JP2007081172A - Probe-needle cleaning substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe-needle cleaning substrate capable of being easily manufactured as a member for cleaning a probe needle and being realized at a low cost, while being able to easily and accurately detect the place of the outer peripheral end of the substrate, and capable of preventing the stop of the operation of a semiconductor inspection device by the abnormality of the detection of the outer peripheral end of the substrate. <P>SOLUTION: The accuracy of a picture recognition by a CCD camera for the semiconductor inspection device is improved by a concentric circular coloring carried out on the surface of a cleaning sheet and the difference of a bright and a darkness by a stepped section formed to an outermost periphery with the stuck cleaning sheet for a wafer. The place of the surface of the cleaning sheet is detected easily, and the outer peripheral end of the wafer is easy to conduct a recognition. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a probe needle cleaning substrate in which a cleaning sheet is attached to the surface of a substrate and the probe needle is cleaned by the cleaning sheet as a member for cleaning a probe needle in a semiconductor inspection apparatus.

  Conventionally, when a semiconductor integrated circuit constituting a semiconductor product such as an IC chip is electrically functionally tested in a wafer (base material) state, a semiconductor inspection apparatus has been widely used. A probe card that is connected to a semiconductor inspection apparatus and has a plurality of probe needles attached is used. By repeating the inspection by bringing the probe needle into contact with a bonding pad formed on a semiconductor integrated circuit, the probe needle Contaminants such as aluminum dust and altered diffused material that make up the pad adhere to the tip, and these contaminants deteriorate the electrical characteristics of the probe needle, especially the contact resistance, making it impossible to correctly inspect semiconductor products. There is.

  In order to prevent this, when a certain number of semiconductor integrated circuits have been inspected, the probe needle cleaning substrate previously stored in the semiconductor inspection apparatus is taken into the inspection flow as a probe needle cleaning member. Thus, the tip of the probe needle is periodically cleaned to maintain the electrical characteristics of the probe card.

  A conventional probe needle cleaning substrate, which is a probe needle cleaning member as described above, is configured by attaching a soft cleaning sheet to the surface of a wafer having the same diameter as that of a semiconductor product. Repeated several tens to several hundreds of times by taking it on the stage along the same path, attracting it to the probe card, and pressing the tip of the probe needle of the probe card (usually hundreds on a large logic LSI) against the cleaning sheet surface. This removes contaminants from the tip of the probe needle. Such an operation is usually performed every time 1000 to 2000 semiconductor chips are measured.

  However, when cleaning the probe needles of the semiconductor inspection apparatus, the semiconductor inspection apparatus is used to align the probe needles so that all of the probe needles are on the probe needle cleaning substrate. The surface of a conventional cleaning sheet is light, single color, flat, and has no light / dark difference. Therefore, the diffusion of semiconductor products is usually performed using an electronic image from a CCD camera through an optical microscope attached to a semiconductor inspection apparatus. A semiconductor inspection apparatus that recognizes a pattern cannot correctly recognize a position on a wafer to which a cleaning sheet having no light and dark difference is attached as described above, and often stops the operation of the semiconductor inspection apparatus. .

In order to improve this, a probe needle cleaning substrate (for example, see Patent Document 1) in which a mark for position detection on the upper surface of the wafer is provided on the cleaning sheet has been proposed. As specifically shown in FIG. 1, the probe needle cleaning substrate is obtained by attaching a cleaning sheet 2 as an adhesive layer on a base material, for example, a wafer 1, and the wafer 1 is placed at five locations on the upper surface thereof. A mark 3 for detecting and recognizing the upper position is formed.
JP 2000-180468 A

  However, as described above, in the conventional probe needle cleaning substrate shown in FIG. 1, when the position detection mark 3 is provided on the cleaning sheet, a mark made of a different material is embedded in the cleaning sheet surface as the mark 3. As a cleaning member, there is a problem in that it is disadvantageous in terms of manufacturing cost.

  Also, when cleaning the probe needle, as the position detection with respect to the cleaning sheet by the semiconductor inspection device, in order to make sure that the probe needle of the probe card is placed on the cleaning sheet surface, first recognize the edge (outer edge) of the wafer, Then, in order to adjust the pressure with which the probe needle contacts the cleaning sheet, the height position of the cleaning sheet is recognized, but the probe needle is placed on the cleaning sheet surface by recognizing the wafer edge. This is to prevent the probe needle from coming off the cleaning sheet area and coming into contact with other parts or being not cleaned. Therefore, the horizontal alignment of the cleaning sheet (wafer) is performed by the CCD camera of the semiconductor inspection apparatus. It is necessary to perform With the mark provided on the cleaning sheet in the lobe needle cleaning substrate, it is difficult to recognize the outer peripheral edge of the wafer, and as a result, there is a possibility that the operation of the semiconductor inspection apparatus stops due to abnormal detection of the wafer edge. Had.

