JP2006339200A - Structure of pattern of substrate in flexible flat cable and soldering method in flexible flat cable - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make solder touch hard to occur so as to improve operability at the time of fitting a flexible flat cable to a pattern of a substrate. <P>SOLUTION: A plurality of patterns 4 and 5 for mounting terminals T of the flexible flat cable F are formed on a surface of the substrate 1 between a large pattern 2 for accumulating solder H after DIP and a large pattern 3 where solder H is finally accumulated at the time of mounting the flexible flat cable F. A solder mounting-side end part of one adjacent pattern 4 or 5 is formed to be long and the other solder mounting-side end part is formed to be short. A solder accumulation part 4a which is projected to a mounting direction in a square shape is formed in an end part of the pattern 4 formed to be long. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a structure of a substrate pattern in a flexible flat cable in which terminals of a flexible flat cable are attached to a pattern formed on the surface of the substrate by soldering, and a soldering method in the flexible flat cable.

  Conventionally, in order to connect a plurality of terminals of a flexible flat cable to a pattern formed on a substrate, for example, as shown in FIGS. As shown in FIGS. 1A and 1B, a large pattern 102 on one side for storing solder is formed on the substrate 101 after DIP, and the solder is finally attached when the flexible flat cable F is mounted. A larger pattern 103 on the other side to be accumulated is formed. Further, a plurality of patterns 104 for mounting a plurality of terminals T of the flexible flat cable F are formed between the large patterns 102 and 103. The plurality of patterns 104 are formed in the same length.

  However, the interval between the patterns 104 on which the plurality of terminals T of these flexible flat cables F are mounted is narrow, and after DIP in the direction of arrow A shown in FIG. 1A, when the terminals T shown in FIG. There has been a problem that a solder touch occurs when performing hand-approaching in the direction of arrow B.

  The first prior art is shown in FIGS. As shown in FIGS. 9 and 10, this conventional printed wiring board connection structure crosses the terminal portion conductor of the flexible wiring board 220 with the connection terminal portion 212 of the circuit pattern 211 formed on the hard printed wiring board 210. To be connected by soldering. Further, the pattern shape of one terminal portion 212 that becomes the bottom side during soldering is formed in a substantially semicircular arc shape, and two opposite sides of the shape of the pattern 201 of the other terminal portion 200 that rises intersecting are curved inward. It is formed in a substantially triangular shape that spreads at the bottom. (For example, refer to Patent Document 1).

  However, this increases the strength of the solder, and the touch of the solder has not been considered at all.

  A second prior art is shown in FIG. As shown in FIG. 11, this conventional circuit component connection terminal structure is a circuit component having a wire bundle of a plurality of connection terminals 302 formed planarly on a base 300A, 300B by a conductive film. The line located at the center of the bundle of terminals 302 is longer than the line located outside the bundle, and the center of the bundle of connection terminals 302 having the tip bent to the outside of the bundle and the connection terminals 309 of the IC unit 300C. The wire located at the outer side of the bundle is slightly shorter than the wire located at the outer side of the bundle, and the connection terminal 309 whose tip is bent toward the inner side of the bundle is overlapped and connected by soldering, and the connection terminal 302 is bent. The line width at the tip is larger than the line width at other locations. (For example, refer to Patent Document 2).

  However, in this case, the connection by the solder is improved, and it is not considered in the touch of the solder.

  A third prior art is shown in FIG. As shown in FIG. 12, this conventional flat cable soldering structure is such that the exposed conductor 409 at the end of the flat cable 401 is soldered to the substrate 405 so that the conductor 402 is located outside, and is bent. A double-sided adhesive tape 408 is sandwiched between the conductor exposed portions 409. (For example, refer to Patent Document 3).

However, in this case, the strength of soldering is increased, and the touch of solder is not considered at all.
JP-A 63-299190 JP-A-11-284304 Japanese Utility Model Publication No. 5-77968

  The present invention has been made in view of the above-described conventional problems, and when attaching a flexible flat cable to a pattern of a substrate, it is possible to make it difficult for solder touch to occur and to improve workability. It is an object of the present invention to provide a structure of a substrate pattern in a cable and a soldering method in a flexible flat cable.

