JP2007064823A - Sensor device and fixing method by brazing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easily placeable sensor device, and a fixing method by brazing. <P>SOLUTION: A pipe is fixed by brazing to an adapter 133 on a joint part 130 of a pressure sensor 10. The joint part 130 is provided with a cooling part 132 for cooling the heat by brazing. Hereby, since the heat during brazing is cooled at the cooling part 132, a heat influence on a pressure sensor module 112 provided inside a housing 110 can be suppressed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a sensor device for measuring the pressure of a fluid and a brazing fixing method.

  2. Description of the Related Art Conventionally, a pressure sensor is known in which the airtightness of a connection portion with an introduction portion that introduces pressure is improved. (For example, refer to Patent Document 1).

  The thing of this patent document 1 is provided with the pressure sensor main body, the copper tube for brazing, and the SUS connector for joints. Then, the copper tube for brazing is inserted into the copper tube insertion portion of the SUS connector for joint, and the gap between the insertion portion and the copper tube for brazing and the circular chamfered portion are brazed in a furnace at 1050 ° C. with phosphor bronze brazing. To create an adapter with one end being a brazing copper tube and the other end being a joint SUS connector. Then, the joint SUS connector of this adapter is aligned with the joint portion of the pressure sensor body, and after three or more temporary weldings, the chamfered portion of the pressure sensor and the boundary between the joint SUS connector are laser welded.

JP-A-2004-245599 (refer to page 6 and page 7, FIG. 2 and FIG. 3)

  By the way, in the conventional pressure sensor like patent document 1, the adapter created by brazing the copper tube for brazing and the SUS connector for joint is laser-joined to the pressure sensor main body. For this reason, especially when the place where the pressure sensor is disposed is narrow, the copper tube for brazing becomes an obstacle during laser bonding, or a high bonding technique is required. Therefore, it is necessary to perform laser bonding after three-point temporary bonding as in Patent Document 1, and there is a problem that the bonding work may be complicated.

  An object of the present invention is to provide a sensor device and a brazing fixing method that can be easily installed.

  The sensor device of the present invention includes a sensor body in which a sensor module is housed, a joint part for introducing a fluid to be tested into the sensor body, and brazing to the joint part, and the fluid to be tested is fixed to the joint part. A fluid introduction pipe for introducing a fluid into the sensor body, wherein the joint part includes a cooling part for preventing transmission of brazing heat to the sensor body when brazing the fluid introduction pipe. It is characterized by that.

  In the present invention having such a configuration, the joint portion includes a cooling portion that prevents transmission of brazing heat to the sensor body when brazing the fluid introduction pipe. As a result, the joint part and the fluid introduction pipe are fixed by brazing, so that the joint part and the fluid introduction pipe are hermetically sealed. For example, when a high pressure fluid is introduced into the fluid introduction pipe, fluid leakage or pressure Decrease can be prevented. Also, when, for example, molten metal brazing is injected into the joint by brazing, the cooling unit prevents the heat of the molten wax from being transmitted to the sensor body, so that the thermal effect on the sensor module provided inside the sensor body Can be suppressed. Therefore, it is possible to provide a sensor device that can alleviate the thermal influence on the sensor module and can be easily joined.

  In the sensor device of the present invention, the joint portion includes a connection portion connected to the sensor main body, and a tube attachment portion to which the fluid introduction pipe is brazed, and the cooling portion includes the connection portion. It is preferable that the connecting part and the pipe attaching part are connected to each other.

  According to the present invention, the cooling part connects the connecting part connected to the sensor body and the pipe attaching part to which the fluid introduction pipe is fixed by brazing. As a result, when the fluid introduction pipe is brazed and fixed to the pipe mounting portion, the heat due to brazing is cooled, and the heat is hardly transmitted to the connection portion. Therefore, the influence on the sensor module of the sensor body at the time of brazing can be reduced.

  Furthermore, in the sensor device of the present invention, the cooling part is formed such that a cross-sectional area of a cross section substantially perpendicular to a fluid introduction direction from the pipe mounting part toward the connection part is smaller than a cross-sectional area of the pipe mounting part. It is preferred that

  In the present invention, the cooling part is formed so that the cross-sectional area is smaller than the cross-sectional area of the tube mounting part. In general, the amount of heat transmitted through an object is determined by the product of thermal conductivity, temperature difference, and cross-sectional area. The amount of heat transferred to can be reduced. Therefore, when brazing the fluid introduction pipe to the pipe mounting portion, the amount of heat transferred to the connecting portion by brazing can be reduced. Therefore, the thermal influence on the sensor module due to the brazing heat can be reduced.

