JP2007047347A - Manufacturing method of electro-optical apparatus, manufacturing apparatus for the same, and manufacturing method of mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electro-optical apparatus, a manufacturing apparatus for the same, and the manufacturing method of a mounting structure, for improving reliability of connection by pressurizing each of a plurality of terminals of electronic components with almost same pressure. <P>SOLUTION: The manufacturing method comprises: a process (S3) for aligning a pressing head 42 so that the same pressure is applied to each of a plurality of driver side input-output terminals 12, 24 from substrate side input-output terminals 11a, 14a when pressurizing a pressurizing center C of a driver IC 17 by a pressing head 42; and a process (S4) for press-fixing the driver IC 17 to the substrate 4 by the pressing head 42. Consequently, the driver side input-output terminals 23, 24 can be press-fixed to the substrate 4 side by the pressing head 42 with almost one and the same pressure, and reliability of the connections can be improved by almost equally crushing the conductive particles 26, for example, preventing crushing unevenness of the conductive particles 26 sandwiched between the substrate side input-output terminals 11a, 14a and the driver side input-output terminals 23, 24. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electro-optical device used in an electronic apparatus such as a personal computer or a cellular phone, a manufacturing apparatus for an electro-optical device, and a method for manufacturing a mounting structure.

  Conventionally, for example, a liquid crystal device or the like as an electro-optical device has been used as a display device of an electronic apparatus such as a personal computer or a mobile phone. In this liquid crystal device or the like, for example, an IC chip is mounted between a substrate and an IC chip by an ACF (an anisotropic conductive film) or the like in a flip chip method. If the center is different from the center of the outer shape of the IC chip, it is difficult to press the input / output bumps uniformly when the IC chip is pressed by the pressure head, and the connection reliability of the input / output bumps is reduced. There was a problem.

In order to solve this problem, for example, a technique is disclosed in which the IC chip is pressed by the pressure head in a state where the center of the pressure head substantially coincides with the center line of the input bump row and the output bump row. Yes. (For example, refer to Patent Document 1).
JP 2000-340163 (paragraph [0028], FIG. 2).

  However, although the above-described technique can improve the reliability of the conductive connection, for example, the number of input bumps is smaller than the output bumps, and the ratio of the area of the output bumps to the area where the output bumps are arranged is The area of the input bump is larger than the ratio of the area of the input bump, that is, the input bump is sparse and the output bump is densely provided. There is a problem that the pressure becomes smaller than the pressure applied to each input bump, the input / output bumps and the conductive particles are crushed unevenly, and the connection reliability is lowered.

  The present invention has been made in view of the above-described problems. An electro-optical device manufacturing method and an electro-optical device capable of improving connection reliability by pressing each of a plurality of terminals of an electronic component with substantially the same pressure. An object is to provide a manufacturing apparatus and a manufacturing method of a mounting structure.

  In order to achieve the above object, a method for manufacturing an electro-optical device according to a main aspect of the present invention is a method for manufacturing an electro-optical device in which an electronic component having a plurality of terminals is mounted on a substrate by being pressed by a pressing member. The step of aligning the electronic component and the pressing member so that an equal force per unit area is applied to each of the plurality of terminals, and the electronic component by the pressing member aligned by the aligning step. And a step of pressure-bonding to the substrate.

  In the present invention, the step of aligning the electronic component and the pressing member so that an equal force per unit area is applied to each of the plurality of terminals, and the electronic component is pressure-bonded to the substrate by the pressing member aligned by the alignment step. For example, when crimping the substrate side and the plurality of terminals of the electronic component through, for example, an adhesive containing conductive particles, the plurality of terminals are not dependent on the arrangement state of the plurality of terminals. Each terminal can be pressed to the substrate side by a pressing member with substantially the same pressure, and the respective conductive particles are crushed approximately equally, for example, the conductive particles crushed between the substrate side and a plurality of terminals of the electronic component. Unevenness can be prevented, and when the unevenness of deformation is large, the contact area is reduced and connection failure occurs, but by securely connecting multiple terminals of electronic components to the board side It is possible to improve the reliability of the connection.

  Also, when an electronic component is crimped via an adhesive that does not contain conductive particles, for example, each of the plurality of terminals of the electronic component is pressed with substantially the same pressure without depending on the arrangement state of the plurality of terminals. For example, it is possible to prevent crushing unevenness of each terminal, and to improve the reliability of connection between each terminal and the substrate side.

  An electro-optical device manufacturing method according to a main aspect of the present invention is an electro-optical device manufacturing method in which an electronic component having a plurality of terminals is mounted on a substrate by pressing the electronic component with the pressing member. And the step of pressure-bonding the electronic component to the substrate by the pressing member aligned by the aligning step, wherein the aligning step includes i as a natural number from 1 to n, and n as the When the number of terminals of the electronic component, the area of each of the terminals is area Si, and the pressure P is an equal pressure applied per unit area of each of the areas, each force Fi (= P The pressing center of the pressing member is made to coincide with the center point that is the point where the sum of moments of Si) becomes zero. Note that the number n of terminals of the electronic component may include, for example, dummy terminals that are not actually connected to the wiring on the substrate side in addition to the terminals that are actually connected to the wiring on the substrate side. Here, the pressing center refers to the position of the line of action of the resultant force of the pressing force when the pressing force is applied to a plurality of locations of the electronic component when the electronic component is pressed by a pressing member, for example.

  In this invention, it comprises the process of aligning an electronic component and a pressing member, and the process of crimping | bonding an electronic component to a board | substrate with the pressing member aligned by the process of aligning, and the process of aligning i is 1-n. When a natural number, n is the number of terminals of an electronic component, an area of each terminal is an area Si, and an equal pressure applied per unit area of each area is a pressure P, each force Fi (= Since the center of pressing of the pressing member coincides with the center point where the sum of the moments of P · Si) becomes zero, for example, the substrate side and the plurality of terminals of the electronic component are connected, for example, via an adhesive containing conductive particles. When the pressure is applied, the moments about the center points of the forces Fi (= P · Si) acting on the plurality of terminals are balanced, and the plurality of terminals are surely the same. It can be pressed against the substrate side by the pressing member with a force, for example, to prevent collapse unevenness of the conductive particles reliably a plurality of terminals of the electronic component can be connected to the substrate side.

  According to an aspect of the present invention, the center point has a position xi and a position of the center of the area of the terminal by a coordinate in two directions with respect to an arbitrary point on the active surface having the plurality of terminals of the electronic component. When represented by the position yi, the following formula, xi = (F1 · x1 + F2 · x2 + ... + Fn · xn) / (F1 + F2 + ... + Fn), yi = (F1 · y1 + F2 · y2 + ... + Fn · yn) / (F1 + F2 +... + Fn). Thereby, when the center position of the area of the terminal is represented by the position xi and the position yi by the coordinates in two directions with respect to an arbitrary point on the active surface having a plurality of terminals of the electronic component, Xi = (F1 · x1 + F2 · x2 +... + Fn · xn) / (F1 + F2 +... + Fn), yi = (F1 · y1 + F2 · y2 +... + Fn · yn) / (F1 + F2 +... + Fn) Therefore, when the electronic component has a plurality of terminals having different areas Si at different positions xi and yi, it is easy to substitute each value of xi, yi and Fi (= P · Si) into the above formula and The center point can be accurately obtained, and by accurately pressing the center point by the pressing member, each terminal of the electronic component can be pressed with substantially the same pressure, and the connection reliability can be improved.

  According to an aspect of the present invention, the plurality of terminals are greater than the first number of input terminals provided on the active surface side of the electronic component and the first number provided on the active surface. And a second number of output terminals. Thus, the plurality of terminals have a first number of input terminals provided on the active surface side of the electronic component and a second number of output terminals greater than the first number provided on the active surface. In the step of aligning the pressing member, for example, when the input terminal and the output terminal are provided substantially in parallel, for example, as the ratio of the second number of output terminals to the first number of input terminals increases. By moving the center point closer to the output terminal than the input terminal, each of the plurality of input / output terminals can be pressed to the substrate side by the pressing member with substantially the same pressure, and the adhesive on the output terminal side It is possible to prevent the conductive particles from being crushed, and to improve the connection reliability between the input terminal, the output terminal, and the substrate side.