The present invention has been proposed to solve the above-mentioned problems, and the invention according to claim 1 is such that the terminal of the flexible flat cable is attached to the pattern formed on the surface of the substrate by soldering. In the structure of the substrate pattern, a plurality of terminals for mounting the terminals of the flexible flat cable between a large pattern for collecting solder after DIP and a large pattern for finally collecting solder when the flexible flat cable is mounted. Is formed on the surface of the substrate, one solder mounting side end of the adjacent pattern is formed long, the other solder mounting side end is formed short, and the pattern of the long pattern is formed. A solder reservoir that protrudes in a square shape toward the mounting direction is formed at the end.

  According to a second aspect of the present invention, there is provided a substrate pattern structure in which a terminal of a flexible flat cable is attached to a pattern formed on the surface of the substrate by soldering, and a larger pattern for collecting solder after DIP A plurality of patterns for mounting the terminals of the flexible flat cable are formed on the surface of the substrate between the large pattern where the solder finally accumulates when the flexible flat cable is mounted, and one of the adjacent patterns The solder mounting side end is formed long and the other solder mounting side end is formed short.

  According to a third aspect of the present invention, in the second aspect of the present invention, a solder reservoir that protrudes in a square shape toward the mounting direction is formed at an end of the long pattern, and the short pattern is formed. An inclined cutout is formed on the long pattern side of the pattern.

  According to a fourth aspect of the present invention, in the second aspect of the present invention, a solder reservoir that protrudes in an arc shape toward the mounting direction is formed at an end of the long pattern.

  According to a fifth aspect of the present invention, there is provided a soldering method in which terminals of a flexible flat cable are attached to a pattern formed on a surface of a substrate by soldering, and a large pattern on one side for collecting solder after DIP, A plurality of patterns for mounting the end portion of the flexible flat cable are formed on the surface of the substrate adjacent to the larger pattern on the other side where the solder finally accumulates when the flexible flat cable is mounted. One solder mounting side end of the pattern is formed long and the other solder mounting side end is formed short, and the protruding solder reservoir is protruded toward the mounting direction at the end of the long pattern. In the DIP, the flexible flat cable is not placed on the pattern. DIP horizontally and when mounted, the flexible flat cable is placed on the pattern from the larger pattern side on the one side to the larger pattern side on the other side. It is characterized by the fact that the neighboring parts that do not touch are hand-made.

  According to the first aspect of the present invention, when mounting the terminals of the flexible flat cable, it is possible to release excess solder to the corners of the solder reservoir formed at the end of the pattern, so that the solder touch can be performed. It can be prevented from occurring. Furthermore, since the lengths of the patterns are different, it is difficult for the soldering iron in hand to contact the adjacent patterns at the same time, and as a result, it is possible to prevent a solder touch from occurring and workability can be improved.

  According to the second aspect of the present invention, since the pattern lengths are different, it is difficult for the soldering iron at the time of handing to touch the adjacent pattern at the same time, and as a result, it is possible to prevent a solder touch from occurring. Workability can be improved.

  According to the third aspect of the present invention, when mounting the terminals of the flexible flat cable, it is possible to allow excess solder to escape to the corners of the solder reservoir formed at the end of the pattern, so that the solder touch can be performed. It can be prevented from occurring. In addition, since the notched portion inclined on the long pattern side in the short pattern is formed, the interval between the end portions of the adjacent patterns is increased, and it is possible to prevent further solder touch. .

  According to the fourth aspect of the present invention, when mounting the terminals of the flexible flat cable, it is possible to release excess solder to the arc-shaped solder reservoir formed at the end of the pattern, so that the solder touch can be performed. It can be prevented from occurring.

  According to the fifth aspect of the present invention, since the protruding solder reservoir is formed at the end of the long pattern of adjacent patterns, an extra portion of the protruding solder reservoir is mounted when the flexible flat cable is mounted. Therefore, it is possible to prevent a solder touch from occurring. In addition, since the lengths of the end portions of the adjacent patterns are different from each other, it is difficult for the soldering iron in hand-wearing to contact the adjacent patterns at the same time, and as a result, it is possible to prevent a solder touch from occurring.

  Hereinafter, the structure of the pattern of the board | substrate in the flexible flat cable which concerns on this invention, and the soldering method in a flexible flat cable are demonstrated, referring a figure.

