JP2007022853A - Electrically conductive bonding member, image display device provided with spacer bonded by using the electrically conductive bonding member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrically conductive bonding member freed from Pb for fixing a spacer in a display panel of an image display device. <P>SOLUTION: There is used an electrically conductive bonding member comprising in weight percentage 55-75 wt.% V<SB>2</SB>O<SB>5</SB>, 15-30 wt.% P<SB>2</SB>O<SB>5</SB>, 0-25 wt.% BaO, 0-15 wt.% Sb<SB>2</SB>O<SB>3</SB>(wherein the sum of BaO+Sb<SB>2</SB>O<SB>3</SB>is at least 5 wt.%) and 5-20 wt.% GeO<SB>2</SB>, or 55-75 wt.% V<SB>2</SB>O<SB>5</SB>, 15-30 wt.% P<SB>2</SB>O<SB>5</SB>, 0-25 wt.% BaO, 0-15 wt.% Sb<SB>2</SB>O<SB>3</SB>(wherein the sum of BaO+Sb<SB>2</SB>O<SB>3</SB>is at least 5 wt.%) and 3-10 wt.% Ag<SB>2</SB>O. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a conductive bonding member and an image display device, and more particularly to a self-luminous flat panel type image display device using electron emission into a vacuum, particularly a back substrate having an electron source that emits electrons by field emission. A predetermined interval is provided between the configured rear panel and a front panel formed of a front substrate having a plurality of color phosphor layers that emit light by excitation of electrons extracted from the rear panel and an anode that is an electron acceleration electrode. The present invention is suitable for an image display apparatus including a display panel configured by arranging a plurality of spacers (also referred to as interval holding members or partition walls) to be held.

  Conventionally, a color cathode ray tube has been widely used as an image display device (display device) excellent in high luminance and high definition. However, with the recent improvement in image quality of information processing devices and television broadcasts, there has been an increasing demand for flat (or flat panel) image display devices that have high luminance and high definition characteristics and are lightweight and space-saving. Yes.

  As typical examples, liquid crystal display devices, plasma display devices and the like have been put into practical use. In addition, particularly capable of high brightness, an electron emission type image display device or field emission type image display device using electron emission from an electron source into a vacuum, an organic EL display characterized by low power consumption, etc. Various types of flat-type image display devices are also in practical use. Note that a plasma image display device, an electron emission image display device, or an organic EL image display device that does not require an auxiliary illumination light source is generally referred to as a self-luminous flat image display device.

  Among such self-luminous flat image display devices, field emission image display devices include C.I. A. Spindt et al. Have a cone-shaped electron emission structure, have a metal-insulator metal (MIM) type electron emission structure, and have an electron emission structure utilizing the electron emission phenomenon due to the quantum tunnel effect (surface conduction) In addition, there are known those having a type electron source), and those utilizing the electron emission phenomenon of diamond films, graphite films, nanotubes typified by carbon nanotubes, and the like.

  A display panel constituting a field emission type image display device which is an example of a self-luminous flat image display device has electrode lines (usually cathode lines, signal lines or data lines, hereinafter) having field emission type electron sources on the inner surface. Signal line) and a control panel electrode line (usually a gate line or a scan line, hereinafter referred to as a scan line) formed on a rear panel, and a multi-color phosphor layer on the inner surface facing the rear panel And a front panel including a front substrate provided with acceleration electrodes (also referred to as anode electrodes or anodes). The front substrate constituting the front panel is formed of a light transmissive material suitable for glass. An insulating material such as glass or alumina is used for the back substrate.

  A sealing frame (usually also referred to as a glass frame or a frame glass) is inserted in the bonding inner periphery of both panels, and is sealed and sealed with a sealing member. The back panel, the front panel, and the sealing The inside formed by the frame is evacuated.

  The electron source is provided in the vicinity of the intersection between the signal line and the scanning line, and the amount of electrons emitted from the electron source (including emission on / off) is controlled by the potential difference between the signal line and the scanning line. The emitted electrons are accelerated by a high voltage applied to the anode included in the front panel, and also hit the phosphor layer included in the front panel and excite this to thereby respond to the emission characteristics of the phosphor layer. Colored with colored light.

