JP2007070707A - Vacuum deposition apparatus and vacuum deposition method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus capable of forming a uniform film on a long belt-like substrate without causing the thermal damage of a crucible and the substrate as well as capable of being simple in the structures of devices configured in the vacuum deposition apparatus, and to provide a vacuum deposition method. <P>SOLUTION: The vacuum deposition apparatus 1 is provided with a substrate conveyor 4 that allows a long belt-like substrate 5 to continuously travel in a vacuum chamber 2 and a crucible 3 for holding a molten evaporation material. The substrate conveyor 4 conveys the substrate 5 in a manner that it is inclined to such a scope that the width direction of the surface of the substrate 5 makes an angle of 7° to 47° with the surface of a molten evaporation material in the crucible 3 in forming a film on the substrate 5. Film formation is carried out by vacuum-depositing molecules evaporated from the evaporation material molten in the crucible 3 on the substrate 5 continuously travelled by the substrate conveyor 4 so as to form the film with uniform thickness. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a vacuum deposition apparatus and a vacuum deposition method for depositing evaporated molecules of an evaporation material melted in a crucible on a long belt-like substrate that continuously travels by a substrate transport device in a vacuum chamber.

  When vapor deposition is performed while continuously running a long belt-like substrate, generally, the evaporation material in a crucible placed in a vacuum chamber is melted, and vapor evaporated from the molten evaporation material is deposited on the substrate to form a film. The way to be done.

  By the way, the crucible is usually disposed below the central portion in the width direction of the long belt-like base material, and when the evaporation material is evaporated from the crucible, the evaporation flow diffuses in a fan shape.

  Here, when the center of the crucible is set to the origin 0, and the long strip member X is arranged in parallel to the molten metal surface of the crucible, the solid in the straight line connecting the origin 0 and the central portion a in the width direction of the long strip substrate X FIG. 3 shows the area (Sa1) of the base material within the angle dφ and the area (Sb) of the base material within the solid angle dφ on the straight line connecting the origin 0 and the width direction end b of the base material.

  In FIG. 3, when the area (Sa1) is compared with the area (Sb), the area (Sb) is larger than the area (Sa1). However, since the number of evaporation molecules (flux) deposited in these areas is equal, the film thickness becomes thinner toward the end in the width direction of the substrate.

  When the crucible and the long belt-like substrate are arranged in this way, the film thickness formed at the central portion in the width direction of the long belt-like substrate, as shown by the square plot lines in the graph of FIG. The film thickness was the thickest and the film thickness was the thinnest at the end in the width direction, resulting in nonuniform film thickness distribution.

  Therefore, in order to form a film as uniformly as possible in the width direction of the base material, as shown in Patent Document 1, a long crucible extending in the width direction of the base material is provided below the plate-like base material, and this crucible is provided. The upper surface of each has been sealed, and a plurality of holes are formed on the upper surface along the longitudinal direction. Furthermore, in patent document 1, the longitudinal direction both ends in the upper surface of a crucible are made to incline toward the center of the width direction of a base material. In Patent Document 1, the evaporation material melted in the crucible is evaporated from a plurality of holes and uniformly deposited from one end to the other end in the width direction of the substrate.

JP 2004-269948 A

  However, the crucible shown in Patent Document 1 is formed longer than the width of the long belt-like base material, and the crucible is formed with a molten metal reservoir that substantially corresponds to the length of the crucible. The evaporating material melted in step 1 is evaporated from each hole to the outside of the crucible.

  As described above, in Patent Document 1, since a long crucible is used, the molten metal area of the crucible (the liquid area of the molten metal accumulated in the molten metal reservoir) is inevitably larger than that of the conventional crucible described above. The amount of radiant heat received by the material increases. Therefore, the film thickness distribution in the width direction of the film formed on the base material is more uniform than the conventional one, but there is a problem that the base material temperature rises and the base material causes a change in physical properties due to heat. .

  In addition, in order to prevent the substrate temperature from rising, if the substrate is placed away from the crucible, specifically, the distance between the substrate and the crucible is 300 mm or more, vapor deposition is performed in the same manner as the conventional vapor deposition method described above. The film thickness at the edge of the substrate becomes thin due to the diffusion of molecules.

