JP2007057497A - System and method for inspecting phosphor film thickness - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately inspect the film thickness of a phosphor even when coated object deforms. <P>SOLUTION: An irradiation section 5 irradiates ultraviolet rays to the phosphor 3, a light receiver 6 receives light (luminescence light) emitted by the phosphor 3 according to ultraviolet irradiation, and a computer system 8 converts the luminance of the luminescence light of the phosphor 3 into the film thickness value of the phosphor 3, thereby directly measuring the film thickness of the phosphor 3 applied onto the surface of the coated object 2. Thus, the film thickness of the phosphor 3 is accurately inspected even when deformation such as distortion occurs in the coated object 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a phosphor film thickness inspection system and a phosphor film thickness inspection method for inspecting the film thickness of a phosphor coated on the surface of an object to be coated.

Conventionally, as a method of measuring the film thickness of the phosphor coated on the surface of the object to be coated, a method of measuring the film thickness from the cross section of the coated surface by destroying the object coated with the phosphor, A method of directly measuring the thickness of a phosphor using a contact-type measuring device is known. In addition, a plasma display panel inspection apparatus is known, but this inspection apparatus is for detecting color unevenness of a phosphor and does not measure the film thickness of the phosphor (Patent Document 1). See).
JP 2001-15030 A

  However, since the conventional film thickness measurement method is configured to measure the film thickness of the phosphor with reference to the interface between the object to be coated and the phosphor, when deformation such as distortion occurs in the object to be coated. It was difficult to accurately measure the thickness of the phosphor.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a fluorescent material capable of accurately inspecting the film thickness of a phosphor even when deformation such as distortion occurs in an object to be coated. The object is to provide a body thickness inspection system and a phosphor thickness inspection method.

  In order to solve the above-described problems, the phosphor film thickness inspection system and the phosphor film thickness inspection method according to the present invention irradiate the phosphor with ultraviolet rays having a predetermined wavelength, and the phosphor emits in response to the ultraviolet irradiation. Receiving light, calculating the brightness of the received light, converting the brightness calculated using the relational expression showing the relationship between the brightness and the film thickness value of the phosphor into the film thickness value of the phosphor, It is determined whether the phosphor has a desired film thickness value by comparing the film thickness value with a predetermined reference value.

  According to the phosphor film thickness inspection system and the phosphor film thickness inspection method according to the present invention, since the film thickness of the phosphor coated on the surface of the coating object is directly measured, deformation such as distortion is applied to the coating object. Even when this occurs, the film thickness of the phosphor can be accurately inspected.

  Hereinafter, the configuration and operation of a phosphor film thickness inspection system according to an embodiment of the present invention will be described with reference to the drawings.

[Configuration of phosphor film thickness inspection system]
A phosphor film thickness inspection system 1 according to an embodiment of the present invention is for inspecting the film thickness of a phosphor 3 applied on the surface of an object 2 as shown in FIG. A light source 4, an irradiation unit 5 that irradiates the surface of the phosphor 3 with ultraviolet rays emitted from the ultraviolet light source 4, a light receiving unit 6 that receives light (emitted light) emitted from the phosphor 3 in response to the irradiation of ultraviolet rays, The main components are a spectroscopic device 7 that splits the emitted light received by the light receiving unit 6 and a computer system 8 that calculates and inspects the film thickness of the phosphor 3 using the emitted light dispersed by the spectroscopic device 7. Prepare.

  In the present embodiment, the ultraviolet light source 4 generates a wavelength in the range of 200 to 450 [nm] so that the phosphor 3 can emit light. Moreover, in this embodiment, although the light-receiving part 6 is arrange | positioned on the surface side of the fluorescent substance 3 as shown in FIG. 1, the to-be-coated object 2 emits light emitted from the fluorescent substance 3 such as transparent glass or plastic. In the case of being formed of a transmissive material, the light receiving portion 6 may be disposed on the back side of the article 2 to be coated. Further, when inspecting the film thickness of the phosphor 3, in order to make it possible to inspect the film thickness with higher accuracy, the ambient light is blocked from entering the ambient light by, for example, darkening the peripheral part of the system. It is desirable to eliminate the influence of.

