JP2006332146A - Adjustment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To optimize an environment control parameter for controlling environment in an exposing device precisely and quickly. <P>SOLUTION: By using a simplex method or a GA, processing is repeated, where at least one of information on exposure precision and that on an environment inside the device affecting exposure precision is monitored while the setting value of a group of environment control parameters for controlling the environment inside the exposing device is changed, and the value of an evaluation function with the exposure precision as an evaluation index is calculated based on the monitored result. In step 407, the setting value of the group of environment control parameters of which the value of the evaluation function is satisfactory is decided as the desired value of a group of currently-operated environment control parameters of the device. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an adjustment method, and more particularly to an adjustment method for adjusting an environment in an exposure apparatus.

  Conventionally, in a lithography process for manufacturing an electronic device such as a semiconductor element (integrated circuit) or a liquid crystal display element, an image of a pattern of a mask or a reticle (hereinafter collectively referred to as “reticle”) is transmitted via a projection optical system. 2. Description of the Related Art Projection exposure apparatuses that transfer onto a photosensitive object (hereinafter referred to as “object” or “wafer”) such as a wafer or glass plate coated with a resist (photosensitive agent) are used.

  In this type of projection exposure apparatus, the displacement of a reticle stage that is movable while holding a reticle or a wafer stage that is movable while holding a wafer is measured using a laser interferometer, and the measurement results are measured on both stages. In general, it is used for position control. This is because in consideration of the currently required pattern transfer accuracy, it is necessary to use a measurement apparatus with high resolution and little delay for stage position control.

  A laser interferometer detects the change in the optical path length of the laser light obtained by irradiating the measurement object with laser light and receiving the reflected light, and measures the displacement of the measurement object based on the detection result. Therefore, the measurement result is affected by the environment such as the pressure, temperature, and humidity of the space irradiated with the laser beam. Therefore, it is desirable that the internal environment of the exposure apparatus that houses the stage or the like is always optimally adjusted with respect to the measurement of the laser interferometer. The internal environment of the exposure apparatus is optimally adjusted not only for the laser interferometer but also for various exposure apparatus hardware such as a projection optical system lens that projects an image of the mask pattern onto the wafer. desirable. Therefore, the exposure apparatus is provided with a control system for controlling the environment such as pressure, temperature, and humidity inside the apparatus, and environmental control for controlling the control apparatus prior to actual operation of the exposure apparatus. Adjustments are made to set the parameters to optimal values and create a steady state of the optimal environment in the device. However, these optimum values are affected by the environment in the clean room where the exposure equipment is placed (such as low or high altitude), and there are differences between units. There are usually a large number of such environmental control parameters, and it is extremely difficult to manually set them all by trial and error.

  According to a first aspect of the present invention, there is provided an adjustment method for adjusting an environment in an exposure apparatus, wherein an environment control parameter group for controlling the environment in the exposure apparatus using a predetermined optimization method. While changing the set value, at least one of the information on the exposure accuracy of the exposure apparatus and the information on the environment in the apparatus affecting the exposure accuracy is monitored, and the value of the evaluation function using the exposure accuracy as an evaluation index is monitored. A first step of repeatedly performing a process of calculation based on a monitoring result; a set value of the environmental control parameter group for which the value of the evaluation function is good, and a target value of the environmental control parameter group during operation of the apparatus And a second step of determining as an adjustment method.

  Here, in this specification, the “environment control parameter” refers to a variable that can adjust the control state of the environment such as temperature, humidity, and pressure in the exposure apparatus by changing the set value.

  According to this, instead of searching for the optimum value of the environment control parameter group for controlling the environment in the exposure apparatus by trial and error, it is related to the exposure accuracy of the exposure apparatus while changing those set values. A process of monitoring at least one of information and information on the environment in the exposure apparatus that affects the exposure accuracy, and calculating a value of an evaluation function using the exposure accuracy as an evaluation index based on the monitoring result; Therefore, the environment control parameter group can be optimized in a short time and with high accuracy.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 schematically shows the overall configuration of an exposure apparatus 100 according to an embodiment of the present invention. The exposure apparatus 100 includes a main body chamber 12 that houses an exposure apparatus main body 22 and a machine room 14 that is disposed adjacent to the main body chamber 12. The main body chamber 12 and the machine room 14 are installed on the floor surface F in the clean room.

<Exposure chamber>
Inside the main body chamber 12, environmental conditions (cleanness, pressure, temperature, humidity, etc.) are maintained almost constant, and in the internal space, there are a large room 16 on the machine room 14 side and two small rooms. 18 and 20 are provided. The large chamber 16 is an exposure chamber in which the exposure apparatus main body 22 is accommodated. Hereinafter, the large room 16 is referred to as an “exposure chamber 16”.

<Reticle loader room>
The two small rooms 18 and 20 are arranged in two upper and lower stages on the opposite side of the large room 16 from the machine room 14. In one small chamber 18, a reticle library 80 for storing a plurality of reticles and a reticle loader 82 composed of a horizontal articulated robot are sequentially arranged from the opposite side to the exposure chamber 16. By reticle loader 82, reticle R is carried into reticle stage RST, which will be described later, constituting exposure apparatus main body 22, and unloaded from reticle stage RST. In the present embodiment, a reticle loader system is configured by the reticle library 80 and the reticle loader 82, and this reticle loader system is housed in the small room 18. Therefore, in the following, the small room 18 is referred to as “reticle loader room 18”.

<Wafer loader room>
The other small chamber 20 includes therein a wafer carrier 84 for storing a plurality of wafers, a horizontal articulated robot 86 for loading / unloading the wafer into / from the wafer carrier 84, and the robot 86 and the exposure apparatus main body 22. A wafer transfer device 88 for transferring a wafer to and from wafer stage WST to be stored is housed. In the present embodiment, a wafer loader system is configured by the wafer carrier 84, the robot 86, and the wafer transfer device 88, and this wafer loader system is housed in the small room 20. Therefore, in the following, the small chamber 20 is referred to as a “wafer loader chamber 20”.

<Exposure device body>
The exposure apparatus main body 22 accommodated in the exposure chamber 16 includes mirrors M1 and M2 disposed above the exposure chamber 16, a reticle stage RST that is disposed below the mirror M1 and holds the reticle R, and below (−Z Projection optical system PL disposed on the side) and wafer stage WST holding wafer W disposed further below projection optical system PL.

  Illumination light such as KrF excimer laser or ArF excimer laser emitted from an illumination system (not shown) arranged outside the exposure chamber 16 is incident on the exposure chamber 16 and then bent by mirrors M2 and M1. The reticle R held on the reticle stage RST is illuminated. By this illumination, the circuit pattern and the like on the reticle R is reduced and transferred onto the wafer W held on the wafer stage WST via the projection optical system PL and a wafer holder (not shown).

  Reticle stage RST is driven in a two-dimensional direction on a reticle base (not shown) within an XY plane by a driving device (not shown) such as a planar motor or a linear motor. The XY position and yawing amount (rotation amount θz around the Z axis) are measured by the laser interferometer IF1 with a resolution of about 0.5 to 1.0 nm, for example. The projection optical system PL is held by a main frame that forms the ceiling surface of the main column 34. Wafer stage WST is driven in a two-dimensional direction on the bottom plate of main column 34 by a driving device (not shown) such as a planar motor or a linear motor. The position and orientation of the wafer stage WST in the XY plane (the yawing amount, the pitching amount (rotation amount θx around the X axis), and the rolling amount (rotation amount θy around the Y axis)) are, for example, 0.5 by the laser interferometer IF2. It is measured with a resolution of about ~ 1.0 nm. The space inside the main column 34 is isolated from the exposure chamber 16. Hereinafter, this space will be referred to as a “wafer stage chamber 30” to distinguish it from the exposure chamber 16.