  Furthermore, theoretically, the deposition rate decreases in proportion to the square of the distance from the molten metal surface to the base material, so that the production efficiency decreases as the distance from the molten metal surface to the base material increases. .

  Further, in Patent Document 1, since both ends of the upper surface of the crucible are inclined, it becomes difficult to manufacture a crucible and a heat source for heating the crucible (especially in the case of resistance heating), and at the inflection point of the inclination of the upper surface of the crucible. Thermal stress concentrates and cracks are likely to occur. As described above, when the crucible is cracked, the film forming process cannot be stably performed.

  Therefore, the present invention can form a uniform film on the base material without causing damage to the crucible and the long belt-like base material due to the heat of the crucible while simplifying the configuration of the equipment disposed in the vacuum evaporation apparatus. An object of the present invention is to provide a vacuum deposition apparatus and a vacuum deposition method.

  The vacuum deposition apparatus of the present invention is a vacuum deposition apparatus for depositing a film by evaporating evaporated molecules of an evaporation material melted in a crucible on a long strip-shaped substrate continuously running by a substrate conveying device in a vacuum chamber. The base material transport device is long so that the width direction of the base material surface is inclined in the range of 7 ° or more and 47 ° or less with respect to the molten metal surface in the crucible when the film is formed on the long belt-like base material. The belt-shaped substrate is transported.

  Examples of the evaporation material include metals such as aluminum and silicon. In addition, examples of the long belt-like substrate on which the vapor of the evaporation material is deposited include resin films such as polyethylene and polypropylene, and metal films such as copper. By depositing aluminum on the resin film, it can be used for food bags and the like, and by depositing silicon on a copper film, it can be used for the negative electrode of a lithium battery.

  The crucible consists of a circular or square container in plan view having a molten metal storage part, and a heating device such as resistance heating (heater) or induction heating is arranged below the crucible to heat the evaporation material in the crucible, Alternatively, an electron gun is provided obliquely above the crucible, and the evaporating material is directly heated by irradiating the evaporating material in the crucible with an electron beam.

  The crucible is supplied with the evaporation material to the molten metal storage unit using the material supply device, and then the evaporation material is heated and melted with the heating device described above to make a molten metal state.

  And a base-material conveyance apparatus is a cooling roll arrange | positioned in the downward position between these rolls, the winding roll which winds the elongate strip-shaped base material by which the long strip-shaped base material was wound, and the vapor-deposited long strip-shaped base material And have.

  Furthermore, in the present invention, by attaching the long belt-like base material to the base material transport device, the surface on which the long belt-like base material is formed is disposed above the crucible, and the width direction of the base material surface Is inclined with respect to the molten metal surface in the crucible within a range of 7 ° to 47 °. And it conveys, making the surface of a elongate strip | belt-shaped base material incline with respect to the molten metal surface in a crucible in this way, and performs vapor deposition.

  The specific configuration for inclining the surface of the long belt-shaped base material is that the feed roll, winding roll, and cooling roll of the base material transport device have an outer peripheral surface of 7 ° with respect to the molten metal surface in the crucible. It should be arranged in the vacuum chamber so as to be inclined in the range of 47 ° or less.

  And in this invention, since the rotating shaft of a cooling roll will be in the state inclined with respect to the molten metal surface in a crucible, the width direction of a base-material surface is also in the crucible in the elongate strip | belt-shaped base material hold | maintained at the cooling roll. It will be in the state which inclined in the range of 7 degrees or more and 47 degrees or less with respect to the molten metal surface. The inclination angle of the substrate is most preferably 20 ° or more and 34 ° or less.

  The inclination angle is in the range of 7 ° to 47 ° because when the inclination angle is smaller than 7 °, the film pressure at the end in the width direction of the long belt-like substrate is smaller than that in the central portion as in the conventional case. This is because the variation in the minimum and maximum thickness of the film is very large. In addition, when the inclination angle is larger than 47 °, the evaporation ratio of the evaporated molecules on the inner wall of the vacuum chamber without being deposited on the long belt-like base material gradually increases, leading to a decrease in production efficiency. .

  In the present invention, by attaching the long belt-like base material to the base material transport device and driving the base material transport device in this way, the surface of the long belt-like base material is at the above angle with respect to the molten metal surface in the crucible. Evaporation is performed while transporting in an inclined state.

