JP2007016126A - Thermosetting resin composition and electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having excellent properties in cured state in the case of using for the bonding of electronic part elements such as semiconductor chips and further giving a junction having excellent reliability and provide an electronic part produced by using the thermosetting resin composition. <P>SOLUTION: The thermosetting resin composition contains a thermosetting resin and a curing agent for the thermosetting resin. The peak of tanδ measured by a dynamic viscoelasticity measuring instrument is ≥0.5 in cured state and the peak temperature of tanδ is ≥150°C. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a thermosetting resin composition used for bonding electronic component elements such as semiconductor chips, and more specifically, not only has excellent properties after curing, but also provides bonding with excellent reliability. The present invention relates to a thermosetting resin composition to be obtained and an electronic component using the thermosetting resin composition.

  In the semiconductor chip, in order to improve various reliability, a structure in which the semiconductor chip is housed in a package or mounted on a package material is used. In recent years, in order to achieve miniaturization and thinning, flip chip mounting has been widely used when packaging semiconductor chips. In the flip chip mounting method, a circuit formation surface of a semiconductor chip is used as a lower surface, and metal bumps for electrically connecting to an electrode land on the package side are provided on the lower surface so as to protrude downward. The semiconductor chip is mounted on the substrate from the lower surface side, and the metal bump is electrically connected to the electrode land on the substrate. The gap between the circuit forming surface, which is the lower surface of the semiconductor chip, and the substrate is filled with an epoxy resin composition or the like as an underfill material to reinforce the joint and protect the semiconductor chip.

  In recent years, in an electronic component element such as a semiconductor chip, the number of terminal electrode portions for connecting the electronic component element to the outside has been increasing with the increase in integration and multifunction. Therefore, in an electronic component element in which a large number of metal bumps are provided as terminal electrodes as used in the flip chip mounting method, the bump diameter is reduced and the pitch between the bumps is reduced. Therefore, in the cured product used as the underfill material, it is possible to sufficiently increase the reliability of bonding, the handling property and the reliability with respect to the thermal cycle, and it is difficult to cause contamination or corrosion of bumps and wiring electrodes. That is strongly desired.

  In Patent Document 1 below, a cured product of an adhesive having a storage elastic modulus at 25 ° C. of 10 to 2000 MPa and a storage elastic modulus at 260 ° C. of 3 to 50 MPa measured using a dynamic viscoelasticity measuring device. A semiconductor device including an adhesive layer made of is disclosed.

The cured product of the adhesive described in Patent Document 1 has a low storage elastic modulus at around room temperature and a storage elastic modulus at a high temperature in the above range, so that it has excellent handleability and relieves thermal stress during a cooling cycle. be able to. Therefore, the occurrence of cracks during reflow is unlikely to occur and the heat resistance is excellent.
JP 2003-60127 A

  However, in Patent Document 1, the handling property and the reliability with respect to the thermal cycle are improved by using a low elastic modulus, but it does not sufficiently satisfy all the required qualities such as the joining reliability and the stress relaxation property. It was difficult.

  In general, an epoxy resin composition used as an underfill material is blended with an inorganic filler such as silica in order to increase its rigidity, thereby improving the reliability of bonding. However, in the case of an underfill material containing a large amount of inorganic filler, when the pitch is narrowed, particularly when the pitch between the wiring electrodes becomes a narrow pitch of 50 μm or less, the inorganic filler is not between the wiring electrodes. There was a risk of adhering and entering between the wiring electrode on the substrate and the metal bump of the semiconductor chip. As a result, poor conduction between the wiring electrode and the metal bump may occur. Further, when the pitch is reduced, an undesired short circuit may occur between the electrodes on the substrate. On the other hand, an underfill material not containing an inorganic filler is also known, but in this case, the reliability of bonding has to be lowered.

  In order to improve the reliability of bonding, a method of increasing the glass transition temperature Tg of an epoxy resin composition or the like is also known, but when the Tg is increased, the stress relaxation property tends to be inferior.

  The object of the present invention is to provide a bonding with excellent reliability as well as excellent properties after curing when used for bonding electronic component elements such as semiconductor chips, for example, in view of the above-described state of the art. An object of the present invention is to provide a thermosetting resin composition that can be applied and an electronic component using the thermosetting resin composition.

