JP2007072128A - Manufacturing method of electrophoresis apparatus, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing technology of an electrophoresis apparatus by which moisture resistance can be improved. <P>SOLUTION: A manufacturing method of the electrophoresis apparatus includes a step for providing an electrophoresis layer (20), on at least either one surface of a first substrate (10) and a second substrate (30); a step for sticking the first and the second substrates to each other via the electrophoresis layer; a step for sticking a first moisture preventing film (40) to the other surface of the first substrate so as to have a part brought into contact with the other surface of the first substrate and an excessive part disposed on the periphery thereof; a fourth step for sticking a second moisture-preventing film (42) to the other surface of the second substrate so as to have a part brought into contact with the other surface of the second substrate and an excessive part disposed on the periphery thereof; and a step for providing a sealing resin (44), between the respective excessive parts of the first and the second moisture-preventing films so as to enclose outer edges of the first and the second substrates. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electrophoretic apparatus that uses electrophoresis in which charged particles in a medium move by applying a voltage for image formation and the like, and an electronic apparatus including the electrophoretic apparatus.

  One of the excellent features of a display device using an electrophoretic phenomenon, particularly a microcapsule type electrophoretic display device, is flexibility. That is, it is possible to easily realize a flexible display device by using a film of resin or the like as two substrates sandwiching the electrophoretic dispersion liquid, and it can be applied to electric equipment such as electronic paper. Expected. On the other hand, when a film is used instead of glass or the like as a substrate, deterioration of the electrophoretic display device due to intrusion of moisture becomes a problem. In other words, a glass substrate has a high effect of suppressing intrusion of moisture, but in the case of a film substrate, the effect is low, so an electrophoretic display device configured using a film is placed under high temperature and high humidity. When exposed for a long period of time, there is a problem that deterioration occurs due to intrusion of moisture and display quality is remarkably lowered. As a solution to such a problem, Japanese Unexamined Patent Application Publication No. 2005-114820 (Patent Document 1) and Japanese Unexamined Patent Application Publication No. 2005-114822 (Patent Document 2) disclose a transparent resin on a display surface side substrate (first substrate). A protective film is laminated, and at the peripheral edge surface portion of the display surface, a water vapor blocking resin layer is provided in the gap between the transparent resin protective film and the non-display surface side substrate (second substrate), thereby preventing moisture from entering. An electrophoretic display device having a blocking structure is disclosed.

  However, even with the above-described conventional technology, display characteristics and retention characteristics due to intrusion of moisture from the peripheral end face and the back surface in an environment of high temperature (for example, about 60 ° C.) and high humidity (for example, about 90%). There is a concern that it may cause deterioration of the electrophoretic material and deterioration of the electrophoretic material. For this reason, an electrophoresis apparatus that can further improve the moisture resistance is expected.

JP 2005-114820 A JP 2005-114822 A

  Therefore, an object of the present invention is to provide an electrophoretic device manufacturing technique capable of further improving moisture resistance.

  According to the first aspect of the present invention, there is provided a first step of providing an electrophoretic layer on at least one of the first substrate and the one surface of the second substrate, the one surface of the first substrate, and the first substrate. A second step of bonding the first substrate and the second substrate so that one surface side of the two substrates faces the electrophoretic layer, and the first moisture-proof film is attached to the first substrate. A second step of attaching the second moisture-proof film to the second substrate, and a third step of attaching the second substrate to the other surface of the first substrate in such a manner that a portion in contact with the other surface of the substrate and an excess portion disposed around the portion are provided. A fourth step of attaching to the other surface of the second substrate so as to provide a portion in contact with the other surface of the substrate and a surplus portion disposed around the portion; and the first substrate and the second substrate The first moisture-proof film and the second moisture-proof film so as to surround the outer edge A fifth step of forming a sealing resin therebetween for each of the above surplus portion of a method of manufacturing an electrophoretic device comprising a.

  According to the second aspect of the present invention, there is provided a first step of providing an electrophoretic layer on at least one side of the first substrate and one side of the second substrate, and a first moisture-proof film formed on the first substrate. A second step of attaching the second substrate to the other surface of the first substrate in such a manner that a portion in contact with the other surface and a surplus portion disposed around the portion are provided; A third step of attaching to the other surface of the second substrate so as to provide a portion in contact with the other surface and a surplus portion disposed around the portion; the one surface side of the first substrate; A fourth step of bonding the first substrate and the second substrate so that one surface side of the two substrates faces the electrophoretic layer, and the first substrate and the second substrate. The first moisture-proof film and the second moisture-proof film so as to surround the outer edge A fifth step of forming a sealing resin therebetween for each of the above surplus portion of a method of manufacturing an electrophoretic device comprising a.

  According to the first or second aspect of the present invention, the one side and the other side of the electrophoretic panel in which the electrophoretic layer is interposed between the first substrate and the second substrate are respectively provided. An electrophoretic device having high moisture resistance, which is covered with a moisture-proof film and whose outer edge is sealed with a sealing resin, is obtained.

  The further suitable aspect regarding this invention of the said 1st or 2nd aspect is demonstrated below.

  Preferably, after the fifth step, a part of the excess portion of each of the first moisture-proof film and the second moisture-proof film and a part of the sealing resin are combined with the first moisture-proof film and the second moisture-proof film. A sixth step of cutting so that the end surface of the film and the end surface of the sealing resin are flush with each other is included.

