JP2007047296A - Paste member with built-in ic chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that an attachment member newly required for attaching an IC chip increases costs and requires a space. <P>SOLUTION: In a paste member with a built-in IC chip, the IC chip is inserted into a sheet with an adhesive material already provided to an image forming apparatus. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to information storage. More specifically, the present invention relates to an image forming apparatus such as a copying machine, a printer, a facsimile, or the like that forms an image by an electrophotographic method or an electrostatic recording method, and sheet processing attached to the image forming device. In the apparatus, the present invention relates to an IC chip built-in pasting member.

In recent years, in the image forming apparatus or the sheet processing apparatus attached to the image forming apparatus, the scrapped apparatus is collected and disassembled, the usage status of the parts is analyzed, and the usable parts are selected and put into a new apparatus. Reuse of parts is progressing, such as using them as maintenance parts. For this reason, it has been proposed that an IC chip is attached to a component and the material information and durability information of the component is recorded, so that the component is given information and used at the time of sorting (for example, see Patent Document 1).
JP 2002-169431 A

  However, in the image forming apparatus main body or unit, it is necessary to newly create and attach an attachment member so that the IC chip does not come off during transportation. However, when a new attachment member is created, there is a problem that the cost of the new member is increased in addition to the price of the IC chip, resulting in an expensive one (FIG. 9). That is, the IC chip 100, the mounting member 101, the surrounding member 102, and the elastic claw 103 for attaching the member to the apparatus unit are required. Moreover, in order to make it easy at the time of decomposition | disassembly, it is necessary for an attachment member to be removable.

  An object of the present invention is to provide an IC chip mounting method that uses what is already provided in an image forming apparatus, minimizes cost increase, and can be easily removed at the time of disassembly.

  In order to achieve the above object, in the first invention according to the present application, an IC chip is attached to the inside of the apparatus by the adhesiveness of the adhesive member by using the sheet material used in the image forming apparatus and the adhesive member attached to the sheet material. It is attached to the unit.

  Next, a second invention according to the present application is characterized in that the IC chip is attached by using a sheet material expressing an operation method, a warning, a product symbol, or an adhesive material of a resin member.

  By using the adhesive tape of the member used in the IC chip image forming apparatus, it is possible to attach without adding a new member. Therefore, there is no need to increase the cost and add a space necessary for mounting the IC chip.

  In addition, since the adhesive member of a kind considering the separability has been put into practical use in recent years, it can be easily separated by pulling it by hand if the corner is peeled off with a flathead screwdriver or the like. In addition, since the label describing the operation method and size is functionally necessary to touch the user's eyes, the label is generally arranged on the external surface of the image forming apparatus main body or in a close place.

  Therefore, unlike a deep part of the image forming apparatus, information can be recorded and read easily. In addition, the risk of damaging the IC chip is extremely low because it is in a position where it can be affixed immediately before shipment in assembly.

In addition, if it is affixed to a label that contains information that appeals to the user's vision, and the rules for attaching an IC chip, such as a product symbol, are determined, the location where the IC chip is affixed Judgment can be made regardless of the product.
When reading the recycling process and information, it is possible to instantly know where the reader should be placed, and the process time can be shortened.

Example 1
FIG. 1 is an external view of an image forming apparatus embodying the present invention, and FIG. 2 is a schematic sectional view. The image forming apparatus includes a paper feeding unit 4, an image forming unit 5, and a fixing unit 6. The external appearance is composed of an exterior covering the image forming apparatus and a logo mark 2 with a product symbol. The exterior is large and includes a front door 3, a paper feed cassette 4, a deck 5, a transport path 6 also serving as an external surface, and a rear cover (not shown). Various standard seals (31, 32, 33, 34) are generally attached to the rear cover (FIG. 3) (image forming means and paper feeding operation are omitted).

  First, the IC chip will be described. The wireless IC chip includes an antenna and is made of semiconductor technology. As a specific example of the size of the wireless ID chip, a size of 0.4 mm × 0.4 mm × 0.06 mm has been put into practical use. When the wireless IC chip receives the radio wave transmitted by the IC reader, the wireless IC chip is activated by the received radio wave and transmits an IC number specific to the wireless IC chip as the radio wave. That is, the wireless IC chip has a feature that it does not require a wired signal or power supply, and therefore has a high degree of freedom in installation.

  Since one IC reader can detect the IC number of a plurality of wireless IC chips, even if a plurality of wireless ID chips are provided, only one IC reader can be used.