  Each electron source is paired with a corresponding phosphor layer to constitute a unit pixel. Usually, one pixel (one unit pixel of three colors of red (R), green (G), and blue (B)) ( In the case of a color pixel, the unit pixel is also referred to as a sub-pixel (sub-pixel).

A frame glass is fixed to the inner peripheral edge of the back panel and the front panel by a sealing member such as frit glass. The degree of vacuum inside the airtight container formed by the back panel, the front panel, and the frame glass is, for example, 10 ⁻⁵ to 10 ⁻⁷ Torr. In a front panel having a large display surface size, a plurality of spacers are interposed between the back panel and the front panel, and are joined and fixed by a joining member, and the two panels are held at a predetermined interval. This spacer is made of a surface of an insulating member such as glass or ceramics coated with a film having a slight conductivity, or a plate-like body formed of a member having a certain degree of conductivity. It is installed in a position that does not interfere with the operation of

  When installing spacers that maintain a predetermined distance between the back panel and the front panel, the structure prevents the electron beam trajectory from being bent by the charge-up of the spacers, and the arrangement of the spacers prevents the loss of partition walls. Various studies have been made on the structure for preventing discharge and the structure for preventing discharge.

As a joining member in the installation of such a spacer, PbO-based glass, Bi ₂ O ₃ -based glass, SiO ₂ —Bi ₂ O ₃ -based glass, soda glass, silica glass, and Si, Zn described in Patent Document 1 are used. A conductive frit glass containing at least one of Al, Sn, Mg, and the like is known. Also, Patent Document 2 discloses a circuit protection glass containing one or more selected from V ₂ O ₅ , ZnO, B ₂ O ₃ , SiO ₂ , Al ₂ O ₃ , MgO, CaO, SrO, and BaO. It is. Patent Document 3 discloses a low-expansion glass in which a fine powder of a conductive material suitable for copper (Cu) is mixed.
JP 2001-338528 A JP-A-2-289445 JP 61-281044 A

The spacer in the display panel of the field emission type image display device has a low resistivity of about 10 ^{8 to} 10 ⁹ Ω · cm in order to suppress charge-up. In order to plant and bond such a spacer between the rear panel (the rear substrate, usually a glass substrate) and the front panel (the front substrate, usually a glass substrate), A bonding member (glass paste, frit glass) having a low resistivity of about 10 ^{3 to} 10 ⁷ Ω · cm is required.

  In addition, this conductive joining member has a small difference in thermal expansion coefficient between the back substrate and the glass material constituting the front substrate, and good wettability at a low melting point below the maximum temperature (approximately 450 ° C.) in the manufacturing process. It is required that it can be joined with.

  In addition, although what mixed Ag particle | grains widely used as electroconductive metal particle with PbO type | system | group glass with favorable joining characteristics is also considered, in order to express electroconductivity in the said glass material, content of Ag particle is increased. In addition, since PbO-containing glass cannot be used after the year 2006 due to the problem of environmental burden, development of other alternative materials is required.

  An object of the present invention is to provide a novel conductive bonding member for fixing a spacer in a display panel of an image display device, and an image display device having a spacer bonded using the conductive bonding member. .

In order to obtain the conductive bonding member, the inventors have paid attention to conductive V ₂ O ₅ —P ₂ O ₅ glass. V ₂ O ₅ —P ₂ O ₅ glass has electronic conductivity. We make the electrical resistivity of the V ₂ O ₅ -P ₂ O ₅ -based glass even lower, the heat required to apply the V ₂ O ₅ -P ₂ O ₅ -based glass as the conductive bonding member As a result of intensive investigations on adjusting the expansion characteristics and heat-resistant temperature, the inventors have developed a conductive bonding member characterized by the following components.

That is, the conductive bonding member of the present invention, 55～75Wt% of V ₂ O ₅ in a weight percentage in terms of oxide, 15 to 30 wt% of P ₂ O _5, 0~25wt% of BaO, Sb ₂ O ₃ 0-15 wt% (however, the total amount of BaO and Sb ₂ O ₃ is 5 wt% or more) and GeO ₂ is contained 5-20 wt%.