  FIG. 1 shows a first embodiment of a substrate pattern structure in a flexible flat cable according to the present invention, and is a schematic plan view showing a state of solder accumulation during DIP. FIG. 2 is a solder when mounting a flexible flat cable having the same structure. It is a schematic plan view which shows the accumulation condition of.

  The structure of the substrate pattern in the flexible flat cable according to the first embodiment is that, as shown in FIGS. 1 and 2, large trapezoidal patterns 2 and 3 having large upper and lower ends in the figure are formed on the surface of the substrate 1. A plurality of patterns 4 and 5 for connecting the terminals T of the flexible flat cable F are formed therebetween. Of the plurality of adjacent patterns 4 and 5, the upper pattern 4 is formed long on the left end side in the figure, and a rectangular solder reservoir 4 a is formed on the lower side in the figure. The lower pattern 5 is formed with a short right end in the drawing.

  As shown in FIG. 1, when DIP is performed in the direction of arrow A, the solder H is accumulated on the left side in the patterns 2, 3, 4, and 5 diagrams. This is because the solder H tends to accumulate on the rear side with respect to the DIP direction. As shown in FIG. 2, when the flexible flat cable F is mounted, if the vicinity of the terminal T that does not contact the terminal T is worn from the upper side to the lower side in the drawing, the extra solder H particularly in the square solder reservoir 4a. And the solder H tends to accumulate in this portion.

  Therefore, it is possible to prevent a solder touch from occurring. Furthermore, since the lengths of the patterns 4 and 5 are different, it is difficult for the soldering iron at the time of wearing to be in contact with the adjacent patterns 4 and 5 at the same time, and as a result, it is possible to prevent a solder touch from occurring, and workability is improved. Can be improved. In addition, when the terminal T of the flexible flat cable F is worn, the solder in the vicinity of the terminal T is heated and melted, and accordingly, the solder in the terminal T portion is also melted and the terminal T is connected. .

  FIG. 3 shows the structure of the flexible flat cable substrate pattern of the second embodiment, and is a schematic plan view showing the state of solder accumulation during DIP. FIG. 4 is the state of solder accumulation when the flexible flat cable having the same structure is mounted. It is a schematic plan view which shows. In addition, the same code | symbol is attached | subjected to the same member and the same location as the said 1st Embodiment, and the description is abbreviate | omitted.

  In the second embodiment, as shown in FIGS. 3 and 4, a cutout portion 5 a is formed such that the left end of the pattern 5 formed short is inclined toward the pattern 4 formed long. Therefore, it is possible to prevent the solder touch from occurring further because the distance between the long pattern 4 and the adjacent patterns 4 and 5 is increased.

  FIG. 5 is a schematic plan view showing the structure of the substrate pattern of the flexible flat cable according to the third embodiment, and shows the state of solder accumulation during DIP. FIG. 6 is the state of solder accumulation when the flexible flat cable having the same structure is mounted. It is a schematic plan view which shows. In addition, the same code | symbol is attached | subjected to the same member and the same location as above-mentioned 1st Embodiment, and the description is abbreviate | omitted.

  In the third embodiment, as shown in FIGS. 5 and 6, a solder reservoir portion 4 b that protrudes downward in a circular arc shape is formed on the left end side in the long pattern 4. Therefore, when the terminal T of the flexible flat cable F is mounted, the excess solder H can be released to the arc-shaped protruding solder reservoir 4b formed at the end of the pattern 4, thereby preventing the occurrence of solder touch. be able to.

  FIG. 7 is a schematic plan view showing the structure of the substrate pattern of the flexible flat cable of the fourth embodiment.

  In the fourth embodiment, as shown in FIG. 7, among the plurality of patterns 4 and 5, the left end side of the upper pattern 4 in the figure is long and the left end side of the lower pattern 5 is short. . Note that the arrow A indicates the DIP direction, and the arrow B indicates the clothing direction. According to the fourth embodiment, since the lengths of the patterns 4 and 5 are different, it is difficult for the soldering iron at the time of wearing to be in contact with the adjacent patterns 4 and 5 at the same time, thereby preventing the occurrence of solder touch. Workability can be improved.

