JP2007035827A5 - - Google Patents
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- Publication number
- JP2007035827A5 JP2007035827A5 JP2005215446A JP2005215446A JP2007035827A5 JP 2007035827 A5 JP2007035827 A5 JP 2007035827A5 JP 2005215446 A JP2005215446 A JP 2005215446A JP 2005215446 A JP2005215446 A JP 2005215446A JP 2007035827 A5 JP2007035827 A5 JP 2007035827A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005215446A JP4271674B2 (en) | 2005-07-26 | 2005-07-26 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005215446A JP4271674B2 (en) | 2005-07-26 | 2005-07-26 | Wire bonding equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007035827A JP2007035827A (en) | 2007-02-08 |
| JP2007035827A5 true JP2007035827A5 (en) | 2007-05-24 |
| JP4271674B2 JP4271674B2 (en) | 2009-06-03 |
Family
ID=37794731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005215446A Expired - Fee Related JP4271674B2 (en) | 2005-07-26 | 2005-07-26 | Wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4271674B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7537149B2 (en) * | 2006-09-26 | 2009-05-26 | Orthodyne Electronics Corporation | Deep access large ribbon bond head |
| CH700015B1 (en) * | 2007-04-04 | 2010-06-15 | Oerlikon Assembly Equipment Ag | Ultrasonic Transducer. |
| JP4874445B2 (en) * | 2007-11-07 | 2012-02-15 | 超音波工業株式会社 | Ultrasonic welding tool and method of attaching ultrasonic welding tool |
| US20110290859A1 (en) | 2009-02-06 | 2011-12-01 | Orthodyne Electronics Corporation | Ribbon bonding tools and methods of using the same |
| US10847491B2 (en) | 2009-02-06 | 2020-11-24 | Kulicke And Soffa Industries, Inc. | Ribbon bonding tools and methods of using the same |
| JP5804644B2 (en) * | 2012-02-21 | 2015-11-04 | 超音波工業株式会社 | Ultrasonic wire bonding apparatus and ultrasonic wire bonding method |
| JP6427813B2 (en) * | 2015-01-06 | 2018-11-28 | 株式会社アドウェルズ | Wire bonding equipment |
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2005
- 2005-07-26 JP JP2005215446A patent/JP4271674B2/en not_active Expired - Fee Related