  Here, FIG. 3 shows a state of vapor deposition on the base material when the center of the crucible is set to the origin 0 and the long strip member X1 is inclined with respect to the molten metal surface of the crucible. FIG. 3 shows the area (Sa2) of the substrate within the solid angle dφ in the straight line connecting the origin 0 and the width direction central portion a of the long belt-like substrate X1, and the origin 0 and the width direction end portion c (center of the substrate). The area (Sc) of the substrate within the solid angle dφ in a straight line connecting the part a and a position away from the origin 0), and the origin 0 and the width direction end d of the base material (closer to the origin 0 than the center part a) The area (Sc) of the substrate within the solid angle dφ in the straight line connecting the (position).

  As shown in FIG. 3, these areas (Sa2, Sc, Sd) have a relationship of Sd <Sa2 <Sc, and the number of evaporated molecules (flux) deposited in these areas (Sa2, Sc, Sd). Are equal.

  In the present invention, from the above, the film thickness at one end in the width direction of the long strip-shaped substrate X1 that is closer to the molten metal surface (origin 0) of the crucible is the largest, and is far from the molten metal surface (origin 0). The film thickness on the other end side of the long belt-like substrate X1 that is the side becomes the thinnest.

  Therefore, once the vapor-deposited long belt-like substrate is used, this time, one end in the width direction where the film thickness is formed becomes the side far from the molten metal surface of the crucible, and the other end in the width direction where the film thickness is formed thin. Vapor deposition is performed by attaching to the substrate conveying apparatus so that the side is closer to the molten metal surface of the crucible.

  By the second deposition, the film formed on the other end in the width direction is thick and the film formed on the one end is thin as before. A film uniform in the direction can be formed.

  When the same film-forming surface of the long belt-like substrate X1 is deposited twice, it may be run twice on one crucible or once on two crucibles in succession. You may make it drive | work. When vapor deposition is performed twice by running the long belt-shaped substrate once, the inclination of the rotation axis of the cooling roll of the substrate transport device is reversed in the front and rear directions.

  Furthermore, in the present invention, it is preferable that the length corresponding to the width direction of the long strip-shaped substrate at the opening of the molten metal storage portion in the crucible is smaller than the width projected on the crucible melt surface of the long strip-shaped substrate. .

  Thus, by setting the size of the crucible, the radiant heat generated in the crucible can be made as small as possible, so that the long belt-like base material can be prevented from being damaged by heat as much as possible.

  Further, in the present invention, when the size of the crucible is set to the above-described size, the distance between the center in the width direction of the long belt-like base material and the molten metal surface so that the distance between the base material and the crucible becomes short. Is preferably 80 mm or more and less than 300 mm.

  The vacuum vapor deposition apparatus of the present invention performs vapor deposition while transporting a long band-shaped substrate with the width direction of the film formation surface inclined at a predetermined angle with respect to the molten metal surface in the crucible when performing film formation. It is like that.

  Then, by performing the vapor deposition method for performing vapor deposition while inclining the long belt-like base material in this manner so that one end side and the other end side in the width direction of the base material are close to the crucible, respectively, As shown by the plot line of the triangular point in the graph of 4, the film thickness distribution curve approaches a straight line. As a result, the film formed on the substrate has a flat film thickness distribution, and the film thickness in the width direction of the substrate is made uniform.

  That is, in the present invention, the deposition is performed while the long belt-shaped substrate is inclined with respect to the molten metal surface of the crucible, so that the film thickness distribution in the substrate width direction by one deposition is the conventional hyperbola shown in FIG. Instead, it becomes a line close to a straight line.

  By the way, in the conventional vapor deposition method shown in the graph of FIG. 4, since the thickness of the film formed at both ends in the width direction of the base material is reduced, the distance between the base material and the crucible is to be formed as much as possible. It was necessary to increase the value to diffuse the evaporated molecules.

  However, when film formation is performed using the vacuum vapor deposition apparatus of the present invention, the film thickness gradually decreases or increases from one end side to the other end side in the width direction of the substrate by one vapor deposition, When the substrate is inverted and vapor deposition is performed twice, the film thickness distribution approaches a straight line parallel to the substrate surface. Therefore, it becomes possible to set the film thickness of the entire base material with reference to the film thickness formed at the center in the width direction of the base material. As a result, in the present invention, the substrate can be brought closer to the crucible than in the prior art, and the film formation speed is proportional to the square of the distance, so that the film can be formed at a high speed.