  In this exposure apparatus main body 22, at the time of exposure, reticle stage RST and wafer stage WST are synchronously scanned in the Y-axis direction at a speed ratio corresponding to the projection magnification of projection optical system PL. The pattern of the reticle R is transferred onto the wafer W. That is, the exposure apparatus 100 is a step-and-scan projection exposure apparatus.

<Air conditioning equipment>
Next, air conditioning equipment in the exposure apparatus 100 will be described.

  The main body chamber 12, particularly the exposure chamber 16, is always kept at a positive pressure with respect to the outside in order to maintain the cleanliness of the inside. However, in consideration of air leakage from an inline interface (not shown) or the like. An OA (Outlet Air) port 50 as an outside air intake port for taking in outside air is provided at the bottom of the machine room 14. In the OA port 50, for example, in order to prevent deterioration of the chemically amplified resist applied on the wafer W, chemical contaminants (impurities) in the air are removed and only clean air is taken into the apparatus. Accordingly, a chemical filter CF2b is provided via a flow rate adjusting throttle 50a described later.

  A cooler (dry coil) 52 is provided at a slightly lower position in the center of the machine chamber 14 in the height direction. A drain pan 68 is disposed below the cooler 52.

  A first heater 56 is disposed above the cooler 52 in the air passage in the machine chamber 14 at a predetermined interval from the cooler 52. Further, a first blower 58 is disposed at the outlet portion of the machine chamber 14 above the first heater 56.

  A blower opening of the first blower 58 is connected to one end of an air supply conduit 24 provided in the main body chamber 12 via a bellows-like connection portion 26. At one end, a chemical filter CF1a is provided. The other end side of the air supply conduit 24 is branched into two, and one branch passage 24 a is connected to the reticle loader chamber 18. An ULPA filter (Ultra Low Penetrarion Air-filter) and a filter for removing particles in the air flowing into the reticle loader chamber 18 through a flow rate adjusting throttle 19a, which will be described later, and a filter are provided at the outlet of the reticle loader chamber 18 side. A filter box AF1 having a plenum is provided. A return portion 40 is provided on the opposite side of the reticle loader chamber 18 from the filter box AF1, and one end of a return duct 42 serving as an exhaust path is connected to a part of the outside of the return portion 40. Is connected to a part of the bottom surface of the machine room 14.

  The branch path 24 a is further provided with a branch path 24 c, and this branch path 24 c is connected to the wafer loader chamber 20. A filter box AF2 composed of a ULPA filter and a filter plenum for removing particles in the air flowing into the wafer loader chamber 20 is provided at a portion of the ejection port on the wafer loader chamber 20 side through a flow rate adjusting throttle 21a. . The filter box AF2 may include a chemical filter. A return portion 44 is provided on the opposite side of the wafer loader chamber 20 from the filter box AF2, and an exhaust port communicating with the return duct 42 is provided on the opposite side of the return portion 44 from the wafer loader chamber 20.

  Further, the other branch passage 24b has particles in the air flowing into the exposure chamber 16 arranged on the reticle loader chamber 18 side of the ejection port 90 formed at the boundary portion between the reticle loader chamber 18 and the exposure chamber 16. Is connected to a filter box AF3 comprising a ULPA filter and a filter plenum. A uniform air flow is sent from the ejection port 90 into the upper space of the exposure chamber 16 by side flow. As shown in FIG. 2, which is a cross-sectional view taken along the line AA in FIG. 1, the boundary portion between the reticle loader chamber 18 and the exposure chamber 16 where the ejection port 90 is formed, except for the reticle transfer area 92. A plurality of filter boxes AF3 are arranged around the periphery.

  Further, as shown in FIG. 1, a return portion 46 is provided on the machine chamber 14 side of the bottom of the exposure chamber 16, and a return as an exhaust path is provided on the bottom wall of the main body chamber 12 below the return portion 46. An exhaust port communicating with one end side of the duct 48 is formed, and the other end side of the return duct 48 is connected to a part of the bottom surface of the machine chamber 14.

  On the other hand, below the first heater 56 in the machine room 14 is provided a branch path 60 into which approximately 1/5 of the air that has passed through the cooler 52 from below is flowed. An end of the branch path 60 on the machine room 14 side is configured by an expandable / contractible bellows-like member 60a. A portion of the branch path 60 opposite to the machine chamber 14 from the bellows-shaped member 60 a is disposed in the exposure chamber 16. A second heater 62 and a second blower 64 are sequentially arranged in the branch path 60. An air outlet for the vicinity of wafer stage WST in wafer stage chamber 30 is formed on the side opposite to machine chamber 14 of second blower 64.

  A filter box AF4 made up of a chemical filter CF1b, a ULPA filter, and a filter plenum is disposed in the vicinity of the wafer stage WST at the outlet of the air sent from the second blower 64. Opposing to the ejection port provided with the chemical filter CF1b and the filter box AF4, an opening end on one end side of a return duct 66 as an exhaust path is disposed in a part of the wafer stage chamber 30 on the wafer loader chamber 20 side. The other end side of the return duct 66 is connected to a part of the bottom of the machine room 14. A flow rate adjusting throttle 66a described later is provided in the return duct 66.

  An opening is formed in a part of the bottom surface of the machine room 14 to which the return ducts 42, 48 and 66 are connected. A chemical filter CF2a is provided facing the opening. The chemical filter CF2a can be easily inserted and removed through an opening / closing door (not shown) provided in the machine room 14.

  The chemical filters CF1a, CF2a, CF1b, and CF2b have a filter medium (media) such as honeycomb-structured carbon fiber. By this filter medium, silicon such as siloxane and silazane is used in addition to a base gas such as ammonia gas. Plasticizers, flame retardants and other chemical pollutants are removed as well as organic substances and hydrocarbons.

  FIG. 3 shows a simplified configuration of a control system related to environmental control of the exposure apparatus 100. This control system is configured around a control device 70 including a microcomputer (or workstation).

  As shown in FIG. 3, temperature sensors 54, 55, 72, and 74 are installed at various locations in the exposure apparatus 100. The 1st temperature sensor 54 is provided in the exit part of this cooler 52 (refer to Drawing 1), and detects the temperature of the cooler surface. The detection value of the first temperature sensor 54 is supplied to the control device 70. The second temperature sensor 55 is provided near the outlet of the first heater 56 (see FIG. 1), and detects the temperature of the heated air from the first heater 56. The detection value of the second temperature sensor 55 is supplied to the control device 70. The third temperature sensor 72 is provided near the machine room 14 at the branch portion of the air supply conduit 24 (see FIG. 1), and the detection value of the third temperature sensor 72 is supplied to the control device 70. Yes. The fourth temperature sensor 74 is provided on the upstream side of the chemical filter CF1b (see FIG. 1), and detects the temperature of the gas sent out from the second blower 64. The detection value of the fourth temperature sensor 74 is supplied to the control device 70.

  As shown in FIG. 3, pressure sampling boards 34a, 18a, 20a, 16a, and CR1 for sampling the gas pressure at each location are installed at various locations inside the exposure apparatus 100. Each of the pressure sampling boards 34a, 18a, 20a, 16a, and CR1 is made of a material that suppresses outgassing (outgas) that adversely affects the exposure process, such as a washed Teflon (registered trademark) coated tube or SUS tube. It has been.