1 is a schematic plan view showing a first embodiment of a substrate pattern structure in a flexible flat cable of the present invention and showing how solder is accumulated during DIP. FIG. It is a schematic plan view which shows the accumulation condition of the solder at the time of mounting of the flexible flat cable of the structure. It is a schematic plan view which shows the structure of the pattern of the board | substrate of the flexible flat cable of 2nd Embodiment, and shows the accumulation condition of the solder at the time of DIP. It is a schematic plan view which shows the accumulation condition of the solder at the time of mounting of the flexible flat cable of the structure. It is a schematic plan view which shows the structure of the pattern of the board | substrate of the flexible flat cable of 3rd Embodiment, and shows the accumulation condition of the solder at the time of DIP. It is a schematic plan view which shows the accumulation condition of the solder at the time of mounting of the flexible flat cable of the structure. It is a schematic plan view which shows the structure of the pattern of the board | substrate of the flexible flat cable of 4th Embodiment. The structure of the pattern of the board | substrate of the conventional flexible flat cable is shown, (a) is a schematic plan view which shows the state at the time of the DIP, (b) is a schematic plan view which shows the state at the time of the mounting of the flexible flat cable. It is a disassembled perspective view which shows the connection structure of the conventional printed wiring board. It is a perspective view which shows the state at the time of the connection of the structure. It is a disassembled perspective view which shows the connection terminal structure of the conventional circuit component. It is a longitudinal cross-sectional view of the soldering structure of the conventional flat cable.

Explanation of symbols

F Flexible flat cable T Terminal H Solder 1 Substrate 2 Large pattern at the upper end 3 Large pattern at the lower end 4 Long pattern 4a Square solder reservoir 4b Arc-shaped solder reservoir 5 Short pattern 5a Notch

Claims (5)

  In the structure of the substrate pattern in which the terminal of the flexible flat cable is attached to the pattern formed on the surface of the substrate by soldering, when the flexible flat cable is finally mounted with a large pattern for collecting solder after DIP A plurality of patterns for mounting the terminals of the flexible flat cable are formed on the surface of the substrate between the large pattern where the solder accumulates, and one end of the solder mounting side of the adjacent pattern is formed long. The other solder mounting side end portion is formed short and a flexible solder pool portion is formed at the end portion of the long pattern so as to project in a square shape toward the mounting direction. The structure of the substrate pattern in a flat cable.   In the structure of the substrate pattern in which the terminal of the flexible flat cable is attached to the pattern formed on the surface of the substrate by soldering, when the flexible flat cable is finally mounted with a large pattern for collecting solder after DIP A plurality of patterns for mounting the terminals of the flexible flat cable are formed on the surface of the substrate between the large pattern where the solder accumulates, and one end of the solder mounting side of the adjacent pattern is formed long. The structure of the pattern of the board | substrate in the flexible flat cable characterized by the other solder mounting side edge part being formed short.   A solder reservoir that protrudes in a square shape toward the mounting direction is formed at an end of the long pattern, and a notch that is inclined toward the long pattern side of the short pattern is formed. The structure of the pattern of the board | substrate in the flexible flat cable of Claim 2.   The structure of the pattern of the board | substrate in the flexible flat cable of Claim 2 in which the solder reservoir part protruded in circular arc shape toward the mounting direction is formed in the edge part of the said long pattern.   In the soldering method in which the terminals of the flexible flat cable are attached to the pattern formed on the surface of the substrate by soldering, when the flexible flat cable is finally mounted with the larger pattern on one side for collecting solder after DIP A plurality of patterns for mounting the end portion of the flexible flat cable are formed on the surface of the substrate between the larger pattern on the other side where the solder accumulates, and one solder mounting side end portion of the adjacent pattern Is formed long, the other end of the solder mounting side is short, and a protruding solder reservoir protruding toward the mounting direction is formed at the end of the long pattern, and the flexible flat is formed during DIP. DIP horizontally with respect to the pattern with no cable placed on the pattern During mounting, the vicinity of the flexible flat cable that is not in contact with the flexible flat cable from the larger pattern side on the one side to the larger pattern side on the other side is hand-mounted while the flexible flat cable is placed on the pattern. A soldering method for a flexible flat cable, characterized in that: