JP2006334766A - Microfabrication method and microfabrication device - Google Patents

Microfabrication method and microfabrication device Download PDF

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JP2006334766A
JP2006334766A JP2005165833A JP2005165833A JP2006334766A JP 2006334766 A JP2006334766 A JP 2006334766A JP 2005165833 A JP2005165833 A JP 2005165833A JP 2005165833 A JP2005165833 A JP 2005165833A JP 2006334766 A JP2006334766 A JP 2006334766A
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potential
metal workpiece
oxide film
electrode
metal oxide
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JP4529802B2 (en
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Kazuhiro Shigyo
和浩 執行
Tatsushi Sato
達志 佐藤
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Mitsubishi Electric Corp
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<P>PROBLEM TO BE SOLVED: To provide a microfabricating method and a microfabricating device capable of machining from several μms to several hundreds of μms, mainly from ten and several μms to several tens of μms in manufacturing a mold used for injection molding and press molding. <P>SOLUTION: Microfabrication is carried out by continuously applying a voltage pulse Vp26 to dissolve a surface of a Fe mold material 4 after dissolving and removing a Fe<SB>2</SB>O<SB>3</SB>film 21 by applying the voltage pulse Vp26 on a surface of the Fe mold material 4 on which the Fe<SB>2</SB>O<SB>3</SB>film 21 is formed through a probe electrode 7 brought close to the surface of the Fe mold material 4 in an electrolytic solution 5 after forming the Fe<SB>2</SB>O<SB>3</SB>film 21 which is a metal oxide film on the surface of the Fe mold material 4 by electrochemical reaction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、例えば射出成形やプレス成形に用いる金型の製造における微細加工方法及び微細加工装置に関するものである。   The present invention relates to a fine processing method and a fine processing apparatus in the manufacture of a mold used for, for example, injection molding or press molding.

近年の電子機器の高密度化、小型化により、微細加工に対する要請が大きくなっている。特にセンサー、アクチュエータの集積化、超小型化が重要になっている。例えば、光磁気ヘッド用のマイクロレンズでは、数μｍから数百μｍ、主として十数μｍから数十μｍ程度の三次元的な微細加工が要求される。このため、微細な形状を持つ電子部品を作るために、金型の製造に対する微細加工技術が必要とされている。従来、金型の加工技術として、切削や研削、研磨などの機械加工、放電加工、電解研磨加工が知られている。中でも、金型の微細加工方法として、加工寸法、加工精度に優れている放電加工による方法が広く用いられている。型彫り加工の放電加工は、放電現象を利用し、数μｍから十数μｍ離した電極と被加工物の間でパルス性アーク放電による絶縁破壊の際に生じる電気火花（スパーク）によって被加工物から導電性物質を除去するもので、一般の機械加工が困難な材質や複雑な形状の加工に使用されている。
しかしながら、放電加工においては加工の際に生じる加工屑（スラッジ）が被加工物の加工精度を低下させてしまうという問題があった。加工中に発生するスラッジが絶縁性の加工液中に浮遊して電極と被加工物の間に介在すると、スラッジと電極の間で二次放電が生じるため、放電が一部に偏在してしまい所望の形状に加工することができない。また、この現象が更に進むと異常放電が発生する場合もある。このため、被加工物の加工精度の低下のみならず、加工面粗度の劣化や加工速度の低下も引き起こしてしまう。これらの問題を解決するために、超音波振動により加工液を流動させ、スラッジを加工部分より除去する方法が提案されている（例えば、特許文献１参照）。 Due to the recent increase in density and miniaturization of electronic devices, the demand for microfabrication has increased. In particular, integration of sensors and actuators and miniaturization are important. For example, a microlens for a magneto-optical head requires three-dimensional microfabrication of several μm to several hundred μm, mainly about several tens of μm to several tens of μm. For this reason, in order to make an electronic component having a fine shape, a fine processing technique for manufacturing a mold is required. Conventionally, machining techniques such as cutting, grinding, and polishing, electric discharge machining, and electrolytic polishing are known as mold processing techniques. Among these, a method using electric discharge machining that is excellent in machining dimensions and machining accuracy is widely used as a fine machining method of a mold. Electric discharge machining of die-sculpture processing uses the electric discharge phenomenon, and the work piece is caused by an electric spark (spark) generated in the case of dielectric breakdown due to pulsed arc discharge between the electrode and the work piece separated by several to tens of micrometers. It is used to remove materials that are difficult to machine and complex shapes.
However, in the electric discharge machining, there is a problem that machining waste (sludge) generated during machining reduces the machining accuracy of the workpiece. If sludge generated during machining floats in the insulating working fluid and is interposed between the electrode and the workpiece, secondary discharge occurs between the sludge and the electrode, and the discharge is unevenly distributed in part. It cannot be processed into a desired shape. Further, when this phenomenon further proceeds, abnormal discharge may occur. For this reason, not only the processing accuracy of the workpiece is reduced, but also the roughness of the processed surface and the processing speed are reduced. In order to solve these problems, a method has been proposed in which a machining fluid is flowed by ultrasonic vibration and sludge is removed from a machining portion (see, for example, Patent Document 1).

特開２００２−３３７０２６号公報（第３頁から第４頁、図４）JP 2002-337026 A (page 3 to page 4, FIG. 4)

従来の放電加工を用いた微細加工方法においては、微細度は加工電極の寸法や加工電極と被加工物との間の距離とその制御の精度に依存する。従来の放電加工では、加工電極の最小の大きさが５０μｍ径程度であり、６５μｍ程度の穴あけ加工は可能である。しかしながら、放電加工においては液中でのアーク現象による熱的溶融・除去作用を利用しているため、加工面には変質層や欠陥が発生する。変質層の厚さは２０μｍから５０μｍにも達し、この変質層内にはピットやクラックがある。このため金型の成形加工時の熱変形によって、金型の欠損、割れが生じる可能性があった。
上述した変質層を除去するにはショットブラスト等による研磨が用いられるが、変質層の除去が必要であるため、加工精度は低下し、微細で複雑な形状の金型を作ることが困難であるという問題があった。 In the conventional micromachining method using electric discharge machining, the fineness depends on the dimensions of the machining electrode, the distance between the machining electrode and the workpiece, and the accuracy of the control. In the conventional electric discharge machining, the minimum size of the machining electrode is about 50 μm in diameter, and drilling of about 65 μm is possible. However, since electric discharge machining utilizes the thermal melting / removal action due to the arc phenomenon in the liquid, a deteriorated layer or a defect is generated on the machined surface. The thickness of the altered layer reaches 20 μm to 50 μm, and there are pits and cracks in the altered layer. For this reason, there is a possibility that the mold may be broken or cracked due to thermal deformation during the molding process.
Polishing by shot blasting or the like is used to remove the above-mentioned deteriorated layer. However, since it is necessary to remove the deteriorated layer, the processing accuracy is lowered and it is difficult to make a mold having a fine and complicated shape. There was a problem.

