship between a temperature characteristic and a compensation amount is stored in advance for a heating element in the electronic device, and the vicinity of the heating element. And a compensation processing means for reading a corresponding compensation amount from the lookup table based on a temperature detected by the temperature sensor and adding a compensation amount corresponding to an input signal or an output signal of the heating element. It is comprised and comprises.

  In the temperature compensation method for an electronic device according to the present invention, the relationship between the temperature characteristic and the compensation amount is stored in a lookup table in advance for the heating element in the electronic device, and the temperature sensor is disposed in the vicinity of the heating element, A corresponding compensation amount is read from the look-up table based on the temperature detected by the temperature sensor, and a compensation amount corresponding to the input signal or output signal of the heating element is added.

  In the above temperature compensation device and method, instead of measuring the temperature of the entire circuit, a temperature sensor is arranged in the vicinity of the heating element and an element having a large characteristic change due to temperature, and the temperature change of the element is measured in advance. The compensation amount is sequentially read from the look-up table to compensate for the temperature characteristic change of the element.

  As described above, according to the present invention, an electronic device can perform stable and accurate temperature compensation even when activated from a cold state, and can obtain stable characteristics without being affected by changes in ambient temperature. Temperature compensation apparatus and temperature compensation method can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a circuit diagram showing an embodiment of a broadcast power amplifier according to the present invention. In FIG. 1, the RF signal is distributed into two systems by a distributor 11, one being supplied to the main amplifier circuit 12 and the other being supplied to the first delay circuit 13. The main amplifier circuit 12 amplifies the power of the input transmission RF signal, and its output is distributed to two systems by the distributor 14, one is supplied to the second delay circuit 15, and the other is supplied to the combiner 16. Is done.

  The first delay circuit 13 delays the input RF signal by the time required for processing of the main amplifier circuit 12 to synchronize with the output of the main amplifier circuit 12, and the delayed output is supplied to the combiner 16. Are combined with the output of the main amplifier circuit 12 distributed by the distributor 14. This combined signal is a distortion component of the output signal with respect to the input signal in the main amplifier circuit 12, amplified by the distortion signal amplifier circuit 17, and supplied to the combiner 18.

  The second delay circuit 15 is for delaying the distribution output of the power amplification signal by a time required for processing of the distortion signal amplification circuit 17 to synchronize with the output of the distortion signal amplification circuit 17. The distortion signal is supplied to the combiner 18 and is antiphase-combined with the distortion signal, and the distortion component is canceled by this combination and output.

  In the above configuration, the heat generating element and the element having a large characteristic change due to temperature are inside the main amplifier circuit 12 and the distortion signal amplifier circuit 17. Therefore, the temperature sensors 19 and 20 are arranged in the vicinity of the circuits 12 and 17 to monitor the temperatures of the heat generating elements of the circuits 12 and 17 and elements having a large characteristic change due to temperature. On the other hand, gain characteristics and phase characteristics of each heat generating element and elements having a large characteristic change due to temperature are measured in advance for each temperature, and compensation corresponding to the temperature is performed in look-up tables (hereinafter referred to as LUTs) 21 and 22. Store as quantity.

  As shown in FIG. 2, during operation after the power is turned on from the cold state, the detected temperature information of the temperature sensors 19 and 20 is sequentially obtained (step S11), and the LUTs 21 and 22 are referred to and the gain characteristics with respect to the detected temperatures. And the compensation amount of the phase characteristic is read (step S12). Then, the gain and phase fluctuations of the main amplifier circuit 12 and the distortion signal amplifier circuit 17 at the detected temperatures are compensated for (step S13).

  As described above, according to the configuration of the present embodiment, a look-up table showing the relationship between the temperature and the characteristic compensation amount is created in advance for each heating element and each element whose characteristic change due to temperature is large. And a temperature sensor arranged in the vicinity of an element having a large characteristic change due to temperature, sequentially reading out the corresponding compensation amount from the look-up table, and compensating for the gain and phase variations of the main amplifier circuit 12 and the distortion signal amplifier circuit 17, respectively. ing. As a result, stable and highly accurate temperature compensation can be achieved even when starting from a cold state, and stable characteristics can be obtained without being affected by changes in ambient temperature.

  In the above embodiment, the case of the power amplifier for broadcasting has been described. However, the present invention is not limited to this, and the same processing can be performed for an electronic device whose characteristics change due to heat generation.

  Further, the present invention is not limited to the above-described embodiments as they are, and can be embodied by variously modifying the constituent elements without departing from the scope of the invention in the implementation stage, and disclosed in the above-described embodiments. Various inventions can be formed by appropriately combining a plurality of constituent elements. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements according to different embodiments may be appropriately combined.

1 is a circuit diagram showing an embodiment of a broadcast power amplifier according to the present invention. The flowchart for demonstrating the processing operation | movement of the distortion signal amplifier circuit after power ON after the cold state in embodiment of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Distributor, 12 ... Main amplifier circuit, 13 ... 1st delay circuit, 14 ... Distributor, 15 ... 2nd delay circuit, 16 ... Synthesizer, 17 ... Distortion signal amplifier circuit, 18 ... Synthesizer, 19 and 20 ... Temperature sensors, 21,22 ... Look-up tables.

Claims (3)

Look-up table in which the relationship between the temperature characteristics and the compensation amount is stored in advance for the heating element in the electronic device,
A temperature sensor disposed in the vicinity of the heating element;
Compensation processing means for reading a corresponding compensation amount from the lookup table based on the temperature detected by the temperature sensor and adding a compensation amount corresponding to the input signal or output signal of the heating element. Temperature compensation device for electronic equipment.   2. The temperature compensation device for an electronic device according to claim 1, wherein the compensation processing unit controls the amplitude and phase of the input signal or the output signal based on the compensation amount. Store the relationship between the temperature characteristics and compensation amount in advance in the look-up table for the heating elements in the electronic device.
A temperature sensor is arranged in the vicinity of the heating element,
Read the corresponding compensation amount from the lookup table based on the temperature detected by the temperature sensor,
A temperature compensation method for an electronic device, wherein a compensation amount corresponding to an input signal or an output signal of the heating element is added.

Images