  According to an aspect of the present invention, the plurality of terminals occupy a first area on the active surface of the electronic component and a second area larger than the first area on the active surface. And an output terminal. Accordingly, the plurality of terminals include an input terminal occupying the first area on the active surface of the electronic component and an output terminal occupying a second area larger than the first area on the active surface. Each of the terminals can be pressed to the substrate side by a pressing member with substantially the same pressure to prevent the conductive particles in the adhesive on the output terminal side from being crushed, the input terminal, the output terminal, and the substrate The connection reliability with the side can be improved.

  According to one form of this invention, the said terminal has a protrusion part which consists of an elastic member provided on the active surface of the said electronic component, and a conductive member which covers the protrusion side of the said protrusion part. Features. Thereby, since the terminal has a protruding portion made of an elastic member provided on the active surface of the electronic component and a conductive member that covers the protruding side of the protruding portion, the protruding portion is elastically deformed in the step of pressure bonding. For example, the conductive member and the substrate side can be reliably connected. Further, after the crimping, for example, even if the distance between the electronic component and the substrate is increased by an external force or the like, the protruding portion can be elastically deformed to follow and secure the connection between the terminal and the substrate side.

  According to an aspect of the present invention, the terminal includes a conductive protrusion provided on the active surface of the electronic component. Thereby, since the terminal has conductive protrusions provided on the active surface of the electronic component, the substrate side and the plurality of conductive protrusions of the electronic component are, for example, made of an adhesive containing conductive particles. The plurality of conductive protrusions can be pressed to the substrate side by a pressing member at substantially the same pressure, and the protrusions can be substantially crushed, for example, It is possible to prevent crushing unevenness of the conductive particles sandwiched between the plurality of conductive protrusions of the electronic component, and when the crushing unevenness is large, the contact area is reduced, resulting in poor connection. Further, the connection reliability can be improved by connecting a plurality of terminals of the electronic component to the substrate side.

  A mounting structure manufacturing method according to another aspect of the present invention is a mounting structure manufacturing method in which a connected member having a plurality of terminals is mounted on a substrate by pressing with a pressing member. And the step of aligning the pressing member so that an equal force per unit area is applied, and the step of pressing the member to be connected to the substrate by the pressing member aligned in the aligning step. And

  Here, the “substrate” includes, for example, a glass substrate, a flexible substrate, and the like.

  The present invention includes a step of aligning the pressing member so that an equal force per unit area is applied to each of the plurality of terminals, and a step of crimping the connected member to the substrate by the pressing member aligned by the aligning step. Therefore, for example, when crimping the substrate side and the plurality of terminals of the connected member via, for example, an adhesive containing conductive particles, the plurality of terminals are respectively independent of the arrangement state of the plurality of terminals. The pressing member can be pressed to the substrate side with substantially the same pressure, and the crushing of each conductive particle is made substantially the same, for example, the crushing unevenness of the conductive particles sandwiched between the substrate side and the plurality of terminals of the connected member is reduced. When the unevenness of crushing is large, the contact area is reduced and connection failure occurs.On the other hand, it is possible to securely connect the plurality of terminals of the connected member to the board side. Thereby improving the reliability.

  Also, when crimping the connected member via an adhesive that does not contain conductive particles, for example, without depending on the arrangement state of the plurality of terminals, each of the plurality of terminals of the connected member is applied at substantially the same pressure. For example, it is possible to prevent crushing unevenness of each terminal, and to improve the reliability of connection between each terminal and the substrate side. Therefore, when the adherend is a flexible substrate, for example, the connection reliability between the terminals of the flexible substrate and the substrate side can be improved.

  An electro-optical device manufacturing apparatus according to another aspect of the present invention is an electro-optical device manufacturing apparatus in which an electronic component having a plurality of terminals is mounted on a substrate by being pressed by a pressing member. And a position control unit that aligns the pressing member so that an equal force per unit area is applied, and a pressing member that is aligned by the position control unit and press-bonds the electronic component to the substrate.

  The present invention includes a position control unit that aligns the pressing member so that an equal force per unit area is applied to each of the plurality of terminals, and a pressing member that is aligned by the position control unit and presses the electronic component to the substrate. Therefore, for example, when crimping the substrate side and the plurality of terminals of the electronic component via, for example, an adhesive containing conductive particles, the plurality of terminals are substantially at the same pressure without depending on the arrangement state of the plurality of terminals. Can be pressed to the substrate side by the pressing member, and the crushing of the respective conductive particles can be made substantially the same, for example, to prevent uneven crushing of the conductive particles sandwiched between the substrate side and the plurality of terminals of the electronic component. The contact area is reduced and the connection failure occurs when the unevenness of deformation is large, but by connecting multiple terminals of the electronic component to the board side reliably, electric light with excellent connection reliability It is possible to manufacture the equipment.

  Also, when an electronic component is crimped via an adhesive that does not contain conductive particles, for example, each of the plurality of terminals of the electronic component is pressed with substantially the same pressure without depending on the arrangement state of the plurality of terminals. For example, it is possible to prevent crushing unevenness of each terminal, and it is possible to manufacture an electro-optical device having excellent connection reliability between each terminal and the substrate side.

  Embodiments according to the present invention will be described below with reference to the drawings. In the following description of the embodiments, a liquid crystal device as an electro-optical device, specifically, a reflective transflective TFT (Thin Film Transistor) active matrix liquid crystal device, and an electronic device using the liquid crystal device The device and the driver IC mounting device of the liquid crystal device manufacturing apparatus will be described, but the present invention is not limited to this. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

  (First embodiment)

  1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of the liquid crystal device of FIG. 1, and FIG. 3 is a plan view of a driver IC of the liquid crystal device of FIG. is there.

  (Configuration of liquid crystal device)

  The liquid crystal device 1 includes a liquid crystal panel 2 and a circuit board 3 connected to the liquid crystal panel 2. The liquid crystal device 1 is provided with other auxiliary mechanisms such as a frame (not shown) that supports the liquid crystal panel 2 as necessary.

  The liquid crystal panel 2 includes a substrate 4, a substrate 5 provided to face the substrate 4, a sealing material 6 provided between the substrates 4 and 5, and a liquid crystal (not shown) sealed by the substrates 4 and 5. It has. For example, TN (Twisted Nematic) is used for the liquid crystal.

  The substrate 4 and the substrate 5 are plate-shaped members made of a light-transmitting material such as glass or synthetic resin. A gate electrode 7, a source electrode 8, a thin film transistor element T and a pixel electrode 9 are formed on the liquid crystal side of the substrate 4, and a common electrode 5 a is formed on the liquid crystal side of the substrate 5.

  The gate electrode 7 is formed in the X direction, and the source electrode 8 is formed in the Y direction, for example, by a metal material such as aluminum. The source electrode 8 is formed, for example, as shown in FIG. 1, with the upper half routed to the left side and the lower half routed to the right side. Note that the number of the gate electrodes 7 and the source electrodes 8 can be appropriately changed according to the resolution of the liquid crystal device 1 and the size of the display area.

  The thin film transistor element T includes three terminals that are electrically connected to the gate electrode 7, the source electrode 8, and the pixel electrode 9, respectively. The thin film transistor element T is electrically connected to the pixel electrode 9, the gate electrode 7, and the source electrode 8. Thus, a current flows from the source electrode 8 to the pixel electrode 9 or vice versa when a voltage is applied to the gate electrode 7.

  In addition, the substrate 4 includes a region (hereinafter referred to as “projected portion”) 4 a that projects from the outer edge of the substrate 5. On the surface of the overhanging portion 4a, input wirings 11 to 13 and output wirings 14 to 16 are attached, and driver ICs 17, 18 and 19 for driving liquid crystal, for example, are mounted.