  Thereby, the width | variety of sealing resin becomes fixed and the homogenization of sealing performance can be achieved. In addition, since the width (sealing width) of the sealing resin is constant, the degree of freedom in selecting the sealing resin is increased. In addition, since a necessary minimum sealing width can be ensured and an extra region can be removed, the electrophoretic device can be narrowed.

  More preferably, in the sixth step, when the concave portion is formed in the sealing resin, the concave portion is eliminated, and the end surfaces of the first moisture-proof film and the second moisture-proof film, and the end surface of the sealing resin, Cut so that becomes flush.

  Depending on the material of the sealing resin and the like, a concave portion that is recessed from the respective end surfaces of the first moisture-proof film and the second moisture-proof film to the electrophoretic layer side may be prominent due to the relationship of the surface tension of the resin. In this case, since the width of the sealing resin is reduced at the bottom portion of the recess, if the sufficient moisture resistance is ensured even at the bottom portion, the entire width of the sealing resin is increased, and the electrophoresis apparatus Narrowing the frame is hindered. Therefore, a cutting method in which the concave portion is eliminated, such as preliminarily forming the first moisture-proof film, the second moisture-proof film and the sealing resin in advance and then cutting through the portion serving as the bottom of the concave portion. By adopting it, it becomes possible to achieve both moisture resistance and narrow frame.

  According to a third aspect of the present invention, there is provided a first step of providing an electrophoretic layer on at least one of the first substrate and the one surface of the second substrate, the one surface of the first substrate, and the first substrate. A second step of bonding the first substrate and the second substrate so that one surface side of the two substrates faces the electrophoretic layer, and the first moisture-proof film is attached to the first substrate. A second step of attaching the second moisture-proof film to the second substrate, and a third step of attaching the second substrate to the other surface of the first substrate in such a manner that a portion in contact with the other surface of the substrate and an excess portion disposed around the portion are provided. A fourth step of attaching to the other surface of the second substrate in such a manner that a portion in contact with the other surface of the substrate and an excess portion disposed around the portion are provided; and the excess portion of the first moisture-proof film; Joining the surplus part of the second moisture-proof film, A fifth step of forming a sealing portion covering the outer edge of the substrate and the second substrate, and a sealing resin so as to cover at least the end surfaces of the first moisture-proof film and the second film around the sealing portion A sixth step of providing an electrophoretic device.

  According to the fourth aspect of the present invention, there is provided a first step of providing an electrophoretic layer on at least one side of the first substrate and one side of the second substrate, and a first moisture-proof film formed on the first substrate. A second step of attaching the second substrate to the other surface of the first substrate in such a manner that a portion in contact with the other surface and a surplus portion disposed around the portion are provided; A third step of attaching to the other surface of the second substrate so as to provide a portion in contact with the other surface and a surplus portion disposed around the portion; the one surface side of the first substrate; A fourth step of bonding the first substrate and the second substrate so that one surface side of the two substrates faces the electrophoretic layer, and the surplus portion of the first moisture-proof film; Joining the surplus part of the second moisture-proof film, A fifth step of forming a sealing portion covering the outer edge of the substrate and the second substrate, and a sealing resin around the sealing portion so as to cover at least the end surfaces of the first moisture-proof film and the second film A sixth step of providing an electrophoretic device.

  According to the first or second aspect of the present invention, the one side and the other side of the electrophoretic panel in which the electrophoretic layer is interposed between the first substrate and the second substrate are respectively provided. An electrophoretic device having high moisture resistance, which is covered with a moisture-proof film and is sealed with a sealing resin after the moisture-proof films are joined and sealed with respect to the outer edge.

  The further suitable aspect regarding this invention of the said 3rd or 4th aspect is demonstrated below.

  Preferably, a seventh step of cutting the end surfaces of the first moisture-proof film and the second moisture-proof film between the fourth step and the fifth step is further included.

  Thereby, a necessary minimum sealing width can be ensured and an extra region can be removed, so that the electrophoretic device can be narrowed.

  Preferably, in the sixth step, the sealing resin is formed so that a cross section thereof is substantially U-shaped.

  Thereby, it becomes possible to make moisture-proof property stronger.

  The fifth aspect of the present invention is an electronic apparatus including the above-described electrophoresis apparatus as a display unit. Here, the “electronic device” includes all devices including a display unit that uses display by an electrophoretic material, and includes a display device, a television device, an electronic paper, a clock, a calculator, a mobile phone, a portable information terminal, and the like. Including. Also, things that deviate from the concept of “equipment”, for example, flexible paper / film-like objects, belonging to real estate such as wall surfaces to which these objects are attached, moving objects such as vehicles, flying objects, ships, etc. Can also be included.

  According to this configuration, an electronic device including a display unit that has high moisture resistance and excellent durability can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a diagram illustrating a cross-sectional structure of the electrophoresis apparatus according to the first embodiment. 1 includes a first substrate 10, a thin film semiconductor circuit layer 12, an electrophoretic layer 20, a second substrate 30, a transparent electrode layer 32, a first moisture-proof film 40, a second moisture-proof film 42, a seal. A stop resin 44 is included.