この発明は、数μｍから数百μｍ、主として十数μｍから数十μｍの微細な加工が可能な金型の微細加工方法及び微細加工装置を提供することを目的としている。   An object of the present invention is to provide a mold micromachining method and a micromachining apparatus capable of performing micromachining of several μm to several hundred μm, mainly ten to several tens of μm.

上記課題を解決するために、この発明に係る微細加工方法及び微細加工装置においては、金属被加工物に金属酸化膜を形成する工程と、陽電極上に載置された前記金属被加工物と前記金属酸化膜の加工部位に近接して配設されたプローブ電極とを電解液中に配置し、前記プローブ電極に電圧パルスを印加して、前記金属酸化膜の電位を不動態溶解電位にして、かつ、前記電解液と前記金属酸化膜とを化学反応させ、前記金属酸化膜の所定の部分を除去する工程と、を有するものである。
また、陽電極上に載置された金属被加工物と前記金属被加工物の加工部位に近接して配設されたプローブ電極とを電解液中に配置し、前記プローブ電極に電圧パルス印加して、前記金属被加工物の電位を不動態溶解電位にして、かつ、前記電解液と前記金属被加工物とを化学反応させ、前記金属被加工物の所定の部分に金属酸化膜を形成する工程と、前記金属酸化膜が形成されていない前記金属被加工物の部位のみを溶解する工程と、を有するものであってもよい。 In order to solve the above problems, in the micromachining method and the micromachining apparatus according to the present invention, a step of forming a metal oxide film on a metal workpiece, and the metal workpiece placed on the positive electrode, A probe electrode disposed in the vicinity of the processing site of the metal oxide film is placed in an electrolyte solution, and a voltage pulse is applied to the probe electrode to make the potential of the metal oxide film a passive dissolution potential. And a step of chemically reacting the electrolytic solution and the metal oxide film to remove a predetermined portion of the metal oxide film.
Further, a metal workpiece placed on the positive electrode and a probe electrode arranged in the vicinity of the machining site of the metal workpiece are arranged in an electrolyte solution, and a voltage pulse is applied to the probe electrode. Then, the potential of the metal workpiece is set to a passive dissolution potential, and the electrolytic solution and the metal workpiece are chemically reacted to form a metal oxide film on a predetermined portion of the metal workpiece. And a step of dissolving only a portion of the metal workpiece on which the metal oxide film is not formed.

この発明によれば、電気化学反応を利用した加工方法を用いて、金属被加工物の表面に形成した金属酸化膜を微細加工し、エッチングマスクとして利用しているため、金属被加工物の加工時に電解液の拡散の影響を受けず、数μｍから数百μｍの微細な加工が可能になる。   According to the present invention, the metal oxide film formed on the surface of the metal workpiece is finely processed using a processing method using an electrochemical reaction, and is used as an etching mask. Sometimes fine processing of several μm to several hundred μm is possible without being affected by the diffusion of the electrolyte.

この発明の実施の形態として、微細加工装置を用いて、金属被加工物として例えば鉄（Ｆｅ）金型の型彫り加工の実施例に基づき図面を参照して説明する。
実施の形態１．
図１は、この発明の実施の形態１における微細加工装置の略斜視断面図を示している。図１において、Ｘ−Ｙ軸方向に移動可能なステージ１上には、容器２が固定されており、この容器２の中には陽電極３が配置され、この陽電極３上には金属被加工物４であるＦｅ金型材４が載置されている。容器２には電解液５が満たされており、Ｆｅ金型材４の表面の近傍には、陰電極６が配置され、さらに、Ｆｅ金型材４表面上には、近接してプローブ電極７が配設され、このプローブ電極７は、先端部を残して絶縁被覆８で保護されている。また、プローブ電極７には、Ｚ軸方向に移動できるように駆動装置９が取付けられている。電源１０と陽電極３、陰電極６及びプローブ電極７とは導電線１１、１２及び１３により、それぞれ電気的に接続されている。容器２の電解液５中には、参照電極１４が配置されており、その一端には電位計測器１５が取付けられている。ステージ１、プローブ電極７の位置決め、プローブ電極７と陽電極３間及び陽電極３と陰電極６との間に印加する電圧を制御する手段は、駆動装置９、電源１０および電位計測器１５が信号線１６、１７、１８及び１９を介して、制御装置２０によりに構成されている。 An embodiment of the present invention will be described with reference to the drawings on the basis of an example of an iron (Fe) mold engraving process as a metal workpiece using a fine processing apparatus.
Embodiment 1 FIG.
1 is a schematic perspective sectional view of a microfabrication apparatus according to Embodiment 1 of the present invention. In FIG. 1, a container 2 is fixed on a stage 1 movable in the XY axis direction, and a positive electrode 3 is disposed in the container 2, and a metal coating is placed on the positive electrode 3. An Fe mold material 4 which is a workpiece 4 is placed. The container 2 is filled with an electrolytic solution 5, a negative electrode 6 is disposed in the vicinity of the surface of the Fe mold material 4, and a probe electrode 7 is disposed on the surface of the Fe mold material 4 in close proximity. The probe electrode 7 is protected by an insulating coating 8 except for the tip. A drive device 9 is attached to the probe electrode 7 so as to be movable in the Z-axis direction. The power supply 10 and the positive electrode 3, the negative electrode 6, and the probe electrode 7 are electrically connected by conductive wires 11, 12, and 13, respectively. A reference electrode 14 is disposed in the electrolytic solution 5 of the container 2, and a potential measuring device 15 is attached to one end thereof. The means for controlling the stage 1, positioning of the probe electrode 7, and the voltage applied between the probe electrode 7 and the positive electrode 3 and between the positive electrode 3 and the negative electrode 6 include the driving device 9, the power supply 10 and the potential measuring device 15. The control device 20 is configured through signal lines 16, 17, 18 and 19.