  In the input wiring 11, the board side input terminal 11 a at one end shown in FIG. 2 is connected to the input terminal 23 shown in FIG. 2 of the driver IC 17, and the other end 11 b is attached to the flexible base 31 of the circuit board 3. The wiring 36 is connected via an ACF or the like (not shown). The input wirings 12 and 13 have input terminals (not shown) at one ends connected to input terminals (not shown) of the driver ICs 18 and 19, respectively.

  The output wiring 14 has an output terminal 14a at one end shown in FIG. 2 connected to the output terminal 24 shown in FIG. 2 of the driver IC 17, and the other end connected to the gate electrode 7 shown in FIG. The output wirings 15 and 16 have output terminals (not shown) at one end connected to output terminals (not shown) of the driver ICs 18 and 19, respectively.

  As shown in FIG. 2, the driver IC 17 is bonded to the substrate 4 with an adhesive such as ACF 25 provided between the driver IC 17 and the substrate 4. The ACF 25 includes conductive particles 26 in which, for example, resin-made elastic particles are covered with a metal film.

  As shown in FIG. 2, the driver IC 17 includes, for example, an aluminum electrode pad 21, an electrode pad 22, an electrode pad 21, and an electrode pad 21 provided on the active surface 20 a side facing the substrate 4 of the silicon chip 20. 22 are provided with a plurality of driver side input terminals 23 and a plurality of driver side output terminals 24 which are respectively connected to the active surface 20a side of the driver IC 17 and are projected.

  As shown in FIG. 2, the silicon chip 20 is a substantially rectangular chip, for example, and includes wiring and the like that are connected to the electrode pads 21 and 22 and are not shown. This wiring is connected to an electronic component such as a transistor provided in the silicon chip 20, for example.

  The electrode pads 21 and 22 are arranged in the Y direction on the active surface 20 a side of the silicon chip 20.

  The driver side input terminal 23 and the driver side output terminal 24 are respectively connected to the electrode pads 21 and 22 shown in FIG. 2 and arranged in the Y direction as shown in FIG.

  The number of driver side output terminals 24 is larger than the number of driver side input terminals 23. In the present embodiment, in order to simplify the description, an example in which the number of driver-side input terminals 23 is, for example, 8 and the number of driver-side output terminals 24 is, for example, 20 is shown, but the number is not limited. For example, the number of driver side input terminals 23 may be about 200, and the number of driver side output terminals 24 may be about 1040.

  As shown in FIG. 3, the area Si (i = 1 to 8) where the driver side input terminal 23 and the board side input terminal 11a are connected is, for example, the driver side output terminal 24 and the board side output terminal 14a. Is set to be larger than the connected area Si (i = 9 to 28). For example, in the present embodiment, in order to simplify the description, a case where the area Si (i = 1 to 8) is set to, for example, twice the area Si (i = 9 to 28) will be described. The area ratio (magnification) is not particularly limited. The area Si is, for example, the area where the plurality of conductive particles 26 of the ACF 25 are connected to each driver-side input terminal 23, or the area where the plurality of conductive particles 26 of the ACF 25 are connected to each driver-side output terminal 24. Each area.

  The position Ri (xi, yi) (i = 1 to 8) of the driver side input terminal 23 is, for example, the position Ri (the center of the area Si when the origin is the lower left corner of the outer diameter of the driver IC 17 shown in FIG. xi, yi). The position Ri (xi, yi) (i = 9 to 28) of the driver side output terminal 24 is represented by the center position of the area Si (i = 9 to 28), for example.

  As described above, the liquid crystal can be driven by outputting a signal input from the input wiring 11 to the driver IC 17 to the output wiring 14 via the driver IC 17. In addition, although the width in the Y direction of the driver side input terminal 23 and the driver side output terminal 24 is substantially equal to the width of the board side input terminal 11a and the board side output terminal 14a, it may be larger or smaller.

  As shown in FIG. 1, the circuit board 3 is connected to the overhanging portion 4a through an adhesive or the like, for example. The circuit board 3 is mounted on the flexible base material 31 in order to control the flexible base material 31, the output wiring 32 provided on the flexible base material 31, the input wiring 33, and the driver IC 17, for example. And a semiconductor IC 34. In addition to this, for example, a semiconductor IC for power supply (not shown) is mounted on the flexible base 31.

  As shown in FIG. 1, the output wiring 32 is routed in the X direction, for example, and one end of the output wiring 32 is provided in the through hole shown in FIG. 2 formed in the flexible base 31. Is connected to the end of the wiring 36 attached to the flexible base 31. The other end of the output wiring 32 is connected to an output terminal (not shown) of the semiconductor IC 34 via an ACF or the like.

  As shown in FIG. 1, the input wiring 33 is routed, for example, in the X direction. As shown in FIG. 1, one end of the input wiring 33 is connected to, for example, an input terminal (not shown) of the semiconductor IC 34 via an ACF or the like. The other end of the input wiring 33 is connected to an external device (not shown), for example.

  Next, an apparatus for manufacturing the liquid crystal device 1 (including a driver IC mounting device) used when manufacturing the liquid crystal device 1 of the present embodiment will be described with reference to the drawings.

  FIG. 4 is a schematic sectional view of the driver IC mounting apparatus.

  (Configuration of manufacturing apparatus of liquid crystal device 1)

  The manufacturing apparatus for the liquid crystal device 1 includes a liquid crystal panel manufacturing apparatus (not shown) for manufacturing a liquid crystal panel before mounting the driver IC 17, a driver IC mounting apparatus 40 for mounting the driver IC 17, and the like. The liquid crystal panel manufacturing apparatus and the like before mounting the driver IC 17 are the same as those in the publicly known technology, and thus description thereof is omitted.

  <Driver IC mounting device 40>

  As shown in FIG. 4, the driver IC mounting apparatus 40 is used to press and bond the stage 41, the driver IC 17, and the like that can support and fix the liquid crystal panel 2 with the ACF 25 attached to the substrate side input / output terminals 11 a and 14 a, for example. A pressing head 42 as a pressing member, and a conveying portion 43 for moving the pressing head 42 up and down or aligning the pressing head 42 with a predetermined position.

  The stage 41 is provided, for example, so that the liquid crystal panel 2 can be supported or fixed from below.

  The crimping head 42 is provided so as to be movable up and down, for example, with respect to the stage 41 so that the driver IC 17 can be crimped to the liquid crystal panel 2. The crimping head 42 is configured such that the pressing center H is positioned at the center of the surface that presses the driver IC 17 or the like, for example. When the driver IC 17 is pressed by the crimping head 42, for example, when the pressing force is applied to a plurality of locations of the driver IC 17, the pressing center H is the position of the action line of the resultant force of these pressing forces.

  The transport unit 43 includes, for example, a transport mechanism that can control the position of the crimping head 42 in the XY directions with respect to the stage 41.

  (Manufacturing method of the liquid crystal device 1)

  Next, a manufacturing method of the liquid crystal device 1 using the manufacturing apparatus of the liquid crystal device 1 will be described with reference to the drawings.

  FIG. 5 is a flowchart showing a manufacturing process of the liquid crystal device 1 using the manufacturing apparatus of the liquid crystal device 1 of the first embodiment. In the present embodiment, the manufacturing process of the liquid crystal panel 2 until the adhesive material for mounting the driver IC 17 and the like is attached is the same as that of the known technique, so that the description thereof is omitted, and the mounting process of the driver IC 17 and the like (S1 to S1). S4) will be mainly described.

  First, the liquid crystal panel 2 before mounting the driver IC 17 with the ACF 25 attached so as to cover the substrate side input / output terminals 11a and 14a is set on the stage 41 of the driver IC mounting apparatus 40 (S1).

  Subsequently, the driver IC 17 is set on the overhanging portion 4a, for example, manually (S2). That is, the board side input / output terminals 11a and 14a correspond to the driver side input / output terminals 23 and 24.

  Next, for example, as shown in FIG. 4, the pressing center H, which is the center of gravity of the crimping head 42, is aligned with the pressing center point C (xc, yc) obtained in advance as described later (S 3). In the case of the present embodiment, the pressing center point C (xc, yc) is a position shifted to the upper right with respect to the center Q of the outer diameter of the driver IC 17, for example, as shown in FIG.