  The first substrate 10 is made of a flexible substrate as an insulating base substrate that forms an electric circuit. The thickness of the first substrate 10 is preferably 25 μm or more from the viewpoint of the physical strength of the substrate when forming a thin film circuit, and is 200 μm or less from the viewpoint of ensuring the flexibility of the substrate. It is desirable to be. As the first substrate 10, for example, a polycarbonate substrate having a thickness of about 200 μm can be used. A semiconductor circuit layer 12 is bonded onto the first substrate 10 via an adhesive layer made of, for example, a UV (ultraviolet) curable adhesive. In the case where the thin film semiconductor circuit layer 12 is formed on the first substrate 10 as described above, it is introduced in, for example, Japanese Patent Laid-Open Nos. 10-125931, 11-26733, and 2004-327836. Thin film element transfer technology can be used. In these documents, a thin film semiconductor circuit is formed on a heat resistant substrate (glass substrate), and then the thin film semiconductor circuit layer including the thin film semiconductor circuit is peeled off from the heat resistant substrate and transferred entirely or partially onto the resin substrate. A thin film circuit transfer technique is disclosed.

  Here, as the flexible substrate constituting the first substrate 10, a resin material excellent in lightness, flexibility, elasticity and the like can be used. For example, any of a thermoplastic resin and a thermosetting resin may be used. For example, polyolefins such as polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, cyclic polyolefin, modified polyolefin, polyvinyl chloride, Vinylidene chloride, polystyrene, polyamide, polyimide, polyamideimide, polycarbonate, poly- (4-methylpentene-1), ionomer, acrylic resin, polymethylmethacrylate, acrylic-styrene copolymer, butadiene-styrene copolymer, polyol Polyester such as copolymer (EVOH), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polycyclohexane terephthalate (PCT), polyether, polyether ketone (PEEK), poly -Terimide, polyacetal, polyphenylene oxide, modified polyphenylene oxide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, other fluorine resins, styrene, polyolefin, polyvinyl chloride, polyurethane, Various thermoplastic elastomers such as fluoro rubber and chlorinated polyethylene, epoxy resin, phenol resin, urea resin, melamine resin, non-corrosive polyester, silicone resin, polyurethane, etc., or copolymers and blends mainly composed of these , Polymer alloys, and the like, and one or more of these can be used in combination (for example, as a laminate of two or more layers).

  The thin film semiconductor circuit layer 12 includes a plurality of wiring groups, pixel electrode groups, pixel driving circuits, connection terminals, row decoders and column decoders for selecting driving pixels, and the like arranged in a row direction and a column direction. . The pixel drive circuit includes a circuit element such as a thin film transistor (TFT). The material used as the adhesive layer between the first substrate 10 and the thin film semiconductor circuit layer 12 is, for example, a photocurable adhesive such as a reactive curable adhesive, a thermosetting adhesive, an ultraviolet curable adhesive, or anaerobic. Various curable adhesives such as a curable adhesive can be used. In particular, it is preferable to use a photocurable adhesive from the viewpoint of reducing the cycle time of the process. As said photocurable material, an epoxy type, an acrylate type, and a silicone type photocurable material can be used, for example. The thickness of the adhesive layer is about 1 μm to 1 mm, more preferably about 10 to 100 μm.

  The electrophoretic layer 20 is provided so as to be interposed between one surface of the first substrate 10 and one surface of the second substrate 30. The electrophoretic layer 20 includes a large number of microcapsules fixed by a binder. The microcapsule contains an electrophoretic dispersion medium and electrophoretic particles. The electrophoretic particles have a property of moving in the electrophoretic dispersion medium according to an applied voltage, and one type (one color) or more of electrophoretic particles are used. The thickness of the electrophoretic layer 20 is, for example, about 50 μm to 75 μm. The electrophoretic layer 20 is obtained by mixing the above-described microcapsules with a desired dielectric constant adjusting agent in a binder, and using a roll coater on the substrate with the obtained resin composition (emulsion or organic solvent solution) It can be formed using a known coating method such as a printing method or a spray method.

  Here, as the electrophoretic dispersion medium, for example, alcohol solvents such as water, methanol, ethanol, isopropanol, butanol, octanol, and methyl cellosolve, various esters such as ethyl acetate and butyl acetate, acetone, methyl ethyl ketone, and methyl isobutyl Ketones such as ketones, aliphatic hydrocarbons such as pentane, hexane and octane, alicyclic hydrocarbons such as cyclohexane and methylcyclohexane, aromatic hydrocarbons such as benzene, toluene, xylene and hexylbenzene, methylene chloride, chloroform, A compound obtained by blending a surfactant or the like with a halogenated hydrocarbon such as carbon tetrachloride or 1,2-dichloroethane, a carboxylate or other various oils alone or a mixture thereof can be used.

  As described above, the electrophoretic particles are particles (polymer or colloid) having a property of moving to a desired electrode side by performing electrophoresis based on a potential difference in an electrophoretic dispersion medium. For example, black pigments such as aniline black and carbon black, white pigments such as titanium dioxide, zinc white, antimony trioxide, aluminum oxide, azo pigments such as monoazo, disazo, polyazo, isoindolinone, yellow lead, yellow iron oxide , Yellow pigments such as cadmium yellow, titanium yellow and antimony, red pigments such as quinacridone red and chrome vermillion, phthalocyanine blue and indanthrene blue, anthraquinone dyes, blue pigments such as bitumen, ultramarine blue and cobalt blue, phthalocyanine green, etc. Green pigments and the like. These particles may be used alone or in combination of two or more. Furthermore, these pigments include electrolytes, surfactants, metal soaps, resins, rubbers, oils, varnishes, charge control agents composed of particles such as compounds, or dispersing agents such as titanium coupling agents, lubricants, as necessary. Stabilizers and the like can be added.