  And in the sensor apparatus of this invention, it is preferable that the said cooling part is cooled from an outer peripheral surface with a cooling fluid.

  According to this invention, the cooling part is cooled from the outer peripheral surface by the cooling fluid. That is, the cooling unit is cooled by blowing cooling air, immersing the cooling unit in cooling water, or flowing cooling water on the outer peripheral surface. Thereby, since the cooling part is further cooled, it is possible to prevent the heat at the time of brazing the fluid introduction pipe from being transmitted to the connection part, and to reduce the thermal influence of the sensor module.

  Here, the sensor device includes a dish member having a bottom surface portion provided in the connection portion, and a cylindrical portion that rises from a peripheral end portion of the bottom surface portion and has a diameter larger than the diameter dimension of the cooling portion, The cooling unit is preferably cooled by filling the dish member with a cooling fluid.

  In this configuration, the cooling unit is cooled by the cooling fluid filled in the dish member. Thereby, a cooling part can be cooled more simply and efficiently.

  The brazing and fixing method of the present invention includes a sensor main body, a joint portion for introducing a fluid to be inspected into the sensor main body, a fluid that is fixed to the joint portion by brazing and introduces the fluid to be inspected into the joint portion. A brazing and fixing method for the joint part of the sensor device and the fluid introduction pipe, wherein the joint part and the fluid are cooled in a state where the cooling part provided in the joint part is cooled by a cooling fluid. The introduction tube is fixed by brazing.

  According to such a brazing and fixing method, when the joint portion and the fluid introduction pipe are brazed, the cooling portion provided in the joint portion is brazed in a cooled state. Thereby, when inject | pouring the metal brazing fuse | melted by brazing into a joining location, the heat | fever of the fuse | melted brazing is cooled by the cooling part. For this reason, the thermal influence on the sensor module provided inside the sensor body can be suppressed.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a front view of a sensor device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a cross section of the adapter of the pressure sensor in the present embodiment.

[Configuration of pressure sensor]
In FIG. 1, 10 is a pressure sensor as a sensor device, and this pressure sensor 10 is used for measuring the pressure of a fluid flowing at a high pressure, for example. As shown in FIG. 1, the pressure sensor 10 includes a pressure sensor main body 100, a pipe 200 as a fluid introduction pipe connected to the pressure sensor main body 100 and a pipe through which a fluid to be inspected flows. , Etc.

  The housing 110 is formed in a hollow shape in which one end side is opened and the other end side is closed. The opening side of the housing 110 is caulked and fixed to a casing 121 provided on the hexagonal portion 120. The housing 110 includes a diaphragm 112A that can be displaced by the pressure of the fluid, a pressure sensor module 112 that is fixed to the joint 130, and a circuit board that detects the displacement of the diaphragm 112A and converts it into an electrical signal. 111 is stored. The circuit board 111 converts the displacement of the diaphragm 112 </ b> A into an electrical signal, and outputs the electrical signal to the tongue die 111 </ b> C formed to protrude outward from the closed portion of the housing 110. The tanshidai 111C is connected to a signal detector (not shown) such as a personal computer, for example, and recognizes the pressure detected by the pressure sensor 10 with this signal detector.

  The hexagonal portion 120 is formed in a substantially hexagonal nut shape with a cross section substantially orthogonal to the axis of the pressure sensor 10, and a cylindrical casing 121 is formed on one end side. As described above, the housing 110 and the hexagonal portion 120 are fixed by caulking the opening side end of the housing 110 inside the casing 121. In addition, a through hole 122 that penetrates from the housing 110 side to the joint portion side is formed in the axial center of the hexagonal portion 120. And the sensor module 112 fixed to the joint part 130 is inserted in this through-hole 122.

  The joint part 130 includes a fixing part 131 as a connection part connected and fixed to the hexagonal part 120, a cooling part 132 connected to the fixing part, an adapter 133 as a pipe mounting part connected to the cooling part, Etc. are integrally formed. Moreover, the joint part 130 is formed in a substantially cylindrical shape, and the pressure introduction hole 134 is provided in a state where the fixing part 131, the cooling part 132, and the adapter 133 are communicated.