  The thermosetting resin composition of the present invention is a thermosetting resin composition containing a thermosetting resin and a curing agent for the thermosetting resin, and is measured using a dynamic viscoelastic device after curing. The tan δ peak value is 0.5 or more, and the tan δ peak temperature is 150 ° C. or more.

  In a specific aspect of the thermosetting resin composition of the present invention, the thermosetting resin is an epoxy compound.

  In another specific aspect of the thermosetting resin composition of the present invention, after curing, the storage elastic modulus at 30 ° C. measured using a dynamic viscoelastic device is in the range of 2000 to 4000 MPa, and 260 ° C. The storage elastic modulus at is 100 MPa or less.

  In still another specific aspect of the thermosetting resin composition of the present invention, the inorganic filler is not included, or the inorganic filler is included at a ratio of 10 parts by weight or less with respect to 100 parts by weight of the thermosetting resin. .

  An electronic component of the present invention includes an electronic component element and a substrate on which the electronic component element is mounted, and the electronic component element is bonded onto the substrate using the thermosetting resin composition configured according to the present invention. It is characterized by being.

In a specific aspect of the present invention, the electronic component has an adhesive strength between the electronic component element and the substrate of 120 N / 4 mm ² or more, and the fracture surface when the electronic component element and the substrate are peeled is It is not an interface of an element or a substrate.

  Details of the present invention will be described below.

  The thermosetting resin composition according to the present invention includes a thermosetting resin and a curing agent for the thermosetting resin. In the thermosetting resin composition according to the present invention, after curing, the peak value of tan δ measured using a dynamic viscoelastic device is 0.5 or more, and the peak temperature of tan δ is 150 ° C. or more. It is characterized by that. In the present invention, since the peak value of tan δ of the cured product is 0.5 or more and the peak temperature of tan δ is 150 ° C. or more, the stress relaxation property is excellent, and excellent bonding reliability is given. If the peak value of tan δ is less than 0.5, the stress relaxation property may not be sufficient, and if the peak temperature is less than 150 ° C., the Tg is low and softening may occur during the reliability test, thereby reducing the reliability. .

  The thermosetting resin composition according to the present invention has a storage elastic modulus at 30 ° C. measured using a dynamic viscoelastic device in a range of 2000 to 4000 MPa, and a storage elastic modulus at 260 ° C. of 100 MPa or less. It is preferable. When the storage elastic modulus at 30 ° C. is less than 2000 MPa, the bonding strength near room temperature may not be sufficiently exhibited. When the storage elastic modulus at 30 ° C. exceeds 4000 MPa, the elastic modulus is too high and chip cracks, May cause warping. When the storage elastic modulus at 260 ° C. exceeds 100 MPa, it may cause a resin crack during solder reflow.

(Thermosetting resin)
Examples of the thermosetting resin include epoxy resins, thermosetting modified polyphenylene ether resins, thermosetting polyimide resins, urea resins, allyl resins, silicon resins, benzoxazine resins, and phenol resins. And unsaturated polyester resins, bismaleimide triazine resins, alkyd resins, furan resins, melamine resins, polyurethane resins, aniline resins, and the like. Among them, epoxy resins, thermosetting modified polyphenylene ether resins, thermosetting polyimide resins, urea resins, allyl resins, silicon resins, benzoxazine resins, phenol resins, unsaturated polyester resins, A bismaleimide triazine resin or the like is preferably used. These thermosetting resins may be used alone or in combination of two or more.

  A thermosetting resin is a liquid, semi-solid or solid at room temperature, and is composed of a relatively low molecular weight substance that exhibits fluidity at room temperature or under heating. It means a resin that is insoluble and infusible by forming a network-like three-dimensional structure while causing a chemical reaction such as a curing reaction or a cross-linking reaction to increase the molecular weight.

  In the present invention, an epoxy compound is more preferably used as the thermosetting resin. When an epoxy compound is used, the cooling cycle reliability and connection reliability can be further improved.

  In the thermosetting resin composition of the present invention, the epoxy compound that is a thermosetting resin refers to an organic compound having at least one oxirane ring.