  As a material constituting the microcapsule, it is preferable to use a flexible material such as a gum arabic / gelatin compound or a urethane compound. The microcapsules can be formed using a known microencapsulation method such as an interfacial polymerization method, an insolubilization reaction method, a phase separation method, or an interfacial precipitation method. In addition, it is preferable that the microcapsules have a substantially uniform size in order to exhibit an excellent display function. Microcapsules having a substantially uniform size can be obtained using, for example, filtration or specific gravity differential class. The size of the microcapsules is usually about 30 to 60 μm.

  The binder is not particularly limited as long as it has good affinity with the microcapsules, has excellent adhesion to the electrode, and has insulating properties. As the binder, those exemplified below can be used as in the case of the insulating synthetic resin base material described above. For example, polyethylene, chlorinated polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, polypropylene, ABS resin, methyl methacrylate resin, vinyl chloride resin, vinyl chloride-vinyl acetate copolymer, vinyl chloride -Vinylidene chloride copolymer, vinyl chloride acrylate copolymer, vinyl chloride-methacrylic acid copolymer, vinyl chloride-acrylonitrile copolymer, ethylene-vinyl alcohol-vinyl chloride copolymer, propylene-vinyl chloride copolymer Polymer, thermoplastic resin such as vinylidene chloride resin, vinyl acetate resin, polyvinyl alcohol, polyvinyl formal, and cellulose resin, polyamide resin, polyacetal, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenyl Emissions oxide, polysulfone, polyamideimide, polyaminobismaleimide, polyether sulfone, polyphenylene sulfone, polyarylate, graft poly Fini ether, polyether Ether ketone, polymers such as polyetherimide. Fluorine such as polytetrafluoroethylene, polyfluoroethylenepropylene, tetrafluoroethylene-perfluoroalkoxyethylene copolymer, ethylene-tetrafluoroethylene copolymer, polyvinylidene fluoride, polytrifluoroethylene chloride, fluororubber Silicone resin such as resin, silicone resin and silicone rubber. As other binder materials, methacrylic acid-styrene copolymer, polybutylene, methyl methacrylate-butadiene-styrene copolymer, and the like can be used. The binder material preferably has substantially the same dielectric constant of the electrophoretic display liquid and that of the dispersant as described in, for example, JP-A-10-149118.

  The second substrate 30 is made of a thin film (transparent insulating synthetic resin base material) having a transparent electrode layer 32 formed on one side, and is formed so as to cover the electrophoretic layer 20. As for the thickness of the 2nd board | substrate 30, 10-200 micrometers is desirable, More preferably, it is 25-75 micrometers. For example, a polyethylene terephthalate (PET) film is used as the thin film constituting the second substrate 30. As the thin film, various materials can be used as in the case of the first substrate 10 as long as it is an insulating transparent material. The thickness of the thin film is preferably thinner than the thickness of the first substrate 10. More preferably, it is about half or less of the thickness of the first substrate 10.

  The transparent electrode layer 32 is configured using a transparent conductive film such as an indium oxide film (ITO film) doped with tin, for example. The transparent electrode layer 32 is formed over substantially the entire one surface of the second substrate 30. The circuit wiring of the first substrate 10 and the transparent electrode layer 32 of the second substrate 30 are electrically connected outside the region where the electrophoretic layer 20 is formed. Specifically, the transparent electrode layer 32 and the connection electrode (terminal) of the thin film semiconductor circuit layer 12 are connected via a conductive connector. As the transparent conductive film constituting the transparent electrode layer 32, for example, in addition to the ITO film described above, a tin oxide film doped with fluorine (FTO film), a zinc oxide film doped with antimony, and indium were doped. Examples thereof include a zinc oxide film and a zinc oxide film doped with aluminum. The method for forming the transparent electrode on the thin film is not particularly limited. For example, a sputtering method, an electron beam method, an ion plating method, a vacuum deposition method, a chemical vapor deposition method (CVD method), or the like is employed. be able to.

  The first moisture-proof film 40 is attached to the other surface side of the first substrate 10 and plays a role of sealing and protecting the electrophoretic layer 20. This 1st moisture-proof film 40 is comprised using what has translucency, such as a polyethylene terephthalate (PET) film, for example. Here, the shape of the first moisture-proof film 40 will be described. FIG. 2 is a view for explaining the shapes of the first substrate 10 and the first moisture-proof film 40, and the joined body of the first substrate 10 and the first moisture-proof film 40 is viewed from the first moisture-proof film 40 side. A schematic plan view is shown. As shown in FIG. 2, the first moisture-proof film 40 (expressed as satin in the drawing) has a frame-like surplus portion disposed around the portion in addition to the portion in contact with the other surface of the first substrate 10. Have. The surplus portion is used for forming a space for providing a sealing agent (sealing resin) 44, as will be described later.

  The second moisture-proof film 42 is attached to the other surface side of the second substrate 30 and plays a role of sealing and protecting the electrophoretic layer 20. This 2nd moisture-proof film 42 is comprised using a polyethylene terephthalate (PET) film etc., for example. Similar to the first moisture-proof film 40 described above (see FIG. 2), the second moisture-proof film 42 has a frame-like surplus disposed around the part other than the part in contact with the other surface of the second substrate 30. Has a site. The surplus portion is used for forming a space for providing a sealing agent (sealing resin) 44, as will be described later.