The suitable adhesion temperature of the said conductive joining member can be adjusted within the range of 430 degreeC-550 degreeC. In this case, the heat resistant temperature of the conductive bonding member is about 380 ° C. to 400 ° C. When the lower bonding temperature is required, 55~75wt% of V ₂ O ₅ in a weight percentage in terms of oxide, 15 to 30 wt% of P ₂ O _5, 0~25wt% of BaO, Sb ₂ O ₃ Of 0 to 15 wt% (however, the total amount of BaO and Sb ₂ O ₃ is 5 wt% or more) and ₃ to 10 wt% of Ag ₂ O are used. A suitable bonding temperature of the conductive bonding member can be adjusted within a range of 380 ° C. to 450 ° C., and a heat resistant temperature is about 280 ° C. to 320 ° C. Usually, a lower bonding temperature is preferred, but the conductive bonding member of the present invention can be used properly depending on the need for heat resistance of the conductive bonding member.

What is called a conventional conductive adhesive member is a material in which conductive particles are mixed with non-conductive glass. However, in the present invention, appropriate conductivity, thermal expansion characteristics, and temperature characteristics are provided for the glass itself. It is characterized by giving. Therefore, the filler material to be mixed as a means for finely adjusting the thermal expansion coefficient of the conductive joining member of the present invention does not have to be particularly conductive, and 5 to 30% by volume of a ceramic filler material having an arbitrary low thermal expansion coefficient is added. Can do. As the ceramic filler, any one of SiO ₂ , ZrO ₂ , Al ₂ O ₃ , ZrSiO ₄ , zirconium phosphate (ZWP), cordierite, mullite, and eucryptite can be used. It is also possible to obtain conductivity by adding a conductive filler material.

The image display device according to the present invention includes a plurality of signal lines extending in the first direction and arranged in parallel in the second direction intersecting the first direction, and the signal lines are insulated from the signal lines. A plurality of scanning lines extending in the second direction and juxtaposed in the first direction; and a plurality of pixels having electron sources provided in the vicinity of intersections of the signal lines and the scanning lines. A rear panel formed of a rear substrate on which the display area is provided, a plurality of color phosphor layers that emit light by excitation of electrons extracted from the electron source included in the display area of the rear panel, and an anode are formed A front panel composed of a front substrate, a plurality of spacers joined by a conductive joining member between the back panel and the front panel in the display area and held between the panels at a predetermined interval; and the back panel; A sealing member is interposed in the periphery with the front panel. It has a frame glass for hermetic sealing,
The conductive bonding member, 55~75wt% of V ₂ O ₅ in a weight percentage of the oxide equivalent, P ₂ O ₅ to 15~30wt%, 0~25wt% of BaO, Sb ₂ O ₃ and 0 to 15 wt% (However, the total amount of BaO and Sb ₂ O ₃ is 5 wt% or more) and is a conductive bonding member containing 5 to 20 wt% of GeO ₂ .

The image display device of the present invention, the conductive bonding member, 55～75Wt% of V ₂ O ₅ in a weight percentage in terms of oxide, 15 to 30 wt% of P ₂ O _5, the BaO 0～25Wt %, Sb ₂ O ₃ in an amount of 0 to 15 wt% (the total amount of BaO and Sb ₂ O ₃ is 5 wt% or more), and Ag ₂ O in an amount of ₃ to 10 wt%.

And as said electroconductive joining member, what added 5-30vo1% of ceramic filler materials of a low thermal expansion coefficient can be used. As the ceramic filler, any one of SiO ₂ , ZrO ₂ , Al ₂ O ₃ , ZrSiO ₄ , zirconium phosphate (ZWP), cordierite, mullite, and eucryptite can be used.

The spacer of the image display apparatus of the present invention, preferably, a SiO ₂ as a main component, La, Sc, Y, Ce , Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm , Yb and Lu are used which are formed of a glass material (hereinafter referred to as rare earth-containing glass) containing 1 to 20% by weight.

  According to the conductive joining member of the present invention, the conductive path can be formed uniformly and stably. By fixing and fixing the spacer of the image display device with this conductive bonding member, the spacer is uniformly planted between the rear substrate and the front substrate, so that the charge to be charged up to the spacer is absorbed on the substrate side. Thus, an image display device capable of displaying a high-quality image can be provided. In addition, since the electroconductive joining member of this invention is applicable also as a wiring material and is lead (Pb) free, it can respond to RoHS regulation.