  The fixing portion 131 is connected and fixed to the opposite side of the hexagonal portion 120 from the housing 110 by, for example, laser welding. Further, as described above, the pressure sensor module 112 that holds the diaphragm 112A is fixed to the end portion of the fixed portion 131 by welding, and the pressure introduction hole 134 is closed by the diaphragm 112A. The joint portion 130 is fixed by laser welding the fixing portion 131 to the end face of the hexagonal portion 120 in a state where the pressure sensor module 112 is inserted through the through hole 122 of the hexagonal portion 120 as described above.

  The cooling part 132 is formed in a concave shape whose diameter is smaller from the central axis of the pressure introducing hole 134 than the fixing part 131 and the adapter 133. Here, since the cooling unit 132 has a small diameter with respect to the fixed unit and the adapter 133, the heat transfer amount of the cooling unit 132 is small. That is, generally, the amount of heat transmitted through the cylinder is obtained by the following equation.

Quantity of heat Q = thermal conductivity H × temperature difference ΔT × cross-sectional area S (1)
In the above equation (1), the cooling unit 132 has a smaller diameter from the central axis and a smaller cross-sectional area S than the fixed unit 131 and the adapter 133. Thereby, the amount of heat passing through the cooling unit 132 is reduced, and for example, the amount of heat transmitted from the adapter 133 to the fixed unit 131 is reduced.

  The adapter 133 is formed in a substantially cylindrical shape having a diameter larger than that of the cooling unit 132. In addition, the pressure introduction hole 134 formed in the adapter 133 is provided with a pipe insertion hole 135 that is formed to have a diameter larger than that of the fixing portion 131 and the cooling portion 132 and into which a later-described pipe 200 can be inserted. Further, a taper portion 136 having a tapered shape with a large diameter on the entrance side is provided on a part of the entrance side of the pipe insertion hole 135 into which the pipe 200 is inserted.

  The pipe 200 is made of a metal such as copper, for example. Further, one end of the pipe 200 is inserted into the pipe insertion hole 135 of the adapter 133 and fixed. At this time, the pipe 200 is fixed by brazing by pouring a metal brazing material such as bronze phosphorous wax that is in a molten state at a high temperature into the tapered portion 136 of the adapter 133. The other end of the pipe 200 is fixedly connected to, for example, a pipe through which high-pressure fluid flows, for example, by brazing, and the high-pressure fluid flows into the pipe 200 from this pipe.

[Pressure sensor brazing and fixing method]
Next, as a method for installing the pressure sensor 10, a fixing method for fixing the pipe 200 to the adapter 133 will be described with reference to FIG. FIG. 3 is a cross-sectional view of the vicinity of the cooling unit 132 when the pipe 200 is fixed to the adapter 133.

  When installing the pressure sensor 10, the pipe 200 is connected to the pressure sensor main body 100 assembled in advance. At this time, first, the pressure sensor body 100 is fixed in a posture in which the tongue die 111C is vertically downward. Then, a cooling dish 300 as a dish member as shown in FIG. 3 is installed on the upper part of the fixing part 131 of the joint part 130 via an O-ring 310 that is a seal member.

  This cooling dish 300 may be formed, for example with the metal, and may be formed with the synthetic resin etc. In the cooling dish 300, a bottom surface portion 301 that extends in a radial direction substantially orthogonal to the axis of the joint portion 130 and a flange portion 302 as a cylindrical portion that rises from the peripheral end portion of the bottom surface portion toward the adapter 133 are integrated. It is formed. In addition, the hook may be provided in the bottom face part 301 of the cooling dish 300, and the structure which the cooling dish 300 is fixed by hooking this hook on the hexagonal part 120 etc. may be sufficient. With such a configuration, the stability of the cooling dish 300 can be improved.