  The sealing agent (sealing resin) 44 is provided between the excess portions of the first moisture-proof film 40 and the second moisture-proof film 42 so as to surround the outer edges of the first substrate 10 and the second substrate 30. In the electrophoresis device 1 of the present embodiment, the end surfaces of the first moisture-proof film 40 and the second moisture-proof film 42 and the end surface of the sealant 44 are formed flush with each other as shown in the drawing. Here, as the sealing agent 44, an epoxy resin, a silicon resin, an acrylic resin, or the like is preferably used. Further, those obtained by dispersing inorganic fine particles such as silica and alumina in these resins are also preferably used.

  Next, a method for manufacturing the electrophoresis apparatus 1 according to the first embodiment will be described.

  FIG. 3 is a process cross-sectional view illustrating the manufacturing method of the electrophoretic device according to the first embodiment.

  First, the electrophoretic layer 20 is provided on at least one of the one surface of the first substrate 10 and the one surface of the second substrate 30 (FIG. 3A). In the illustrated example, the electrophoretic layer 20 is provided on one surface of the second substrate 30. The electrophoretic layer 20 may be provided on one surface of the first substrate 10, or the electrophoretic layer 20 may be provided on both the first substrate 10 and the second substrate 30.

  Next, the first substrate 10 and the second substrate 30 are bonded together so that the one surface side of the first substrate 10 and the one surface side of the second substrate 30 face each other with the electrophoretic layer 20 interposed therebetween ( FIG. 3 (B)).

  Next, the first moisture-proof film 40 is provided with a portion in contact with the other surface of the first substrate 10 and a surplus portion disposed around the portion (see FIG. 2). Affixed in the direction (FIG. 3C). The first moisture-proof film 40 is attached by interposing a photocurable adhesive or a thermosetting adhesive between the first moisture-proof film 40 and the first substrate 10 or by interposing a double-sided adhesive material. Is called. It is preferable to laminate the first moisture-proof film 40 using a vacuum laminator.

  In addition to the above steps, the second moisture-proof film 42 is provided with a portion in contact with the other surface of the second substrate 30 and a surplus portion (see FIG. 2) disposed around the portion. Affixed to the other surface of the two substrates 30 (FIG. 3C). As for the attachment of the second moisture-proof film 42, a photo-curing adhesive or a thermosetting adhesive is interposed between the second moisture-proof film 42 and the second substrate 30, or a double-sided pressure-sensitive adhesive is interposed. Done. It is preferable to laminate the second moisture-proof film 42 using a vacuum laminator.

  Next, a sealing resin 44 is provided between the surplus portions of the first moisture-proof film 40 and the second moisture-proof film 42 so as to surround the outer edges of the first substrate 10 and the second substrate 30 (FIG. 3D )). As the sealing resin 44, any of photo-curing type, thermosetting type, or two-component mixed curing type can be adopted. The sealing resin 44 is preferably low in viscosity so as not to entrain bubbles during filling and high in viscosity so as not to flow out (specifically, about 0.1 to 10 cP). As a filling method, for example, a method of filling between the first moisture-proof film 40 and the second moisture-proof film 42 while discharging an appropriate amount by a micro dispenser can be adopted. In order to avoid the mixing of bubbles as much as possible, it is also preferable to work in a vacuum state (low pressure state).

  Next, a part of each excess part of the first moisture-proof film 40 and the second moisture-proof film 42 and a part of the sealing resin 44 are used, and an end face of the first moisture-proof film 40 and the second moisture-proof film 42 and the sealing resin 44 are used. Cut so that the end surface of the substrate is flush with the other end surface (FIG. 3E). In this cutting step, the first moisture-proof film 40 existing outside the sealing width is secured so that the sealing resin 44 having a desired sealing width (for example, about 0.5 mm to 1.5 mm) is secured. Then, the second moisture-proof film 42 and the sealing resin 44 are removed. Various cutting methods such as a Thomson blade, a mold blade, and a laser cut can be employed in this step. Here, the further suitable aspect of this process is demonstrated below.

  FIG. 4 is a diagram for explaining the cutting process in more detail, and the vicinity of the end surfaces of the first moisture-proof film 40 and the second moisture-proof film 42 is shown enlarged. When the cured sealing resin 44 is strictly observed, depending on conditions such as the properties of the resin material used as the sealing resin 44, as shown in FIG. May occur. In such a case, since the width of the resin becomes the smallest at the bottom portion of the recess 46, it is necessary to provide the sealing resin 44 so that the sealing width at this portion is necessary and sufficient to ensure moisture resistance. Thus, if necessary and sufficient moisture resistance is ensured also in the bottom part of the recessed part 46, the sealing width | variety of resin will become large and will prevent the narrowing of a frame. Therefore, when the recessed part 46 has arisen in the sealing resin 44, as shown to FIG. 4 (B), the recessed part 46 is eliminated and the end surface of the 1st moisture-proof film 40 and the 2nd moisture-proof film 42, and sealing resin It is desirable that cutting in this step is performed so that the end face of 44 is flush. Specifically, as shown in the figure, the cutting is performed so as to pass through the portion that becomes the bottom of the recess 46 of the sealing resin 44. This makes it possible to achieve both moisture-proofing and narrowing of the frame.