次に、実施の形態１における微細加工方法の原理について、図１を参照して説明する。図２は、電解液５中で電位を変化させた場合にＦｅ金型材４の表面における電位−電流特性を示すものである。まず、図２を用いて、電解液中で電圧が印加されたＦｅ金型材４の表面に見られる電気化学現象について説明する。
ここでは、参照電極１４と電位計測器１５を用いてＦｅ金型材４表面の電位を測定し、それに対応した電圧を印加した結果を次に説明する。図２においては、横軸は電位Ｖを、縦軸は電流Ｉを対数表示したものを表わしており、電位Ｖは参照電極１４を基準にしている。なお、図２中のＳＨＥは標準水素電位を表わす。
ここでは、電解液５としては、１Ｌ（リットル）の水にホウ酸（Ｈ２ＢＯ３）を１６．７ｇ、ホウ砂（Ｎａ２Ｂ４Ｏ７・１０Ｈ２Ｏ）を２．８６ｇ溶かしたもので、ｐＨ７．２の水溶液とした実施例について説明する。容器２の電解液５中に金属被加工物４であるＦｅ金型材４を陽電極３の上に載せ、陰電極６との間に印加する電圧を増加させた場合の電位−電流特性２２は、３つの領域に分けられる。
まず、第一の領域である電位Ｖａ（本実施例では、−０．２Ｖ）までは、活性溶解領域２３と呼ばれる領域で、電位Ｖの増加とともに電流Ｉが増加し、Ｆｅ金型材４からＦｅイオンが電解液５により溶解される。この状態でのＦｅ金型材４の表面電位を活性溶解電位と呼ぶ。次に、第二の領域である電位ＶａからＶｂの間は、不動態形成領域２４と呼ばれる領域で、電位Ｖが増加しても電流Ｉがあまり流れず一定の値となる状態であり、この領域では、Ｆｅは電解液５で溶解されず、Ｆｅ金型材４表面に不動態膜であるＦｅの酸化膜Ｆｅ２Ｏ３（三二酸化鉄）膜２１が形成される。この状態におけるＦｅ金型材４の表面電位を不動態形成電位と呼ぶ。さらに、第三の領域である電位Ｖｂ（本実施例では、１．３Ｖ）以上は、不動態溶解領域２５と呼ばれる領域で、電位Ｖを増加させると、再び電流Ｉが急激に増加し、Ｆｅ金型材４やＦｅ２Ｏ３膜２１を溶解する状態になる。この状態でのＦｅ金型材４の表面電位を不動態溶解電位と呼ぶ。 Next, the principle of the fine processing method in the first embodiment will be described with reference to FIG. FIG. 2 shows the potential-current characteristics on the surface of the Fe mold material 4 when the potential is changed in the electrolytic solution 5. First, the electrochemical phenomenon seen on the surface of the Fe mold material 4 to which a voltage is applied in the electrolytic solution will be described with reference to FIG.
Here, the result of measuring the potential on the surface of the Fe mold material 4 using the reference electrode 14 and the potential measuring device 15 and applying the corresponding voltage will be described. In FIG. 2, the horizontal axis represents the potential V and the vertical axis represents the logarithm of the current I. The potential V is based on the reference electrode 14. Note that SHE in FIG. 2 represents a standard hydrogen potential.
Here, as the electrolytic solution 5, 16.7 g of boric acid (H 2 BO 3 ) and 2.86 g of borax (Na 2 B 4 O 7 · 10 H 2 O) are dissolved in 1 L (liter) of water. An example in which the aqueous solution has a pH of 7.2 will be described. A potential-current characteristic 22 in the case where the Fe mold material 4 as the metal workpiece 4 is placed on the positive electrode 3 in the electrolytic solution 5 of the container 2 and the voltage applied to the negative electrode 6 is increased is as follows. Divided into three areas.
First, up to potential Va (-0.2 V in this embodiment), which is the first region, current I increases with increasing potential V in a region called active dissolution region 23, and Fe mold material 4 increases Fe to Fe. Ions are dissolved by the electrolytic solution 5. The surface potential of the Fe mold material 4 in this state is called an active dissolution potential. Next, between the potentials Va and Vb, which is the second region, a region called a passive formation region 24 is a state in which the current I does not flow so much even when the potential V increases and becomes a constant value. In the region, Fe is not dissolved by the electrolytic solution 5, and a Fe oxide film Fe 2 O 3 (iron trioxide) film 21 as a passive film is formed on the surface of the Fe mold material 4. The surface potential of the Fe mold material 4 in this state is called a passive formation potential. Further, the potential Vb (1.3 V in this embodiment) or more which is the third region is a region called the passive dissolution region 25. When the potential V is increased, the current I rapidly increases again, and Fe The mold material 4 and the Fe 2 O 3 film 21 are dissolved. The surface potential of the Fe mold material 4 in this state is called a passive dissolution potential.

上述の現象は、電圧印加による電解液５とＦｅとの化学反応により起こる。電流値は電気化学反応速度に対応しており、電流値が大きいほど、溶解速度が大きいことを示す。なお、Ｆｅ金型材４以外の金属材料についても同様の現象が起こる。ここで、電位計測器１５は参照電極１４が検出した電位信号を処理し、信号線１９を通して制御装置２０に送るものである。参照電極１４としては、電気化学の分野で一般に用いられる代表的なＳＣＥ（飽和カロメル電極）やＡｇ（銀）−ＡｇＣｌ（塩化銀）電極を用いる。   The above phenomenon occurs due to a chemical reaction between the electrolytic solution 5 and Fe caused by voltage application. The current value corresponds to the electrochemical reaction rate. The larger the current value, the higher the dissolution rate. The same phenomenon occurs for metal materials other than the Fe mold material 4. Here, the potential measuring device 15 processes the potential signal detected by the reference electrode 14 and sends it to the control device 20 through the signal line 19. As the reference electrode 14, a typical SCE (saturated calomel electrode) or Ag (silver) -AgCl (silver chloride) electrode generally used in the field of electrochemistry is used.