  The epoxy compound is not particularly limited, and examples thereof include the following various epoxy resins and epoxy-containing compounds. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol type epoxy resin such as bisphenol S type epoxy resin, novolac type epoxy resin such as phenol novolac type epoxy resin, cresol novolac type epoxy resin, Aromatic epoxy resins such as trisphenol methane triglycidyl ether, naphthalene type epoxy resins, dicyclopentadiene type epoxy resins, and hydrogenated products and brominated products thereof; 3,4-epoxycyclohexylmethyl-3,4-epoxy Cyclohexanecarboxylate, 3,4-epoxy-2-methylcyclohexylmethyl-3,4-epoxy-2-methylcyclohexanecarboxylate, bis (3,4-epoxycyclohexane Syl) adipate, bis (3,4-epoxycyclohexylmethyl) adipate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 2- (3,4-epoxycyclohexyl-5,5-spiro-3, Alicyclic epoxy resins such as 4-epoxy) cyclohexanone-meta-dioxane, bis (2,3-epoxycyclopentyl) ether, trade name “EHPE-3150” (softening temperature 71 ° C., manufactured by Daicel Chemical Industries); 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether An aliphatic epoxy resin such as a polyglycidyl ether of a long-chain polyol containing a polyoxyalkylene glycol or a polytetramethylene ether glycol containing an alkylene group having 2 to 9 carbon atoms (preferably 2 to 4 carbon atoms); Glycidyl ester type epoxy resin such as phthalic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, diglycidyl-p-oxybenzoic acid, glycidyl ether-glycidyl ester of salicylic acid, dimer acid glycidyl ester, etc. And hydrogenated products thereof: triglycidyl isocyanurate, N, N′-diglycidyl derivative of cyclic alkylene urea, N, N, O-triglycidyl derivative of p-aminophenol, N, N, of m-aminophenol Glycidylamine type epoxy resins such as O-triglycidyl derivatives and their hydrogenated products; copolymers of glycidyl (meth) acrylate and radical polymerizable monomers such as ethylene, vinyl acetate and (meth) acrylate An epoxidized unsaturated carbon double bond of a polymer based on a conjugated diene compound such as epoxidized polybutadiene or a partially hydrogenated polymer thereof, such as epoxidized SBS A conjugated diene of a block copolymer having a polymer block mainly composed of a vinyl aromatic compound and a polymer block mainly composed of a conjugated diene compound or a polymer block of a partially hydrogenated product in the same molecule. Epoxidized unsaturated carbon double bond of the compound; NBR, CTBN, polybutadiene Diene rubber modified epoxy resin a rubber component was contained in the acrylic rubber; like, conventionally known various epoxy-containing compounds. As for the said epoxy compound, only 1 type may be used and 2 or more types may be used together.

  Among the above epoxy compounds, it is desirable to use at least a polymer containing a large amount of epoxy groups, which can dramatically improve the heat resistance of the cured thermosetting resin composition of the present invention. The polymer containing a large amount of such epoxy groups is not particularly limited, but an epoxy group-containing acrylic polymer is preferably used.

  The weight average molecular weight of the epoxy group-containing polymer is preferably in the range of 5,000 to 200,000, more preferably in the range of 10,000 to 100,000. When the weight average molecular weight is less than 5,000, the effect of improving the heat resistance may not be obtained, and when it exceeds 200,000, the storage stability may be lowered.

  When using the said epoxy group containing polymer, when the said epoxy compound whole is 100 weight part, it is desirable to use in 1 weight part-10 weight part in 100 weight part. When the amount is less than 1 part by weight, the heat resistance improvement effect may not be obtained so much. When the amount exceeds 10 parts by weight, the viscosity when a paste made of a thermosetting resin composition is produced becomes too high. In addition, there is a possibility that problems such as stringing are likely to occur. The epoxy equivalent of the epoxy group-containing polymer is preferably in the range of 200 to 1,000. An epoxy group-containing polymer having an epoxy equivalent in the range of 200 to 1,000 is desirable because it has excellent compatibility with other epoxy monomers, and thus can improve the heat resistance of the resulting cured product.