  As shown in FIG. 1, the pressure sampling board 34a is inside the wafer stage chamber 30, the pressure sampling board 18a is inside the reticle loader chamber 18, the pressure sampling board 20a is inside the wafer loader chamber 20, and the pressure sampling board 16a is exposed. It is provided in the chamber 16. The pressure sampling board CR1 is provided outside the main chamber 12 (not shown in FIG. 1, see FIG. 3). As shown in FIG. 3, the pressure sampling boards 34a, 18a, 20a, 16a, and CR1 are respectively connected to the pressure sensor PM1 through corresponding electromagnetic valves 34b, 18b, 20b, 16b, and CR2. By controlling the electromagnetic valves 34b, 18b, 20b, 16b, and CR2, it is possible to detect the pressure in each air conditioning chamber and the atmospheric pressure outside the main body chamber 12, that is, in the clean room where the exposure apparatus is installed. The pressure detector 10 is composed of the pressure sampling boards 34a, 18a, 20a, 16a, CR1, the electromagnetic valves 34b, 18b, 20b, 16b, CR2, and the pressure sensor PM1. The pressure detector 10 can detect a minute pressure change of, for example, 0.5 Pa or less and outputs the detected value (pressure information) to the control device 70.

  The pipes of the pressure sampling boards 34a, 18a, 20a, 16a, and CR1 are arranged so that their ports face in a direction intersecting with the gas flow in order to eliminate the influence of the dynamic pressure component of the gas. It is necessary to consider so that.

  In the middle of the return duct 66, which is an exhaust flow path connected to the main column 34, a flow rate adjusting throttle 66a for adjusting the flow rate of the gas flowing through the return duct 66 by adjusting the opening ratio of the flow path is provided. The opening ratio of the flow path by the flow rate adjusting throttle 66 a is controlled by the control device 70. The flow rate adjusting throttle 66a increases the flow rate of the gas flowing through the return duct 66 by increasing the opening ratio of the flow path, that is, by increasing the exhaust amount from the wafer stage chamber 30, thereby increasing the flow rate inside the wafer stage chamber 30. The pressure can be reduced. On the other hand, the pressure in the wafer stage chamber 30 is increased by reducing the flow rate of the gas flowing through the return duct 66 by decreasing the opening ratio of the flow path, that is, by reducing the exhaust amount from the wafer stage chamber 30. .

  In addition, a branch flow path 24a as an air supply flow path connected to the reticle loader chamber 18 has a flow rate adjustment throttle (flow rate ratio adjusting unit) that adjusts the flow rate of the gas flowing through the filter box AF1 by adjusting the opening rate of the flow path. , A pressure adjusting device) 19a is provided. The pressure in the reticle loader chamber 18 is adjusted by adjusting the gas supply amount to the reticle loader chamber 18 according to the opening ratio of the flow path set by the flow rate adjusting throttle 19a.

  In the middle of the branch path 24c as an air supply path connected to the wafer loader chamber 20, a flow rate adjusting throttle (flow path opening ratio adjusting section) that adjusts the flow rate of the gas flowing through the branch path 24c by adjusting the efficiency of the flow path. , Pressure adjusting device) 21a is provided. The pressure in the wafer loader chamber 20 is adjusted by adjusting the gas supply amount to the wafer loader chamber 20 according to the opening ratio of the flow path set by the flow rate adjusting throttle 21a.

  The OA port 50 for taking outside air into the main body chamber 12 is provided with a flow rate adjusting throttle 50a for adjusting the flow rate of the gas taken into the main body chamber 12 by adjusting the opening ratio of the flow path. Gas that is taken in from the OA port 50 according to the opening ratio of the flow path set by the flow rate adjusting throttle 50a, and is supplied to the exposure chamber 14 of the main body chamber 12 through the mechanical chamber 14, the connection portion 26, and the air supply conduit 24. The air supply is adjusted. Here, the flow rate adjusting throttle 50a increases the pressure in each air-conditioned room (especially the exposure room 16) by increasing the opening ratio of the flow path and increasing the gas supply amount to all the air-conditioned rooms. The pressure in each air-conditioning room (especially the exposure room 16) is reduced by reducing the opening ratio of the flow path and reducing the gas supply amount to all air-conditioning rooms. Thereby, the differential pressure between the atmospheric pressure in the clean room where the exposure apparatus 100 is installed or the pressure in the substrate processing apparatus and the coater / developer connected in-line with the exposure apparatus 100 can be adjusted. It is possible to set the pressure to be equal to or higher than the pressure in the clean room or the pressure in the coater / developer (for example, positive pressure).

  As described above, the main body chamber 12 is divided into a plurality of air conditioning chambers of the reticle loader chamber 18, the wafer loader chamber 20, the exposure chamber 16, and the wafer stage chamber 30. Detected and sent to the control device 70. Based on the detection result of the pressure detector 10, the control device 70 supplies the air conditioning chambers so that the reticle loader chamber 18, the wafer loader chamber 20, the exposure chamber 16, and the wafer stage chamber 30 have a predetermined pressure difference. The flow rate adjusting throttles 66a, 19a, 21a, and 50a provided in the air path or the exhaust path are respectively controlled.

  Next, air conditioning in the exposure apparatus configured as described above will be described with reference to FIG.

  First, the first and second blowers 58 and 64 are operated by the control device 70, whereby the reticle loader chamber 18, wafer loader chamber 20, exposure chamber 16 and wafer are passed through the filter boxes AF1, AF2, AF3 and AF4, respectively. Gas is fed into the vicinity of wafer stage WST in stage chamber 30, and air conditioning of the respective parts is performed. In this case, air conditioning is performed in the reticle loader chamber 18 and the wafer loader chamber 20 by downflow. In the exposure chamber 16, the air conditioning of each part of the exposure apparatus main body 22 during the above-described exposure operation is performed by a side flow. The air returned to the return duct 42 via the return portions 40 and 44, the air returned to the return duct 48 via the return portion 46, and the air returned to the return duct 66 are the return ducts. It passes through a chemical filter CF2a provided at the outlet on the machine chamber 14 side (in this embodiment, the inlet of the machine chamber 14). While passing through the chemical filter CF2a, chemical contaminants contained in the air in the return ducts 42, 48, 66 are adsorbed and removed by the filter medium.

  The chemical clean air that has passed through the chemical filter CF2a is taken from outside the exposure apparatus via the OA port 50, and is cooled to a predetermined temperature by the cooler 52 together with the chemical clean air that has passed through the chemical filter CF2b. Is done. In this case, in the present embodiment, the controller 70 controls the cooling operation of the cooler 52 while monitoring the output of the first temperature sensor 54. At this time, the cooler is controlled at the humidity and pressure of the air passing through the cooler portion. The surface is cooled to a temperature that does not cause condensation on the surface, for example, a temperature slightly higher than 5 ° C. or about 15 ° C. As described above, since no condensation occurs on the surface of the cooler 52, the drain piping system is not provided in this embodiment. However, the surface temperature control of the cooler 52 as described above may be difficult due to the failure of the first temperature sensor 54 or the occurrence of some malfunction of the cooler 52. Therefore, in the present embodiment, the drain pan 68 is provided in consideration of such an emergency situation.

  Then, about 80% of the air that has passed through the cooler 52 and is cooled to a predetermined temperature is sent to the first heater 56, and the remaining about 20% is sent to the second heater 62 in the branch path 60. Heated to target temperature. In this case, the control device 70 performs feedback control of the first heater 56 based on the detection values of the second temperature sensor 55 and the third temperature sensor 72, and the second heater 62 based on the detection value of the fourth temperature sensor 74. Feedback control. In this case, the target temperature of the air (including the temperature control range) ejected into the exposure chamber 16 and the like via the air supply conduit 24 and the target of the air ejected near the wafer stage WST via the branch path 60. The temperature (including the temperature control range) can be set individually.