図３は、実施の形態１における微細加工方法の工程を説明する略断面図を示す。
図２で説明した電気化学反応を利用し、図３に示すＦｅ金型材４に微細な溝加工を行う実施の形態１における微細加工方法の実施例と微細加工装置の動作について、図１の微細加工装置および図４に示す電解液中における電位−電流特性を参照して説明する。
まず、図３（ａ）に示す第一の工程では、Ｆｅ金型材４を電解液５が満たされた容器２に入れ、陽電極３の上に載置する（図３では、陽電極３、Ｆｅ金型材４、プローブ電極７、Ｆｅ２Ｏ３膜２１のみを表示する）。陰電極６と陽電極３との間に電源１０から導電線１１、１２を通して、Ｆｅ金型材４の表面にかかる電位Ｖを図４で示す不動態形成領域２４となる電位Ｖｃ（例えば、０．７Ｖとする）として、Ｆｅ金型材４表面を不動態形成電位の状態で保持する。この状態では、Ｆｅ金型材４表面の近傍の電解液５のみが分極されているため、Ｆｅの溶解は起こらず、電気化学反応によりＦｅ金型材４表面に金属酸化膜であるＦｅ２Ｏ３膜２１が反応生成される。（１）から（３）式にＦｅ２Ｏ３膜２１が生成される反応式を示す。
Ｆｅ→Ｆｅ３＋＋３ｅ− （１）
Ｈ２Ｏ→２Ｈ＋＋Ｏ２− （２）
２Ｆｅ＋３Ｈ２Ｏ→Ｆｅ２Ｏ３＋６Ｈ＋＋６ｅ− （３）
次に、図３（ｂ）に示す第二の工程では、駆動装置９を操作して、先端が１２μｍ径のプローブ電極７をＦｅ２Ｏ３膜２１が形成されたＦｅ金型材４の表面に対して約１μｍの距離に近接させ、電源１０からプローブ電極７と陽電極３との間に図４で示す電圧パルス２６を印加する。パルス電圧を不動態溶解領域２５となるＶｐ（例えば、１Ｖとする）として、Ｆｅ金型材４の表面電位を不動態溶解電位にすると、プローブ電極７の先端部分が近接するＦｅ２Ｏ３膜２１の部分のみが溶解除去され、Ｆｅ２Ｏ３膜除去部２８が形成される。（４）式にＦｅ２Ｏ３膜２１が溶解される反応式を示す。
Ｆｅ２Ｏ３＋３Ｈ＋→２Ｆｅ３＋＋３Ｈ２Ｏ （４）
続いて、図３（ｃ）に示す第三の工程では、さらに電源１０からプローブ電極７と陽電極３との間に図４で示す電圧パルス２６を印加する。このとき、図３（ｂ）において、Ｆｅ２Ｏ３膜除去部２８の露出されたＦｅ金型材４の表面が溶解除去されて、加工溝２９が形成される。例えば、パルスの印加時間Ｔを５０ｎｓ、休止時間を５５０ｎｓとするパルスの周波数約１．７ＭＨｚとした場合では、Ｆｅ金型材４の溶解加工速度は５００ｎｍ／ｓである。
第二の工程、第三の工程を繰り返しながら、ステージ１を逐次移動させると、Ｆｅ金型材４の表面に線状の加工溝２９が形成される。
最後に、図３（ｄ）に示す第四の工程では、陽電極６と陰電極３との間に電源１０により、Ｆｅ金型材４の表面電位を不動態溶解領域２５の電位となるよう電圧を印加し、電解液５との電気化学反応によりＦｅ２Ｏ３膜２１のみを除去することにより、Ｆｅ金型材４上に微細な溝形状の加工が完了する。その反応式を（５）式に示す。
Ｆｅ→Ｆｅ３＋＋３ｅ− （５） FIG. 3 is a schematic cross-sectional view illustrating the steps of the microfabrication method in the first embodiment.
The example of the micromachining method and the operation of the micromachining apparatus in the first embodiment in which the fine groove machining is performed on the Fe mold material 4 shown in FIG. 3 using the electrochemical reaction described in FIG. This will be described with reference to the processing apparatus and the potential-current characteristics in the electrolytic solution shown in FIG.
First, in the first step shown in FIG. 3A, the Fe mold material 4 is placed in the container 2 filled with the electrolytic solution 5 and placed on the positive electrode 3 (in FIG. 3, the positive electrode 3, Only the Fe mold material 4, the probe electrode 7, and the Fe 2 O 3 film 21 are displayed). A potential Vc applied to the surface of the Fe mold material 4 through the conductive wires 11 and 12 from the power source 10 between the negative electrode 6 and the positive electrode 3 becomes a passivity forming region 24 shown in FIG. 7V), the surface of the Fe mold material 4 is held in a state of passive formation potential. In this state, since only the electrolyte solution 5 in the vicinity of the surface of the Fe mold material 4 is polarized, Fe does not dissolve, and an Fe 2 O 3 film, which is a metal oxide film, is formed on the surface of the Fe mold material 4 by an electrochemical reaction. 21 is produced by reaction. Equations (1) to (3) show reaction equations for generating the Fe 2 O 3 film 21.
Fe → Fe 3+ + 3e − (1)
H 2 O → 2H + + O 2− (2)
2Fe + 3H 2 O → Fe 2 O 3 + 6H + + 6e − (3)
Next, in the second step shown in FIG. 3B, the driving device 9 is operated to place the probe electrode 7 having a tip of 12 μm in diameter on the surface of the Fe mold material 4 on which the Fe 2 O 3 film 21 is formed. On the other hand, a voltage pulse 26 shown in FIG. 4 is applied between the probe electrode 7 and the positive electrode 3 from the power source 10 close to a distance of about 1 μm. When the pulse voltage is Vp (for example, 1 V) that becomes the passive dissolution region 25 and the surface potential of the Fe mold material 4 is the passive dissolution potential, the Fe 2 O 3 film 21 in which the tip portion of the probe electrode 7 is close Only the portion is dissolved and removed, and the Fe 2 O 3 film removal portion 28 is formed. (4) shows a reaction formula in which the Fe 2 O 3 film 21 is dissolved.
Fe 2 O 3 + 3H + → 2Fe 3+ + 3H 2 O (4)
3C, a voltage pulse 26 shown in FIG. 4 is further applied between the probe electrode 7 and the positive electrode 3 from the power source 10. In the third step shown in FIG. At this time, in FIG. 3B, the exposed surface of the Fe mold material 4 of the Fe 2 O 3 film removal portion 28 is dissolved and removed, and a processed groove 29 is formed. For example, when the pulse application time T is 50 ns and the pause time is 550 ns, and the pulse frequency is about 1.7 MHz, the melt processing speed of the Fe mold material 4 is 500 nm / s.
When the stage 1 is sequentially moved while repeating the second step and the third step, a linear processing groove 29 is formed on the surface of the Fe mold material 4.
Finally, in the fourth step shown in FIG. 3D, a voltage is applied between the positive electrode 6 and the negative electrode 3 so that the surface potential of the Fe mold material 4 becomes the potential of the passive dissolution region 25 by the power source 10. Is applied, and only the Fe 2 O 3 film 21 is removed by an electrochemical reaction with the electrolytic solution 5 to complete the processing of the fine groove shape on the Fe mold material 4. The reaction formula is shown in Formula (5).
Fe → Fe 3+ + 3e − (5)

本実施の形態１で使用されるプローブ電極７には、駆動装置９が装着されており、その駆動装置９により、Ｚ軸方向に駆動される。駆動は圧電素子により動作されるため、０．１ｎｍ程度のステップでＺ軸方向に移動が可能で、プローブ電極７をＦｅ金型材４表面に対して高精度に位置決めすることができる。また、容器２が搭載されたステージ１は駆動装置（図示せず）によりＸ、Ｙ軸方向に移動されるとともに、角度も調整される。これら一連の操作は、信号線１６から１８を通じて、制御装置２０により行われる。ここで、プローブ電極７は、電解液５中で使用されるため、プローブ材料には腐食されないＰｔ（白金）やＡｕ（金）などの貴金属製が使用される。また、プローブ先端部以外は絶縁被覆８で覆われている。
また、陰電極６により不動態形成領域２４においてＦｅ金型材４の電位Ｖ、時間を制御することにより、Ｆｅ２Ｏ３膜２１の厚さを、さらに、プローブ電極７により不動態溶解領域２５おける電圧パルス２６の電圧Ｖｐ、パルス幅Ｔ、パルス数を制御することにより、Ｆｅ２Ｏ３膜除去部２８の大きさを変えることができ、Ｆｅ金型材４に加工する溝の幅、深さを調整することができる。なお、プローブ電極７は、駆動装置９によりＸ及びＹ軸方向にも移動可能としてもよく、微調整が可能となる。 A drive device 9 is attached to the probe electrode 7 used in the first embodiment, and is driven in the Z-axis direction by the drive device 9. Since the drive is operated by a piezoelectric element, it can be moved in the Z-axis direction in steps of about 0.1 nm, and the probe electrode 7 can be positioned with high accuracy with respect to the surface of the Fe mold material 4. The stage 1 on which the container 2 is mounted is moved in the X and Y axis directions by a driving device (not shown), and the angle is adjusted. These series of operations are performed by the control device 20 through the signal lines 16 to 18. Here, since the probe electrode 7 is used in the electrolytic solution 5, a noble metal such as Pt (platinum) or Au (gold) that is not corroded is used for the probe material. Further, the portion other than the probe tip is covered with an insulating coating 8.
Further, by controlling the potential V and time of the Fe mold material 4 in the passive formation region 24 by the negative electrode 6, the thickness of the Fe 2 O 3 film 21 is further controlled by the probe electrode 7 in the passive dissolution region 25. By controlling the voltage Vp, the pulse width T, and the number of pulses of the voltage pulse 26, the size of the Fe 2 O 3 film removal portion 28 can be changed, and the width and depth of the groove processed into the Fe mold material 4 can be changed. Can be adjusted. The probe electrode 7 may be movable in the X and Y axis directions by the driving device 9, and fine adjustment is possible.