(Curing agent)
As the curing agent, any appropriate curing agent conventionally known as a curing agent for thermosetting resins can be used as long as it is not compatible with the thermosetting resin used. That is, as the curing agent, for example, phenolic curing agent, acid anhydride curing agent, latent curing agent such as dicyandiamide, diamine curing agent, imidazole curing agent, tertiary amine curing agent, phosphine curing agent Etc. In this invention, only 1 type may be used for the said hardening | curing agent and 2 or more types may be used together.

  The curing agent is generally an addition reaction type curing agent in a curing agent that reacts equivalently with a thermosetting resin, such as a curing agent such as phenol, acid anhydride, dicyandiamide, or diamine, and a polymerization reaction, that is, a thermosetting resin. And a curing agent that causes an ionic reaction (for example, imidazole, tertiary amine, or phosphine). The latter curing agent also has the effect of promoting the curing of the curing agent that reacts equivalently with the thermosetting resin. That is, the curing agent in the present invention includes a curing accelerator in a narrow sense.

  When only the above addition reaction type curing agent is used, the curing rate of the thermosetting resin is very slow, but functional groups such as esters and amines remain in the cured product, and between the crosslinking points. The distance is also moderate. Accordingly, the cured system is balanced, and a cured product having excellent adhesive strength is obtained.

  On the other hand, when only the polymerization reaction type curing agent is used, the curing rate is fast, but the main chain of the cured product is an ether bond, and this distance becomes very short. Accordingly, the stress relaxation property of the cured product is low and the adhesion reliability may be inferior.

  Therefore, it is preferable to combine the addition reaction type curing agent and the polymerization reaction type curing agent.

  When combining the above addition reaction type curing agent and polymerization reaction type curing agent, in order to adjust the pH of the cured product, an acidic addition reaction type curing agent such as phenol or acid anhydride, and imidazole are used. It is preferable to combine with a basic polymerization reaction type curing agent such as benzene or tertiary amine. Among them, it is most preferable to use a curing agent made of an acid anhydride and a curing agent made of imidazole in combination because of excellent workability and a wide range of material selectivity.

  Moreover, in this invention, it is required that the said hardening | curing agent does not have compatibility with the thermosetting resin used. But in this invention, you may use together the hardening | curing agent which has compatibility with the thermosetting resin used and the hardening | curing agent which does not have the said compatibility. When only the curing agent having compatibility with the thermosetting resin is used, the problem of short circuit failure due to the curing agent hardly occurs, but there is a problem that the stability is low during storage. Examples of the incompatible curing agent include a curing agent generally used for extracting the potential. More specifically, examples of the latent curing agent include dicyandiamide, hydrazide curing agent, amine adduct curing agent, microcapsule curing agent, and imidazole curing agent. Among these, since many types of curing agents are known, imidazole curing agents are preferably used.

  The imidazole curing agent has a structure represented by the following general formula (1), but in the present invention, it is necessary to use an imidazole curing agent that is incompatible with the epoxy compound to be used.

(In the formula, R ¹ and R ² are each a hydrogen atom or an alkyl group such as a methyl group, an ethyl group, a hydroxymethyl, or a phenyl group, a substituted alkyl group, an aryl group, etc., having 1 to 12, and preferably 1 to 6 carbon atoms A substituted or unsubstituted monovalent hydrocarbon group, R ³ is an alkyl group such as a methyl group, an ethyl group, a phenyl group or an allyl group, an alkenyl group, an aryl group and the like having 1 to 12, preferably 1 to 6 carbon atoms Or an unsubstituted monovalent hydrocarbon group, wherein R ⁴ is a hydrogen atom, an alkyl group such as a methyl group, an ethyl group, a cyanoethyl group or a benzyl group, a substituted alkyl group, an aralkyl group or the like, preferably 1 to 12 carbon atoms, A substituted or unsubstituted monovalent hydrocarbon group of 1 to 6 or a group represented by the following formula (2), and examples of the substituted monovalent hydrocarbon group include hydroxy-substituted and cyano-substituted groups. It is possible.)