  It should be noted that the present invention is not limited to the above-described configurations and the configurations described in the embodiments described below, and it goes without saying that various modifications can be made without departing from the technical idea of the present invention. Yes.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1A and 1B are diagrams for explaining an example of an image display device according to the present invention. FIG. 1A is a perspective view, and FIG. 1B is cut along line AA ′ in FIG. It is a schematic sectional drawing. In FIG. 1, a signal line (data line, cathode electrode line) CL and a scanning line (gate electrode line) GL are provided on the inner surface of the rear substrate SUB1 constituting the rear panel PNL1, and the signal line CL and the scanning line GL intersect each other. An electron source ELS is formed in the portion. A scanning line lead line (not shown) is formed at the end of the scanning line GL, and a signal line lead line (not shown) is formed at the end of the signal line CL.

  A light shielding film (black matrix) BM, an anode (metal back, anode) AD, a phosphor layer PH, and the like are formed on the inner surface of the front substrate SUB2 constituting the front panel PNL2. The rear substrate SUB1 constituting the rear panel PNL1 and the front substrate SUB2 constituting the front panel PNL2 are bonded to each other by a sealing member FGM with a sealing frame (frame glass) MFL interposed therebetween. In order to maintain the bonded gap at a predetermined value, the spacer SPC described above is bonded and planted between the rear substrate SUB1 and the front substrate PNL2 by a conductive bonding member (not shown).

  The internal space sealed by the back panel PNL1, the front panel PNL2, and the sealing frame MFL is exhausted from an exhaust pipe (not shown) provided in a part of the back panel PNL1, and is maintained in a predetermined vacuum state. These configurations will be described later.

  FIG. 2 is a schematic diagram illustrating a detailed structure of a cross section along the line AA ′ in FIG. 1. FIG. 3 is an enlarged cross-sectional view of the main part of FIG. 2 and 3, FGM is a sealing member for fixing the frame glass MFL, FGS is a conductive bonding member for bonding spacers, and AR is a display area. The same reference numerals as those in FIG. 1 correspond to the same functional parts.

  In such a configuration, the back substrate SUB1 is preferably a glass plate or a ceramic plate such as alumina, and the front substrate SUB2 is preferably a transparent glass plate. In addition, a glass substrate is usually used also for the back substrate SUB1. The black matrix BM, the phosphor layer PH, and the anode AD are formed on the inner surface.

  Further, the frame glass MFL also serving as an outer frame installed at the peripheral edge between the back substrate SUB1 and the front substrate SUB2 is fixed between the back substrate SUB1 and the front substrate SUB2 via a sealing member FGM, The distance at the periphery between the back substrate SUB1 and the front substrate SUB2 is maintained at a predetermined dimension, for example, about 3 mm.

  The spacer SPC is bonded and fixed by a conductive bonding member FGS between the scanning lines GL formed on the inner surface of the back substrate SUB1 and the anode AD on the black matrix BM formed on the inner surface of the front substrate SUB2.

  FIG. 4 is a partially cutaway perspective view illustrating an example of the overall structure of the image display apparatus of the present invention in more detail. FIG. 5 is a cross-sectional view taken along the line AA ′ of FIG. To repeat, the inner surface of the rear substrate SUB1 constituting the rear panel PNL1 has a signal line CL and a scanning line GL, and an electron source is formed near the intersection of the signal line CL and the scanning line GL. . A signal line lead line CLT is formed at the end of the signal line CL, and a scan line lead line GLT is formed at the end of the scanning line GL.

  As described above, the anode AD and the phosphor layer PH are formed on the inner surface of the front substrate SUB2 constituting the front panel PNL2. The rear substrate SUB1 constituting the rear panel PNL1 and the front substrate SUB2 constituting the front panel PNL2 are bonded to each other with a sealing frame MFL interposed therebetween. As described above, a spacer SPC, preferably a glass plate or a ceramic plate, is planted between the rear panel SUB1 and the front panel PNL2 in order to maintain the bonded gap at a predetermined value. FIG. 5 shows a cross section along the spacer SPC. FIG. 5 shows three spacers along the scanning line GL on the scanning line GL, but this is merely an example.

  The internal space sealed by the rear panel PNL1, the front panel PNL2, and the frame glass MFL is exhausted from an exhaust pipe EXC provided in a part of the rear panel PNL1, and is brought into a predetermined vacuum state.