  Then, the phosphor film thickness inspection system 1 having such a configuration performs the phosphor film thickness inspection process described below, so that the phosphor 3 is deformed even when deformation such as distortion occurs in the coating object 2. This makes it possible to accurately inspect the film thickness. The operation of the phosphor film thickness inspection system 1 when executing the phosphor film thickness inspection process will be described below with reference to the flowchart shown in FIG.

[Phosphor film thickness inspection process]
The flowchart shown in FIG. 2 starts in response to the operator turning on the phosphor film thickness inspection system and instructing execution of the phosphor film thickness inspection process. The phosphor film thickness inspection process is performed in step S1. Proceed to the process.

  In the process of step S <b> 1, the irradiation unit 5 irradiates the surface of the phosphor 3 with ultraviolet rays emitted from the ultraviolet light source 4. Thereby, the process of step S1 is completed and the phosphor film thickness inspection process proceeds to the process of step S2.

  In the process of step S2, the light receiving unit 6 receives light (emitted light) emitted from the phosphor 3 in response to ultraviolet irradiation. Thereby, the process of step S2 is completed, and the phosphor film thickness inspection process proceeds to the process of step S3.

  In the process of step S3, the spectroscopic device 7 splits the emitted light received by the light receiving unit 6 into a plurality of different color elements. Thereby, the process of step S3 is completed and the phosphor film thickness inspection process proceeds to the process of step S4.

  In the process of step S <b> 4, the computer system 8 calculates the luminance of the color element that is likely to change depending on the film thickness of the phosphor 3 among the color elements dispersed by the spectroscopic device 7. In addition, as a color element which is easy to change with the magnitude | size of the film thickness of the fluorescent substance 3, although a green component can be illustrated, it is desirable for an operator to select suitably according to the material type of the fluorescent substance 3.

  In addition, the computer system 8 is not the luminance of the color element that easily changes depending on the film thickness of the phosphor 3, but has the highest luminance level among the dispersed color elements, and the other wavelength elements and the peak wavelength. The luminance of color elements that do not interfere with each other may be calculated. Thereby, the process of step S4 is completed, and the phosphor film thickness inspection process proceeds to the process of step S5.

  In the process of step S5, the computer system 8 converts the luminance calculated by the process of step S4 into the film thickness value of the phosphor 3 using the light emission luminance of the phosphor having a known film thickness as a reference value. Specifically, when the emission light luminance of a phosphor having a film thickness of 10 [μm] has been previously measured as 2200 [cd] by experiment, the computer system has a luminance per film thickness of 1 [μm] of 220 [cd]. As shown in FIG. 3, the luminance calculated by the process of step S4 is divided by 220 to convert the luminance calculated by the process of step S4 into the film thickness value of the phosphor 3. Thereby, the process of step S5 is completed, and the phosphor film thickness inspection process proceeds to the process of step S6.

  In the process of step S6, the computer system 8 determines whether or not the film thickness value converted by the process of step S5 satisfies a predetermined acceptance criterion. Specifically, when the desired film thickness value is 10 [μm], the computer system 8 determines that the film thickness value converted by the process of step S5 is 10 ± 2.5 [μm] (7.5 to 12). .5 [μm]) is determined. And as a result of discrimination | determination, when the film thickness value converted by the process of step S5 satisfy | fills a predetermined acceptance criterion (for example, shown in FIG. 3), the computer system 8 determines the fluorescent substance 3 as an acceptable product, On the contrary, when the predetermined acceptance criterion is not satisfied, the phosphor 3 is determined as a defective product. Thereby, a series of phosphor film thickness inspection processing is completed.

  As is clear from the above description, in the phosphor film thickness inspection system 1 according to the embodiment of the present invention, the irradiation unit 5 irradiates the phosphor 3 with ultraviolet rays, and the light receiving unit 6 responds to the ultraviolet irradiation with the phosphors 3. Is received on the surface of the object 2 by converting the luminance of the emitted light of the phosphor 3 into the film thickness value of the phosphor 3. Since the film thickness of the phosphor 3 is directly measured, the film thickness of the phosphor 3 can be accurately inspected even when deformation such as distortion occurs in the coating object 2.

