JP2007009026A5 - - Google Patents

Download PDF

Info

Publication number
JP2007009026A5
JP2007009026A5 JP2005190345A JP2005190345A JP2007009026A5 JP 2007009026 A5 JP2007009026 A5 JP 2007009026A5 JP 2005190345 A JP2005190345 A JP 2005190345A JP 2005190345 A JP2005190345 A JP 2005190345A JP 2007009026 A5 JP2007009026 A5 JP 2007009026A5
Authority
JP
Japan
Prior art keywords
resin
mass
less
particles
modifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005190345A
Other languages
Japanese (ja)
Other versions
JP4878129B2 (en
JP2007009026A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005190345A priority Critical patent/JP4878129B2/en
Priority claimed from JP2005190345A external-priority patent/JP4878129B2/en
Publication of JP2007009026A publication Critical patent/JP2007009026A/en
Publication of JP2007009026A5 publication Critical patent/JP2007009026A5/ja
Application granted granted Critical
Publication of JP4878129B2 publication Critical patent/JP4878129B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

本発明の要旨は、平均粒子径が20μm以上であり、10μm以下の粒子の占める割合が30質量%未満である樹脂用改質剤であって、40wの超音波を5分間照射した後に、10μm以下の粒子の占める割合が30質量%以上となり、その1次粒子の平均粒子径が300nm以上、600nm未満の範囲内にある樹脂用改質剤にある。
また、本発明の要旨は、前記樹脂用改質剤1〜40質量%と、熱可塑性樹脂もしくは硬化性樹脂99〜60質量%(両者の合計量が100質量%)からなる樹脂組成物にある。
更に本発明の要旨は、前記樹脂組成物を成形してなる成形品にある。
The gist of the present invention is a resin modifier having an average particle diameter of 20 μm or more and a proportion of particles of 10 μm or less of less than 30% by mass, and after irradiation with 40 w ultrasonic waves for 5 minutes, 10 μm The proportion of the following particles occupies 30% by mass or more, and the average particle size of the primary particles is in the range of 300 nm or more and less than 600 nm .
The gist of the present invention resides in a resin composition comprising 1 to 40% by mass of the resin modifier and 99 to 60% by mass of a thermoplastic resin or a curable resin (the total amount of both is 100% by mass). .
Furthermore, the gist of the present invention resides in a molded product formed by molding the resin composition.

本発明の樹脂用改質剤に用いるグラフト共重合体は、噴霧乾燥により回収されるが、この時熱可塑性樹脂や硬化性樹脂中での分散性を向上させるために、最終的に得られた乳化重合ラテックス粒子、すなわち1次粒子の平均粒子径が、300nm以上、600nm未満の範囲内にあることが必要である。さらに好ましくは400nm以上、600nm未満であり、より好ましくは500nm以上、600nm未満である。平均粒子径が300nmより小さい場合には、得られた粉体状樹脂用改質剤の1次粒子が融着し、良好な分散性を示すことが出来ない。また同様に粉体分散性制御の点から、ラテックス粒子の粒子径分布は、出来るだけ狭いほうが、さらに150nm以下の粒子は存在しても特に不都合は無いが、出来るだけ少ないほうがより好ましい。逆に700nm以上の場合、重合時の安定性が低下し、凝集物が増加するため、生産安定性、および重合体の回収率が著しく低下するため好ましくない。
なお、グラフト共重合体ラテックスには、必要に応じてあらかじめ適当な酸化防止剤や添加剤を加えることが出来る。
The graft copolymer used for the resin modifier of the present invention is recovered by spray drying, and at this time, it was finally obtained in order to improve the dispersibility in the thermoplastic resin and the curable resin. It is necessary that the average particle size of the emulsion polymerization latex particles, that is, the primary particles is in the range of 300 nm or more and less than 600 nm . More preferably, it is 400 nm or more and less than 600 nm , More preferably, it is 500 nm or more and less than 600 nm . When the average particle size is smaller than 300 nm, the primary particles of the obtained modifier for powdery resin are fused, and good dispersibility cannot be exhibited. Similarly, from the viewpoint of controlling powder dispersibility, the particle size distribution of latex particles is preferably as narrow as possible, and even if particles of 150 nm or less are present, there is no particular inconvenience, but it is more preferable that the particle size distribution is as small as possible. On the other hand, when the thickness is 700 nm or more, stability during polymerization is decreased and aggregates are increased, so that production stability and a polymer recovery rate are significantly decreased.
An appropriate antioxidant or additive can be added to the graft copolymer latex in advance as needed.