  The pressing center point C (xc, yc) includes the area Si where the driver side input / output terminals 23 and 24 and the board side input / output terminals 11a and 14a are connected, and the center position Ri (xi, yi) of the area Si. It is a point determined by.

  The pressing center point C (xc, yc) is a plurality of driver side input / output terminals from the board side input / output terminals 11a and 14a when the driver IC 17 is pressed by the pressing head 42 at the pressing center point C (xc, yc), for example. This is the position at which the sum of moments related to the pressing center point C (xc, yc) of each force Fi acting on 23 and 24 becomes zero.

  In other words, the position Fi (xi, yi), the area Si, and the force Fi (= Pi · Si) acting on the driver side input / output terminals 23 and 24 at the position Ri (xi, yi) from the substrate 4 side when pressed by the crimping head 42. ), The pressing center point C (xc, yc) displayed in the xy coordinates is

  (Xc, yc) = {(F1 · x1 + F2 · x2 + ... + Fn · xn) / (F1 + F2 + ... + Fn), (F1 · y1 + F2 · y2 + ... + Fn · yn) / (F1 + F2 + ... + Fn) Where i is a natural number of 1 to n, and n is the number of driver-side input / output terminals 23 and 24).

  Here, when the driver IC 17 is pressed by the crimping head 42, the pressure Pi (i = 1 to 28) applied to the plurality of driver side input / output terminals 23 and 24 becomes substantially the same pressure P (for example, Fi = P · Si). The pressing center point C (xc, yc) is

  (Xc, yc) = {(S1 · x1 + S2 · x2 + ... + Sn · xn) / (S1 + S2 + ... + Sn), (S1 · y1 + S2 · y2 + ... + Sn · yn) / (S1 + S2 + ... + Sn) Where i is a natural number of 1 to n, and n is the number of driver-side input / output terminals 23 and 24). At this time, the area Si is approximately proportional to the area where the driver side input / output terminals 23 and 24 and the board side input / output terminals 11a and 14a shown in FIG. 6 are opposed to each other. This opposing area may be substituted for.

  Specifically, (xc, yc) = {(8 (2 · 0.5) + 20 · (1 · 3.5)) / (2 + 2 + 2 + 2 + 2 + 2 + 2 + 2 + 2 + 1 · (20)), (2 · 1 + 2 · 3 + 2 · 6 + 2 · 12 + 2 14 + 2 · 16 + 2 · 18 + 2 · 20 + 1 · 1 + 1 · 2 + ... + 1 · 20) / (2 + 2 + 2 + 2 + 2 + 2 + 2 + 1 · (20))} = (83/36, 390/36), that is, the pressing center point C (xc, yc) is approximately (2.3, 10.8).

  Next, the crimping head 42 is lowered by the transport unit 43, and the driver IC 17 is crimped (S4). At this time, as shown in FIG. 7, for example, a force F <b> 1 that acts on the driver side input terminal 23 from the board side input terminal 11 a when pressed by the crimping head 42 acts on the driver side output terminal 24 from the board side output terminal 14 a. 2 is the same as the force F9 shown in FIG. 2 (the same applies to other forces F2 and the like), but the pressure P, which is a force per unit area, is the same, and the conductive particles 26 in the ACF 25 are crushed as shown in FIG. It is possible to prevent the occurrence of crushing unevenness in the state. In FIG. 7, illustration of each component of the driver IC mounting device 40 other than the pressure bonding head 42 is omitted.

  Then, the liquid crystal panel 2 and the circuit board 3 on which the semiconductor IC 34 is mounted are electrically connected via a conductive adhesive or the like (not shown) (S5), and a backlight, a reflection sheet, or the like is provided. Thus, the liquid crystal device 1 is manufactured (S6).

  This is the end of the description of the method for manufacturing the liquid crystal device 1.

  As described above, according to the present embodiment, when the pressing center point C of the driver IC 17 is pressed by the crimping head 42, the same is applied to the plurality of driver side input / output terminals 23, 24 from the board side input / output terminals 11a, 14a side. Since there is a step (S3) of aligning the crimping head 42 so that pressure is applied and a step (S4) of crimping the driver IC 17 to the substrate 4 by the aligned crimping head 42, the crimping is performed via the ACF 25. Sometimes, the driver-side input / output terminals 23, 24 can be crimped to the substrate 4 side by the crimping head 42 at substantially the same pressure P, without depending on the arrangement state of the driver-side input / output terminals 23, 24. The conductive particles 26 are crushed substantially in the same manner, for example, a conductive material sandwiched between the substrate side input / output terminals 11a, 14a and the driver side input / output terminals 23, 24. The chip 26 can be prevented from being crushed unevenly, and when the crushed unevenness is large, the contact area is reduced to cause a connection failure, while the driver side input / output terminals 23 and 24 of the driver IC 17 are securely inserted into the board side. By connecting to the output terminals 11a and 14a, connection reliability can be improved.

  Further, in the alignment step (S3), each pressure applied to the driver side input / output terminals 23 and 24 from the board side input / output terminals 11a and 14a when the pressing center point C is pressed by the area Si and the pressure bonding head 42 is used. Since the pressure bonding head 42 is aligned using Pi so that the sum of the moments about the pressing center point C of each force Fi (= Pi · Si) acting on the driver side input / output terminals 23 and 24 becomes zero. When crimping via the ACF 25, the moments relating to the pressing center point C of the respective forces Fi (= Pi · Si) acting on the driver side input / output terminals 23, 24 are balanced, and the driver side input / output terminals 23, 24 are connected to each other. Each of them can be reliably crimped to the substrate 4 side by the crimping head 42 with the same pressure, and for example, the collapse of the conductive particles 26 can be prevented. , It is possible to reliably connect the driver-side output terminal 23, 24 substrate-side output terminal 11a, to 14a.

  At this time, for example, when Fi = P · Si (pressure P is constant), (xc, yc) = {(S1 · x1 + S2 · x2 +... + Sn · xn) / (S1 + S2 +... + Sn), (S1 Since y1 + S2 · y2 +... + Sn.yn) / (S1 + S2 +... + Sn)}, the driver IC 17 has driver-side input / output terminals 23 and 24 having different areas Si at different positions Ri (xi, ii). In the case of providing a plurality, it is possible to easily and accurately obtain the pressing center point C by substituting each value of Si into (xi, yi) and the above formula, and the pressing center point C (xc, yc) is crimped. By pressing accurately with the head 42, the driver side input / output terminals 23 and 24 of the driver IC 17 can be pressed with substantially the same pressure P, and the connection reliability can be improved. Kill.

  Further, the driver IC 17 has, for example, eight driver side input terminals 23 provided on the active surface 20a side of the driver IC 17 and 20 driver side output terminals 24 provided on the active surface 20a. In the step of aligning 42 (S3), for example, as shown in FIG. 6, by moving the pressing center point C (xc, yc) to a position closer to the driver side output terminal 24 than to the driver side input terminal 23 in the X direction, The side input / output terminals 23 and 24 can be crimped to the substrate 4 side by the crimping head 42 at substantially the same pressure P, respectively, and the collapse of the conductive particles 26 between the driver side output terminal 24 and the substrate side output terminal 14a is small. Therefore, the connection reliability between the driver side input / output terminals 23 and 24 and the board side input / output terminals 11a and 14a can be improved.

  Further, for example, the driver-side input terminal 23 having an area S1 to S8 on the active surface 20a of the driver IC 17 and the driver-side output terminal 24 having an area S9 to S28 smaller than the areas S1 to S8 on the active surface 20a, respectively. Therefore, the driver side output terminals 24 can be pressed against the board side input / output terminals 11a and 14a by the crimping head 42 with substantially the same pressure P, respectively. It is possible to prevent the conductive particles 26 coming into contact with the metal from being crushed and to improve the connection reliability.