  Next, the relationship between the IC chip, the sheet with the adhesive member, and the member to be attached will be described. As shown in FIG. 4, an adhesive 42 using a double-sided tape is attached to fix the sheet material 41 to a member to be attached, but an IC chip 43 is sandwiched between the sheet material and the adhesive member. It is attached to a member to be stuck and pasted. Alternatively, an IC chip may be sandwiched between a sheet material with an adhesive material and a member to be attached.

  When an IC chip is attached to the main body logo mark in FIG. 1, the sheet is replaced with a resin.

  Next, a practical example will be described. Sheet materials with adhesive members are generally used in several places in image forming apparatuses. The purpose is to suppress the paper sound, to regulate the direction of the paper, and to assist the introduction to the roller.

  Generally, PET is often used, although the type and thickness of the sheet material used varies depending on the application. Also, the thickness is often around 100 μm. Here, a sheet for assisting introduction into the roller will be described as an example. Specifically, as shown in FIG. 5, a sheet material 53 is pasted to assist intrusion into the rollers before the registration rollers 51 and 52 that perform skew correction. Then, as shown in FIG. 6, an IC chip 54 is embedded in this sheet material.

  When it is embedded in the surface through which the paper passes, the IC chip comes off due to wear of the sheet material, and there is a malfunction. If there is no place to stick, stick outside the paper size width of the product. Thereby, as described above, the date of manufacture of this unit, the product lot, etc. can be read from the information from the IC chip.

(Example 2)
The sheet material 61 on which characters are printed on the surface of FIG. 7 is made of adhesive paper using a sheet material 62 using a polyester film and a double-sided tape 63, and is attached to the apparatus main body. A section of the sheet material 62 will be described with reference to FIG.

  It comprises a laminate 65 for protecting the printing surface, a printing layer 66, a polyester film 67, an adhesive layer 68, and a release paper 69. In the high temperature part, there is a case where the surface of the laminate is flocked, or the paper is a mixture of polyimide and not a laminate or polyester fill. The following is printed on the surface of the sheet material.

1. Operation procedure ・ Sentences such as “Please put paper here for use.” 2. Warning text, high temperature warnings, etc. Notes to service personnel (persons who maintain the equipment) ・ Sentences such as "Invisible laser light is emitted inside this cover. Please do not expose to the laser light." Size display ・ Paper size notation such as A4, B5, etc. Product symbol 6. Approved only for products that meet the specified standards, such as standard acquisition symbols and energy stars.

  FIG. 8 illustrates an example of a paper feed cassette that is generally mounted in an image forming apparatus. The paper feed cassette is composed of a frame 71 for storing paper and a label 72 describing the operation method. The IC chip 73 is embedded in the label by the method described above and attached in the direction of arrow A.

  The method of attaching an IC chip to the adhesive layer is advantageous in terms of cost. However, in order to further improve the accuracy of communication reading, it is necessary to remove the influence of the signal depending on the thickness of the sheet material. This is a proposal for further improving the communication accuracy of the IC chip.

  There is a type in which a polyester film is pasted on the sheet surface to protect the printing surface. The sheet molding process is in the order of printing ⇒ film application ⇒ adhesive layer application. If the IC chip is sandwiched in advance in synchronism with the film pasting step, it is close to the surface, so that it can have a more excellent communication structure.

1 is an external view of an image forming apparatus showing an embodiment of the present invention. 1 is a cross-sectional view of an image forming apparatus showing an embodiment of the present invention. The figure of the seal affixed on an exterior cover. IC chip mounting method. IC chip mounting method. IC chip mounting method. IC chip mounting method. IC chip mounting method. FIG.

Claims (7)

  An IC chip built-in pasting member, which is used in an image forming apparatus and incorporates an IC chip that reads and writes data by radio waves.   2. The IC chip built-in pasting member according to claim 1, comprising a sheet material, an adhesive member, and an IC chip, wherein the IC chip is held between the sheet material and the adhesive sheet.   It is composed of a sheet material having an adhesive member bonded on one side, an IC chip, and a member to be bonded, and the IC chip is configured between a sheet material and a member to which the sheet material is bonded. The IC chip built-in pasting member according to claim 1.   4. The IC chip built-in adhesive member according to claim 2, wherein information appealing to the user's vision is described on the surface of the sheet material, and can be shared with other products.   5. The IC chip built-in pasting member according to claim 4, wherein any one of an operation method, a warning text, a paper size, or an acquired standard mark is written on the surface of the sheet.   5. The IC chip built-in bonding member according to claim 4, wherein the sheet material is replaced with a resin member, and a product symbol is written on the surface of the resin.   An IC chip comprising a sheet material that is laminated on the surface and printed on a lower layer of the laminate layer and an IC chip, and the IC chip is held between the printing surface and the laminate layer Built-in pasting member.

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