  The chemically clean gases heated to the target temperatures by the first and second heaters 56 and 62 are sent to the chemical filters CF1a and CF1b by the first and second blowers 58 and 64, respectively. . Then, the gas that has passed through the chemical filter CF1a is sent into the reticle loader chamber 18, the wafer loader chamber 20, and the exposure chamber 16 through the air supply conduit 24 and the filter boxes AF1, AF2, and AF3 in the main body chamber 12, respectively. . The air that has passed through the chemical filter CF1b passes through the filter box AF4 and is sent to the vicinity of the wafer stage WST (and the laser interferometer IF2).

  Particles in the air are almost certainly removed by passing through the ULPA filters in the filter boxes AF1, AF2, AF3, and AF4, respectively. Therefore, the reticle loader chamber 18, the wafer loader chamber 20, the exposure chamber 16, and the wafer stage In the vicinity of WST, only highly clean air is supplied in the sense that it does not contain particles and fine particles such as chemical contaminants, and the reticle loader system, wafer loader system, and exposure apparatus main body 22 are air-conditioned by this clean air. The Then, the air conditioning is finished, and chemically contaminated air containing chemical contaminants resulting from degassing from the exposure apparatus main body 22 and the like is returned into the return ducts 42, 48, and 66. In this way, the air conditioning of each part is repeated. Hereinafter, such an air conditioning operation is also referred to as an air conditioning control operation of the exposure apparatus.

  When air-conditioning each part, air-conditioning is performed while controlling the flow rate adjusting throttles 66a, 19a, 21a, and 50a as pressure adjusting devices provided in the air supply passage or the exhaust passage for each air-conditioning chamber. At this time, as described above, the inside of the main body chamber 12 is always kept at a positive pressure with respect to the outside (in the present embodiment, a clean room) by taking outside air from the OA port 50. The pressure inside the main body chamber 12 is set to a positive pressure of, for example, about 0.5 Pa with respect to the outside (clean room) by adjusting with a flow rate adjusting throttle 50a as a pressure adjusting device provided at the OA port 50. By keeping the inside of the main body chamber 12 at a positive pressure with respect to the outside, inflow of gas from the outside to the inside of the main body chamber 12 is prevented, and the cleanliness is maintained.

Further, when the pressure of the wafer stage chamber 30 is P _WST , the pressure of the reticle loader chamber 18 is P _RL , the pressure of the wafer loader chamber 20 is P _WL , and the pressure of the exposure chamber 16 is P _EX , the control device 70 performs air conditioning. Based on the detection result of the pressure of each air-conditioned room sampled by the pressure sampling plates 34a, 18a, 20a, 16a provided in each of the rooms,
P _WST ≧ P _WL ≧ P _EX ≧ P _RL
Then, pressure adjustment is performed using each flow rate adjustment throttle.

Further, the pressure in the installation environment (clean room) of the exposure apparatus 100 when the P _CR, is so adjusted that P _RL ≧ P _CR. Furthermore, the pressure in the exposure apparatus 100 and the line connected to the substrate processing apparatus is (such as coater-developer) when a P _CD, to satisfy the P _WL ≧ P _CD becomes relevant.

In other words, it is necessary to protect the resist applied to the wafer W in order to perform the exposure process with high accuracy. Therefore, the cleanliness in the air-conditioning chamber where the wafer W is arranged for the longest time in a series of processes in the exposure apparatus is improved. Need to keep the highest. Accordingly, the pressure P _WST of the wafer stage chamber 30 in which the wafer stage WST on which the wafer W to be exposed is placed is accommodated is set to the pressure of the reticle loader chamber 18, wafer loader chamber 20, and exposure chamber 16 which are other air conditioning chambers. It is set higher so that gas does not flow from the outside into the main column 34 (that is, P _WST > P _WL , P _EX , P _RL is preferable).

  The operations of the cooler 52, the first heater 56, the second heater 62, the first blower 62, the second blower 64, and the flow rate adjusting throttles 66a, 19a, 21a, and 50a controlled by the control device 70 are controlled by the control device 70. Defined by defined control parameters. For example, the inverter frequency of the fans provided in the first blower 62 and the second blower 64, the reference voltage in the cooler 52 and the heater 56, and the throttle amounts of the flow rate adjusting throttles 66a, 19a, 21a, and 50a are examples. .

≪Control parameter optimization process≫
Next, control parameter optimization processing will be described. As described above, in the exposure apparatus 100, it is necessary to optimize the control parameters in order to keep the pressure in each air-conditioned room at the target value. The control parameter optimization process will be described below. Here, if the target values of the pressure in the exposure chamber 16, the wafer stage chamber 30, the reticle loader chamber 18, and the wafer loader chamber 20 are RS ^* , WS ^* , RL ^* , WL ^* , respectively, the evaluation function E used for this optimization is used. (X _p ) can be expressed as:

ここで、ＲＳ（Ｘ_p）、ＷＳ（Ｘ_p）、ＲＬ（Ｘ_p）、ＷＬ（Ｘ_p）は、制御パラメータの設定値群のある組合せＸ_pを設定したときの露光室１６、ウエハステージ室３０、レチクルローダ室１８、ウエハローダ室２０の圧力の実測値（すなわち圧力検出器１０の検出結果）である。これらの圧力の実測値は、制御パラメータの実測値を入力とする関数であるとみなすことができる。ここで、ＲＳ^*、ＷＳ^*、ＲＬ^*、ＷＬ^*は、前述した各空調室の圧力Ｐ_EX、Ｐ_WST、Ｐ_RL、Ｐ_WLに対応するため、上述した、Ｐ_WST≧Ｐ_WL≧Ｐ_EX≧Ｐ_RLの関係などに代表される圧力の大小関係（本体チャンバ外の圧力Ｐ_CDとの関係を含む）を満たす必要があることに留意する必要がある。

Here, RS (X _p ), WS (X _p ), RL (X _p ), WL (X _p ) are the exposure chamber 16 and wafer stage when a combination X _p with a set value group of control parameters is set. This is an actual measurement value of the pressure in the chamber 30, reticle loader chamber 18, and wafer loader chamber 20 (that is, the detection result of the pressure detector 10). These measured values of pressure can be regarded as a function having the measured values of control parameters as inputs. Here, since RS ^* , WS ^* , RL ^* , WL ^* correspond to the pressures P _EX , P _WST , P _RL , P _WL of each air conditioning chamber described above, P _WST ≧ P _WL ≧ P _EX described above. ≧ P (including the relationship between the pressure P _CD outside body chamber) of magnitude of the pressure typified relationship _RL has to be noted that it is necessary to satisfy the.

In the evaluation function E (X _p ), the measured pressure values in the exposure chamber 16, the wafer stage chamber 30, the reticle loader chamber 18, and the wafer loader chamber 20 become larger as the measured values deviate from the target values. Therefore, in this optimization method, the control parameter group X _p that minimizes the value of the evaluation function E (X _p ) is found as the optimum value.

In this embodiment, the number of control parameters is k, and a vector of optimal solution candidates for control parameters whose elements are (x ₁ , x ₂ , x ₃ ,..., X _k ) is X _p (p = 1, 2,..., N). The subscript p is an identification number of a solution candidate vector used in the optimization process. In the present embodiment, an optimal solution of this vector X _p is obtained.

In the present embodiment, the control parameter is optimized by a predetermined optimization method. However, the exposure apparatus 100 can select the following two methods as the optimization method.
(1) Optimization using the simplex method (2) Optimization using the genetic algorithm (GA) It is held in the control device 70 which of the methods (1) and (2) is selected. Specified by the device parameter. In this apparatus parameter, mode 1 is designated when optimization using the simplex method is selected, and mode 2 is designated when optimization using GA is performed. The device parameters can be set by an operator via an input device (not shown) such as a keyboard while confirming the display regarding the parameters displayed on the display device (not shown).