上述のとおり、本実施の形態１においては、Ｆｅ２Ｏ３膜２１の所定の部分を除去した微細なＦｅ２Ｏ３膜除去部２８を設け、このＦｅ２Ｏ３膜除去部２８の露出されたＦｅ金型材４の表面をパルス電圧Ｖｐを印加することにより電解液５との電気化学反応により溶解除去させることにより、Ｆｅ金型材４に微細な溝加工を施すことができる。一般的に、電解液５のイオンが拡散することにより、プローブ電極７の径の何倍もの大きさの加工寸法のものしか得られないが、金属酸化膜であるＦｅ２Ｏ３膜２１をエッチングマスクとして利用することにより、プローブ電極７の径と同等の微細加工が可能である。特にＦｅ２Ｏ３膜２１は、電解液５のイオンの拡散を抑制する働きをするため、Ｆｅ金型材４の表面の状況による影響を受け難く、従来の加工方法では困難であった、主として十数μｍから数十μｍと幅の狭い細線な加工が可能となる。さらに、プローブ電極の径が異なるものを使用することにより、例えば１μｍ径のものを使用すれば１〜２μｍの加工も可能である。従って、この発明により数μｍから数百μｍの微細な加工が容易にできる。 As described above, in the first embodiment, the fine Fe 2 O 3 film removing unit 28 obtained by removing a predetermined portion of the Fe 2 O 3 film 21 is provided, and the Fe 2 O 3 film removing unit 28 is exposed. The Fe mold material 4 can be finely grooved by dissolving and removing the surface of the Fe mold material 4 by an electrochemical reaction with the electrolytic solution 5 by applying a pulse voltage Vp. In general, diffusion of ions of the electrolyte 5 results in a processing dimension that is many times larger than the diameter of the probe electrode 7, but the Fe 2 O 3 film 21 that is a metal oxide film is etched. By using it as a mask, fine processing equivalent to the diameter of the probe electrode 7 is possible. In particular, since the Fe 2 O 3 film 21 functions to suppress the diffusion of ions in the electrolyte solution 5, the Fe 2 O 3 film 21 is not easily affected by the surface condition of the Fe mold material 4, and is difficult to achieve with conventional processing methods. Thin line processing as narrow as several μm to several tens μm is possible. Further, by using a probe electrode having a different diameter, for example, if a probe electrode having a diameter of 1 μm is used, processing of 1 to 2 μm is possible. Therefore, according to the present invention, fine processing of several μm to several hundred μm can be easily performed.

本実施の形態１では、図３（ｃ）に示す工程において、Ｆｅ金型材４の表面の加工溝２９をパルス電圧印加により形成する例について述べたが、例えば、図３（ｂ）の工程において、ステージ１を逐次移動させて、線状の開口を持つＦｅ２Ｏ３膜除去部２８を形成しておき、その後、電源１０により導電線１１、１２を通して、陽電極３と陰電極６との間に電圧を印加して電位Ｖを活性溶解領域２２であるＶｆ（例えば、−０．３Ｖ）として、Ｆｅ金型材４表面を活性溶解電位に保持することにより、優れた耐食性を持つＦｅ２Ｏ３膜２１が電解液５中では溶解されないエッチングマスクとして作用し、Ｆｅ２Ｏ３膜除去部２８の露出されたＦｅ金型材４の表面部分のみを溶解させることもできる。これにより、Ｆｅ金型材４表面は溝状にエッチングされた加工溝２９が形成されるが、この方法であっても、前述した図３（ｂ）の工程で説明した方法と同様の効果が期待できる。
また、本実施の形態１では、Ｆｅ金型材４の表面に金属酸化膜であるＦｅ２Ｏ３膜２１を形成する方法として、電解液５中で化学反応により形成したものを利用する例について説明したが、予め、金属被加工物のＦｅ金型材４を高温（９００℃から１２００℃）の酸化雰囲気に晒す、ウエット酸化法（Ｏ２、Ｈ２Ｏガス中）あるいはスチーム酸化法（Ｈ２Ｏガス中）により金属酸化膜を形成したものを利用してもよい。 In the first embodiment, the example in which the processing groove 29 on the surface of the Fe mold material 4 is formed by applying a pulse voltage in the step shown in FIG. 3C has been described. For example, in the step shown in FIG. Then, the stage 1 is sequentially moved to form the Fe 2 O 3 film removal portion 28 having a linear opening, and then the positive electrode 3 and the negative electrode 6 are connected by the power source 10 through the conductive wires 11 and 12. By applying a voltage between them and setting the potential V to Vf (for example, -0.3 V) which is the active dissolution region 22, the Fe mold material 4 surface is maintained at the active dissolution potential, thereby providing Fe 2 O having excellent corrosion resistance. The 3 film 21 can act as an etching mask that is not dissolved in the electrolytic solution 5, and can dissolve only the surface portion of the Fe mold material 4 where the Fe 2 O 3 film removal portion 28 is exposed. Thereby, a processed groove 29 etched into a groove shape is formed on the surface of the Fe mold material 4. Even in this method, the same effect as the method described in the step of FIG. 3B is expected. it can.
Further, in the first embodiment, as an example of a method for forming the Fe 2 O 3 film 21 that is a metal oxide film on the surface of the Fe mold material 4, an example in which the one formed by a chemical reaction in the electrolytic solution 5 is used will be described. However, a wet oxidation method (in O 2 or H 2 O gas) or a steam oxidation method (H 2 O) in which an Fe mold material 4 of a metal workpiece is exposed to an oxidizing atmosphere at a high temperature (900 ° C. to 1200 ° C.) in advance. A metal oxide film formed in a gas) may be used.