  Furthermore, since the driver IC 17 includes driver side input / output terminals 23 and 24 which are conductive protrusions provided on the active surface 20a of the driver IC 17, the board side input / output terminals 11a and 14a and the driver side For example, when the input / output terminals 23 and 24 are crimped via the conductive particles 26, the driver side input / output terminals 23 and 24 can be crimped to the substrate 4 side by the crimping head 42 with substantially the same pressure. When the crushing of the conductive particles 26 sandwiched between the substrate-side input / output terminals 11a and 14a and the driver-side input / output terminals 23 and 24 can be prevented, for example, the crushing unevenness is large. The contact area is reduced to cause a connection failure, but the board side input / output terminals 11a, 14a and the driver side input / output terminals 23, 24 are securely connected to each other. Thereby improving the reliability.

  Further, the driver IC mounting device 40 sets the pressing center H of the crimping head 42 to the pressing center point C of the driver IC 17 so that the respective pressures acting on the plurality of driver-side input / output terminals 23 and 24 of the driver IC 17 are the same. Since the conveyance unit 43 as a position control unit for alignment and the crimping head 42 for crimping the driver IC 17 to the substrate 4 by the aligned crimping head 42 are provided, for example, the board side input / output terminals 11a and 14a and the driver side input For example, when the output terminals 23 and 24 are pressure-bonded via the ACF 25 including the conductive particles 26, the driver-side input / output terminals 23 and 24 are not dependent on the arrangement state of the driver-side input / output terminals 23 and 24, respectively. The crimping head 42 can be crimped to the substrate 4 side with substantially the same pressure P, and the crushing of the conductive particles 26 is substantially the same. For example, the conductive particles 26 sandwiched between the board-side input / output terminals 11a and 14a and the driver-side input / output terminals 23 and 24 can be prevented from being crushed, and when the crushed unevenness is large, the contact area is reduced, resulting in poor connection. In contrast to this, the substrate side input / output terminals 11a, 14a and the driver side input / output terminals 23, 24 are securely connected to manufacture the liquid crystal device 1 with excellent connection reliability and quality. Can do. Further, by manufacturing the liquid crystal device 1 using the driver IC mounting device 40, the substrate side input / output terminals 11a, 14a and the driver side input / output terminals 23, 24 can be reliably connected to ensure a stable yield. it can.

  (Second Embodiment)

  Next, a liquid crystal device according to a second embodiment of the present invention and a method for manufacturing the liquid crystal device will be described. In the following description of the present embodiment, the same components and the like as those of the above-described embodiment will be denoted by the same reference numerals, description thereof will be omitted, and different portions will be mainly described. Since the driver IC mounting apparatus 40 is the same as that of the first embodiment, the description thereof is omitted.

  FIG. 8 is a partial cross-sectional view of the liquid crystal device according to the second embodiment of the present invention.

  (Configuration of liquid crystal device)

  In the liquid crystal device 50 according to the present embodiment, for example, a driver IC 53 including resin core bumps 51 and 52 is mounted instead of the driver IC 17 and the like.

  The driver IC 53 includes resin core bumps 51 and 52 that protrude from the active surface 20 a side of the driver IC 53. The resin core bumps 51 and 52 are arranged in the Y direction so as to correspond to the driver side input / output terminals 23 and 24 of the first embodiment, for example, and are connected to the substrate side input / output terminals 11a and 14a, respectively. Yes.

  The number of resin core bumps 52 on the output side is larger than the number of resin core bumps 51 on the input side. In the present embodiment, in order to simplify the description, an example in which the number of the resin core bumps 51 is, for example, 8 and the number of the resin core bumps 52 is, for example, 20 is shown, but the number is not limited. The number of 51 may be about 200, and the number of resin core bumps 52 may be about 1040.

  The resin core bumps 51 and 52 are respectively resin cores 54 and 56 as projecting portions protruding from the active surface 20a, and metal wirings 55 and 57 as conductive members provided so as to cover the resin cores 54 and 56. And. As a result, when the driver IC 53 is mounted, the resin cores 54 and 56 of the resin core bump 51 are elastically deformed, so that the area Si where the board-side input / output terminals 11a and 14a and the metal wiring 55 and 57 are in contact with each other is secured. .

  The area Si (i = 1 to 8) where the resin core bump 51 and the substrate side input terminal 11a are connected is, for example, the area Si (i = 9 to 8) where the resin core bump 52 and the substrate side output terminal 14a are connected. 28) It is set to be larger. For example, in the present embodiment, in order to simplify the description, a case where the area Si (i = 1 to 8) is set to, for example, twice the area Si (i = 9 to 28) will be described. Here, the area Si is an area where each substrate-side input terminal 11a and the metal wiring 55 are in contact with each other, or an area where each substrate-side output terminal 14a and the metal wiring 57 are in contact with each other.

  The position Ri (xi, yi) (i = 1 to 28) of the resin core bumps 51 and 52 is represented by the position of the center of the area Si when, for example, one corner of the outer diameter of the driver IC 17 is the origin.

  Thus, the liquid crystal can be driven by outputting a signal input from the input wiring 11 to the driver IC 53 to the output wiring 14 via the driver IC 53.

  The driver IC 53 is bonded to the substrate 4 with an adhesive such as NCF 58 provided between the driver IC 53 and the substrate 4. Since other configurations are the same as those in the first embodiment, description thereof is omitted.

  (Manufacturing method of the liquid crystal device 50)

  Next, a manufacturing method of the liquid crystal device 50 using the liquid crystal device manufacturing apparatus used in the first embodiment will be described with reference to the drawings. In the present embodiment, the manufacturing process of the liquid crystal panel 2 before attaching the NCF 58 for mounting the driver IC 53 and the like is the same as that of the first embodiment, so the description thereof is omitted, and the NCF 58 for mounting the driver IC 53 is omitted. The process after the step of attaching is mainly described.

  First, the NCF 58 is pasted so as to cover the substrate-side input / output terminals 11a and 14a, and the liquid crystal panel 2 (before mounting the driver IC 53 and the like) is set on the stage 41 of the driver IC mounting apparatus 40.

  Subsequently, the driver IC 53 is set on the overhanging portion 4a, for example, manually. That is, the board side input / output terminals 11a and 14a correspond to the driver side input / output terminals 23 and 24.

  Next, for example, the pressing center H of the crimping head 42 is aligned with the pressing center point C (xc, yc) by the transport unit 43 of the driver IC mounting device 40. In the case of this embodiment, the pressing center point C (xc, yc) is a position shifted to the upper right with respect to the driver IC 53, for example.

  The pressing center point C (xc, yc) is determined by an area Si where the resin core bumps 51 and 52 and the substrate side input / output terminals 11a and 14a are connected, and a position Ri (xi, yi) of the center of the area Si. It is a point.

  The pressing center point C (xc, yc) is a plurality of resin core bumps 51 from the substrate side input / output terminals 11a, 14a when the driver IC 53 is pressed by the pressing head 42 at the pressing center point C (xc, yc). This is the position at which the sum of moments related to the pressing center point C (xc, yc) of each force Fi (= Pi · Si) acting on 52 becomes zero.

  That is, the position Ri (xi, yi) of the plurality of resin core bumps 51, 52, the area Si where the resin core bumps 51, 52 at the position Ri (xi, yi) contact the substrate side input / output terminals 11a, 14a, the substrate side input / output The pressing center point C (xc, yc) displayed in xy coordinates using the force Fi (= Pi · Si) acting on the resin core bumps 51, 52 from the terminals 11a, 14a at the position Ri (xi, yi)

  (Xc, yc) = {(F1 · x1 + F2 · x2 + ... + Fn · xn) / (F1 + F2 + ... + Fn), (F1 · y1 + F2 · y2 + ... + Fn · yn) / (F1 + F2 + ... + Fn) } (Where i is a natural number from 1 to n, and n is the number of resin core bumps 51 and 52).