  In particular, if the length corresponding to the width direction of the long belt-like base material at the opening of the molten metal reservoir in the crucible is smaller than the width projected on the crucible molten metal surface of the long belt-like base material, the base material radiates heat of the melt. Since the degree of heating can be reduced, the substrate can be brought as close to the crucible as possible to the extent that the substrate is not damaged by heat.

  Furthermore, in the present invention, by making the size of the crucible smaller than the width projected on the molten metal surface of the long belt-shaped substrate, the distance between the center in the width direction of the long belt-shaped substrate and the surface of the molten metal is 80 mm. More than 300 mm can be achieved, and the deposition rate can be increased as compared with the conventional method.

  As a result, even if vapor deposition is performed twice on the same substrate, the film formation time can be halved, so that the productivity does not decrease.

  Embodiments of a vacuum deposition apparatus according to the present invention will be described below with reference to the drawings. The vacuum vapor deposition apparatus 1 of this embodiment has the crucible 3 and the base material conveyance apparatus 4 in the vacuum chamber 2, as shown in FIG. 1 and FIG.

  In the vacuum evaporation apparatus 1, although the vacuum chamber 2 is not shown in the drawing, exhaust ports are provided at the head and the bottom, respectively, and the inside is exhausted from the exhaust port so that the inside is decompressed.

  In the vacuum chamber 2, a crucible 3 is arranged at the lower part, and a substrate conveying device 4 is arranged at the upper part.

  The crucible 3 has a molten metal storage part 31 for storing the evaporated material, and the opening of the molten metal storage part 31 has a circular shape, and the outer shape is also circular. As for the size of the opening of the molten metal storage part 31, for example, if the length in the width direction of the long belt-like substrate 5 is 300 mm, if the diameter is 80 mm, vapor deposition with a sufficiently uniform film thickness can be performed. It can be carried out. Moreover, the crucible may be provided with a molten metal storage part 31 having a rectangular opening. In this case, the long side portion of the molten metal storage portion 31 is arranged so as to correspond to the width direction of the long strip-shaped substrate 5, and the length of the long side portion is also longer than the width direction length of the long strip-shaped substrate 5. To shorten the length.

  Specifically, the length corresponding to the width direction of the elongated strip-shaped substrate 5 at the opening of the molten metal storage portion 31 is smaller than the width projected on the crucible molten metal surface of the elongated strip-shaped substrate 5. Form.

  Although not shown in FIG. 1, the vacuum evaporation apparatus 1 supplies the evaporation material into the crucible 3 by the evaporation material supply apparatus, and the evaporation material in the crucible 3 is provided by an electron gun provided on the side of the vacuum chamber 2. Melt. The crucible 3 is filled with an evaporation material such as silicon or aluminum.

  Examples of the evaporation material supply device include a hopper portion provided outside the vacuum chamber 2 and a supply pipe connected to a lower portion of the hopper portion and having a lower end opened into the crucible 3.

  Further, the electron gun provided on the side wall portion of the vacuum chamber 2 is disposed at a position where an electron beam emitted from the electron gun is irradiated on the evaporation material in the crucible 3. Then, the evaporated material heated and melted by this electron gun evaporates, and the evaporated molecules are deposited on the long belt-like substrate 5 running on the peripheral surface of the cooling roll 43 of the substrate transport device 4 to form a film. It has become so.

  The substrate transport apparatus 4 includes a feeding roll 41, a winding roll 42, and a cooling roll 43 that is disposed at a lower position between these rolls.

  The feeding roll 41 and the take-up roll 42 are rotated at a constant speed, and the cooling roll 43 is rotated freely. The cooling roll 43 is provided with a cooling device (not shown) inside so as to suppress deformation or the like due to a temperature rise of the long belt-like substrate 5. The cooling roll 43 is disposed to face the molten metal storage portion 31 of the crucible 3. The rotation of the feed roll 41 and the take-up roll 42 is performed by driving and controlling a motor connected to the drive shaft of the take-up roll 42 by a control means such as a computer. By rotating this motor, the take-up roll 42 rotates so that the long belt-like substrate 5 runs continuously.