  In the phosphor film thickness inspection system 1 according to the embodiment of the present invention, the spectroscopic device 7 splits the light received by the light receiving unit 6 into a plurality of different color elements, and the computer system 8 has a plurality of different color elements. Among them, the luminance of the light of the color element having a correlation with the film thickness of the elementary phosphor 3 is calculated, and the calculated luminance is converted into the film thickness value of the phosphor 3, so that the film thickness of the phosphor 3 is accurately determined. Can be inspected well.

  The inventors of the present invention have conducted intensive research, and as a result, until the film thickness of the phosphor 3 reaches about 10 [μm], the luminance of the emitted light is as shown in FIG. Although it follows the value, it has been found that when the film thickness of the phosphor 3 is about 25 [μm], the luminance of the emitted light has an offset value with respect to the film thickness value as shown in FIG. This is presumably because the amount of ultraviolet rays absorbed by the phosphor 3 increases as the thickness of the phosphor 3 increases. Therefore, it is desirable to apply this system to the film thickness inspection process of a phosphor having a film thickness of 30 [μm] or less. When the film thickness is 10 [μm] or more, the converted film thickness value is used. It is desirable to add an appropriate correction to.

  As mentioned above, although embodiment which applied the invention made by the present inventors was described, this invention is not limited by the description and drawing which make a part of indication of this invention by this embodiment. That is, it should be added that other embodiments, examples, operation techniques, and the like made by those skilled in the art based on the above-described embodiments are all included in the scope of the present invention.

It is a block diagram which shows the structure of the fluorescent substance film thickness test | inspection system used as embodiment of this invention. It is a flowchart figure which shows the flow of the fluorescent substance film thickness test | inspection process used as embodiment of this invention. It is a figure for demonstrating the method to calculate the film thickness value of a fluorescent substance from the brightness | luminance of the emitted light of a fluorescent substance. It is a figure which shows the relationship between the brightness | luminance of emitted light, and a film thickness value when the film thickness of a fluorescent substance is 10 [micrometers]. It is a figure which shows the relationship between the brightness | luminance of emitted light, and a film thickness value when the film thickness of a fluorescent substance is 25 [micrometers].

Explanation of symbols

1: Phosphor film thickness inspection system 2: Coating object 3: Phosphor 4: Ultraviolet light source 5: Irradiation unit 6: Light receiving unit 7: Spectrometer 8: Computer system

Claims (4)

A phosphor film thickness inspection system for inspecting the film thickness of a phosphor coated on the surface of an object to be coated,
An irradiation unit for irradiating the phosphor with ultraviolet rays having a predetermined wavelength;
A light receiving unit that receives light emitted from the phosphor in response to the irradiation of the ultraviolet rays;
The brightness of the light received by the light receiving unit is calculated, the brightness calculated using the relational expression indicating the relationship between the brightness and the thickness value of the phosphor is converted into the thickness value of the phosphor, and the phosphor film A phosphor film thickness inspection system comprising: an arithmetic unit that determines whether or not the phosphor has a desired film thickness value by comparing the thickness value with a predetermined reference value. The phosphor film thickness inspection system according to claim 1,
A light splitting unit that splits the light received by the light receiving unit into a plurality of different color elements, and the arithmetic unit is a color element having a correlation with the thickness of the phosphor among the color elements dispersed by the light splitting unit; A phosphor film thickness inspection system characterized by calculating the luminance of light. The phosphor film thickness inspection system according to claim 2,
The phosphor film thickness inspection system, wherein the color element having a correlation with the film thickness of the phosphor is a green color element. A phosphor film thickness inspection method for inspecting the film thickness of a phosphor coated on the surface of an object to be coated,
Irradiating the phosphor with ultraviolet rays of a predetermined wavelength;
Receiving light emitted by the phosphor in response to the irradiation of the ultraviolet rays;
Calculating the brightness of the received light;
Converting the brightness calculated using the relational expression showing the relationship between the brightness and the film thickness value of the phosphor into the film thickness value of the phosphor;
And determining whether or not the phosphor has a desired film thickness value by comparing the film thickness value of the phosphor with a predetermined reference value.

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