  Here, the pressing center point C (xc, yc) indicates that the pressure Pi (i = 1 to 28) applied to the plurality of resin core bumps 51 and 52 when the driver IC 53 is pressed by the crimping head 42 is substantially the same as the pressure P. (Fi = P · Si (pressure P is constant)), the pressing center point C (xc, yc) is

  (Xc, yc) = {(S1 · x1 + S2 · x2 + ... + Sn · xn) / (S1 + S2 + ... + Sn), (S1 · y1 + S2 · y2 + ... + Sn · yn) / (S1 + S2 + ... + Sn) } (Where i is a natural number from 1 to n, and n is the number of resin core bumps 51 and 52).

  Specifically, in this embodiment, since the resin core bumps 51 and 52 are disposed at the same position as the driver-side input / output terminals 23 and 24 of the first embodiment, the pressing center point C (xc, yc) Is shifted in the positive direction from the center Q of the outer diameter of the driver IC 53 shown in FIG.

  Next, the crimping head 42 is lowered by the transport unit 43 and the driver IC 53 is crimped. At this time, for example, when viewed in the X direction, for example, the force F1 that acts on the resin core bump 51 from the substrate side input terminal 11a when pressed by the crimping head 42 is twice the force F9 that acts on the resin core bump 52 from the substrate side input terminal 14a. (The same applies to the other resin core bumps 51 and 52), but the pressure P, which is the force per unit area, is the same, and the uneven deformation of the resin core bumps 51 and 52 is prevented as shown in FIG.

  Then, the liquid crystal panel 2 and the circuit board 3 on which the semiconductor IC 34 is mounted are electrically connected through a conductive adhesive or the like (not shown), and a liquid crystal device is provided by providing a backlight, a reflective sheet, or the like. 50 is manufactured.

  This is the end of the description of the method for manufacturing the liquid crystal device 50.

  Thus, according to the present embodiment, when the pressing center point C of the driver IC 53 is pressed by the crimping head 42, the same pressure P is applied to the plurality of resin core bumps 51, 52 from the substrate side input / output terminals 11a, 14a side. Since it includes the step of aligning the crimping head 42 and the step of crimping the driver IC 53 to the substrate 4 by the aligned crimping head 42 so as to be applied, the resin core bumps 51, 52 are used when crimping via the NCF 58. The resin core bumps 51 and 52 can be crimped to the substrate 4 side by the crimping head 42 with substantially the same pressure P, and the resin core bumps 51 and 52 are crushed in the same manner. The occurrence of uneven crushing of 51 and 52 is prevented, and the resin core bumps 51 and 52 are securely connected to the substrate side input / output terminals 11a. By connecting to 14a, it is possible to improve the reliability of the connection.

  In the alignment step, each force Fi acting on the plurality of resin core bumps 51 and 52 from the substrate-side input / output terminals 11a and 14a when the pressing center point C (xc, yc) of the driver IC 53 is pressed by the crimping head 42. Since the crimping head 42 is aligned so that the sum of the moments about the pressing center point C (xc, yc) of (= P · Si) becomes zero, each force Fi (= P · Si) moment about the pressing center point C is balanced, and the resin core bumps 51 and 52 can be reliably pressed to the substrate 4 side by the pressure-bonding head 42 with the same pressure P, respectively, and the crushing of the resin core bumps 51 and 52 is the same. Thus, the resin core bumps 51 and 52 can be reliably connected to the substrate side input / output terminals 11a and 14a.

  Further, the driver IC 53 includes resin cores 54 and 56 that are protrusions made of an elastic member provided on the active surface 20a, and metal wirings 55 and 57 as conductive members that cover the protruding sides of the resin cores 54 and 56. Therefore, the resin cores 54 and 56 can be elastically deformed in the step of crimping the driver IC 53, and for example, the resin core bumps 51 and 52 and the board-side input / output terminals 11a and 14a can be reliably connected. . Further, after the crimping, even if the distance between the driver IC 53 and the substrate 4 is increased due to external force or the like, the resin core bumps 51 and 52 are elastically deformed to follow and the resin core bumps 51 and 52 and the substrate side input / output terminals 11a and 14a are followed. Connection can be secured.

  Furthermore, the driver IC mounting apparatus 40 is configured so that the pressure center of the pressure-bonding head 42 is adjusted so that the pressures P applied to the plurality of resin core bumps 51 and 52 of the driver IC 53 from the board-side input / output terminals 11a and 14a are the same. Since the conveyance unit 43 serving as a position control unit that aligns with the pressing center point C of the IC 53 and the crimping head 42 that crimps the driver IC 53 to the substrate 4 by the aligned crimping head 42, adhesion without containing conductive particles is provided. Even when the driver IC 53 is pressure-bonded via the NCF 58 as a material, the resin core bumps 51 and 52 can be pressed with substantially the same pressure P without depending on the arrangement state of the resin core bumps 51 and 52, for example. The liquid crystal device 50 with excellent connection reliability is manufactured by making the crushing of the resin core bumps 51 and 52 the same. Rukoto can.

  (Third embodiment)

  Next, a liquid crystal device according to a third embodiment of the present invention and a method for manufacturing the liquid crystal device will be described. Since the driver IC mounting device 40 is the same as that of the first embodiment, the description thereof is omitted.

  FIG. 10 is a partial plan view of the liquid crystal device of the third embodiment, and FIG. 11 is a cross-sectional view taken along the line BB of the liquid crystal device of FIG.

  (Configuration of liquid crystal device)

  As shown in FIG. 10, the liquid crystal device 70 of this embodiment is a COF (Chip on Film) liquid crystal device, and a circuit board 71 is connected to the projecting portion 4a 'of the liquid crystal panel 2'.

  The liquid crystal panel 2 ′ includes an overhanging portion 4 a ′ that is shorter in the X direction than the overhanging portion 4 a of the above embodiment. A wiring 14 'shown in FIG. 10 connected to the output wiring 14 shown in FIG. 1 is provided on the overhanging portion 4a'. A connection terminal 14a 'is formed at the end of the wiring 14'.

  On the other hand, the circuit board 71 includes a flexible base 72 and a driver IC 73 mounted on the flexible base 72 as shown in FIG.

  On the flexible base material 72, as shown in FIGS. 10 and 11, for example, input / output wirings 76 and 77 connected to the substrate side input / output terminals 76a and 77a are attached. As shown in FIG. 10, the output wiring 77 is connected to a wiring 79 provided on the side of the flexible base material 72 facing the protruding portion 4 a ′ through a through hole (not shown). As shown in FIG. 10, the wiring 79 is connected to the connection terminal 14a 'via an ACF 78, for example.

  As shown in FIG. 11, the driver IC 73 includes driver-side input / output terminals 74 and 75 protruding from the active surface 20 a side of the driver IC 73. The driver side input / output terminals 74 and 75 are arranged in the Y direction so as to correspond to, for example, the board side input / output terminals 76a and 77a as shown in FIG. 10, and the board side input / output terminals as shown in FIG. 76a and 77a are connected through conductive particles 81 of ACF80, respectively.

  The number of driver side output terminals 75 is larger than the number of driver side input terminals 74. In this embodiment, in order to simplify the description, an example in which the number of driver-side input terminals 74 is three and the number of driver-side output terminals 75 is eight, for example, is not limited.

  As shown in FIG. 10, the area Si (i = 1 to 3) where the driver side input terminal 74 and the board side input terminal 76a are connected is, for example, the driver side output terminal 75 and the board side output terminal 77a. Is set to be larger than the connected area Si (i = 4 to 11). For example, in this embodiment, in order to simplify the description, a case where the area Si (i = 1 to 3) is set to, for example, twice the area Si (i = 4 to 11) will be described. The area Si is, for example, the area where the plurality of conductive particles 81 of the ACF 80 are connected to the driver side input terminals 74, or the area where the plurality of conductive particles 81 of the ACF 80 are connected to the driver side output terminals 75. Each area.

  The positions Ri (xi, yi) (i = 1 to 11) of the driver side input / output terminals 74 and 75 are respectively positions at the center of the area Si when one corner of the outer diameter of the driver IC 73 is the origin O. expressed.

  Thus, the liquid crystal can be driven by outputting a signal input from the input wiring 76 to the driver IC 73 to the output wiring 77 via the driver IC 73. Since other configurations are the same as those in the first embodiment, description thereof is omitted.