  The control parameter optimization operation by the exposure apparatus 100 of the present embodiment will be described with reference to the flowcharts of FIGS. 4 and 5 and FIG. 6 showing the processing procedure of the CPU in the control apparatus 70.

  As shown in FIG. 4, first, in step 401, it is determined whether or not the mode 1 is set. If this determination is affirmed, the process proceeds to subroutine 403, and if not, the process proceeds to step 405. Here, it is assumed that mode 1 is set, the determination is affirmed, and the routine proceeds to subroutine 403.

In the subroutine 403, as shown in FIG. 5, first, in step 501, N candidate solutions are randomly selected as candidate optimal solutions for the control parameter vector X _p (these solutions). Are X ₁ , X ₂ , X ₃ ,..., X _N ). However, N ≧ k + 1. The group of N solution candidates is called “simplex”. In the next step 503 sets the candidate X _p of each solution of the simplex which is measured in step 501, by performing the "air-conditioning control operation of the exposure apparatus 100", calculates the value of each of the objective function .

In the next step 505, the evaluation function E calculated by the air conditioning control operation of the exposure apparatus 100 when X ₁ , X ₂ , X ₃ ,..., X _N obtained in step 503 are respectively set as control parameters. (X _p) with reference _{to, X 1, X 2, X} 3, ..., from the X _N, as defined by the following equation, in the simplex search subject to a k-dimensional vector space of optimal solutions A vertex X _h (maximum) having the largest (worst) evaluation function, a vertex X _S having the second largest evaluation function value, and X _l having the smallest evaluation function value are selected.

In the next step 507, simplex, it meets the stop condition, i.e., in the X _p, the value of the evaluation function, it is determined whether there is has reached the target value (calculated censored evaluation value) . If this determination is affirmed, the process is terminated assuming that an optimal solution has been obtained, and if the determination is negative, the process proceeds to step 509. Here, it is assumed that the determination is negative and the process proceeds to step 509.

In the next step 509, the centroid X ₀ of the simplex solution candidate excluding the maximum vertex X _h shown in the above equation (2) is calculated. In the next step 511, the k-dimensional vector space, and calculates the maximum vertex X _h and mirror image point X _r on the positions symmetrical with respect to the center of gravity X _0, when setting the Kagamizoten X _r as a control parameter " The “environment control operation in the exposure apparatus” is executed to calculate the value of the evaluation function for the objective function.

ここで、αは鏡像係数である。

Here, α is a mirror image coefficient.

FIG. 6 shows a vector space diagram when each vertex of the control parameter is represented by a k-dimensional plane. In FIG. 6, in the simplex, the maximum vertex X _h is shown on the left side of the drawing, the minimum vertex X _l is shown at the top, the second largest vertex X _s is shown, the center of gravity X ₀ , the mirror image point X _r is shown.

In the following, the values of the evaluation functions of the maximum vertex X _h , the minimum vertex X _l , the second largest vertex X _S , the center of gravity X ₀ , and the mirror image point X _r are compared, and simplex expansion or reduction is repeated, and the minimum value is obtained. Perform search processing.

Returning to FIG. 5, in the next step 513, the evaluation function value E (X _r ) of the mirror image point X _r is equal to or smaller than the evaluation function value E (X _s ) of the vertex X _s having the second largest evaluation function value. It is determined whether or not. If this determination is affirmed, the process proceeds to step 515. If the determination is negative, the process proceeds to step 525.

First, a case where the determination is affirmative in step 513 and the process proceeds to step 515 will be described. At step 515, it is determined whether Kagamizoten X _r of the evaluation function value E (X _r) is smaller than the minimum vertex X _l of the evaluation function value E (X _l). If this determination is affirmed, the process proceeds to step 517, and if not, the process proceeds to step 523. If the judgment here is denied, the evaluation function value E (X _r ) of the mirror image point X _r is equal to or less than the evaluation function value E (X _S ) of the vertex X _s (E (X _r )). ≦ E (X _s )) and greater than or equal to the value of the evaluation function of the minimum vertex X _l (E (X _r ) ≧ E (X _l )). In this case, vertex value of the evaluation function is minimized is in the simplex, it may be regarded as likely to be near the mirrored point X _r. Therefore, in step 523, it updates the mirror-point X _r on the maximum vertex X _h. After step 523 is completed, the process returns to step 505.

On the other hand, if the determination in step 515 is affirmative, the evaluation function value E (X _r ) of the mirror image point X _{r is} the evaluation function value E (X (X) of the vertex X _s having the second largest evaluation function value). _s ) or less (E (X _r ) ≦ E (X _s )) and smaller than the evaluation function value E (X _l ) of the minimum vertex X _l (E (X _r ) <E (X _l )) Means that. In this case, the vertex at which the value of the evaluation function is minimized can be considered to be highly likely to be outside the simplex. Therefore, in step 517, the expansion point X _e shown in the following equation is calculated, and the “air conditioning control operation of the exposure apparatus” is performed to obtain the value E (X _e ) of the evaluation function. In the next step 519, the value E (X _e) of the evaluation function of the expansion point X _e is extended point X _r evaluation function value E (X _r) whether the difference is less than the _{(E (X e) <E} ( _Xr )) is determined. If the determination is negative, the process proceeds to step 523 where the maximum vertex X _h is updated to the mirror point X _r and the process returns to step 505. On the other hand, if the determination is affirmed, the process proceeds to step 521 where the maximum vertex X _h is updated to the extension point X _e and the process returns to step 505.

Next, a case where the determination is negative in step 513 and the process proceeds to step 525 will be described. At step 525, mirror image point X _r value of the evaluation function in E (X _r) it is determined less whether than the maximum vertex X _h value of the evaluation function in E (X _h). If this determination is affirmed, the process proceeds to step 527, and if not, the process proceeds to step 529. In step 527, it updates the maximum vertex X _h mirror-point X _r, the process proceeds to step 529. In step 529, the contraction point _Xc shown in the following equation is obtained, and the "air conditioning control operation of the exposure apparatus" is performed to obtain the evaluation function value E ( _Xc ).

ここで、βは、収縮係数である。

Here, β is a contraction coefficient.

In the next step 531, it is determined whether or not the evaluation function value E (X _c ) of the extension point X _c is smaller than the evaluation function value E (X _h ) of the maximum vertex X _h . If this determination is affirmed, the process proceeds to step 533, and if not, the process proceeds to step 535. In step 533, the maximum vertex X _h, updates the extended point X _c. On the other hand, in step 535, the reduced point X _i ′ is obtained using the following equation, and the simplex is updated.

ここで、０＜κ＜１であり、縮小点Ｘ_i'は、鏡映点Ｘ_rと、重心Ｘ₀とを結ぶ線分を、κ：１−κに内分する点である。ステップ５３３及びステップ５３５終了後は、ステップ５０３に戻る。

Here, 0 <κ <1, and the reduction point X _i ′ is a point that internally divides the line segment connecting the mirror point X _r and the center of gravity X ₀ into κ: 1−κ. After step 533 and step 535 are completed, the process returns to step 503.

  Thereafter, until the stop condition is satisfied and the determination in step 507 is affirmed, the above process is repeatedly executed, and an optimal solution of the control parameter at which the value of the evaluation function becomes a minimum value is obtained. After the determination in step 507 is affirmed, the subroutine 403 is terminated, and the process proceeds to step 407 in FIG.

