JP2007047998A5 - - Google Patents

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Publication number
JP2007047998A5
JP2007047998A5 JP2005231126A JP2005231126A JP2007047998A5 JP 2007047998 A5 JP2007047998 A5 JP 2007047998A5 JP 2005231126 A JP2005231126 A JP 2005231126A JP 2005231126 A JP2005231126 A JP 2005231126A JP 2007047998 A5 JP2007047998 A5 JP 2007047998A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005231126A
Other languages
Japanese (ja)
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JP2007047998A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005231126A priority Critical patent/JP2007047998A/ja
Priority claimed from JP2005231126A external-priority patent/JP2007047998A/ja
Priority to US11/460,690 priority patent/US7593223B2/en
Publication of JP2007047998A publication Critical patent/JP2007047998A/ja
Publication of JP2007047998A5 publication Critical patent/JP2007047998A5/ja
Pending legal-status Critical Current

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JP2005231126A 2005-08-09 2005-08-09 電子部品冷却構造及び情報処理装置 Pending JP2007047998A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005231126A JP2007047998A (ja) 2005-08-09 2005-08-09 電子部品冷却構造及び情報処理装置
US11/460,690 US7593223B2 (en) 2005-08-09 2006-07-28 Information-processing apparatus and cooling system used therein

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005231126A JP2007047998A (ja) 2005-08-09 2005-08-09 電子部品冷却構造及び情報処理装置

Publications (2)

Publication Number Publication Date
JP2007047998A JP2007047998A (ja) 2007-02-22
JP2007047998A5 true JP2007047998A5 (US20080242721A1-20081002-C00053.png) 2008-09-18

Family

ID=37742324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005231126A Pending JP2007047998A (ja) 2005-08-09 2005-08-09 電子部品冷却構造及び情報処理装置

Country Status (2)

Country Link
US (1) US7593223B2 (US20080242721A1-20081002-C00053.png)
JP (1) JP2007047998A (US20080242721A1-20081002-C00053.png)

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JP4518097B2 (ja) * 2007-04-13 2010-08-04 ソニー株式会社 情報処理装置のフロント構造
WO2008147838A1 (en) * 2007-05-22 2008-12-04 Mku Cyprus Ltd Multi compartment green shelter
US20090059514A1 (en) * 2007-08-31 2009-03-05 Silver-Stone Technology Co., Ltd. Heat dissipating apparatus of computer
US7782613B2 (en) * 2008-03-19 2010-08-24 Harris Technology, Llc Cooling system for a portable device
KR20110027766A (ko) * 2008-07-09 2011-03-16 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 컴퓨터 섀시 챔버를 위한 전용의 공기 흡입구 및 공기 배출구
CA2742807C (en) * 2008-11-11 2014-05-27 Pv Powered, Inc. Solar inverter cabinet architecture
US8649173B2 (en) * 2008-12-02 2014-02-11 Hitachi, Ltd. Operation processor
US8462495B1 (en) * 2009-09-29 2013-06-11 Emc Corporation Disk drive carrier and disk drive enclosure cooling system
JP4892078B2 (ja) * 2010-05-11 2012-03-07 株式会社東芝 電子機器
US8184434B2 (en) * 2010-08-19 2012-05-22 M & A Technology Inc. Video/audio computer display processor
TW201212800A (en) * 2010-09-03 2012-03-16 Hon Hai Prec Ind Co Ltd Heat dissipating device and electronic device having the same
CN102566712A (zh) * 2010-12-10 2012-07-11 鸿富锦精密工业(深圳)有限公司 电脑机箱散热系统
US9310860B2 (en) 2011-06-15 2016-04-12 Hewlett-Packard Development Company, L.P. Thermal chamber partition and fan unit for computer system
US9170615B2 (en) * 2011-10-31 2015-10-27 Radisys Corporation Compact network server or appliance
US20140063726A1 (en) * 2012-09-06 2014-03-06 You-Chi Liu Computer cooling system
EP2762796A1 (en) * 2013-02-04 2014-08-06 ABB Oy Cooling assembly
JP6337547B2 (ja) * 2014-03-20 2018-06-06 富士通株式会社 電子機器筐体
US9643233B2 (en) * 2014-09-22 2017-05-09 Dell Products, L.P. Bi-directional airflow heatsink
US20160098068A1 (en) * 2014-10-07 2016-04-07 Antec, Inc. Computer case providing multiple independent airflows
USD926750S1 (en) * 2019-05-31 2021-08-03 Apple Inc. Electronic device

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JPS6260096A (ja) * 1985-09-10 1987-03-16 広播電子工業株式会社 ホテルなどの火災検知方法とその報知方法
US5751549A (en) * 1996-06-26 1998-05-12 Sun Microsystems, Inc. Hard disk drive assembly which has a plenum chamber and a fan assembly that is perpendicular to a rack chamber
US6104608A (en) * 1997-10-30 2000-08-15 Emc Corporation Noise reduction hood for an electronic system enclosure
US6115250A (en) * 1998-01-20 2000-09-05 Dell Usa, Lp Computer and an assembly and method for cooling a computer
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US6414845B2 (en) * 1999-05-24 2002-07-02 Hewlett-Packard Co. Multiple-fan modular cooling component
US6373697B1 (en) * 1999-06-28 2002-04-16 Sun Microsystems, Inc. Computer system housing and configuration
JP2001042973A (ja) 1999-07-27 2001-02-16 Royal Electric Co Ltd コンピュータの冷却装置
US7630198B2 (en) * 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
JP2002169626A (ja) 2000-12-05 2002-06-14 Nec Gumma Ltd 中央処理装置内蔵型電子機器
US6504717B1 (en) * 2001-06-15 2003-01-07 Cereva Networks. Inc. Failure-tolerant high-density card rack cooling system and method
US6889752B2 (en) * 2002-07-11 2005-05-10 Avaya Technology Corp. Systems and methods for weatherproof cabinets with multiple compartment cooling
JP4154938B2 (ja) * 2002-07-12 2008-09-24 株式会社日立製作所 情報処理装置
JP4012091B2 (ja) * 2003-02-20 2007-11-21 富士通株式会社 電子装置の冷却構造及び情報処理装置
JP4082380B2 (ja) * 2004-05-07 2008-04-30 ソニー株式会社 筐体、コンピュータおよび電子機器
US7248472B2 (en) * 2004-05-21 2007-07-24 Hewlett-Packard Development Company, L.P. Air distribution system
US7382613B2 (en) * 2004-05-21 2008-06-03 Hewlett-Packard Development Company, L.P. Computer system with external air mover
US7259961B2 (en) * 2004-06-24 2007-08-21 Intel Corporation Reconfigurable airflow director for modular blade chassis
US7230827B2 (en) * 2005-04-20 2007-06-12 Dell Products L.P. Method and apparatus for venting a chassis
US7430117B2 (en) * 2005-12-14 2008-09-30 Flextronics Ap, Llc Airflow system for electronics chassis
US7403385B2 (en) * 2006-03-06 2008-07-22 Cisco Technology, Inc. Efficient airflow management
US7324338B1 (en) * 2006-08-29 2008-01-29 Silver-Stone Technology Co., Ltd. Heat dissipating apparatus of a computer system

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