参考例、実施例1、比較例1〜3
硬化性樹脂100質量部に対して、得られた樹脂用改質剤を10質量部配合し、シート状成形試験片を得た。その試験片を用いて、アイゾット衝撃強度、及び樹脂用改質剤の分散性を評価した。結果を表2に示した。
なお、実施例における硬化性樹脂組成物には以下のものを使用した。
ビスフェノールA型エポキシ樹脂(旭電化(株)製アデカレジンEP−4100E)100部、テトラヒドロメチル無水フタル酸(旭電化(株)製アデカハードナーEH−3326)85部、および樹脂用改質剤10部を60℃にて攪拌機を用いて150rpmにて90分間攪拌した後、N−ベンジル−2−メチルイミダゾール1部を加え更に攪拌混合し、得られた組成物を金型に充填し80℃で2時間、120℃で6時間加熱して試験片を作成した。
また、評価方法は以下の方法を用いた。
(1)衝撃強度:シート状試験片を成形し切断後、ASTM D256に基づき評価した。(厚み:1/4インチ、単位:J/m)
(2)分散性:シート状試片を用い、試験片を液体窒素を用い凍結破断させ破断面をSEM観察することにより、樹脂用改質剤の分散状態(凝集状態)を用いて下記の基準で評価した。
○:10μm以上の粒子は観察されない。
△:50μm以上の粒子は観察されないが、10μm以上の粒子は観察される。
×:50μm以上の粒子が観察される。
Reference Example, Example 1 , Comparative Examples 1-3
10 parts by mass of the obtained resin modifier was blended with 100 parts by mass of the curable resin to obtain a sheet-shaped molded test piece. The Izod impact strength and the dispersibility of the resin modifier were evaluated using the test piece. The results are shown in Table 2.
In addition, the following were used for the curable resin composition in an Example.
100 parts of bisphenol A type epoxy resin (Adeka Resin EP-4100E manufactured by Asahi Denka Co., Ltd.), 85 parts of tetrahydromethylphthalic anhydride (Adeka Hardener EH-3326 manufactured by Asahi Denka Co., Ltd.), and 10 parts of a modifier for resin After stirring for 90 minutes at 150 rpm using a stirrer at 60 ° C., 1 part of N-benzyl-2-methylimidazole was added and further stirred and mixed, and the resulting composition was filled in a mold and stirred at 80 ° C. for 2 hours. A test piece was prepared by heating at 120 ° C. for 6 hours.
Moreover, the following method was used for the evaluation method.
(1) Impact strength: After a sheet-like test piece was molded and cut, it was evaluated based on ASTM D256. (Thickness: 1/4 inch, unit: J / m)
(2) Dispersibility: Using a sheet-like specimen, the specimen is freeze-fractured using liquid nitrogen and the fracture surface is observed by SEM, and the following criteria are used using the dispersion state (aggregation state) of the modifier for resin. It was evaluated with.
○: Particles of 10 μm or more are not observed.
Δ: Particles of 50 μm or more are not observed, but particles of 10 μm or more are observed.
X: Particles of 50 μm or more are observed.

Figure 2007009026
Figure 2007009026

Claims (3)

平均粒子径が20μm以上であり、10μm以下の粒子の占める割合が30質量%未満である樹脂用改質剤であって、40wの超音波を5分間照射した後に、10μm以下の粒子の占める割合が30質量%以上となり、その1次粒子の平均粒子径が300nm以上、600nm未満の範囲内にある樹脂用改質剤。 A resin modifier having an average particle diameter of 20 μm or more and a proportion of particles of 10 μm or less of less than 30% by mass, and a proportion of particles of 10 μm or less after 40 minutes of ultrasonic irradiation for 5 minutes Is a modifier for resin having an average particle diameter of primary particles in the range of 300 nm or more and less than 600 nm . 請求項1記載の樹脂用改質剤1〜40質量%と、熱可塑性樹脂もしくは硬化性樹脂99〜60質量%(両者の合計量が100質量%)からなる樹脂組成物。   A resin composition comprising 1 to 40% by mass of the resin modifier according to claim 1 and 99 to 60% by mass of a thermoplastic resin or a curable resin (the total amount of both is 100% by mass). 請求項2記載の樹脂組成物を成形してなる成形品。   A molded product formed by molding the resin composition according to claim 2.
JP2005190345A 2005-06-29 2005-06-29 Resin modifier and resin composition and molded product using the same Active JP4878129B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005190345A JP4878129B2 (en) 2005-06-29 2005-06-29 Resin modifier and resin composition and molded product using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005190345A JP4878129B2 (en) 2005-06-29 2005-06-29 Resin modifier and resin composition and molded product using the same