  FIG. 5 is a process cross-sectional view illustrating another aspect of the method for manufacturing the electrophoretic device of the first embodiment. Note that the manufacturing method shown in FIG. 3 described above and the manufacturing method described below are different in steps until the first moisture-proof film 40 and the second moisture-proof film 42 are attached. In the following, the differences between the two will be mainly described, explanations of items common to both will be omitted as appropriate,

  First, the electrophoretic layer 20 is provided on at least one of the one surface of the first substrate 10 and the one surface of the second substrate 30 (FIG. 5A). In the illustrated example, the electrophoretic layer 20 is provided on one surface of the second substrate 30. The electrophoretic layer 20 may be provided on one surface of the first substrate 10, or the electrophoretic layer 20 may be provided on both the first substrate 10 and the second substrate 30.

  Next, the first moisture-proof film 40 is provided with a portion in contact with the other surface of the first substrate 10 and a surplus portion disposed around the portion (see FIG. 2). Affixed in the direction (FIG. 5B). The first moisture-proof film 40 is attached by interposing a photocurable adhesive or a thermosetting adhesive between the first moisture-proof film 40 and the first substrate 10 or by interposing a double-sided adhesive material. Is called. It is preferable to laminate the first moisture-proof film 40 using a vacuum laminator.

  In addition to the above steps, the second moisture-proof film 42 is provided with a portion in contact with the other surface of the second substrate 30 and a surplus portion (see FIG. 2) disposed around the portion. The two substrates 30 are attached to the other surface (FIG. 5A). As for the attachment of the second moisture-proof film 42, a photo-curing adhesive or a thermosetting adhesive is interposed between the second moisture-proof film 42 and the second substrate 30, or a double-sided pressure-sensitive adhesive is interposed. Done. It is preferable to laminate the second moisture-proof film 42 using a vacuum laminator.

  The electrophoretic layer 20 may be formed after the first moisture-proof film 40 and the second moisture-proof film 42 are attached.

  Next, the first substrate 10 and the second substrate 30 are bonded together so that the one surface side of the first substrate 10 and the one surface side of the second substrate 30 face each other with the electrophoretic layer 20 interposed therebetween ( FIG. 5C).

  Next, a sealing resin 44 is provided between the surplus portions of the first moisture-proof film 40 and the second moisture-proof film 42 so as to surround the outer edges of the first substrate 10 and the second substrate 30 (FIG. 5D )). Suitable conditions for this step are the same as described above.

  Next, a part of each excess part of the first moisture-proof film 40 and the second moisture-proof film 42 and a part of the sealing resin 44 are used, and an end face of the first moisture-proof film 40 and the second moisture-proof film 42 and the sealing resin 44 are used. Cut so that the end surface of the surface is flush with the other end surface (FIG. 5E). Suitable conditions for this step are the same as described above. The same applies to more preferable cutting conditions (see FIG. 4).

  As described above, according to the first embodiment, with respect to the electrophoretic panel in which the electrophoretic layer is interposed between the first substrate and the second substrate, the one surface side and the other surface side are respectively moisture-proof films. Thus, an electrophoretic device having a high moisture resistance, which is covered with an outer edge and sealed with a sealing resin, is obtained.

<Second Embodiment>
FIG. 6 is a diagram illustrating a cross-sectional structure of the electrophoresis apparatus according to the second embodiment. The electrophoretic display device 1a shown in FIG. 6 includes a first substrate 10, a thin film semiconductor circuit layer 12, an electrophoretic layer 20, a second substrate 30, a transparent electrode layer 32, a first moisture-proof film 40, a second moisture-proof film 42, a seal A stop resin 44a is included. The electrophoresis device 1a of the present embodiment basically has the same configuration as the electrophoresis device 1 of the first embodiment described above, and includes a first moisture-proof film 40, a second moisture-proof film 42, and a sealing resin 44a. The sealing structure consisting of is different. The following description will be made by paying attention to the different points, and the common configurations of the two will be denoted by the same reference numerals as those in FIG.

  As shown in FIG. 6, the electrophoresis apparatus 1 a of the second embodiment is configured by joining the surplus portion of the first moisture-proof film 40 and the surplus portion of the second moisture-proof film 42, and includes the first substrate 10 and the first substrate 10. The sealing part 48 which covers the outer edge of the 2 board | substrate 30 is provided. A sealing resin 44 a is provided around the sealing portion 48 so as to cover the end surfaces of the first moisture-proof film 40 and the second moisture-proof film 42. The sealing resin 44a of this embodiment is formed so as to have a substantially U-shaped cross section as shown in the figure. The sealing resin 44a only needs to be provided so as to cover at least the end surfaces of the first moisture-proof film 40 and the second moisture-proof film 42, but by having a substantially U-shaped cross section as shown in the figure. More moisture resistance. Suitable conditions such as a material used as the sealing resin 44a are the same as those of the sealing resin 44 described above. Moreover, as shown in the figure, the end surfaces of the first moisture-proof film 40 and the second moisture-proof film 42 are formed flush with each other. Thereby, the width | variety of the outer edge part of the 1st moisture-proof film 40 and the 2nd moisture-proof film 42 can be narrowed to required minimum, and the narrow frame of the electrophoresis apparatus 1a can be achieved. Moreover, the usage-amount of sealing resin 44a can also be reduced.

  Next, a preferred example of a method for manufacturing the electrophoresis apparatus 1a according to the second embodiment will be described. Note that items common to those in the first embodiment described above are omitted as appropriate.

  FIG. 7 is a process cross-sectional view illustrating the manufacturing method of the electrophoresis device of the second embodiment.