実施の形態２．
上記実施の形態１では、Ｆｅ金型材４表面に金属酸化膜であるＦｅ２Ｏ３膜２１を形成し、プローブ電極７により局所的に電圧を印加することにより、Ｆｅ２Ｏ３膜２１を溶解、Ｆｅ金型材４表面を加工するものであった。実施の形態２では、電圧印加によりプローブ電極近傍のＦｅ金型材４表面にＦｅ２Ｏ３膜の微細線を形成し、エッチングマスクとして利用する場合の例について説明する。図５は、実施の形態２における微細加工方法の工程を説明する略断面図を示す。
実施の形態１と同様に図２で説明した電気化学反応を利用し、図５に示すＦｅ金型材４に細いリッジ加工を行う、この発明の実施の形態２における微細加工方法と微細加工装置の動作について、図１の微細加工装置および図６に示す電解液中における電位−電流特性を参照して説明する。
まず、図５（ａ）に示す第一の工程では、Ｆｅ金型材４を電解液５の入った容器２に入れ、陽電極３の上に載置する（図５では、陽電極３、Ｆｅ金型材４、プローブ電極７、Ｆｅ２Ｏ３膜２１のみを表示する）。ここで、電解液５は実施の形態１で説明したものと同じものである。駆動装置９を操作して、先端が１２μｍ径のプローブ電極７をＦｅ金型材４の表面に対して約１μｍの距離に近接させ、Ｆｅ金型材４の電位を電流が流れない−０．５Ｖ以下の状態から電源１０によりプローブ電極７と陽電極３との間に図６で示す電圧パルス２７を印加する。パルス電圧を不動態形成領域２４である電圧Ｖｒ（例えば、１．２Ｖ）として、Ｆｅ金型材４の表面電位を不動態形成電位にするとプローブ電極７の先端部分が近接する位置にＦｅの金属酸化膜であるＦｅ２Ｏ３膜２１が反応生成される。ステージ１を逐次移動させることにより線状のＦｅ２Ｏ３膜２１が得られる。
次に、図５（ｂ）に示す第二の工程では、電源１０から導電線１２、１１を通して、陽電極３と陰電極６の間にＦｅ金型材４の表面にかかる電位Ｖを、図６で示す活性溶解領域２２であるＶｆ（例えば、−０．３Ｖ）として、Ｆｅ金型材４表面を活性溶解電位に保持する状態にすると、Ｆｅ金型材４のＦｅ２Ｏ３膜２１は耐食性を有しており、電解液５中では溶解されないためエッチングマスクとして働き、細線状のＦｅ２Ｏ３膜２１で覆われていないＦｅ金型材４の表面部分が溶解され、エッチング部３０が形成される。
最後に、図５（ｃ）に示す第三の工程では、陽電極６と陰電極３との間に電源１０により、Ｆｅ金型材４の表面電位を不動態溶解領域２５の電位となるよう電圧を印加し、細線状のＦｅ２Ｏ３膜２１を除去することにより、Ｆｅ金型材４上にリッジ３１形状の微細線加工が完了する。 Embodiment 2. FIG.
In the first embodiment, the Fe 2 O 3 film 21 that is a metal oxide film is formed on the surface of the Fe mold material 4 and a voltage is locally applied by the probe electrode 7 to dissolve the Fe 2 O 3 film 21. The surface of the Fe mold material 4 was processed. In the second embodiment, an example in which a fine line of an Fe 2 O 3 film is formed on the surface of the Fe mold material 4 near the probe electrode by applying a voltage and used as an etching mask will be described. FIG. 5 is a schematic cross-sectional view illustrating the steps of the microfabrication method in the second embodiment.
As in the first embodiment, the electrochemical reaction described in FIG. 2 is used to perform the thin ridge processing on the Fe mold material 4 shown in FIG. 5, and the fine processing method and the fine processing apparatus in the second embodiment of the present invention are used. The operation will be described with reference to the microfabrication apparatus of FIG. 1 and the potential-current characteristics in the electrolytic solution shown in FIG.
First, in the first step shown in FIG. 5A, the Fe mold material 4 is placed in the container 2 containing the electrolytic solution 5 and placed on the positive electrode 3 (in FIG. 5, the positive electrode 3, Fe Only the mold material 4, the probe electrode 7, and the Fe 2 O 3 film 21 are displayed). Here, the electrolytic solution 5 is the same as that described in the first embodiment. By operating the driving device 9, the probe electrode 7 having a 12 μm diameter tip is brought close to the surface of the Fe mold material 4 at a distance of about 1 μm, and no electric current flows through the Fe mold material 4 −0.5 V or less. 6 is applied between the probe electrode 7 and the positive electrode 3 by the power source 10. When the pulse voltage is set to the voltage Vr (for example, 1.2 V) which is the passivation formation region 24 and the surface potential of the Fe mold material 4 is set to the passivation formation potential, the metal oxidation of Fe is performed at a position close to the tip portion of the probe electrode 7. The Fe 2 O 3 film 21 that is a film is generated by reaction. A linear Fe 2 O 3 film 21 is obtained by sequentially moving the stage 1.
Next, in the second step shown in FIG. 5B, the potential V applied to the surface of the Fe mold material 4 between the positive electrode 3 and the negative electrode 6 through the conductive wires 12 and 11 from the power source 10 is shown in FIG. When the surface of the Fe mold material 4 is kept at the active dissolution potential as Vf (for example, −0.3 V) which is the active dissolution region 22 shown in FIG. 2, the Fe 2 O 3 film 21 of the Fe mold material 4 has corrosion resistance. Since it is not dissolved in the electrolytic solution 5, it functions as an etching mask, and the surface portion of the Fe mold material 4 not covered with the fine-line Fe 2 O 3 film 21 is dissolved, thereby forming an etched portion 30.
Finally, in the third step shown in FIG. 5C, a voltage is applied between the positive electrode 6 and the negative electrode 3 so that the surface potential of the Fe mold material 4 becomes the potential of the passive dissolution region 25 by the power source 10. Is applied to remove the fine wire-like Fe 2 O 3 film 21, thereby completing the fine wire processing of the ridge 31 shape on the Fe mold material 4.