  In the present invention, the addition ratio of the addition reaction type curing agent is preferably in the range of 30 to 95 equivalents, more preferably 50 to 90 equivalents with respect to 100 equivalents of the thermosetting resin. If it is less than 30 equivalents, it may be difficult to obtain a cured product having sufficient adhesive strength. If it exceeds 95 equivalents, the pot life may be increased and the physical properties of the cured product may be reduced. .

  Further, the blending ratio of the polymerization type curing agent, that is, the curing accelerator in a narrow sense, is 0.1 to 30 parts by weight with respect to a total of 100 parts by weight of the thermosetting resin and the addition reaction type curing agent. The amount is preferably 1 to 15 parts by weight. If the amount is less than 0.1 parts by weight, the curing rate may be extremely slow, and a good cured product may not be obtained. If the amount exceeds 30 parts by weight, the pot life is too short, and There is a possibility of causing deterioration of electrical characteristics due to the residual.

(Inorganic filler)
The thermosetting resin composition according to the present invention preferably contains no inorganic filler or contains an inorganic filler in a proportion of 10 parts by weight or less with respect to 100 parts by weight of the thermosetting resin. When the blending ratio of the inorganic filler is 10% by weight or less, chip cracks derived from inorganic substances and biting between the electrodes can be prevented.

  Examples of the inorganic filler include silica, but fumed silica having a particle size of nano-order is more preferable for preventing the above problems.

(Other additives)
In the thermosetting resin composition according to the present invention, other additives may be added as necessary within a range not impeding the achievement of the object of the present invention. Such additives include conductive powders, aliphatic hydroxyl group-containing compounds, thermoplastic resins, silane coupling agents, adhesion improvers, fillers, reinforcing materials, softeners, plasticizers, viscosity modifiers, thixotropics. Agents, stabilizers, antioxidants, colorants, dehydrating agents, flame retardants, antistatic agents, foaming agents, antifungal agents and the like. Only 1 type may be used for these additives and 2 or more types may be added.

  In the thermosetting resin composition according to the present invention, one or more kinds of various thermoplastic resins may be blended as other resin components. Moreover, a silane coupling agent may be mix | blended with the thermosetting resin composition which concerns on this invention. When a silane coupling agent is blended, moisture-resistant adhesion can be improved.

(Production method)
The method for producing the thermosetting resin composition according to the present invention is not particularly limited, and can be obtained by uniformly dispersing and mixing the various components. The dispersion / mixing method is not particularly limited, and examples thereof include a dispersion / kneading method using a three-roller, a raking machine, a planetary mixer, and the like. During mixing, the pressure may be reduced as necessary. Moreover, it is desirable to mix each component by using a planetary stirrer, whereby each component can be mixed uniformly and easily while avoiding the mixing of metal.

(Electronic parts)
An electronic component according to the present invention has an electronic component element and an electrode land to which the electronic component element is electrically connected on the surface by a cured product obtained by curing the thermosetting resin composition configured according to the present invention. It is characterized by being bonded to the electrode land of the substrate. Although it will not specifically limit if it is such a structure, Preferably, the electronic component element has a metal bump, and the structure where this metal bump is joined to the electrode land on a board | substrate with the said hardened | cured material can be mentioned. Such a structure is a structure in which an electronic component element is mounted on a substrate by the above-described flip chip mounting method, and is widely used for mounting a package substrate of a semiconductor chip, for example.

  FIG. 1 is a front sectional view schematically showing an example of such an electronic component of the present invention. In the electronic component 1, the electronic component element 2 has a plurality of metal bumps 3 on the lower surface. A plurality of electrode lands 5 are formed on the upper surface of the substrate 4. Here, the metal bump 3 and the electrode land 5 are joined and electrically connected by the sheet-like cured product 6 obtained by curing the thermosetting resin composition configured according to the present invention.

  The bonding method is not particularly limited, but a semi-cured sheet-like thermosetting resin composition is disposed on the substrate 4, and the side on which the metal bumps 3 of the electronic component element 2 are formed from above is used as the lower surface. What is necessary is just to make it press-contact and heat in the case of this press-contact. At the time of press contact, the sheet-like thermosetting resin composition is pushed away by the metal bump 3, and the metal bump 3 is mounted on the electrode land 5. And a sheet-like thermosetting resin composition hardens | cures by heating, and the sheet-like hardened | cured material 6 is formed. However, the present invention can also be applied to an electronic component formed by bonding an electronic component element not having the metal bump 3 to an electrode land on a substrate.