  The feed roll 41, the take-up roll 42, and the cooling roll 43 have a cylindrical shape having a roll surface longer than the width of the long belt-like substrate 5, and the drive shaft of the take-up roll 42 is connected via a motor. The rotating shafts of the feed roll 41 and the cooling roll 43 are supported in the vacuum chamber 2 via bearings.

  Then, the tape-like long belt-like substrate 5 is wound around the feeding roll 41. The long belt-like base material 5 has a structure in which it is wound around the winding roll 42 while being pulled out from the feeding roll 41 and supported by the cooling roll 43 so as to be pushed downward in the figure.

  Further, the substrate transport device 4 includes a feeding roll 41, a winding roll 42, and a cooling roll 43, with a drive shaft and a rotation shaft in a range of 7 ° to 47 ° with respect to the molten metal surface in the crucible. It is arranged in the vacuum chamber 2 so as to be in an inclined state, ie, 27 ° which is the most preferable inclination angle in this embodiment.

  Then, since the axis of each roll is inclined by 27 ° with respect to the molten metal surface in the crucible 3, the width direction of the long belt-like substrate 5 held on the outer peripheral surface of the cooling roll 43 is also within the crucible 3. It will be in the state inclined with respect to the molten metal surface.

  In the present embodiment, the long belt-like base material 5 is attached to the base material transport device 4 in this way, and the base material transport device 4 is driven so that the surface of the long belt-like base material 5 is the molten metal surface in the crucible 3. On the other hand, vapor deposition is performed while transporting in a state inclined at the angle.

  Further, as described above, the diameter of the opening of the molten metal storage portion 31 of the crucible 3 is made smaller than the width projected on the crucible molten metal surface of the long strip-shaped substrate 5, and the width direction of the long strip-shaped substrate 5 It arrange | positions so that the distance of a center part and the molten metal surface may be less than 300 mm. For example, when the width of the long belt-like substrate 5 is 300 mm and the diameter of the opening of the molten metal storage portion 31 of the crucible 3 is 80 mm, the distance between the long belt-like substrate 5 and the molten metal surface is 200 mm. The crucible 3 and the cooling roll 43 are arranged.

  Thus, by setting the size of the crucible 3, the radiant heat generated in the crucible can be made as small as possible, so that the long belt-like substrate can be prevented from being damaged by heat as much as possible. Furthermore, since the distance between the substrate and the crucible is as short as 200 mm, the deposition rate can be increased as compared with the conventional method. As a result, even if the vapor deposition is performed twice on the same base material, the time for one film formation can be halved, so that the productivity does not decrease.

  As the long belt-like substrate 5, a resin film, a metal film, or the like is used, but in this embodiment, a copper film is used.

  An operation of forming a film on the long belt-like substrate 5 using the vacuum vapor deposition apparatus 1 having the above configuration will be described.

  First, the feeding roll 41 around which the long belt-like substrate 5 is wound is set in the vacuum chamber 2, the long belt-like substrate 5 is set along the cooling roll 43, and then the end is fixed to the winding roll 42. .

  The long belt-like substrate 5 is inclined with respect to the upper surface of the crucible 3 so that one end in the width direction of the surface of the long belt-like substrate 5 is close to the crucible 3.

  Next, the vacuum chamber 2 is evacuated to maintain a predetermined degree of vacuum. Thereafter, a predetermined evaporation material is supplied from the evaporation material supply device into the molten metal storage part 31 of the crucible 3.

  Then, the evaporation material in the crucible 3 is heated and melted with an electron gun. When the evaporating material in the crucible 3 is melted, the base material transport device 4 is driven to carry out vapor deposition on the long strip base material 5 while transporting the long strip base material 5.

  After vapor deposition is performed by one run on the long belt-like base material 5, next, with respect to the vapor-deposited long belt-like base material 5, this time, the width direction of the surface of the long belt-like base material 5 and the like. Vapor deposition is carried out while transporting the long belt-like substrate 5 by inclining at the same angle as the previous time so that the end side is close to the crucible 3.

  The film thickness of the film formed on the long belt-like substrate 5 is set based on the film thickness formed at the center in the width direction of the long belt-like substrate 5 in one run. Set.