  Then, when brazing the pipe 200 to the adapter 133, as shown in FIG. 3, the posture is changed so that the adapter 133 is positioned above and the fixing portion 131 is positioned below, and the cooling dish 300 is used as a cooling fluid. Fill the cooling water 320. As the cooling water 320, in addition to cold water, cooling oil, etc., a jelly-like cooling substance can be used, and any cooling water can be used as long as it cools the cooling unit 132. When the cooling water 320 is filled in the cooling plate 300, the cooling unit 132 is cooled from the outer peripheral surface by the cooling water 320. In this state, the pipe 200 is inserted into the pipe insertion hole 135 of the adapter 133 of the joint portion 130, and bronze phosphorous wax that is in a high-temperature molten state is poured into the tapered portion 136 to be fixed by brazing. At this time, the temperature of the brazing at the time of brazing is about 1050 ° C., but since the cooling unit 132 is cooled, the transmission of the heat amount of the brazing to the fixed unit 131 side becomes small.

[Operation effect of pressure sensor]
As described above, in the pressure sensor 10 according to the embodiment, the pipe 200 is fixed to the adapter 133 of the joint portion 130 by brazing. The joint portion 130 is provided with a cooling portion 132 that prevents transmission of brazing heat to the housing 110. For this reason, by fixing the adapter 133 and the pipe 200 of the joint part 130 by brazing, the sealing property of the adapter 133 and the pipe 200 is improved. For example, even when a high-pressure fluid flows through the pipe 200, fluid leakage and pressure Decline can be prevented. In addition, it is possible to prevent the heat of brazing from being transmitted to the housing 110 by the cooling unit 132, and the influence of the heat at the time of brazing on the pressure sensor module 112 and the circuit board 111 housed in the housing 110. Can be suppressed.

  The cooling unit 132 connects the fixing unit 131 and the adapter 133 to which the pipe 200 is fixed by brazing. For this reason, when the pipe 200 is brazed and fixed to the adapter 133, the heat of brazing is cooled by the cooling unit 132, and the heat is hardly transmitted to the fixing unit 131. Therefore, the thermal effect on the pressure sensor module 112 of the housing 110 during brazing can be reduced.

  Furthermore, the cooling unit 132 is formed so that the cross-sectional area is smaller than the cross-sectional area of the adapter 133. For this reason, the amount of heat transferred from the adapter 133 to the fixed part 131 through the cooling part 132 can be reduced. Therefore, when the pipe 200 is brazed to the adapter 133, the amount of heat transferred to the fixing portion 131 by this brazing can be reduced. Therefore, the thermal effect on the pressure sensor module 112 due to the brazing heat can be reduced.

  When the pipe 200 is attached to the adapter 133, the cooling unit 132 is cooled from the outer peripheral surface by the cooling water 320. For this reason, the cooling unit 132 is further cooled by the cooling water 320, and can further prevent the heat at the time of brazing of the pipe 200 from being transmitted to the fixing unit 131, thereby reducing the thermal influence on the pressure sensor module 112. .

  Moreover, the cooling part 132 is cooled by the cooling water 320 with which the cooling tray 300 is filled, as shown in FIG. For this reason, the cooling part 132 can be easily cooled simply by filling the cooling dish 300 fixed to the fixing part 131 side with the cooling water 320, and a special operation for cooling the cooling part 132 is unnecessary. The brazing and fixing work of the pipe 200 can be easily performed.

[Modification of Embodiment]
Note that the present invention is not limited to the above-described embodiment, and includes the following modifications as long as the object of the present invention can be achieved.

  For example, in the above-described embodiment, the pressure sensor module 112 uses a diaphragm type pressure sensor module that detects and measures the pressure by detecting the displacement of the diaphragm 112A by the circuit board 111, but is not limited thereto. For example, any sensor module such as one that detects the amount of movement of a cylinder that moves due to pressure may be used. Moreover, in the said embodiment, although the pressure sensor 10 using the pressure sensor module 112 which measures a pressure as a sensor module was illustrated, it is not restricted to this. For example, the present invention may be applied to a temperature sensor using a temperature sensor module that detects temperature as a sensor module.

  In the above embodiment, the configuration in which the joint portion 130 is laser-welded to the hexagonal portion 120 in advance has been described. However, the hexagonal portion 120 and the joint portion 130 may be integrally formed and manufactured. In such a configuration, the hexagonal portion 120 is attached to the housing 110 after the pressure sensor module is installed in the housing 110. Thereafter, the pipe 200 is brazed and fixed to the adapter 133 of the joint portion 130. In such a configuration, there is no need for laser welding of the hexagonal portion 120 and the joint portion 130, and productivity can be improved.

  Furthermore, it is good also as a structure in which the hexagonal part 120 is not provided. In other words, the joint portion 130 may be provided directly on the housing 110. In this case, since the hexagonal portion 120 is not necessary, the number of parts can be reduced, and the productivity can be improved.

  In the above embodiment, when the pipe 200 is brazed and fixed to the adapter 133, the cooling tray 300 is attached, and the cooling tray 300 is filled with the cooling water 320 to cool the cooling unit 132. It is not limited. For example, the operation of fixing the pipe 200 by brazing by directly blowing cooling air to the cooling unit 132 may be performed. Even in such a case, the cooling unit 132 can be effectively cooled, and transmission of the heat pressure sensor module 112 and the circuit board 111 during brazing can be prevented.

  Furthermore, in the above-described embodiment, an example in which the cross-sectional area of the cooling unit 132 is made smaller than the cross-sectional area of the adapter 133 to reduce the amount of heat transmitted to the housing 110 through the cooling unit 132 has been described. It is good also as a structure which lengthens the length dimension. In this configuration, by increasing the length of the cooling unit 132, heat loss in the cooling unit 132 increases, and the amount of heat transfer to the fixed unit 131 can be reduced.

  Moreover, in the said embodiment, although the cooling part 132 was formed in diameter smaller than the diameter dimension of the adapter 133, it prevented that heat was transmitted to the fixing | fixed part 131, However, It is not restricted to this. For example, the cooling unit 132 may be formed of a material that is difficult to transfer heat, such as ceramic. Even with such a configuration, it is possible to effectively prevent the brazing heat from being transmitted to the fixing portion 131.

  In addition, the specific structure and procedure for carrying out the present invention can be appropriately changed to other structures and the like within a range in which the object of the present invention can be achieved.

It is a front view of the pressure sensor in one embodiment concerning the present invention. It is sectional drawing of the pressure sensor in this Embodiment. It is sectional drawing of the cooling part vicinity at the time of fixing a pipe to a pipe attaching part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Pressure sensor 100 ... Pressure sensor main body 112 ... Pressure sensor module 130 ... Joint part 131 ... Fixing part as a connection part 132 ... Cooling part 133 ... Adapter as a pipe attachment part 200 ... Pipe as a fluid introduction pipe 300 ... Dish member As a cooling plate 301 ... bottom surface portion 302 ... flange portion as a cylindrical portion 320 ... cooling water as cooling fluid

Claims (6)

A sensor body in which a sensor module is housed;
A joint for introducing a fluid to be inspected into the sensor body;
A fluid introduction pipe fixed to the joint by brazing, and introducing a fluid to be inspected into the joint;
A sensor device comprising:
The joint unit includes a cooling unit that prevents transmission of brazing heat to the sensor body when brazing the fluid introduction pipe. The sensor device according to claim 1,
The joint portion includes a connection portion connected to the sensor body, and a tube attachment portion to which the fluid introduction tube is brazed,
The said cooling part is provided between the said connection part and the said pipe attachment part, These these connection parts and the said pipe attachment part are connected. The sensor apparatus characterized by the above-mentioned. The sensor device according to claim 2,
The cooling unit is formed such that a cross-sectional area of a cross section substantially perpendicular to a fluid introduction direction from the pipe mounting part toward the connection part is smaller than a cross-sectional area of the pipe mounting part. . The sensor device according to any one of claims 1 to 3,
The said cooling part is cooled from an outer peripheral surface with a cooling fluid. The sensor apparatus characterized by the above-mentioned. A sensor device according to any one of claims 2 to 4,
Comprising a dish member having a bottom surface portion provided in the connection portion, and a cylindrical portion that rises from a peripheral end portion of the bottom surface portion and has a diameter larger than the diameter of the cooling portion;
The cooling unit is cooled by filling the dish member with a cooling fluid. The sensor device comprising: a sensor main body; a joint portion that introduces a fluid to be tested into the sensor main body; and a fluid introduction pipe that is fixed to the joint portion by brazing and introduces the fluid to be tested into the joint portion. A method for brazing and fixing a joint portion and the fluid introduction pipe,
A brazing and fixing method comprising brazing and fixing the joint and the fluid introduction pipe in a state where a cooling part provided in the joint is cooled by a cooling fluid.

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