  First, the electrophoretic layer 20 is provided on at least one of the first substrate 10 and the second substrate 30 (FIG. 7A). Next, the first substrate 10 and the second substrate 30 are bonded together so that the one surface side of the first substrate 10 and the one surface side of the second substrate 30 face each other with the electrophoretic layer 20 interposed therebetween ( FIG. 7 (B)). Next, the first moisture-proof film 40 is provided with a portion in contact with the other surface of the first substrate 10 and a surplus portion disposed around the portion (see FIG. 2). Affixed in the direction (FIG. 7C). In addition to this step, the second moisture-proof film 42 is provided with a portion in contact with the other surface of the second substrate 30 and a surplus portion (see FIG. 2) disposed around the portion. Affixed to the other surface of the two substrates 30 (FIG. 7C). The preferred conditions for the steps so far are the same as those in the first embodiment described above.

  In addition, after providing the electrophoretic layer 20 on at least one of the one surface of the first substrate 10 and the one surface of the second substrate 30 as in the example illustrated in FIG. The first substrate 10 may be attached to the other surface, the second moisture-proof film 42 may be attached to the other surface of the second substrate 30, and then the first substrate 10 and the second substrate 30 may be attached together in the order of steps. Good.

  Next, the surplus part of the 1st moisture-proof film 40 and the surplus part of the 2nd moisture-proof film 42 are joined, and the sealing part 48 which covers the outer edge of the 1st board | substrate 10 and the 2nd board | substrate 30 is formed (FIG.7 (D )). This step is performed using, for example, a vacuum laminator. At this time, a margin is provided for the bonding width of the first moisture-proof film 40 and the second moisture-proof film 42, and after both are joined, the end surfaces of the first moisture-proof film 40 and the second moisture-proof film 42 are flush with each other. A step of cutting may be further added. Thereby, the dimensional accuracy of an end surface improves. In addition, the width of the sealing portion 48 can be reduced to a necessary minimum, and the frame of the electrophoretic device 1a can be reduced.

  Next, a sealing resin 44a is provided around the sealing portion 48 so as to cover at least the end surfaces of the first moisture-proof film 40 and the second moisture-proof film 42 (FIG. 7E). As described above, in the present embodiment, the sealing resin 44a is formed so that its cross section is substantially U-shaped. The supply of the sealing resin 44a can be performed using, for example, a microdispenser. In order to avoid the mixing of bubbles as much as possible, it is also preferable to perform the operation in this step in a vacuum state (low pressure state).

  As described above, according to the second embodiment, with respect to the electrophoretic panel in which the electrophoretic layer is interposed between the first substrate and the second substrate, the one surface side and the other surface side are respectively moisture-proof films. An electrophoretic device with high moisture resistance is obtained, which is covered with and sealed with moisture-proof films bonded to each other and sealed with a sealing resin.

(Third embodiment)
Next, specific examples of the electronic apparatus including the electrophoresis device according to each of the above-described embodiments will be described.

  FIG. 8 is a perspective view illustrating a specific example of an electronic apparatus to which the electrophoresis apparatus is applied. FIG. 8A is a perspective view illustrating an electronic book which is an example of the electronic apparatus. The electronic book 1000 includes a book-shaped frame 1001, a cover 1002 that can be rotated (openable and closable) with respect to the frame 1001, an operation unit 1003, and the electrophoretic device 1 or 1a described above. The display unit 1004 is provided. FIG. 8B is a perspective view illustrating a wrist watch that is an example of an electronic apparatus. The wristwatch 1100 includes a display unit 1101 configured by the electrophoresis device 1 or 1a. FIG. 8C is a perspective view illustrating electronic paper which is an example of an electronic apparatus. The electronic paper 1200 includes a main body 1201 formed of a rewritable sheet having the same texture and flexibility as paper, and a display unit 1202 formed of the electrophoresis apparatus 1 or 1a. The range of electronic devices to which the electrophoretic device 1 or 1a can be applied is not limited to this, and includes a wide range of devices that use changes in visual color tone accompanying the movement of charged particles. For example, in addition to the apparatus as described above, a device belonging to a real estate such as a wall surface to which an electrophoretic film is bonded, or a device belonging to a moving body such as a vehicle, a flying body, or a ship may also be applicable.

(Examples of other embodiments)
In addition, this invention is not limited to the content of embodiment mentioned above, A various deformation | transformation implementation is possible within the range of the summary of this invention.

  For example, in the embodiment described above, a type using microcapsules has been described as a specific example of the electrophoretic layer. For example, an electrophoretic dispersion liquid is sealed in each of a plurality of cells (small spaces) configured using partition walls. It is also possible to use other types of electrophoretic layers, such as the type to be used.

  Further, the first substrate 10 described above may be formed by cutting a large or roll sheet provided with an adhesive layer necessary for attaching the first moisture-proof film 40 and dividing it into a plurality of sheets. Good. Similarly, the above-described second substrate 30 is formed by cutting a large or roll sheet provided with an adhesive layer necessary for attaching the second moisture-proof film 42 and dividing it into a plurality of sheets. Also good. In these cases, it is desirable to provide a release sheet on the surface of the adhesive layer for the convenience of subsequent processes.