  In this embodiment, since the long strip-shaped substrate 5 is inverted and vapor deposition is performed twice, the film thickness distribution of the film formed on the long strip-shaped substrate 5 approaches a straight line parallel to the substrate surface. . As a result, the elongated belt-like substrate 5 can be brought closer to the crucible 3 than in the prior art, and the film formation speed is proportional to the square of the distance, so that the film can be formed at a high speed.

  In addition, the inclination angle of the long belt-like substrate 5 was 5 °, 7 °, 20 °, 27 °, 30 °, 47 °, 50 °, and the film formation state was examined. A thickness variation of less than half of the variation between the minimum thickness and the maximum thickness with respect to the thickness distribution was obtained, and a substantially uniform film thickness was obtained for 20 °, 27 °, 30 °, and 47 °. In addition, when the tilt angle was 5 °, the film thickness distribution was almost the same as the conventional film thickness distribution. When the tilt angle was 50 °, the film thickness distribution was almost uniform, but the rate of deposition on the wall surface of the vacuum chamber increased due to the diffusion of the evaporated molecules.

  In particular, since the size of the opening of the molten metal storage portion 31 in the crucible 3 is smaller than the width projected on the crucible molten metal surface of the long strip-shaped substrate 5, the long strip-shaped substrate 5 is heated by the radiant heat of the molten metal. The base material can be brought as close to the crucible as possible to the extent that the degree can be reduced and the long belt-like base material 5 is not damaged by heat. As a result, even if vapor deposition is performed twice on the same substrate, the film formation time can be halved, so that the productivity does not decrease.

  As described above, according to the present embodiment, the crucible can be reduced in size and simple, and the base material transport device has a uniform thickness even if the base material transport device is not complicated. A film can be formed.

  The vacuum vapor deposition apparatus of the present invention is suitable for forming a uniform film on a base material while conveying a long belt-like base material.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic whole block diagram of the vacuum evaporation system which forms into a film on the elongate strip-shaped base material of this invention, Comprising: It is the figure seen from the roll surface side of the base material conveying apparatus. It is the figure which looked at the vacuum evaporation apparatus of FIG. 1 from the roll-axis direction of the base material conveying apparatus. The film formation state was compared between the case where the film was formed on the long belt-shaped substrate using the vacuum vapor deposition apparatus of the present invention and the case where the film was formed by arranging the conventional long belt-shaped substrate horizontally on the crucible molten metal surface. FIG. It is explanatory drawing which shows the difference in the film thickness distribution formed into a film in the elongate strip | belt-shaped base material of this invention and the former.

Explanation of symbols

1 Vacuum deposition equipment
2 Vacuum chamber
3 Crucible 31 Molten reservoir
4 Substrate transport device
41 Feeding roll 42 Winding roll 43 Cooling roll
5 Long strip base material

Claims (4)

In a vacuum deposition apparatus for depositing a film by evaporating evaporation molecules of evaporation material melted in a crucible on a long belt-like substrate continuously running by a substrate conveying device in a vacuum chamber,
When forming a film on a long strip base material, the base material transport device is in the form of a long strip so that the width direction of the base surface is inclined in the range of 7 ° to 47 ° with respect to the molten metal surface in the crucible. A vacuum deposition apparatus characterized in that the substrate is transported.   The vacuum deposition apparatus according to claim 1, wherein a length corresponding to a width direction of the long belt-like base material in the opening of the crucible is smaller than a width projected on the crucible molten metal surface of the long belt-like base material. .   The vacuum deposition apparatus according to claim 2, wherein the distance between the central portion in the width direction of the long belt-like substrate and the surface of the molten metal is 80 mm or more and less than 300 mm. Evaporation of the evaporation material on the long band-shaped substrate using a vacuum deposition apparatus comprising a substrate transport device for continuously running the long band-shaped substrate in the vacuum chamber and a crucible for storing the molten evaporation material. In the vacuum deposition method of depositing molecules to form a film,
The long belt-like base material was inclined in the range of 7 ° or more and 47 ° or less with respect to the molten metal surface in the crucible so that one end in the width direction of the base material is close to the crucible. After vapor deposition while being conveyed in the state, the substrate in which the width of the substrate surface is in the width direction with respect to the molten metal surface in the crucible so that the other end in the width direction of the substrate is close to the crucible. A vacuum vapor deposition method, characterized in that vapor deposition is carried out while being transported while being inclined at the same angle.

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