JP2007009554A - Tile construction structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tile construction structure superior in sound insulating performance, and preventing the occurrence of cracking and a crack of a tile, in the tile construction structure of sticking and constructing the tile on a floor slab. <P>SOLUTION: A tile unit 2 is laid on the concrete floor slab 1. This tile unit 2 has a shock absorbing material layer 3 arranged in a bottom part, a backing material 4 arranged on the upper side of the shock absorbing material layer 3, a plurality of tiles 6 adhered on the backing material 4 via an adhesive layer 5, and a joint material 7 filled in a joint between the tiles 6. A large number of grooves 4a are arranged in parallel at a specific interval on an under surface of the backing material 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a tile construction structure in which tiles are constructed on a floor slab.

  If tiles are installed directly on the floor slab, walking sounds on the floor will propagate downstairs and the downstairs comfort will be impaired.

Japanese Patent Application Laid-Open No. 58-69959 describes a structure in which a sound insulating material such as foamed polyethylene is provided on a floor slab and tiles are constructed thereon.
JP-A-58-69959

  Bending stress generated in a tile when a load is applied to the tile from above when a tile is attached on a foamed polyethylene or the like laid on a floor slab as in JP-A-58-69959. Becomes large, and cracks and cracks are likely to occur in the tile.

  An object of the present invention is to provide a tile construction structure in which tiles are attached to a floor slab, which is excellent in sound insulation, and in which tile cracking and crack generation are prevented.

  In the tile construction structure of the present invention (Claim 1), a cushioning material layer is provided on a floor slab, a tile attaching base material is provided on the cushioning material layer, and the tile is bonded to the base material with an adhesive. The tile construction structure is affixed, and a plurality of grooves are provided on the lower surface of the base material.

  The tile construction structure of claim 2 is characterized in that, in claim 1, the adhesive is a high-rigidity adhesive.

  The tile construction structure according to claim 3 is characterized in that, in claim 1 or 2, a plurality of tiles are pasted on the base material, and the grooves are arranged below the joints between the tiles. Is.

  In the tile construction structure of the present invention, since the cushioning material layer is provided on the floor slab, noise and vibration transmitted from the upper floor to the lower floor are reduced.

  In the present invention, since the tile base material is disposed on the cushioning material layer and the tile is pasted thereon, bending stress generated in the tile when a load is applied to the tile from above is applied. Reduces cracking and tiles.

  In the present invention, a groove is provided on the lower surface of the tile-laying base material, and the space in the groove exhibits sound absorption or vibration-proofing action, so that noise and vibration propagating downstairs are extremely small.

  When using a high-rigidity adhesive with high rigidity after curing, such as an epoxy-based adhesive, the tile may be bent and deformed when a load is applied to the tile from above. It is also countered by the base material for attaching the tile, bending stress generated in the tile is further reduced, and cracking and cracking of the tile are sufficiently prevented.

  In addition, when the groove on the back of the tile attachment base material is placed below the joint between the tiles, if the tile attachment base material bends and deforms due to the load from above, this bending deformation is concentrated near the joint. As a result, the bending stress generated in the tile is further reduced, and cracking and cracking of the tile are more sufficiently prevented.

  Hereinafter, embodiments will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a tile construction structure according to the embodiment, and FIG. 2 is a perspective view seen from the lower side (bottom side) of the tile-laying base material used in the tile construction structure of FIG. is there.

  A tile unit 2 is laid on a concrete floor slab 1 in an apartment house or the like. The tile unit 2 includes a buffer material layer 3 disposed at the bottom, a tile pasting base material 4 disposed above the buffer material layer 3, and an adhesive 5 on the base material 4. A plurality of tiles 6 bonded together and a joint material 7 filled in joints between the tiles 6 are provided. On the lower surface of the base material 4, a large number of grooves 4 a are provided in parallel at regular intervals.

  Examples of the material constituting the buffer material layer 3 include polyolefin foams, nonwoven fabric sound absorbing materials, and asphalt sound absorbing materials. The thickness of the buffer material layer is preferably about 1 to 15 mm, particularly about 2 to 6 mm, especially about 3 to 5 mm.

  The thickness of the base material 4 is preferably about 5 to 20 mm, particularly about 9 to 15 mm. Various materials such as a plywood, a hard resin plate, and a hard foam can be used as the material constituting the base material 4.