Publications (3)

Publication Number Publication Date
JP2007009026A JP2007009026A (en) 2007-01-18
JP2007009026A5 true JP2007009026A5 (en) 2008-08-07
JP4878129B2 JP4878129B2 (en) 2012-02-15

Family

ID=37747936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005190345A Active JP4878129B2 (en) 2005-06-29 2005-06-29 Resin modifier and resin composition and molded product using the same

Country Status (1)

Country Link
JP (1) JP4878129B2 (en)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3719241A1 (en) * 1987-06-06 1988-12-15 Roehm Gmbh SPRAY-DRYED EMULSION POLYMER, METHOD FOR THE PRODUCTION AND USE THEREOF AND MOLDING DIMENSIONED THEREOF
JP3165317B2 (en) * 1994-03-18 2001-05-14 株式会社トウペ Acrylic rubber compounding agent for vinyl chloride resin
JP3998762B2 (en) * 1997-07-23 2007-10-31 新第一塩ビ株式会社 Vinyl chloride resin granules for paste processing and method for producing the same
JP2000007788A (en) * 1998-06-23 2000-01-11 Jsr Corp Crosslinked particle dispersion in organic solvent and resin composition using the same
EP1162217B1 (en) * 1998-07-01 2008-12-24 Mitsubishi Rayon Co., Ltd. Fine acrylic polymer particles and plastisol containing the same
JP2002080709A (en) * 2000-09-06 2002-03-19 Teijin Chem Ltd Frame-retarded polycarbonate resin composition
JP2004018803A (en) * 2002-06-20 2004-01-22 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP2004269680A (en) * 2003-03-07 2004-09-30 Nagase Chemtex Corp Epoxy resin composition
WO2005012425A1 (en) * 2003-07-31 2005-02-10 Mitsubishi Rayon Co., Ltd. Resin composition for molding material and molded article made therefrom
KR100805505B1 (en) * 2004-02-16 2008-02-20 미츠비시 레이온 가부시키가이샤 Modifier for resin and resin composition using the same and formed article

Similar Documents

Publication Publication Date Title
Liu et al. Improving the fracture toughness of epoxy with nanosilica-rubber core-shell nanoparticles
KR20170098913A (en) Composition comprising a multistage polymer, it method of preparation and its use
JP5340558B2 (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same
JPH1149912A (en) Aqueous fluoropolymer dispersion and production of thermoplastic resin composition containing fluoropolymer
JP2007099820A (en) Powder composition, granulated form and molded product
JP2006233145A (en) Liquid epoxy resin composition
JP2013519745A (en) Use of mixtures in the preparation of impact modified thermoplastic compositions.
US20100305273A1 (en) Reaction resin comprising core-shell particles and method for the production thereof and the use thereof
JP2007009026A5 (en)
JP6874154B2 (en) Vinyl chloride resin latex composition and its manufacturing method
JP2008303269A (en) Granular talc and thermoplastic resin molding material containing the same
JP2017116810A5 (en)
JP5012124B2 (en) Epoxy resin powder coating
JP2017186224A (en) Aluminum phosphite and fire retardant resin composition
JP5208003B2 (en) Polymer fine particle dispersion composition and method for producing the same
JP3211243B2 (en) Method for mixing polytetrafluoroethylene molding powder and organic filler
JP2007246783A (en) Epoxy resin powder coating and method for producing the same
JP5350262B2 (en) Granule flaky glass production method, granule flaky glass and resin composition using the same
JP2009197052A (en) Resin composition
JPH10101844A (en) Heavy calcium carbonate filler and its production
JP2003231828A (en) Method for producing laminate for electric wiring board and varnish for prepreg
JP2007145933A (en) Polymer particle composition and thermoplastic resin composition containing the same
JP2006063176A (en) Polytetrafluoroethylene-containing powder composition and method for producing the same
JP2005060655A5 (en)
JP5760975B2 (en) Method for producing resin composition