  In step 407, the value of each control parameter in the optimal solution vector is set in the control device 70 as the value of the control parameter. Thereby, the target value of control with respect to the cooler 52, the 1st heater 56, the 2nd heater 62, the 1st air blower 58, the 2nd air blower 64, and the flow volume adjustment throttles 66a, 19a, 21a, 50a is determined.

  Next, a case where “mode 2” is selected and the determination in step 401 is negative will be described. In this case, the process proceeds to step 405.

  In step 405, optimization of control parameters by GA (genetic algorithm) is executed. Here, N (N> 2) candidates are selected from the control parameter solutions so as not to overlap, and this is set as a parent group. This is the 0th generation. At this time, if the feature space to be optimized is k-dimensional (that is, the number of control parameters is k), one solution candidate is a k-dimensional vector.

  Next, for each individual (parent) of this parent group, the “air conditioning control operation of the exposure apparatus” is performed to determine the value of each evaluation function. Here, if there is an individual that has reached the target value (calculation censored evaluation value) in this generation, the process is terminated with the individual as an optimal solution, but the following processing is performed assuming that such an individual does not exist. I do.

  That is, three parents are randomly selected from this parent group, and M individuals are generated from two of the three parents using, for example, the UNDX crossover method. At this time, the remaining parents of the three parents are used as reference individuals for crossover. Then, the generated M individuals are set as “child populations”, and the evaluation function values (evaluation function values) of the individuals of the child population are obtained. Further, two individuals are selected by roulette selection from a family set consisting of two parents and a child group, and the two selected individuals are returned to the parent group instead of the two parents. Here, when two parents are selected as they are, there is no change in the configuration of the parent group, but in other cases, the configuration of the parent group is changed.

  In GA, the above processing is executed while the generations are advanced one by one, and is repeated until an individual whose evaluation function value reaches the target value appears. Since the optimization of the control parameters by GA is disclosed in Japanese Patent Laid-Open No. 2002-163005 and the like, detailed description thereof is omitted. Then, when an individual whose evaluation function value has reached the target value appears, step 405 is terminated and the process proceeds to step 407. In step 407, since it is as described above, the processing is omitted.

  In this embodiment, after the optimal value of the control parameter is calculated and set in this way, actual exposure is executed. First, reticle R on which a circuit pattern to be transferred is formed is loaded onto reticle stage RST by reticle loader 82 or the like. On the other hand, the wafer W to be exposed is loaded onto the wafer stage WST by the wafer loader 88 or the like before and after the loading of the reticle R. Next, after performing preparatory work such as reticle alignment and baseline measurement using a reticle alignment detection system (not shown), a reference mark plate (not shown) on the wafer stage WST, an alignment system, etc. according to a predetermined procedure, the alignment is performed. Alignment measurement such as EGA (Enhanced Global Alignment) is performed using the detection system. After completion of such alignment measurement, a step-and-scan exposure operation is performed as follows.

  At this time, each room in the main body chamber 12 is optimally adjusted under the setting of the optimal control parameter (control target value), and the exposure operation can be performed with high accuracy.

  As can be seen from the above description, in the present embodiment, the subroutine 403 and step 405 correspond to the first process, and step 407 corresponds to the second process.

As described above in detail, according to the present embodiment, the environment control parameter group (X _p ) for controlling the gas pressure inside the exposure apparatus 100 can be determined by using the adjuster's skill. The pressure detector 10 monitors environmental information in the exposure apparatus 100 (here, gas pressure) that affects the exposure accuracy of the exposure apparatus 100 while changing the set values instead of making adjustments due to errors. Since the process of calculating the value of the evaluation function E (X _p ) using the exposure accuracy as an evaluation index based on the monitor result is automatically performed repeatedly using the simplex method or GA, it can be performed in a short time and with high accuracy. It becomes possible to optimize the environmental control parameter group (X _p ).

  In the present embodiment, as the environmental control parameters, the inverter frequency of the fans provided in the first blower 62 and the second blower 64, the target values of the voltages of the cooler 52 and the heater 56, and the flow rate adjustment throttles 66a, 19a, and 21a. However, in the exposure apparatus 100, an air intake fan may be provided in place of the flow rate adjusting diaphragms 66a, 19a, 21a, and 50a. In this case, the environment control parameter can include the frequency of the inverter that rotates the intake fans instead of the throttle amount.

Further, according to the above embodiment, the target set temperature in the Peltier element for cooling the reticle stage RST, the wafer stage WST, the wafer holder (not shown), the lens of the projection optical system PL, or the like, or the liquid cooling circuit using the liquid as the refrigerant control parameters, such as target setting temperature can be added as a component of the environmental control parameter group X _p as the optimization target. It is also possible to make such a set temperature in a clean room to indirectly influence the environment in the apparatus is also included as an element of the environmental control parameter group X _p.

  Further, according to the present embodiment, as an example of the environment to be controlled, the gas pressure in each air conditioning chamber inside the exposure apparatus 100 is taken as a representative, but the inside of the exposure apparatus 100 that affects the exposure accuracy is taken up. The environment is not limited to this, and there are various environments such as the temperature, humidity, flow rate, and flow direction of the gas. In order to optimize the environmental control parameters in consideration of these environments, the evaluation function used for the optimization of the environmental control parameters does not depend on the control deviation of the gas pressure, for example, the target temperature of each air conditioning room , The target humidity, the sum of squares of differences in measured values of temperature, humidity, and flow rate relative to the target flow rate, and the sum of correlation values of the vector of the flow direction of the implementation relative to the target vector of the gas flow direction of each air conditioning room, What is necessary is just to make it an evaluation function of a form that can find the optimum value of the environmental control parameter group that makes the environment of the air-conditioned room closest to each target. In addition, in order to measure actual values such as temperature, humidity, and flow rate, sensors for measuring them are required in each air conditioning room. Of course, it is necessary to provide a humidifier in each air conditioning room. is there.

  Also, when simultaneously optimizing several types of environments, such as pressure and temperature, pressure and temperature and humidity, or flow rate, the weighted sum of the deviations between the target values and measured values of these several types of environments is calculated. It can be used as an evaluation function.

In the present embodiment, the objective is to keep the internal environment of the exposure apparatus 100 during exposure optimal from the viewpoint of exposure accuracy. Therefore, information on the environment in the exposure apparatus 100 is obtained in optimization of environmental control parameters. When monitoring, for example, it is desirable that the reticle loader 82, wafer loader 86, wafer stage WST, and the like are operated in the same manner as in an actual process. In this case, process wafer loading and unloading, illumination with illumination light, and synchronous scanning (acceleration / deceleration operation) of both stages WST and RST are performed in accordance with process conditions including shot maps in the actual process. In this state, information on various environments and measurement reproducibility of the interferometer are measured. In this way, it becomes possible to monitor the environment-related information in the exposure apparatus 100 in a form close to that during actual operation, and the environment control parameter group (X _p ) can be optimized with higher accuracy. It can be.

  In the above embodiment, the evaluation function for optimizing the control parameter group is the sum of squares of the difference between the target value and the actual measurement value of each air conditioning room in the exposure apparatus 100. It may be the sum of absolute values of differences between the target value and the actual measurement value. In short, as the evaluation function, a function whose value increases or decreases according to the difference between the target value and the actual measurement value may be used.

  In the above embodiment, the environmental control parameter is expressed by using the evaluation function according to the magnitude of the deviation between the target value and the actual value of the environment of each air conditioning room in the exposure apparatus 100 shown in the above formula (1). Optimized. That is, the above embodiment monitors information related to the environment in the apparatus that affects the exposure accuracy, and when the environment in the apparatus is in a state where the exposure accuracy will be optimal, the value is the highest. The environmental parameter group was optimized by using a good evaluation function. However, the present invention is not limited to this, and the control parameter group may be optimized using an evaluation function having exposure accuracy as a direct evaluation index.

