JP2007061992A - Method for separating metallic plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for separating a metallic plate, which can show the merits of both of the shearing work and the etching work by compensating for their respective faults by combining both of them. <P>SOLUTION: The method for separating the metallic plate to a required shape comprises a first step for forming a plastically deformed portion having a locally thin portion along a separating portion by the plastic working, and a second step for chemically dissolve and remove the plastically deformed portion by the etching work. It is preferable that the plastically deformed portion is a smooth notched portion having a depth deeper than half of a plate thickness along the separating portion, and the portion other than the plastically deformed portion is covered with a coating material, which is insoluble for the etching liquid, to reduce the dissolution of the portions other than the plastically deformed portion in the etching work. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a method for separating and processing a metal plate material into a desired shape, and particularly to a processing method for obtaining a separation / cut surface that is perpendicular, smooth and free of burrs when the plate thickness is thin.

When obtaining a plate material of a desired shape from a thin metal plate, there are an etching process and a shearing process as the contour cutting technique. The former is a method of achieving separation / cutting by dissolving and removing unnecessary portions through a resist mask having a desired contour, and a plate material having a complicated shape can be obtained from a thin plate. However, the etching process is not suitable for mass production because it requires a large number of steps and requires a long processing time for dissolution and removal, and is often used for trial production and production of small lots.

On the other hand, the latter is a processing method in which a desired contour shape is separated by shearing a plate material between a punch and a die that are fitted with a certain clearance along a desired contour, and can be processed at high speed by a press. Widely used in production. However, burrs may be a problem in the shearing of fine pressed parts. In order to solve such a problem, methods such as a method of overlapping and discarding discarded plates (Patent Document 1) and a method of shearing from the opposite direction after half-shearing (Patent Document 2) have been proposed. In some cases, burrs may not be suppressed depending on the material and shape of the workpiece.
JP 2004-25285 A Japanese Patent Laid-Open No. 2001-300648

In shearing processing, it is necessary to fit the punch and die while maintaining a clearance of several percent of the plate thickness along the cutting contour. Therefore, as the plate thickness decreases, it becomes difficult to manufacture the mold and the mold manufacturing cost increases. . Also, under such a small clearance, the punch and the die are likely to vibrate and collide with each other due to the impact when the plate material is sheared, and the die life is shortened compared to the shearing processing of the thick plate. Furthermore, there is a problem with respect to cutting accuracy due to, for example, increased burrs on the fracture surface and warping of the product. On the other hand, in the etching process, as described above, in addition to being disadvantageous for mass production from the viewpoint of productivity, because of the side etch phenomenon in which etching proceeds to the back side of the mask, the shape accuracy and contour dimension accuracy of the cut surface Difficult to guarantee.

Accordingly, an object of the present invention is to provide a method for separating a metal plate that can cover the respective disadvantages and exhibit the advantages of each other by combining shearing and etching.

According to a first aspect of the present invention, in the method for separating a metal plate material into a desired shape, a plastic deformation portion having a thin plate thickness is locally formed along the separation portion by plastic working. It is a metal plate material separation processing method characterized by comprising one step and a second step of chemically dissolving and removing the plastic deformation portion by etching.

The invention described in claim 2 is the metal plate material separation processing method according to claim 1, wherein the plastically deformed portion smoothly forms a deep cut of half or more of the plate thickness along the separation portion.

The invention described in claim 3 comprises covering the portions other than the plastic deformation portion with a coating material that is insoluble in the etching solution in order to reduce dissolution other than the plastic deformation portion in the etching process. It is a separation processing method of the metal plate material of 1 or 2.

In the present invention, in order to achieve separation and cutting while avoiding mold fitting and shear fracture while making use of high productivity of plastic processing, a portion having a thin plate thickness is locally aligned along the contour by plastic deformation. The final separation is achieved by chemically dissolving and removing a small thickness remaining in this portion (second step) by etching (second step).

In the first step of the present invention, since the fitting of the mold as in the normal shearing process is unnecessary, the manufacturing accuracy of the mold is eased. In addition, since shear failure does not occur, there is no impact load on the mold, and improvement of the mold life is expected. In the second step, the slight plate thickness remaining after the first step may be dissolved, so that the processing time is greatly shortened as compared with a normal etching process. Further, there is an effect that a mask manufacturing process is not required. Regarding the processing accuracy, it is not necessary to fit the mold, so that the first process does not break and can form a right-angled and smooth cross section. Since the final separation is etching, the generation of burrs due to shear fracture is avoided. In particular, if the ratio of the first step is large, there is an effect that a good separation surface that is perpendicular, smooth, and free of burrs can be provided.

The metal plate material separation processing method of the present invention includes a first step of forming a thin plastic deformation portion locally along the separation portion by plastic working, and a chemical processing of the plastic deformation portion by etching. In the first step, plasticity is used in order to achieve separation and cutting while avoiding mold fitting and shear failure while taking advantage of the high productivity of plastic processing. A thin portion (plastic deformation portion with a thin plate thickness) is locally formed along the contour (separation portion) by deformation. In the second step, final separation is achieved by chemically dissolving and removing a small thickness remaining in the plastic deformation portion by etching.

In the plastic processing in the first step, there is no particular limitation as a method and means for forming a plastic deformation portion having a thin plate thickness along the separation portion, but knife blade coining processing or semi-shear processing is used. Is desirable. The degree of plastic deformation is preferably such that the plastic deformation part forms a deep cut that is not less than half the plate thickness smoothly along the separation part.