  Also for the electronic component element, various active components or passive components other than the semiconductor chip can be used. Furthermore, the board is not limited to a circuit board on which various electronic component elements are mounted, and may be a package material or the like.

  The thermosetting resin composition of the present invention includes a thermosetting resin and a curing agent for the thermosetting resin. In the present invention, after curing, the peak value of tan δ measured using a dynamic viscoelastic device is 0.5 or more and the peak temperature of tan δ is 150 ° C. or more. Has been improved. Thus, since the reliability of joining by hardened | cured material is improved, it can join members reliably only by hardening the thermosetting resin composition which concerns on this invention in the state which made members contact, for example. it can. Furthermore, the thermosetting resin composition of the present invention is excellent in reliability with respect to a cooling cycle.

  When the thermosetting resin is an epoxy compound, the bonding reliability and the cooling cycle reliability can be further improved.

  After curing, when the storage elastic modulus at 30 ° C. measured using a dynamic viscoelastic device is in the range of 2000 to 4000 MPa and the storage elastic modulus at 260 ° C. is 100 MPa or less, the bonding reliability and Cooling cycle reliability can be further improved.

  When the inorganic filler is not included or the inorganic filler is included in a proportion of 10 parts by weight or less with respect to 100 parts by weight of the thermosetting resin, for example, the inorganic filler adheres between the wiring electrodes, and the wiring on the substrate Occurrence of poor conduction between the electrode and the metal bump of the semiconductor chip can be suppressed. Moreover, in this invention, even when the mixture ratio of an inorganic filler is 10 weight part or less, it is excellent in joining reliability and cooling cycle reliability.

  The electronic component of the present invention includes an electronic component element and a substrate on which the electronic component element is mounted. In the electronic component of the present invention, since the electronic component element is bonded onto the substrate using the thermosetting resin composition configured according to the present invention, the bonding reliability between the substrate and the electronic component element is improved. Yes. In addition, it is possible to provide a mounting structure with excellent connection reliability. In particular, when the metal bumps of the electronic component and the electrode lands on the substrate are bonded by the thermosetting resin composition, the bonding reliability between the metal bumps and the electrode lands can be improved, so that the electrical connection Can be further improved in reliability.

If the bond strength between the electronic component element and the substrate is 120 N / 4 mm ² or more and the fracture surface when the electronic component element and the substrate are peeled off is not the interface between the electronic component element or the substrate, the substrate and the electronic The joining reliability with the component element is further enhanced.

  Hereinafter, the present invention will be clarified by describing specific examples and comparative examples of the present invention. The present invention is not limited to the following examples.

(Materials used)
(1) Epoxy compound Epoxy group-containing acrylic polymer: manufactured by NOF Corporation, product number: CP-30, weight average molecular weight 10,000, epoxy equivalent 500
Dicyclopentadiene type epoxy compound: manufactured by Dainippon Ink Co., Ltd., product number: HP7200
Naphthalene type epoxy: manufactured by Dainippon Ink, product number: HP4032D
Screw type A epoxy: manufactured by JER, product number: EP828
(2) Curing agent Trialkyltetrahydrophthalic anhydride: manufactured by JER, product number: YH-307
Methyltetrahydrophthalic anhydride: manufactured by Shin Nippon Rika Co., Ltd. Methyl hexahydrophthalic anhydride: manufactured by Shin Nippon Rika Co., Ltd. (3) Curing accelerator Imidazole-based curing agent: manufactured by Shikoku Kasei Kogyo Co., Ltd.
Imidazole-based curing agent: manufactured by Shikoku Kasei Kogyo Co., Ltd., product number: 2MZA
Microcapsule type latent curing agent: manufactured by Asahi Kasei Corporation, product number: HX3748
(4) Inorganic filler Silica: manufactured by Tokuyama Corporation, product number: SE-5

Example 1
The above materials were weighed into a 200 ml plastic container so as to have the composition shown in Table 1 below, and uniformly mixed with a planetary stirrer to obtain a paste. This paste was filtered under pressure using a polyester mesh having an opening diameter of 20 μm, and further filled into a 10 ml syringe to obtain a thermosetting resin composition of Example 1.