本実施の形態２では、金属酸化膜であるＦｅ２Ｏ３膜２１をＦｅ金型材４の表面の所定の位置に形成し、このＦｅ２Ｏ３膜２１をエッチング保護膜として、露出されたＦｅ金型材４表面を電解液５で溶解させることにより、Ｆｅ金型材４に微細なリッジ３１加工を施すことができる。この際、Ｆｅ２Ｏ３膜２１はプローブ電極７の先端部分が近接したＦｅ金型材４表面にのみに形成されるため、従来の加工方法では困難であった、数μｍから数百μｍ、主として十数μｍから数十μｍと幅の狭いリッジ状微細線加工が可能となる。
また、プローブ電極７による不導態形成領域２４において電圧パルス２７の電圧Ｖｒ、パルス幅Ｔ、パルス数を制御することにより、Ｆｅ２Ｏ３膜２１の幅、厚さを変えることができる。さらに、陰電極６により活性溶解領域２３においてＦｅ金型材４の表面にかかる電位、時間を制御することにより、リッジ３１の高さを調整することができる。 In the second embodiment, a Fe 2 O 3 film 21 that is a metal oxide film is formed at a predetermined position on the surface of the Fe mold material 4, and this Fe 2 O 3 film 21 is used as an etching protection film to expose the exposed Fe 2 O 3 film 21. By dissolving the surface of the mold material 4 with the electrolytic solution 5, the fine ridge 31 can be processed on the Fe mold material 4. At this time, since the Fe 2 O 3 film 21 is formed only on the surface of the Fe mold material 4 to which the tip portion of the probe electrode 7 is close, it is difficult to perform by a conventional processing method, which is several μm to several hundred μm. Ridge-like fine line processing with a width as narrow as 10 to several tens μm is possible.
Further, the width and thickness of the Fe 2 O 3 film 21 can be changed by controlling the voltage Vr, the pulse width T, and the number of pulses of the voltage pulse 27 in the non-conductive state formation region 24 by the probe electrode 7. Furthermore, the height of the ridge 31 can be adjusted by controlling the potential and time applied to the surface of the Fe mold material 4 in the active dissolution region 23 by the negative electrode 6.

実施の形態１及び２では、金属被加工物としてＦｅ金型材を用いる例について述べたが、この発明は表面に金属酸化膜が形成される材料と電解液の組み合わせであればよく、純粋なＦｅ金型材だけでなく、鉄系の合金、例えばＦｅ−Ｃｒ、Ｆｅ−Ｃｒ−Ｍｏ、Ｆｅ−Ｃｒ−Ｎｉ合金のステンレスであってもＦｅやその合金以外の金属加工にも適用が可能である。
また、実施の形態１及び２では、Ｆｅ金型材４表面のエッチングには、電解液５中でＦｅ製金型材４にかかる電位を活性溶解領域２３であるＶｆとして加工する場合について説明したが、Ｆｅのみを溶解しＦｅ２Ｏ３膜を溶解しない例えば、ペルオキソ二硫酸アンモニウム（（ＮＨ４）２Ｓ２Ｏ８）と希硫酸（Ｈ２ＳＯ４）と水（Ｈ２Ｏ）を混合しｐＨ３以下に調整したエッチング液を使用してもよい。また、必ずしも電圧を印加する必要はない。
また、実施の形態１及び２において、エッチングマスクとしてのＦｅ２Ｏ３膜２１の除去は、電解液５中で電位を不動態領域２５にすることにより行っているが、塩酸（ＨＣｌ）等の酸あるいはアルカリ性溶液で溶解してもよい。また、必ずしも電気化学反応に依らずに除去することも可能である。 In the first and second embodiments, the example in which the Fe mold material is used as the metal workpiece has been described. However, the present invention may be a combination of a material for forming a metal oxide film on the surface and an electrolytic solution, and pure Fe. Not only mold materials but also iron alloys such as Fe-Cr, Fe-Cr-Mo, and Fe-Cr-Ni alloy stainless steels can be applied to metal processing other than Fe and its alloys.
Moreover, in Embodiment 1 and 2, although the case where the electric potential concerning Fe metal mold | die material 4 was processed into Vf which is the active melt | dissolution area | region 23 in the electrolyte solution 5 was demonstrated for the etching of the Fe metal mold | die material 4 surface, for example does not dissolve was dissolved Fe only Fe 2 O 3 film, ammonium peroxodisulfate ((NH 4) 2 S 2 O 8) and dilute sulfuric acid (H 2 SO 4) and water (H 2 O) mixture pH3 following a Etching solution adjusted to may be used. Further, it is not always necessary to apply a voltage.
In the first and second embodiments, the removal of the Fe 2 O 3 film 21 as an etching mask is performed by setting the potential to the passive region 25 in the electrolytic solution 5, but hydrochloric acid (HCl) or the like is used. It may be dissolved in an acid or alkaline solution. Further, it can be removed without necessarily depending on the electrochemical reaction.

また、実施の形態１及び２においては、Ｆｅ金型材４の電解液５として硼酸、硼砂の混合水溶液を利用する例について示したが、電解液としては、例えば、１Ｌ（リットル）の水にリン酸水素二ナトリウム（Ｎａ２ＨＰＯ４）を７．１ｇ、リン酸二水素ナトリウム（ＮａＨ２ＰＯ４）を６．０ｇ溶かし、ｐＨ７の水溶液としたものであっても良好な酸化膜を形成することができるものであり、実施の形態１及び２で示した電解液５と同様の効果を期待できる。この電解液は、上述したＦｅ以外の鉄系の合金に対しても有効である。 In the first and second embodiments, an example in which a mixed aqueous solution of boric acid and borax is used as the electrolytic solution 5 of the Fe mold material 4 is described. However, as the electrolytic solution, for example, phosphorous in 1 L (liter) of water is used. Dissolving 7.1 g of disodium hydrogen oxyhydrogen (Na 2 HPO 4 ) and 6.0 g of sodium dihydrogen phosphate (NaH 2 PO 4 ) to form a good oxide film even when the aqueous solution has a pH of 7 Therefore, the same effect as the electrolytic solution 5 shown in the first and second embodiments can be expected. This electrolytic solution is also effective for iron-based alloys other than Fe described above.

さらに、実施の形態１及び２では、微細な線状の溝やリッジを形成する例について述べたが、実施の形態１と実施の形態２の加工方法の組み合わせや、ステージを制御することにより他の形状に加工することが可能で、複雑な金型の型彫りに応用できるものである。
実施の形態１及び２は、例えば微細な加工が必要な射出成形金型やプレス金型の製造技術として利用できるものである。
なお、図中、同一符号は同一、又は相当部分を示す。 Further, in the first and second embodiments, examples of forming fine linear grooves and ridges have been described. However, other combinations of the processing methods of the first and second embodiments and other stages can be controlled by controlling the stage. It can be processed to the shape of the mold and can be applied to the mold carving of complicated molds.
Embodiments 1 and 2 can be used, for example, as a manufacturing technique for an injection mold or a press mold that requires fine processing.
In the drawings, the same reference numerals indicate the same or corresponding parts.

実施の形態１における微細加工装置を示す略斜視断面図である。1 is a schematic perspective sectional view showing a microfabrication apparatus in a first embodiment. 実施の形態１におけるＦｅの電位−電流特性図である。6 is a potential-current characteristic diagram of Fe in Embodiment 1. FIG. 実施の形態１における微細加工方法の工程を説明するための略断面図である。FIG. 6 is a schematic cross-sectional view for explaining a process of the microfabrication method in the first embodiment. 実施の形態１における動作を説明するためのＦｅの電位−電流特性図である。6 is a potential-current characteristic diagram of Fe for explaining an operation in the first embodiment. FIG. 実施の形態２における微細加工方法の工程を説明するための略断面図である。FIG. 10 is a schematic cross-sectional view for explaining a process of the fine processing method in the second embodiment. 実施の形態２における動作を説明するためのＦｅの電位−電流特性図である。FIG. 9 is a potential-current characteristic diagram of Fe for explaining the operation in the second embodiment.