  FIG. 6 is a schematic diagram illustrating a configuration example of one pixel of the image display device of the present invention. Back substrate SUB1 is a first insulating film comprising a signal line CL constituting a lower electrode of an electron source suitable for an aluminum (Al) film on the main surface (inner surface), and an anodized film obtained by anodizing aluminum of the lower electrode INS1, a second insulating film INS2 preferably made of a silicon nitride film SiN, a feeding electrode (connection electrode) ELC, a scan line GL suitable for chromium Cr, and an upper electrode constituting an electron source of a pixel connected to the scan line GL An AED is formed.

  The electron source has a signal line CL as a lower electrode, a thin film portion INS3 that forms a part of the first insulating film INS1 located on the lower electrode, and a portion of the upper electrode AED that is laminated on the thin film portion INS3. Consists of. The upper electrode AED is formed to cover the scanning line GL and a part of the power supply electrode ELC. The thin film portion INS3 is a so-called tunnel film. With this configuration, a so-called diode electron source is formed.

On the other hand, the front panel PNL2 is formed with a phosphor PH separated from adjacent pixels by a black matrix BM and an anode AD suitable for an aluminum vapor deposition film on the main surface of the front substrate SUB2 suitable for a transparent glass substrate. . The distance between the back panel PNL1 and the front panel PNL2 is about 3 to 5 mm, and this distance is maintained by the spacer SPC.

In such a configuration, when an acceleration voltage (about 1 kV to 10 kV, about 5 kV in FIG. 6) is applied between the upper electrode AED of the rear panel PNL1 and the anode AD of the front panel PNL2, it is supplied to the signal line CL which is the lower electrode. Electrons e ⁻ corresponding to the size of the display data to be emitted are emitted, impinge on the phosphor PH by the acceleration voltage, and are excited to emit light L having a predetermined frequency to the outside of the front panel PNL2. In the case of full-color display, this unit pixel is a color sub-pixel (sub-pixel), and usually one color pixel (color) with three sub-pixels of red (R), green (G), and blue (B). Pixel).

  FIG. 7 is a diagram illustrating an example of an equivalent circuit of the image display device of the present invention. A region indicated by a broken line in FIG. 7 is a display region AR. In this display region AR, n signal lines CL and m scanning lines GL are arranged so as to cross each other to form an n × m matrix. ing. Each intersection of the matrix constitutes a subpixel, and one unit of color (color pixel) is composed of a group of three unit pixels (or subpixels: subpixels) "R", "G", and "B" in the figure Configure. The signal line CL is connected to the image signal drive circuit DDR at the signal line lead terminal CLT, and the scan line GL is connected to the scan signal drive circuit SDR at the scan line lead terminal GLT. The image signal NS is input from the external signal source to the image signal driving circuit DDR, and the scanning signal SS is similarly input to the scanning signal driving circuit SDR.

  Accordingly, a two-dimensional full-color image can be displayed by supplying an image signal to the signal line CL that intersects the scanning lines GL that are sequentially selected. By using the display panel of this configuration example, a self-luminous planar image display device with a relatively low voltage and high efficiency is realized.

Next, the spacer and its fixing structure will be described. An example of the spacer SPC of the present embodiment described with reference to FIGS. 1 to 6 is mainly composed of SiO ₂ and includes La, Sc, Y, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, and Ho. , Er, Tm, Yb, Lu, and a glass material molded body containing 1 to 20% by weight. Then, a conductive film for preventing charging is formed on the outer peripheral surface of the spacer body. In addition, it can replace with what adheres the electroconductive film for antistatic to the outer peripheral surface of a spacer main body, and can also use the material which has electroconductivity for spacer main body itself.

  The spacer SPC is substantially perpendicular to both the substrate surfaces in the display area AR formed between the back substrate SUB1 and the front substrate SUB2, and the length direction of the spacer SPC is one direction (see FIG. 7). A plurality of lines are aligned at a predetermined pitch interval so as to coincide with each other in the x direction), and the scanning lines GL are arranged at a predetermined pitch interval in a plurality of columns in the other direction intersecting the one direction (y direction in FIG. 7). Are juxtaposed on each other, and are joined and fixed by a conductive joining member FGS (see FIG. 3).

The conductive joining member FGS of the present embodiment, 55~75wt% V ₂ O ₅ in weight _{percent, 15~30wt% P 2 O 5,} 0~25wt% BaO, 0~15wt% Sb 2 O 3 ( provided that BaO + Sb ₂ O ₃ total mixing amount is 5 wt% or more), and a conductive bonding member containing 5 to 20 wt% GeO ₂ is used.

In addition, as the conductive bonding member FGS of the present example, 55 to 75 wt% V ₂ O ₅ , 15 to 30 wt% P ₂ O ₅ , 0 to 25 wt% BaO, 0 to 15 wt% Sb ₂ O ₃ (however, by weight percentage) A total amount of BaO + Sb ₂ O ₃ is 5 wt% or more) and a conductive bonding member containing ₃ to 10 wt% Ag ₂ O can be used.

Further, as the conductive bonding member FGS, a material in which a ceramic filler material having a low thermal expansion coefficient is added in an amount of 5 to 30 vol 1 can be used. The ceramic filler is _{added, SiO 2, ZrO 2, Al} 2 O 3, ZrSiO 4, zirconium phosphate (ZWP), cordierite, mullite, use either eucryptite.

  In the image display device of this example, the spacers were joined and fixed using the conductive joining member described above. That is, in the image display apparatus of the present embodiment, a large number of signal lines extending in the first direction and arranged in parallel in the second direction intersecting the first direction are insulated from the signal lines. A plurality of scanning lines extending in the second direction and juxtaposed in the first direction; and a plurality of pixels having electron sources provided in the vicinity of intersections of the signal lines and the scanning lines; And a plurality of color phosphor layers that emit light by excitation of electrons extracted from the electron source included in the display area of the back panel and an anode are formed. A front panel composed of a front substrate, a plurality of spacers joined by a conductive joining member between the back panel and the front panel in the display area and held between the panels at a predetermined interval; and the back panel And a sealing member around the periphery of the front panel It is allowed and a frame glass hermetic seal is obtained by bonding the spacers were fixed with a conductive bonding member described above.

  In this way, by setting the spacer between the back substrate and the front substrate using the conductive bonding member of this embodiment, the charge to be charged up to the spacer is absorbed on the substrate side, and the high quality is achieved. An image display device capable of displaying an image can be provided.

  In addition, the silica film is deposited on the entire surface of the spacer body to form a fine uneven surface, and the surface is roughened to adhere and conduct the conductive metal film formed on the outermost surface. Therefore, it is possible to prevent secondary electrons from being emitted due to charging by electron emission from the electron source.

  The conductive film to be deposited on the surface of the spacer is formed by, for example, depositing the spacer main body in a solution in which conductive oxide fine particles and an inorganic binder are mixed and dipping the spacer body, followed by baking. be able to. By fixing the spacer SPC configured in this manner to the scanning line and the anode with the above-described conductive bonding member FGS, the charge-up portion charged in the spacer SPC can easily flow out and affect the electron flow. Is prevented.

  In the above-described embodiment, the structure using the MIM type as the electron source has been described as an example. However, the present invention is not limited to this, and the self-luminous image display using the various electron sources described above. Needless to say, it can be applied to the apparatus.

Hereinafter, an embodiment 2 of the example of manufacturing the conductive V ₂ O ₅ based glass. The electrical conduction of V-based glass is caused by hopping conduction of electrons between V ⁴⁺ ions and V ⁵⁺ ions present in a glass skeleton composed of V ₂ O ₅ —P ₂ O ₅ . Therefore, the V ⁴⁺ content relative to the total amount of V ions in the V-based glass has a large correlation with the electrical conductivity of the glass.

In general, V ₂ O ₅ and components for producing glass and the composition range thereof are as follows. V ₂ O ₅ makes the most stable glass with P ₂ O ₅ , but depending on the component and its composition range, it is easy to cause crystallization by heating, so it is necessary to be careful. In this example, the electrical conductivity and glass transition temperature of the V-based glass were adjusted by adjusting the amount ratio of V ₂ O ₅ and P ₂ O ₅ , adding Sb ₂ O ₃ , GeO ₂ , Ag ₂ O, and adjusting the glass melting temperature. Adjusted.