The etching process in the second step can also be performed in accordance with ordinary methods and means. However, in order to reduce dissolution other than the plastic deformation site given in the first step, the coating other than the plastic deformation site is insoluble in the etching solution. It is desirable to cover with material. There is no restriction | limiting in particular as such a coating | covering material, A commercially available masking tape for plating, a resist film, etc. can be used.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In FIG. 1, the example at the time of performing a semi-shear process in a 1st process is shown. 1 is a punch, 2 is a die, and 3 is a metal plate. Unlike normal shearing, it is not necessary to fit the mold, so it is possible to set a zero to minus mold clearance, and it is possible to form a deep cut (plastic deformation) in the metal plate without breaking. it can. Along the desired contour a1, the punch 1 is pushed against the metal plate 3 from the surface of the metal plate to a depth w4 'of 70 to 90% of the plate thickness to form a plastically deformed portion.

In FIG. 2, 4 is an etching processing container, 5 is an etching solution, and 6 is a coating material that is insoluble in the etching solution. Subsequent to the first step, as a second step, the w1 side as a product is coated with a coating material 6 that is insoluble in the etching solution, and then immersed in a container 4 filled with the etching solution 5 for a certain period of time. This metal plate material is uniformly etched away from the surface w4 side where the coating material 6 is not applied, and when the removal depth reaches the cut depth w4 ′ by the first step, the metal plate material is w1 which becomes a product. Separated into w2 to be scrap. Also, in order to increase the etching efficiency, a spray type etching method with good solution circulation is desirable.

FIG. 3 shows an example when coining is performed in the first step. 11 is a protrusion punch, 12 is a die, and 13 is a metal plate. Along the desired contour a1, a protrusion punch 11 having a right-angled w1 side as a product after separation is pushed into the metal plate 13, and the protrusion tip is formed at a depth w4 of 70 to 90% of the plate thickness from the surface of the metal plate. Push in until the plastic deformation part is formed. By performing the second step as in FIG. 2, the metal plate material is separated into w1 as a product and w2 as a scrap.

As is apparent from the above description, in the first step of the present invention, mold fitting accuracy as in normal shearing is not required, so that the mold manufacturing accuracy is eased. Further, since shear fracture does not occur, there is no impact load on the mold, and it is considered advantageous in terms of tool life. In the second step, the slight plate thickness remaining after the first step may be dissolved, so that the processing time is greatly shortened as compared with a normal etching process. Further, a mask manufacturing process is not required.

Furthermore, since it is not necessary to fit the mold, a plastic working method that does not cause breakage in the first step and forms a right-angled and smooth cross section can be used. Since the final separation is etching, the generation of burrs due to shear fracture is avoided. For this reason, the larger the ratio of the first step, the better the separation surface having right angles, smoothness and no burrs, and the present invention is very excellent in terms of the processing accuracy of the obtained product.

Specifically, the metal plate material of the present invention was separated under the following conditions. As the metal plate material, beryllium copper foil (C1720) having a thickness of 0.1 mm was used. A disk with a diameter of 4 mm was separated and cut from this plate (cutting contour: a circle with a diameter of 4 mm).

Plastic deformation is performed along the separation part (cutting contour) by semi-shear processing (clearance: -0.01 mm) as shown in FIG. 1 so that the depth of cut is 75 to 90% of the plate thickness. A part was formed (first step).

Next, the plate material on which the plastically deformed portion was formed was immersed in an etching solution (ferric chloride (FeCl ₃ ) solution, concentration 35 g / l) as shown in FIG. 2 at 55 ° C. for 20 to 25 minutes. The portions other than the plastically deformed portion were covered with a masking tape for plating (material: polyvinyl chloride resin) as a covering material.

The obtained beryllium copper foil disc was separated and cut at a right angle, smooth and free from burrs. For comparison, discs of beryllium copper foil were obtained by performing separation / cutting only by shearing or etching only under the above-mentioned conditions. In the case of only the shearing process, burrs were generated on the fracture surface, and in the case of only the etching process, erosion due to side etching occurred on the separation / cut surface.

As a first step, a knife blade coining process using a protruding punch and a die as shown in FIG. 3 is used to plastically deform along the separation part (cutting contour), and the cutting depth is 75 to 90% of the plate thickness. A beryllium copper foil disc was obtained in exactly the same manner as in Example 1 except that the plastically deformed portion was formed. The obtained beryllium copper foil disc was separated and cut at a right angle, smooth and free from burrs.

It is explanatory drawing of the 1st process (half-shear process) of this invention. It is explanatory drawing of the 2nd process (etching process) of this invention. It is explanatory drawing of the 1st process (knife blade coining process) of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,11 Punch 2,12 Die 3,13 Metal plate material 4 Etching vessel 5 Etching solution 6 Coating material insoluble in etching solution

Claims (3)

In the method of separating a metal plate material into a desired shape, a first step of forming a plastic deformation portion having a thin plate thickness locally along the separation portion by plastic processing, and the plastic deformation portion by etching. A method for separating and processing a metal plate material, comprising a second step of chemically dissolving and removing. The metal plate material separation processing method according to claim 1, wherein the plastically deformed portion is formed by smoothly forming a deep cut of half or more of the plate thickness along the separation portion. 3. The metal plate material separation processing method according to claim 1, further comprising: covering a portion other than the plastic deformation portion with a coating material insoluble in an etching solution in order to reduce dissolution other than the plastic deformation portion in the etching process.

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