(Examples 2-5 and Comparative Examples 1-7)
As shown in Table 1 below, a thermosetting resin composition was obtained in the same manner as in Example 1 except that the blending ratio of the used materials was changed.

(Evaluation of Examples and Comparative Examples)
About each said thermosetting resin composition, (1) Measurement of the storage elastic modulus by a dynamic viscoelasticity measuring apparatus, (2) Measurement of tan-delta by a dynamic viscoelasticity measuring apparatus, (3) Adhesive force evaluation, (4) Evaluation of TCT cooling cycle reliability was performed as follows.

  As the cured product, the thermosetting resin composition obtained as described above was heat-cured in an oven at 170 ° C. for 30 minutes and then cut out to a width of 5 mm.

(1) Measurement of storage elastic modulus by dynamic viscoelasticity measuring device The storage elastic modulus E ′ at 30 ° C. and 260 ° C. was measured for the cured product using DVA-200 manufactured by IT Measurement Co., Ltd.

(2) Measurement of tan δ using a dynamic viscoelasticity measuring device Using a DVA-200 manufactured by IT Measurement Co., Ltd., the cured product was heated at a rate of temperature increase of 5 ° C./min. Peak temperature was measured.

(3) Adhesive strength evaluation A thermosetting resin composition is placed on the FR-4 substrate so that the adhesive area is 2 mm × 2 mm, and a spacer is bitten so that the gap is 50 μm. Was bonded at 230 ° C. for 20 seconds. This was heat-cured at 170 ° C. for 1 hour. Next, using a die shear tester, the shear strength and fracture mode at room temperature (30 ° C.) and 125 ° C. were evaluated at a speed of 300 μm / s.

(4) Evaluation of TCT thermal cycle reliability An FR-4 substrate (surface gold plating) was prepared in a daisy chain for a chip (172 pins, height t = 80 um) hit with a gold stud bump. . The thermosetting resin composition was placed on this FR-4 substrate. Thereafter, this chip was bonded under the conditions of 230 ° C., 20 seconds, and 8 kgf to obtain a bonded body. The initial resistance value of the obtained joined body was measured.

  Next, −40 ° C., 10 minutes → room temperature, 5 minutes → 125 ° C., 10 minutes was set as one cycle, and the obtained joined body was put in a thermostatic bath in which this cycle was continued. When a predetermined cycle passed, the joined body was taken out and the resistance value was measured. The number of cycles when the resistance value after the cycle changed by 30% or more with respect to the initial resistance value was evaluated.

  The results are shown in Table 1.

1 is a front cross-sectional view showing an example of an electronic component in which an electronic component element is bonded to a substrate with the thermosetting resin composition of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component 2 ... Electronic component element 3 ... Metal bump 4 ... Board | substrate 5 ... Electrode land

Claims (6)

A thermosetting resin composition comprising a thermosetting resin and a curing agent for the thermosetting resin,
A thermosetting resin composition having a tan δ peak value of 0.5 or more and a tan δ peak temperature of 150 ° C. or more measured using a dynamic viscoelastic device after curing. .   The thermosetting resin composition according to claim 1, wherein the thermosetting resin is an epoxy compound.   The storage elastic modulus at 30 ° C measured using a dynamic viscoelasticity device after curing is in the range of 2000 to 4000 MPa, and the storage elastic modulus at 260 ° C is 100 MPa or less. Thermosetting resin composition.   The thermosetting resin composition of any one of Claims 1-3 which does not contain an inorganic filler or contains an inorganic filler in the ratio of 10 weight part or less with respect to 100 weight part of the said thermosetting resins. object. An electronic component element, and a substrate on which the electronic component element is mounted,
An electronic component, wherein the electronic component element is bonded onto the substrate using the thermosetting resin composition according to any one of claims 1 to 4. The adhesive strength between the electronic component element and the substrate is 120 N / 4 mm ² or more, and the fracture surface when the electronic component element and the substrate are peeled off is not the interface between the electronic component element or the substrate. The electronic component according to claim 5, wherein:

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