符号の説明Explanation of symbols

１ ステージ
２ 容器
３ 陽電極
４ Ｆｅ金型材
５ 電解液
６ 陰電極
７ プローブ電極
１０ 電源
２０ 制御装置
２１ Ｆｅ２Ｏ３膜
２６、２７ 電圧パルス 1 Stage 2 Container 3 Positive Electrode 4 Fe Mold Material 5 Electrolyte 6 Negative Electrode 7 Probe Electrode 10 Power Supply 20 Controller 21 Fe 2 O 3 Film 26, 27 Voltage Pulse

Claims (7)

金属被加工物に金属酸化膜を形成する工程と、
陽電極上に載置された前記金属被加工物と前記金属酸化膜の加工部位に近接して配設されたプローブ電極とを電解液中に配置し、前記プローブ電極に電圧パルスを印加して、前記金属酸化膜の電位を不動態溶解電位にして、かつ、前記電解液と前記金属酸化膜とを化学反応させ、前記金属酸化膜の所定の部分を除去する工程と、
前記金属酸化膜が除去され露出された前記金属被加工物の部位のみを溶解する工程と、
を備えたことを特徴とする微細加工方法。 Forming a metal oxide film on the metal workpiece;
The metal workpiece placed on the positive electrode and the probe electrode arranged in the vicinity of the processing site of the metal oxide film are arranged in an electrolyte solution, and a voltage pulse is applied to the probe electrode. A step of setting the potential of the metal oxide film to a passive dissolution potential and chemically reacting the electrolytic solution with the metal oxide film to remove a predetermined portion of the metal oxide film;
Dissolving only the portion of the metal workpiece that is exposed by removing the metal oxide film; and
A fine processing method characterized by comprising: 金属酸化膜を形成する工程は、電解液中で被加工物の表面電位を不動態形成電位に保持する工程を含むことを特徴とする請求項１に記載の微細加工方法。 2. The micromachining method according to claim 1, wherein the step of forming the metal oxide film includes a step of maintaining the surface potential of the workpiece at a passive formation potential in the electrolytic solution. 露出された金属被加工物の部位のみを溶解する工程は、電解液中で前記金属被加工物の表面電位を活性溶解電位に保持する工程を含むことを特徴とする請求項１に記載の微細加工方法。 2. The method according to claim 1, wherein the step of dissolving only the exposed portion of the metal workpiece includes the step of maintaining the surface potential of the metal workpiece in an electrolytic solution at an active dissolution potential. Processing method. 陽電極上に載置された金属被加工物と前記金属被加工物の加工部位に近接して配設されたプローブ電極とを電解液中に配置し、前記プローブ電極に電圧パルス印加して、前記金属被加工物の表面電位を不動態溶解電位にして、かつ、前記電解液と前記金属被加工物とを化学反応させ、前記金属被加工物の所定の部分に金属酸化膜を形成する工程と、
前記金属酸化膜が形成されていない前記金属被加工物の部位のみを溶解する工程と、
を備えたことを特徴とする微細加工方法。 A metal workpiece placed on the positive electrode and a probe electrode arranged in the vicinity of the machining site of the metal workpiece are placed in the electrolyte, and a voltage pulse is applied to the probe electrode, Forming a metal oxide film on a predetermined portion of the metal workpiece by causing the surface potential of the metal workpiece to be a passive dissolution potential and chemically reacting the electrolytic solution and the metal workpiece; When,
Dissolving only the portion of the metal workpiece on which the metal oxide film is not formed;
A fine processing method characterized by comprising: 金属酸化膜が形成されていない金属被加工物の部位のみを溶解する工程は、電解液中で前記金属被加工物の表面電位を活性溶解電位に保持する工程を含むことを特徴とする請求項４に記載の微細加工方法。 The step of dissolving only a portion of the metal workpiece on which the metal oxide film is not formed includes a step of maintaining a surface potential of the metal workpiece in an electrolytic solution at an active dissolution potential. 4. The microfabrication method according to 4. 移動可能なステージと、
前記ステージに取付けられ電解液を収納する容器と、
前記容器内に固定され金属酸化膜が形成された金属被加工物を載置する陽電極と、
前記金属被加工物に対して所定の位置に配置された陰電極と、
前記金属被加工物に対して所定の位置に配置されたプローブ電極と、
前記金属酸化膜が形成された金属被加工物を不動態膜形成電位とする電圧を前記陽電極と前記陰電極との間に、かつ、前記金属酸化膜が形成された金属被加工物を不動態溶解電位とするパルス電圧を前記陽電極と前記プローブ電極との間に印加する電源と、
前記ステージ及びプローブ電極の位置決めと前記陽電極と前記プローブ電極との間及び前記陽電極と前記陰電極との間に印加する電圧とを制御する手段と、
を備えたことを特徴とする微細加工装置。 A movable stage,
A container that is attached to the stage and stores an electrolyte;
A positive electrode for mounting a metal workpiece fixed in the container and having a metal oxide film formed thereon;
A negative electrode disposed at a predetermined position with respect to the metal workpiece;
A probe electrode disposed at a predetermined position with respect to the metal workpiece;
A voltage at which the metal workpiece on which the metal oxide film is formed has a passive film forming potential is set between the positive electrode and the negative electrode, and the metal workpiece on which the metal oxide film is formed is not allowed. A power supply for applying a pulse voltage as a kinetic dissolution potential between the positive electrode and the probe electrode;
Means for controlling the positioning of the stage and probe electrode and the voltage applied between the positive electrode and the probe electrode and between the positive electrode and the negative electrode;
A fine processing apparatus comprising: 移動可能なステージと、
前記ステージに取付けられ電解液を収納する容器と、
前記容器内に固定され金属被加工物を載置する陽電極と、
前記金属被加工物に対して所定の位置に配置されたプローブ電極と、
前記金属被加工物を不動態膜形成電位とするパルス電圧を前記陽電極と前記プローブ電極との間に印加する電源と、
前記ステージ及びプローブ電極の位置決めと前記陽電極と前記プローブ電極との間及び前記陽電極と前記陰電極との間に印加する電圧とを制御する手段と、
を備えたことを特徴とする微細加工装置。 A movable stage,
A container that is attached to the stage and stores an electrolyte;
A positive electrode fixed in the vessel for placing a metal workpiece;
A probe electrode disposed at a predetermined position with respect to the metal workpiece;
A power supply for applying a pulse voltage between the positive electrode and the probe electrode, with the metal workpiece being a passive film forming potential;
Means for controlling the positioning of the stage and probe electrode and the voltage applied between the positive electrode and the probe electrode and between the positive electrode and the negative electrode;
A fine processing apparatus comprising:
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