  The present invention solves the above-described conventional problems, and can be easily manufactured as a probe needle cleaning member, can be realized at low cost, and can easily and accurately detect the position of the outer peripheral edge of the substrate. Provided is a probe needle cleaning substrate that can prevent the operation stop of the semiconductor inspection apparatus due to abnormal detection of the outer peripheral edge of the substrate.

  In order to solve the above problems, a probe needle cleaning substrate according to claim 1 of the present invention is a probe in which a cleaning sheet is attached to the surface of the substrate, and the probe tip of the probe of the semiconductor inspection apparatus is cleaned by the cleaning sheet. In the needle cleaning substrate, a concentric mark for position detection is provided on the surface of the cleaning sheet.

  The probe needle cleaning substrate according to claim 2 of the present invention is the probe needle cleaning substrate according to claim 1, wherein the cleaning sheet is colored with the mark having a line width of 1 μm or more. .

  Moreover, the probe needle cleaning substrate according to claim 3 of the present invention is the probe needle cleaning substrate according to claim 1, wherein the cleaning sheet is colored with an exclusive color for recognizing the substrate edge at the outermost periphery. It is characterized by that.

  Further, the probe needle cleaning substrate according to claim 4 of the present invention is the probe needle cleaning substrate according to claim 1, wherein the cleaning sheet has a substrate end recognition arrangement on its outermost peripheral portion. It is characterized by.

  By the above, by improving the accuracy of image recognition by the CCD camera of the semiconductor inspection device by concentric coloring on the surface of the cleaning sheet and brightness difference due to the arrangement formed on the outermost peripheral part where the cleaning sheet of the substrate is pasted The position of the cleaning sheet surface can be easily detected and the outer peripheral edge of the substrate can be easily recognized.

  As described above, according to the present invention, the image by the CCD camera of the semiconductor inspection apparatus is obtained by the concentric coloring applied to the cleaning sheet surface and the brightness difference due to the arrangement formed on the outermost peripheral portion where the cleaning sheet of the substrate is attached. By increasing the recognition accuracy, it is possible to facilitate the detection of the position of the cleaning sheet surface and to easily recognize the outer peripheral edge of the substrate.

  Therefore, it is easy to manufacture as a probe needle cleaning member and can be realized at low cost, and the position of the outer peripheral edge of the substrate can be detected easily and accurately. It is possible to prevent the operation of the apparatus from being stopped.

Hereinafter, a probe needle cleaning substrate showing an embodiment of the present invention will be specifically described with reference to the drawings.
FIG. 2 is a structural diagram showing the configuration of the probe needle cleaning substrate of the present embodiment. As shown in FIG. 2A, the probe needle cleaning substrate of the present embodiment is a substrate (such as a wafer 1) having substantially the same size and shape as the semiconductor substrate on which the semiconductor integrated circuit to be inspected is formed. A soft cleaning sheet mainly composed of silicon rubber similar to that in the case of the conventional probe needle cleaning substrate described in FIG. 1 is attached to the base material). As a mark for detection, a plurality of concentric colorings 4 including the outer peripheral end of the wafer 1 are applied. The line width of the colored 4 is 1 μm to 50 μm, preferably 1 μm to 10 μm. Further, coloring 5 is given as a mark at the center of the surface of the cleaning sheet. The diameter is also 1 μm to 50 μm, preferably 1 μm to 10 μm, and the shape is “dot”. With such a size, the colored pattern can be sufficiently recognized during cleaning using a CCD camera attached to the semiconductor inspection apparatus.

  As described above, the probe needle cleaning substrate of the present embodiment is provided with the concentric mark 4 by coloring as a mark on the surface of the cleaning sheet, so that a substance made of a different material such as a conventional cleaning sheet is embedded. Compared to the case, the marking process is simplified. In particular, since the linear mark 4 is formed all week on the outer peripheral edge of the wafer 1, the outer peripheral edge of the wafer 1 can be easily and accurately recognized by the CCD camera of the semiconductor inspection apparatus. Even if the substrate is slightly rotated and set on the stage of the semiconductor inspection apparatus, it is possible to easily and reliably detect the outer peripheral edge of the wafer 1 by providing the marks 4 every week.