  (Manufacturing method of the liquid crystal device 70)

  Next, a manufacturing method of the liquid crystal device 70 using the liquid crystal device manufacturing apparatus will be described with reference to the drawings. In this embodiment, the manufacturing process of the liquid crystal panel 2 ′ (step 1 in FIG. 12) is the same as that in the first embodiment, so that the description thereof will be omitted, and the mounting process of the driver IC 73 will be mainly described. .

  FIG. 12 is a flowchart of the manufacturing method of the liquid crystal device of this embodiment.

  First, the ACF 80 is attached so as to cover the substrate side input / output terminals 76a and 77a on the flexible base 72, and the flexible base 72 before the driver IC 73 is mounted is placed on the stage 41 of the driver IC mounting device 40, for example. (S2).

  Subsequently, the driver IC 73 is set on the flexible base material 72, for example, manually (S3). That is, the board side input / output terminals 76a and 77a correspond to the driver side input / output terminals 74 and 75.

  Next, for example, the pressing center H of the crimping head 42 is aligned with the pressing center point C (xc, yc) by the transport unit 43 of the driver IC mounting device 40 (S4).

  The pressing center point C (xc, yc) includes the area Si where the driver side input / output terminals 74 and 75 and the board side input / output terminals 76a and 77a are connected, and the center position Ri (xi, yi) of the area Si. It is a point determined by.

  The pressing center point C (xc, yc) is a plurality of drivers from the board-side input / output terminals 76a, 77a of the board 4 when the driver IC 73 is pressed by the pressing head 42 at the pressing center point C (xc, yc). This is a position where the sum of moments related to the pressing center point C (xc, yc) of each force Fi (= Pi · Si) acting on the side input / output terminals 74 and 75 becomes zero.

  Using the position Ri (xi, yi), the area Si, and the force Fi (= Pi · Si), the pressing center point C (xc, yc) displayed in the xy coordinates is

  (Xc, yc) = {(F1 · x1 + F2 · x2 + ... + Fn · xn) / (F1 + F2 + ... + Fn), (F1 · y1 + F2 · y2 + ... + Fn · yn) / (F1 + F2 + ... + Fn) } Where i is a natural number of 1 to n, and n is the number of driver-side input / output terminals 74 and 75).

  Here, at the pressing center point C (xc, yc), the pressure Pi (i = 1 to 11) applied to the driver side input / output terminals 74 and 75 when the driver IC 73 is pressed by the crimping head 42 is substantially the same. Position. That is, the pressing center point C (xc, yc) is

  (Xc, yc) = {(S1 · x1 + S2 · x2 + ... + Sn · xn) / (S1 + S2 + ... + Sn), (S1 · y1 + S2 · y2 + ... + Sn · yn) / (S1 + S2 + ... + Sn) }. At this time, the area Si is approximately proportional to the area where the driver side input / output terminals 74 and 75 and the board side input / output terminals 76a and 77a face each other. What is necessary is just to substitute an area.

  Specifically, in the present embodiment, as shown in FIG. 10, the driver side input / output terminals 74 and 75 are arranged in three and nine, respectively, and are provided, for example, biased in the X and Y directions. Pressing center point C (xc, yc) = {(3 (2 · 0.5) + 8 · (1 · 3.5)) / (2 + 2 + 2 + 1 · (8)), (2 · 3 + 2 · 4 + 2 · 6 + 1 · 1 + 1 · 2 + ... + 1 · 8) / (2 + 2 + 2 + 1 · (8))} = (31/14, 62/14) = (2.2, 4.4), that is, as shown in FIG. 13, for example, outside the driver IC 53 It deviates from the center Q of the diameter, for example, in the X direction and the Y direction.

  Next, the crimping head 42 is lowered by the transport unit 43 and the driver IC 73 is crimped (S5). At this time, as shown in FIG. 13, for example, the force F1 that acts on the driver side input terminal 74 from the board side input terminal 76a when pressed by the crimping head 42 is the force that acts on the driver side output terminal 75 from the board side output terminal 77a. The pressure Pi (i = 1 to 11), which is a force per unit area, is the same as F6, but the ACF80 crushing unevenness is prevented as shown in FIG.

  Then, the liquid crystal panel 2 ′ and the circuit board 71 on which the driver IC 73 is mounted are electrically connected via the ACF 78 or the like (S6), and the liquid crystal device 70 is manufactured by providing a backlight, a reflection sheet, or the like. (S7).

  This is the end of the description of the method for manufacturing the liquid crystal device 70.

  As described above, according to the present embodiment, when the pressing center point C of the driver IC 73 is pressed by the crimping head 42, the same is applied to the plurality of driver side input / output terminals 74, 75 from the board side input / output terminals 76a, 77a side. Since there is a step (S4) of aligning the crimping head 42 so that pressure is applied and a step (S4) of crimping the driver IC 73 to the flexible substrate 72 by the aligned crimping head 42, the ACF 80 is provided. When crimping via the crimping head 42, the flexible base material 72 is applied to the driver side input / output terminals 74 and 75 at substantially the same pressure P, without depending on the arrangement state of the driver side input / output terminals 74 and 75. For example, the substrate-side input / output terminals 76a and 77a and the driver-side input / output terminals 74 and 75 It is possible to prevent crushing unevenness of the sandwiched conductive particles 81, and when the crushing unevenness is large, the contact area is reduced and connection failure occurs. Connection reliability can be improved by connecting 75 to the board side input / output terminals 76a and 77a.

  In the alignment step (S4), when the driver IC 73 is pressed at the pressing center point C (xc, yc) by the pressure-bonding head 42, a plurality of driver-side input / output terminals 74, 75 are formed from the board-side input / output terminals 76a, 77a. Since the pressure bonding head 42 is aligned so that the sum of moments of the forces Fi (= P · Si) acting on the pressure center point C (xc, yc) shown in FIG. 13 becomes zero, for example, the flexible base When the board-side input / output terminals 76a and 77a and the driver-side input / output terminals 74 and 75 of the material 72 are pressure-bonded via the ACF 80, for example, each force F (= (P · Si) The moment about the pressing center point C is balanced, and the driver side input / output is independent of the arrangement of the driver side input / output terminals 74 and 75. The sub-elements 74 and 75 can be pressed to the flexible substrate 72 side by the pressure-bonding head 42 with substantially the same pressure P, respectively, and the crushing of the driver-side input / output terminals 74 and 75 is made substantially the same so Connection reliability can be improved by connecting the driver side input / output terminals 74 and 75 to the board side input / output terminals 76a and 77a.

  In the present embodiment, for example, when connecting the liquid crystal panel 2 ′ and the circuit board 71, for example, the position Ri of each connection terminal 14a ′ and the connection terminal of the wiring 79 connected to each connection terminal 14a ′. The pressing center point C may be obtained using the area Si, and the liquid crystal panel 2 ′ and the circuit board 71 may be pressed and connected. Thereby, the reliability of the connection between the liquid crystal panel 2 ′ and the circuit board 71 can be improved.

  (Fourth Embodiment / Electronic Device)

  Next, an electronic apparatus according to the fourth embodiment of the present invention including the above-described liquid crystal device 1 will be described.

  FIG. 14 is a schematic configuration diagram of an overall configuration of a display control system of an electronic apparatus according to the fourth embodiment of the present invention.

  The electronic device 300 includes a liquid crystal panel 2 and a display control circuit 390 as shown in FIG. 14 as a display control system, for example. The display control circuit 390 includes a display information output source 391, a display information processing circuit 392, a power supply circuit 393, and the like. A timing generator 394 and the like are included.

  Further, the liquid crystal panel 2 has a drive circuit 361 including a driver IC 17 for driving the display area I and the like.

  The display information output source 391 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. It has. Further, the display information output source 391 is configured to supply display information to the display information processing circuit 392 in the form of a predetermined format image signal or the like based on various clock signals generated by the timing generator 394.