  It is preferable that the base material 4 and the buffer material layer 3 have the same size.

  The groove 4a on the bottom surface of the base material 4 has a width of 0.5 to 3.0 mm, particularly 1.0 to 2.0 mm, and a depth of about 30 to 80%, particularly about 50 to 75% of the thickness of the base material 4. Preferably there is. The pitch of the grooves 4a is preferably about 10 to 30 mm, particularly about 15 to 20 mm.

  In this embodiment, the base material 4 has a rectangular shape, and each groove 4 a extends in a direction parallel to the short width direction of the base material 4.

  As the adhesive 5, an adhesive having a high rigidity (Young's modulus) after curing, such as an epoxy adhesive, a modified silicon or a urethane adhesive, is suitable. The layer thickness of the adhesive 5 is preferably about 0.3 to 3.0 mm, particularly about 0.5 to 1.5 mm.

  The tile 6 is ceramic in this embodiment, but may be made of stone or artificial stone such as artificial marble. The tile 6 is preferably a square having a side of 150 to 600 mm and a thickness of about 8.0 to 15 mm.

  The joint width between the tiles 6 is preferably about 2.0 to 10.0 mm, particularly about 3.0 to 5.0 mm.

  The joint material 7 is preferably an elastic joint material such as silicon or acrylic. As the tile unit 2, it is preferable that the buffer material layer 3 and the base material 4 are combined and integrated by an adhesive or a pressure-sensitive adhesive. And may be separate. In the latter case, the buffer material layer 3 may be larger than the base material 4.

  A plurality of tile units 2 are laid on the floor slab 1 so that the side end surfaces of the respective base materials 4 abut each other. Thereafter, the joint material is filled in the gap between the tiles 6 of each tile unit 2.

  The buffer material layer 3 and the floor slab 1 may be attached with an adhesive or an adhesive.

  In this embodiment, the arrangement pitch of the tiles 6 is an integral multiple of the pitch of the grooves 4 a, and the grooves 4 a exist below the joints between the tiles 6.

  In the tile construction structure configured as described above, since the buffer material layer 3 is provided on the floor slab 1, noise and vibration transmitted to the downstairs are small. In particular, in this embodiment, the groove 4a is provided on the bottom surface of the base material 4, and the space between the grooves 4a exhibits sound absorption and vibration-proofing action, and the noise and vibration propagating downstairs are extremely small. It becomes.

  Note that the grooves on the lower surface of the base material may be provided in a lattice shape.

  In this embodiment, since the base material 4 having higher rigidity than that is disposed on the relatively soft cushioning material layer 3 and the tile 6 is bonded to the base material 4, it is placed on the tile 6 from above. Even when a load is applied, the bending deformation of the tile 6 is small, and the tile 6 is prevented from cracking or cracking. In particular, in this embodiment, since the adhesive 5 having a high rigidity (Young's modulus) after curing is used, the bending deformation of the tile 6 when a load is applied to the tile 6 from above is the base material 4. Is also restrained by. For this reason, the amount of bending deformation of the tile 6 becomes small, and the crack and crack of the tile 6 are sufficiently prevented.

  In this embodiment, since the groove 4a is present below the joint, when the tile unit 2 is deformed so as to be warped by a load from above, the deformation of the tile unit 2 is concentrated on the joint. Thus, the deformation of the tile 6 is small. This also prevents the tile 6 from cracking or cracking.

It is a longitudinal cross-sectional view which shows the tile construction structure which concerns on embodiment. It is the perspective view seen from the lower side (bottom side) of the plywood used for the tile construction structure of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Floor slab 2 Tile unit 3 Buffer material layer 4 Tiling base material 5 Adhesive 6 Tile 7 Joint material

Claims (3)

A cushioning material layer is provided on the floor slab, a tile base material is provided on the buffer material layer, and a tile construction structure in which the tile is attached to the base material with an adhesive,
A tile construction structure, wherein a plurality of grooves are provided on a lower surface of the base material.   The tile construction structure according to claim 1, wherein the adhesive is a high-rigidity adhesive. In Claim 1 or 2, a plurality of tiles are pasted on the base material,
A tile construction structure in which the groove is disposed below a joint between tiles.

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