For example, those in the apparatus that are most susceptible to the environment in the apparatus include laser interferometers IF1 and IF2 that measure the displacement of reticle stage RST and wafer stage WST. The reproducibility of the measurement values of the laser interferometers IF1 and IF2 is affected by the temperatures of the exposure chamber 16 and the wafer stage chamber 30 and the gas pressure. Therefore, the reproducibility of the measured values of the laser interferometers IF1, IF2, etc. itself can be expressed in numerical formulas, and the environmental parameter group can be optimized using an evaluation function that increases or decreases according to the reproducibility. . As the evaluation function E (X _p ) in this case, for example, the following equation can be adopted.

ここで、Ｉ_i（Ｘ）（ｉ＝１〜Ｎ）は、レーザ干渉計ＩＦ１、ＩＦ２の各測長軸での単位時間当たりの計測再現性（分散）を示している。この単位時間としては、数分間を規定するなど、任意の時間を設定することができるが、一例として、走査露光時において、ウエハＷ上の一点を照明光が照射される露光領域が通過する時間を採用することができる。例えば、ステージが走査される走査方向の露光領域の幅が８ｍｍであり、ウエハステージＷＳＴの走査速度が３６０ｍｍ／ｓであったとすると、単位時間を、約０．０２２秒とすることができる。すなわち、ある一点の像の転写が行われる間のステージの振動に影響を与える干渉計の計測再現性を評価指標とするのが望ましい。

Here, I _i (X) (i = 1 to N) indicates measurement reproducibility (dispersion) per unit time on each measurement axis of the laser interferometers IF1 and IF2. As this unit time, an arbitrary time can be set, such as defining several minutes, but as an example, the time required for the exposure area irradiated with the illumination light to pass through one point on the wafer W during scanning exposure. Can be adopted. For example, if the width of the exposure region in the scanning direction in which the stage is scanned is 8 mm and the scanning speed of wafer stage WST is 360 mm / s, the unit time can be set to about 0.022 seconds. That is, it is desirable to use the measurement reproducibility of the interferometer that affects the vibration of the stage during the transfer of an image at a certain point as an evaluation index.

That is, I _i (X _p ) is a unit at a predetermined sampling interval (for example, 1 msec interval) when the environmental control parameter group X _p is set while the stage (reticle stage RST or wafer stage WST) is stationary. It can be a value (that is, dispersion) based on the fluctuation width of the measured values (in 11 sample values) of the laser interferometer measured in time.

  As a value based on such fluctuation width, for example, if the measurement error of the laser interferometer follows a normal distribution, the normal distribution is estimated from the sampled measurement value group, and the variance of the estimated normal distribution is It is appropriate to set a value based on the standard deviation σ, for example, 1 time (1σ), 3 times (3σ), 6 times (6σ), etc., as described above. It can be said that it is statistically appropriate to use it as the value of each term of the evaluation function.

  Even in the case where the evaluation function represented by the above formula (7) is used, as in the above-described embodiment, it is a matter of course that the optimum combination of control parameter values of the evaluation function of the formula (7) is obtained by the simplex method or GA. It is. That is, if the evaluation function is used for optimization, the optimum values of the environment control parameter group for controlling the environment in the exposure apparatus 100 are not searched by trial and error, but those set values are set. While changing, information regarding the exposure accuracy of the exposure apparatus 100 (that is, measurement reproducibility of the interferometer) is monitored, and a process of calculating an evaluation function value using the exposure accuracy as an evaluation index based on the monitoring result is predetermined. Therefore, it is possible to optimize the environmental control parameter group in a short time and with certainty.

  When the exposure accuracy is directly used as an evaluation index, the exposure accuracy is not limited to the measurement reproducibility of the interferometer. The exposure on the wafer W is actually performed, and the exposure result (for example, the line width deviation or position of the line pattern) An evaluation function based on the deviation amount) may be set, and the value of the evaluation function may be calculated from the actual measurement result of the line width deviation and the position deviation amount of the line pattern, and whether automatic optimization is performed by the simplex method or GA. Of course.

  Thus, in the present invention, the information to be monitored may be information on the exposure accuracy of the exposure apparatus, information on the environment in the apparatus that affects the exposure accuracy, or both of them may be monitored simultaneously. It may be.

  In the above-described embodiment, the optimization of the control parameter may be performed by using the environmental model of the exposure apparatus 100 constructed on the simulation and applying the optimization method. Even in this case, if the environment model reproduces the environment of the actual machine well, the environment control parameters can be optimized without repeatedly performing actual measurement with the actual machine.

  In this simulation, the above formula (1) or formula (7) can be applied as an evaluation function as it is, but the environment model in the simulation takes into account restrictions (that is, constraint conditions) depending on the hardware of the actual machine. However, it is not always possible to extract an appropriate search range. Therefore, prior to the optimization process, the “environment control operation in the apparatus” for the control parameter solution candidate is simulated using the evaluation function shown in the following expression instead of the evaluation function of the expression (1). You may make it carry out virtually using the environmental model in the upper apparatus.

ここで、ｈ（η）は、ペナルティ項である。このｈ（η）としては、制御パラメータの設定値に応じてその値が変化する項、例えば、制御パラメータの解の候補の中に、実機では設定しえない値が含まれるような場合には、巨大な値を有する項とし、制御パラメータが、すべて実機で設定可能な値であった場合には、ｈ（η）＝０とするように設定することができる。このようなペナルティ項を評価関数に設けることにより、実機で設定可能な制御パラメータの範囲内で、最適解の探索範囲を制限することができるようになり、最適化に要する時間を短縮することができるようになる。

Here, h (η) is a penalty term. This h (η) is a term whose value changes according to the set value of the control parameter, for example, when a value that cannot be set by the actual machine is included in the solution of the control parameter. If the term has a huge value and all the control parameters are values that can be set by an actual machine, h (η) = 0 can be set. By providing such a penalty term in the evaluation function, it becomes possible to limit the search range of the optimal solution within the range of control parameters that can be set by the actual machine, and shorten the time required for optimization. become able to.

In this way, in practice, a constraint condition is generally added to the environmental control parameter. For example, there is a range that can also be set for the frequency of the inverter, and the lens of the projection optical system PL is cooled. There is an allowable range for the set temperature. These optimizations need to be done taking this constraint into account. The addition of the penalty term to the evaluation function is particularly effective in such a case. Further, as described above, in the simulation, each coefficient of the evaluation function, for example, the target values RS ^* , WS ^* , RL ^* , WL ^* of the air conditioning chambers of the equation (1), as described above, WS ^* ≧ It should be noted that a value such that WL ^* ≧ RS ^* ≧ RL ^* needs to be set.

  Further, when the above optimization method is used, it is necessary to set an allowable value of the evaluation function as an end condition for terminating the optimization. Since this allowable value depends on the environment in the clean room where the exposure apparatus operates, it is desirable that the allowable value can be set by the user who operates the exposure apparatus. Therefore, in the exposure apparatus 100, it is desirable that the allowable value of such an evaluation function can be set by the user together with the mode setting parameter for selecting the optimization method. In addition, when there are constraints on the environmental control parameters, it is desirable that these constraints can be set by the user.