  The display information processing circuit 392 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied to the drive circuit 361 together with the clock signal CLK. The power supply circuit 393 supplies a predetermined voltage to each component described above.

  As described above, according to the present embodiment, the liquid crystal device 1 having excellent connection reliability between the driver side input / output terminals 23 and 24 of the driver IC 17 and the substrate side input / output terminals 11a and 14a of the projecting portion 4a of the liquid crystal panel 2 is provided. Since it is provided, an electronic device with excellent display quality can be obtained.

  Specific electronic devices include touch panels equipped with liquid crystal devices in addition to mobile phones and personal computers, projectors, liquid crystal televisions and viewfinder types, video tape recorders with direct view of monitors, car navigation systems, pagers, electronic notebooks, A calculator, a word processor, a workstation, a video phone, a POS terminal, etc. are mentioned. Needless to say, for example, the above-described liquid crystal device 1 or the like can be applied as a display unit of these various electronic devices.

  Note that the electronic apparatus of the present invention is not limited to the above-described example, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, in the above-described embodiment, the TFT type liquid crystal device 1 and the like have been described. However, the present invention is not limited to this. For example, a TFD (Thin Film Diode) type active matrix type or passive matrix type liquid crystal device may be used. Further, the present invention may be applied to various electro-optical devices such as a plasma display device, an electrophoretic display device, and a device using an electron-emitting device (Field Emission Display, Surface-Condition Electron-Emitter Display, etc.).

  In the first embodiment and the like, the example in which only the driver side input / output terminals 23 and 24 of the driver IC 17 are provided on the active surface 20a has been described. However, the present invention is not limited to this. In addition to the terminals 23 and 24, for example, dummy terminals connected to dummy wirings provided on the substrate 4 may be provided on the active surface 20 a side of the driver IC 17. Also in this case, the sum of moments related to the pressing center point C of each force acting on the driver-side input / output terminals 23, 24 and the dummy terminals from the board-side input / output terminals 11a, 14a and the dummy wirings becomes zero. The crimping head 42 may be aligned. The pressing center point C in this case is, for example, (xc, yc) = {(S1 · x1 + S2 · x2 + ... + Sn · xn) / (S1 + S2 + ... + Sn), (S1 · y1 + S2 · y2 + ... + Sn · yn) / (S1 + S2 +... + Sn)} (where n is the total number of driver-side input / output terminals 23 and 24 and dummy terminals, and xi and yi are driver-side input / output terminals 23 and 24 and dummy terminals). What should I do? )

1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention. It is AA sectional drawing of the liquid crystal device of FIG. FIG. 2 is a plan view of a driver IC of the liquid crystal device in FIG. 1. It is a schematic sectional drawing of a driver IC mounting apparatus. 4 is a flowchart illustrating a manufacturing process of the liquid crystal device according to the first embodiment. It is a top view in the state where the crimping head was aligned to the driver IC. It is explanatory drawing of the force applied to the driver side input terminal at the time of driver IC crimping | compression-bonding. It is a fragmentary sectional view of the liquid crystal device of a 2nd embodiment concerning the present invention. It is sectional drawing at the time of driver IC crimping | compression-bonding by the crimping head of 2nd Embodiment. It is a partial top view of the liquid crystal device of 3rd Embodiment. It is BB sectional drawing of the liquid crystal device of FIG. It is a flowchart which shows the manufacturing process of the liquid crystal device of 3rd Embodiment. It is sectional drawing at the time of driver IC crimping | compression-bonding by a crimping head. It is a schematic block diagram of the display control system of the electronic device of 4th Embodiment which concerns on this invention.

Explanation of symbols

  Ri: Position, P, Pi ... Pressure, Si: Area, C: Pressing center point, H ... Pressing center, Q ... Center, T ... Thin film transistor element, Fi ... Force, O ... Origin, I ... Display area 1, 50 , 70 ... Liquid crystal device, 2 ... Liquid crystal panel, 3, 71 ... Circuit board, 4, 5 ... Substrate, 4a ... Overhang part, 5a ... Common electrode, 6 ... Sealing material, 7 ... Gate electrode, 8 ... Source electrode, 9 ... Pixel electrode, 11-13, 33,76 ... Input wiring, 11a, 76a ... Substrate side input terminal, 11b ... Other end, 14-16,32,77 ... Output wiring, 14a, 77a ... Substrate side output terminal, 14 ', 36, 79 ... wiring, 14a' ... connection terminal, 17, 18, 19, 53, 73 ... driver IC, 20 ... silicon chip, 20a ... active surface, 21, 22 ... electrode pad, 23, 74 ... dry Side input terminal, 24, 75 ... Driver side output terminal, 25, 78, 80 ... ACF, 26, 81 ... Conductive particles, 31, 72 ... Flexible substrate, 34 ... Semiconductor IC, 37 ... Connection member, 40 ... Driver IC mounting apparatus, 41 ... stage, 42 ... crimping head, 43 ... conveying unit, 51,52 ... resin core bump, 54,56 ... resin core, 55,57 ... metal wiring, 58 ... NCF, 300 ... electronic device, 361 ... Drive circuit, 390 ... Display control circuit

Claims (9)

In a method for manufacturing an electro-optical device in which an electronic component having a plurality of terminals is pressed and mounted on a substrate by a pressing member,
Aligning the electronic component and the pressing member so that an equal force per unit area is applied to each of the plurality of terminals;
And a step of pressure-bonding the electronic component to the substrate by the pressing member aligned in the alignment step. In a method for manufacturing an electro-optical device in which an electronic component having a plurality of terminals is pressed and mounted on a substrate by a pressing member,
Aligning the electronic component and the pressing member;
A step of pressure-bonding the electronic component to the substrate by the pressing member aligned by the alignment step,
In the alignment step, i is a natural number of 1 to n, n is the number of terminals of the electronic component, the area of each terminal is area Si, and an equal pressure applied per unit area of each area is pressure P. The pressing center of the pressing member is made to coincide with a center point where the sum of moments of the forces Fi (= P · Si) acting on the plurality of terminals is zero. Manufacturing method of optical device. When the center position of the area of the terminal is represented by a position xi and a position yi by coordinates in two directions with respect to an arbitrary point on the active surface having the plurality of terminals of the electronic component, The formula,
xi = (F1 · x1 + F2 · x2 + ... + Fn · xn) / (F1 + F2 + ... + Fn)
yi = (F1 · y1 + F2 · y2 +... + Fn · yn) / (F1 + F2 +... + Fn)
The method of manufacturing an electro-optical device according to claim 2, wherein the method is obtained by:   The plurality of terminals include a first number of input terminals provided on the active surface side of the electronic component and a second number of output terminals greater than the first number provided on the active surface. The method of manufacturing an electro-optical device according to claim 1, wherein the electro-optical device is a manufacturing method.   The plurality of terminals include an input terminal that occupies a first area on an active surface of the electronic component, and an output terminal that occupies a second area larger than the first area on the active surface. The method for manufacturing an electro-optical device according to claim 1.   The said terminal has the protrusion part which consists of an elastic member provided on the active surface of the said electronic component, and the electrically-conductive member which covers the protrusion side of the said protrusion part, The Claim 1 to Claim 5 characterized by the above-mentioned. The method for manufacturing the electro-optical device according to any one of the above.   The electro-optical device manufacturing method according to claim 1, wherein the terminal includes a conductive protrusion provided on an active surface of the electronic component. Method. In the manufacturing method of the mounting structure in which the connected member having a plurality of terminals is mounted on the substrate by being pressed by the pressing member.
Aligning the pressing member so that an equal force per unit area is applied to each of the plurality of terminals;
And a step of pressure-bonding the member to be connected to the substrate by the pressing member aligned in the step of aligning. In an electro-optical device manufacturing apparatus in which an electronic component having a plurality of terminals is mounted on a substrate by being pressed by a pressing member,
A position control unit that aligns the pressing member so that an equal force per unit area is applied to each of the plurality of terminals;
An electro-optical device manufacturing apparatus comprising: a pressing member that is aligned by the position control unit and press-bonds the electronic component to the substrate.

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