  A dot-like mark (coloring) 5 provided at the center of the cleaning sheet attached to the upper surface of the wafer 1 is for recognizing the center of the substrate. Is recognized, the relative position between the probe needle fixed to the probe card and the cleaning sheet can be easily recognized. Can do.

  Alternatively, the position of the cleaning sheet can also be recognized by recognizing the colored marks 4 formed on the outermost peripheral edge of the cleaning sheet at three to four points around the substrate. The dot-like colored mark 5 at the center of the cleaning sheet is a height using a CCD camera to adjust the probe needle pressure during cleaning when the probe needle cleaning substrate is placed on the inspection stage of the semiconductor inspection apparatus. Also used to adjust direction.

  As shown in FIG. 2A, if there are a plurality of concentric colored marks 4, the position can be recognized and aligned more accurately and easily. If at least the outermost periphery and the center of the cleaning sheet attached to the probe needle cleaning substrate are colored, the number of colored lines and the interval between them are not particularly limited.

  The probe needle cleaning substrate of the present embodiment is placed on the stage of the semiconductor inspection apparatus, the position of the cleaning sheet is recognized, and the tip of the probe needle attached to the probe card is pressed against a predetermined area of the cleaning sheet multiple times. When this is performed by changing the area on the cleaning sheet, programs such as the vertical movement and XY horizontal movement of the stage of the semiconductor inspection device can be changed and set from the probe card dedicated input section. It is.

  In the case of FIG. 2A, a mark for recognizing the position on the cleaning sheet is formed by coloring. In addition to this, a probe needle cleaning substrate having a structure as shown in FIG. May be. That is, in the configuration shown in FIG. 2B, the outermost peripheral portion of the cleaning sheet 2 is provided with a plate 6 made of the same material as the existing cleaning member, and the thickness is increased to create a step with the flat portion. Other central dot marks and concentric marks other than the outermost periphery are colored marks as shown in FIG.

  The planar shape of the convex portion of the center dot mark can be the same as that in FIG. The height may be 1 μm to 10 μm, the width may be 1 μm to 50 μm, and preferably 1 μm to 10 μm. In the CCD camera of the semiconductor inspection apparatus, if there is such a level difference, it can be recognized as a mark by the contrast of the image. Therefore, if the level difference is provided, it is not necessarily colored, but it is the same as in FIG. The effect of recognizing the outer peripheral edge of the wafer can be obtained.

  In addition, it is possible to expect more accurate position recognition than an existing probe needle cleaning substrate only by coloring the step and the central portion due to the outermost arrangement 6 of the cleaning sheet affixed to the probe needle cleaning substrate. In this case, since the outermost peripheral area of the cleaning sheet 2 is not used for needle tip cleaning, there is no cleaning failure due to a step. However, since the probe needle may be pressed onto the concentric circles and the dots on the inner peripheral portion of the cleaning sheet, it is desirable that the colored mark has no step.

  The probe needle cleaning substrate of the present invention is easy to manufacture as a probe needle cleaning member, can be realized at low cost, and can easily and accurately detect the outer peripheral edge of the wafer. This can prevent the operation of the semiconductor inspection apparatus from being stopped due to abnormal end detection, and can be applied to maintenance parts such as a probe needle cleaning member in the semiconductor inspection apparatus.

External perspective view showing structure of conventional probe needle cleaning substrate The conceptual diagram which shows the structure of the probe needle cleaning board | substrate of embodiment of this invention

Explanation of symbols

1 Wafer (base material)
2 Cleaning sheet (adhesive layer)
3 Mark 4 Concentric coloring 5 Dot coloring 6 Placing the outermost circumference

Claims (4)

  A probe needle cleaning substrate that affixes a cleaning sheet to a surface of a substrate and cleans a probe tip of a probe of a semiconductor inspection apparatus with the cleaning sheet. The cleaning sheet has concentric marks for position detection on the surface. A probe needle cleaning substrate provided.   2. The probe needle cleaning substrate according to claim 1, wherein the mark is colored with a line width of 1 [mu] m or more on the cleaning sheet.   2. The probe needle cleaning substrate according to claim 1, wherein the cleaning sheet has its outermost peripheral portion colored with a dedicated color for substrate end recognition.   2. The probe needle cleaning substrate according to claim 1, wherein the cleaning sheet has a substrate end recognition arrangement formed on an outermost peripheral portion thereof.

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