Starting materials were V ₂ O ₅ (manufactured by High Purity Chemical Laboratory, 99.9%), BaO (manufactured by Wako Reagent, 99.9%), P ₂ O ₅ (manufactured by High Purity Chemical Laboratory, 99.9%). ), Sb ₂ O ₃ (manufactured by High Purity Chemical Laboratory, 99.9%), GeO ₂ (manufactured by High Purity Chemical Laboratory, 99.9%), Ag ₂ O (manufactured by High Purity Chemical Laboratory, 99.9) %). In order to produce the V-based glass base material, the respective raw materials are first mixed at a weight ratio shown in FIG. At this time, all raw materials except P ₂ O ₅ are mixed in advance. This is because P ₂ O ₅ is highly hygroscopic and is not left in the atmosphere for a long time. A mixed powder other than P ₂ O ₅ is put in an alumina crucible, and the alumina crucible is put on a balance, and a predetermined amount of P ₂ O ₅ is weighed, and simultaneously mixed with a metal spoon. At this time, mixing using a mortar or a ball mill is not performed.

The alumina crucible containing the above raw material mixed powder is placed in a glass melting furnace and heating is started. The temperature increase rate is set to 5 ° C./min, and the temperature is maintained for 1 hour from the time when the target temperature is reached. In this embodiment, the target temperature is in the range of 900 ° C to 1200 ° C. The reason why the melting (manufacturing) temperature was examined to a high temperature of 1200 ° C. is to increase the amount of V ⁴⁺ generated and to make the glass skeleton more solid.

  The molten glass is held for 1 hour with stirring. After the holding, the alumina crucible is taken out from the melting furnace and cast into a graphite mold heated to 300 ° C. in advance. The glass cast into the graphite mold was moved to a strain relief furnace that had been heated to a strain relief temperature in advance, and the strain was removed by holding for 1 hour, and then cooled to room temperature at a rate of 1 ° C./min. The obtained glass has a size of 30 mm × 40 mm × 80 mm. Glasses having the compositions shown in Table 2 were produced by such a procedure.

  After evaluating the surface resistance of the obtained glass block, the glass block was cut into a size of 4 mm × 4 mm × 15 mm, and the thermal expansion coefficient was evaluated. DTA analysis was performed using the powder obtained by pulverizing the remaining material.

In this example, it was shown that the electrical resistivity can be obtained in the range of 10 ⁵ to 10 ⁷ Ωcm by adjusting the glass composition and the melting temperature as shown in Table 1. Addition of Ag ₂ O has an effect of lowering the electrical resistivity of the V-based glass, and addition of GeO ₂ has an effect of improving the heat resistance of the glass without deteriorating the electrical resistivity characteristics. The thermal expansion coefficient of the glass can be controlled in the range of 50 to 80 × 10 ⁻⁷ / ° C. by mixing a low thermal expansion coefficient filler such as zirconium phosphate.

As shown in this example, the conductive bonding member of the present invention is characterized by imparting appropriate conductivity, thermal expansion characteristics, and temperature characteristics to the glass itself. Therefore, the filler material to be mixed as a means for finely adjusting the thermal expansion coefficient of the conductive bonding member of the present invention does not need to be particularly conductive, and a ceramic filler material having an arbitrary low thermal expansion coefficient can be added. In this embodiment, Ag ₂ O and GeO ₂ are used. However, the present invention is not limited to this, and the electrical resistivity and heat-resistant temperature can be controlled by other compounds.

It is a figure explaining an example of the image display apparatus by this invention. It is a schematic diagram explaining the detailed structure of the cross section along the A-A 'line of FIG. It is a principal part expanded sectional view of FIG. 1 is a partially broken perspective view illustrating an example of the overall structure of an image display device according to the present invention more specifically. FIG. It is sectional drawing cut | disconnected along the A-A 'line | wire of FIG. It is a schematic diagram explaining the structural example of 1 pixel of the image display apparatus of this invention. It is a figure explaining the example of an equivalent circuit of the image display apparatus of this invention. It is a figure explaining the weight ratio of the raw material which produces V type | system | group glass base material.