It is a figure which shows the cross-section of the electrophoresis apparatus of 1st Embodiment. It is a figure for demonstrating the shape of a 1st board | substrate and a 1st moisture-proof film. It is process sectional drawing explaining the manufacturing method (the 1) of the electrophoresis apparatus of 1st Embodiment. It is a figure for demonstrating in detail about a cutting process. It is process sectional drawing explaining the manufacturing method (the 2) of the electrophoresis apparatus of 1st Embodiment. It is a figure which shows the cross-section of the electrophoresis apparatus of 2nd Embodiment. It is process sectional drawing explaining the manufacturing method of the electrophoresis apparatus of 2nd Embodiment. It is a perspective view explaining the specific example of the electronic device to which the electrophoresis apparatus is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a ... Electrophoresis apparatus, 10 ... 1st board | substrate, 20 ... Electrophoresis layer, 30 ... 2nd board | substrate, 40 ... 1st moisture-proof film, 42 ... 2nd moisture-proof film, 44, 44a ... Sealing resin, 46 ... Recess, 48 ... sealing part

Claims (9)

A first step of providing an electrophoretic layer on at least one of one side of the first substrate and one side of the second substrate;
A second step of bonding the first substrate and the second substrate so that the one surface side of the first substrate and the one surface side of the second substrate face each other with the electrophoretic layer interposed therebetween; ,
A third step of attaching the first moisture-proof film to the other surface of the first substrate in such a manner that a portion in contact with the other surface of the first substrate and a surplus portion disposed around the portion are provided;
A fourth step of attaching the second moisture-proof film to the other surface of the second substrate such that a portion in contact with the other surface of the second substrate and a surplus portion disposed around the portion are provided;
A fifth step of providing a sealing resin between each of the excess portions of the first moisture-proof film and the second moisture-proof film so as to surround the outer edges of the first substrate and the second substrate;
A method for producing an electrophoretic device comprising: A first step of providing an electrophoretic layer on at least one of one side of the first substrate and one side of the second substrate;
A second step of attaching the first moisture-proof film to the other surface of the first substrate in such a manner that a portion in contact with the other surface of the first substrate and a surplus portion disposed around the portion are provided;
A third step of attaching the second moisture-proof film to the other surface of the second substrate such that a portion in contact with the other surface of the second substrate and a surplus portion disposed around the portion are provided;
A fourth step of bonding the first substrate and the second substrate so that the one surface side of the first substrate and the one surface side of the second substrate face each other with the electrophoretic layer interposed therebetween; ,
A fifth step of providing a sealing resin between each of the excess portions of the first moisture-proof film and the second moisture-proof film so as to surround the outer edges of the first substrate and the second substrate;
A method for producing an electrophoretic device, comprising:   After the fifth step, a part of the excess portion of each of the first moisture-proof film and the second moisture-proof film and a part of the sealing resin are attached to the end surfaces of the first moisture-proof film and the second moisture-proof film. The manufacturing method of the electrophoresis apparatus of Claim 1 or 2 including the 6th process cut | disconnected so that the end surface of the said sealing resin may become flush | level.   In the sixth step, when the concave portion is formed in the sealing resin, the concave portion is eliminated, and the end surfaces of the first moisture-proof film and the second moisture-proof film and the end surface of the sealing resin are flush with each other. The method for producing an electrophoretic device according to claim 3, wherein cutting is performed so that A first step of providing an electrophoretic layer on at least one of one side of the first substrate and one side of the second substrate;
A second step of bonding the first substrate and the second substrate so that the one surface side of the first substrate and the one surface side of the second substrate face each other with the electrophoretic layer interposed therebetween; ,
A third step of attaching the first moisture-proof film to the other surface of the first substrate in such a manner that a portion in contact with the other surface of the first substrate and a surplus portion disposed around the portion are provided;
A fourth step of attaching the second moisture-proof film to the other surface of the second substrate such that a portion in contact with the other surface of the second substrate and a surplus portion disposed around the portion are provided;
A fifth step of joining the surplus portion of the first moisture-proof film and the surplus portion of the second moisture-proof film to form a sealing portion that covers the outer edges of the first substrate and the second substrate;
A sixth step of providing a sealing resin around the sealing portion so as to cover at least end surfaces of the first moisture-proof film and the second film;
A method for producing an electrophoretic device comprising: A first step of providing an electrophoretic layer on at least one of one side of the first substrate and one side of the second substrate;
A second step of attaching the first moisture-proof film to the other surface of the first substrate in such a manner that a portion in contact with the other surface of the first substrate and a surplus portion disposed around the portion are provided;
A third step of attaching the second moisture-proof film to the other surface of the second substrate such that a portion in contact with the other surface of the second substrate and a surplus portion disposed around the portion are provided;
A fourth step of bonding the first substrate and the second substrate so that the one surface side of the first substrate and the one surface side of the second substrate face each other with the electrophoretic layer interposed therebetween; ,
A fifth step of joining the surplus portion of the first moisture-proof film and the surplus portion of the second moisture-proof film to form a sealing portion that covers the outer edges of the first substrate and the second substrate;
A sixth step of providing a sealing resin around the sealing portion so as to cover at least end surfaces of the first moisture-proof film and the second film;
A method for producing an electrophoretic device comprising:   The electrophoresis according to claim 5 or 6, further comprising a seventh step of cutting end surfaces of the first moisture-proof film and the second moisture-proof film flush with each other between the fourth step and the fifth step. Device manufacturing method.   The method for manufacturing an electrophoretic device according to claim 5, wherein in the sixth step, the sealing resin is formed so that a cross section thereof is substantially U-shaped. An electronic apparatus comprising the electrophoretic device manufactured by the manufacturing method according to claim 1 as a display unit.

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