Explanation of symbols

PNL1 ... Back panel,
PNL2 ... Front panel,
SUB1 ... Back substrate,
SUB2 ... Front substrate,
CL ... Signal line,
CLT ... Signal line lead-out terminal,
GL ... Scanning line,
GLT ... Scanning line lead terminal,
SPC ... Spacer
PH ... phosphor layer,
BM ... Black matrix,
AD ... Anode,
MFL ・ ・ ・ ・ Frame glass,
FGS ... Conductive bonding member,
FGM ... Sealing member.

Claims (8)

V ₂ O ₅ is 55 to 75 wt%, P ₂ O ₅ is 15 to 30 wt%, BaO is 0 to 25 wt%, and Sb ₂ O ₃ is 0 to 15 wt% (however, BaO, Sb _2). The total amount of O ₃ is 5 wt% or more), and the conductive bonding member contains 5 to 20 wt% of GeO ₂ . V ₂ O ₅ is 55 to 75 wt%, P ₂ O ₅ is 15 to 30 wt%, BaO is 0 to 25 wt%, and Sb ₂ O ₃ is 0 to 15 wt% (however, BaO, Sb _2). The total amount of O ₃ is 5 wt% or more), and the conductive bonding member contains ₃ to 10 wt% of Ag ₂ O.   3. The conductive bonding member according to claim 1, wherein 5 to 30% by volume of a ceramic filler material is added. 4. 4. The ceramic filler according to claim 3, wherein the ceramic filler is any one of SiO ₂ , ZrO ₂ , Al ₂ O ₃ , ZrSiO ₄ , zirconium phosphate (ZWP), cordierite, mullite, and eucryptite. Conductive bonding member. A number of signal lines extending in a first direction and arranged in parallel in a second direction intersecting the first direction are insulated from the signal lines and extend in the second direction to A rear substrate on which a display region is formed that includes a large number of scanning lines arranged in parallel in the first direction and a large number of pixels having electron sources provided in the vicinity of intersections of the signal lines and the scanning lines. A back panel consisting of
A front panel comprising a front substrate on which a plurality of color phosphor layers and an anode that emit light by excitation of electrons extracted from the electron source in the display area of the rear panel are formed;
A plurality of spacers that are joined by a conductive joining member between the back panel and the front panel in the display area and hold the two panels at a predetermined interval;
An image display device comprising a frame glass hermetically sealed by interposing a sealing member around the back panel and the front panel;
The conductive bonding member, 55~75wt% of V ₂ O ₅ in a weight percentage of the oxide equivalent, P ₂ O ₅ to 15~30wt%, 0~25wt% of BaO, Sb ₂ O ₃ and 0 to 15 wt% (However, the total mixed amount of BaO + Sb ₂ O ₃ is 5 wt% or more), and an image display device characterized by being a conductive bonding member containing 5-20 wt% of GeO ₂ . A number of signal lines extending in the first direction and arranged in parallel in the second direction intersecting the first direction, and the signal lines are insulated and extend in the second direction to A rear substrate on which a display region is formed that includes a large number of scanning lines arranged in parallel in a first direction and a large number of pixels having an electron source provided in the vicinity of the intersection of the signal lines and the scanning lines. A back panel consisting of
A front panel comprising a front substrate on which a plurality of color phosphor layers and an anode that emit light by excitation of electrons extracted from the electron source in the display area of the rear panel are formed;
A plurality of spacers that are joined by a conductive joining member between the back panel and the front panel in the display area and hold the two panels at a predetermined interval;
An image display device comprising a frame glass hermetically sealed by interposing a sealing member around the back panel and the front panel;
The conductive bonding member, 55~75wt% of V ₂ O ₅ in a weight percentage of the oxide equivalent, P ₂ O ₅ to 15~30wt%, 0~25wt% of BaO, Sb ₂ O ₃ and 0 to 15 wt% (However, the total amount of BaO and Sb ₂ O ₃ is 5 wt% or more) and an electroconductive joining member containing ₃ to 10 wt% of Ag ₂ O.   7. The image display device according to claim 5, wherein 5 to 30% by volume of a ceramic filler material is added to the conductive joining member. 8. The ceramic filler according to claim 7, wherein the ceramic filler is any one of SiO ₂ , ZrO ₂ , Al ₂ O ₃ , ZrSiO ₄ , zirconium phosphate (ZWP), cordierite, mullite, and eucryptite. Image display device.

Images