  In addition, if the environment control parameters that were optimized at the beginning of operation become unsuitable for the current operation due to changes in the exposure apparatus over time, the environment control parameters can be re-optimized during exposure apparatus maintenance. You may do it. In this case, a series of optimization processes such as selection of optimization methods, allowable values of evaluation functions, and environmental control parameter constraints so that the user of the exposure apparatus can re-optimize the environmental control parameters It is desirable to describe it in the operation manual that explains the setting of information necessary for the operation and the actual re-optimization method.

  When a certain amount of time is required for the optimization of the environmental control parameter, it is desirable that the user can check whether or not the value of the evaluation function is in a converged state. Therefore, in the exposure apparatus 100, for example, in order to optimize the environmental control parameter, for example, how the value of the evaluation function changes can be displayed in a graph in real time on the display of the exposure apparatus. Good.

  In the above embodiment, whether the simplex method or the GA is used as the optimization method can be selected by the operator by setting the operation mode of the control device. It is desirable to carry out based on the characteristics of the two optimization methods. In other words, if you want to optimize the control parameters as quickly as possible, use the simplex method, and if you want to find a globally optimal solution that has enough time and does not fall into a local solution, use GA. It is desirable to use it. Further, GA may be adopted for optimization by the above simulation, and simplex method may be adopted for optimization in an actual machine. Needless to say, methods other than the above two optimization methods can be adopted. For example, the steepest descent method, the Newton method, etc. can be used. In this case as well, it is desirable to decide which method to select based on the characteristics of each method.

  The present invention is applicable to any exposure apparatus that can control the internal environment, and is of course not limited to the one having the configuration shown in FIG. For example, the machine room may be provided under the floor of the clean room, and the machine room and the main body chamber may be integrated. In addition, each air conditioning room may be provided together in a separate chamber or independently. Further, the number of air conditioning rooms may be any number, and the ratio of supplied gas is not limited to 80:20. Further, the number and arrangement of the detectors and controllers of the control system that controls the internal environment are not limited, and it may be installed as necessary. For example, a chemical filter or the like can be provided in the supply port portion of the reticle loader chamber 18 and the wafer loader chamber 20.

  Further, the reticle loader system is not limited to the configuration of the above-described embodiment. For example, a bottom open type sealed cassette (container) capable of storing a plurality of reticles may be used instead of the reticle library 80. Alternatively, a mechanism for sliding the transfer arm as a reticle loader may be used. Further, the reticle storage unit (reticle library 80) and the reticle loader 82 may be arranged in different rooms, or the above-described sealed cassette is placed on the upper part of the reticle loader chamber 18 to maintain its airtightness. In this state, the reticle may be carried into the reticle loader chamber 18 by bottom opening. Further, a shelf or a case for temporarily storing a reticle carried in from a sealed cassette (such as a smif pod) arranged outside the reticle loader chamber 18 may be provided in the reticle loader chamber 18. In short, only the reticle loader may be arranged in the small room 18.

  The wafer loader system is not limited to the above-described configuration. For example, the wafer loader system may be configured only by an articulated robot, or only the wafer loader may be disposed in the wafer loader chamber 20.

  In the above-described embodiment, the exposure apparatus 100 includes one wafer stage. However, for example, the exposure includes two wafer stages as disclosed in International Publications WO98 / 24115 and WO98 / 40791. The present invention can also be applied to an apparatus.

The present invention is not limited to the exposure light source. As a light source for an illumination system that emits exposure light, vacuum ultraviolet light such as far ultraviolet light such as KrF excimer laser light source (oscillation wavelength 248 nm), ArF excimer laser light source (oscillation wavelength 193 nm), or F ₂ laser light source (oscillation wavelength 157 nm). What generates light etc. can be used. It is also possible to use an ultra-high pressure mercury lamp that generates ultraviolet emission lines (g-line, i-line, etc.). Further, it may be used other vacuum ultraviolet light source such as Ar ₂ laser light source (output wavelength 126 nm). In addition, for example, the laser light source output from each of the above light sources as vacuum ultraviolet light is not limited to the laser light source output from a DFB (Distributed Feedback) semiconductor laser or a fiber laser. A light source that irradiates, as illumination light, harmonics that are amplified with a fiber amplifier doped with, for example, erbium (Er) (or both erbium and ytterbium (Yb)) and converted into ultraviolet light using a nonlinear optical crystal. It may be used. In addition, the present invention may be applied to an exposure apparatus that uses EUV light, X-rays, or charged particle beams such as electron beams and ion beams as exposure beams. Furthermore, the present invention may be applied to an immersion type exposure apparatus disclosed in, for example, International Publication WO99 / 49504 and the like, in which a liquid is filled between the projection optical system PL and the wafer W.

When ArF excimer laser light (wavelength 193 nm) is used as illumination light, an inert gas (nitrogen or the like) is also supplied into the lens barrel of the projection optical system PL or the housing that houses the projection optical system PL. Further, when F ₂ laser light (wavelength 157 nm) is used as exposure light, a reticle stage and a wafer stage are respectively disposed in the sub-chamber, and in addition to the illumination optical system and projection optical system PL (not shown), the illumination An inert gas (such as helium) is also supplied between the optical system and the projection optical system PL and between the projection optical system PL and the wafer W. Therefore, in an exposure apparatus that seals at least part of an illumination optical path from the light source to the wafer W including the inside of the light source and supplies an inert gas or the like therein, for example, the inert gas supplied to the illumination optical system It is preferable to provide a chemical substance removal filter (chemical filter) in the middle of the exhaust path through which it passes or also at the outlet. Of course, a chemical filter may be provided in the middle or at the inlet of the inflow path of the inert gas, which is particularly effective when the recovered inert gas is cleaned and reused. Further, as described above, for example, when light belonging to a vacuum ultraviolet region having a wavelength of about 120 nm to 200 nm is used as exposure light, the above-described inert gas (nitrogen gas, helium gas, etc.) is used as the air conditioning gas.

  In the exposure apparatus of the above embodiment, the magnification of the projection optical system may be not only a reduction system but also an equal magnification and an enlargement system, and the projection optical system PL is not only a refraction system but also any of a reflection system and a catadioptric system. However, the projected image may be either an inverted image or an erect image.

  In the above embodiment, it is needless to say that the illumination light of the exposure apparatus is not limited to light having a wavelength of 100 nm or more, and light having a wavelength of less than 100 nm may be used. For example, in recent years, in order to expose a pattern of 70 nm or less, EUV (Extreme Ultraviolet) light in a soft X-ray region (for example, a wavelength region of 5 to 15 nm) is generated using an SOR or a plasma laser as a light source, and its exposure wavelength Development of an EUV exposure apparatus using an all-reflection reduction optical system designed under (for example, 13.5 nm) and a reflective mask is underway. In this apparatus, a configuration in which scanning exposure is performed by synchronously scanning a mask and a wafer using arc illumination is conceivable.

  In the above embodiment, the case where the present invention is applied to a scanning exposure apparatus such as a step-and-scan method has been described. However, the scope of the present invention is not limited to this, and step-and-scan is not limited thereto. The present invention can be applied to a repeat reduction exposure apparatus, a step-and-stitch exposure apparatus, a proximity exposure apparatus, a mirror projection aligner, and the like. The present invention can also be applied to a twin stage type exposure apparatus having two wafer stages.

  An illumination optical system and a projection optical system composed of a plurality of lenses are incorporated into the exposure apparatus main body, optical adjustment is performed, and a reticle stage or wafer stage consisting of a large number of mechanical parts is attached to the exposure apparatus main body to provide wiring and piping. , And further performing general adjustment (electrical adjustment, operation check, etc.), the exposure apparatus of the above embodiment can be manufactured. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate, or a predetermined reflecting pattern is formed on a light-reflecting substrate. Although the formed light reflection type mask is used, an electronic mask that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed may be used instead of these masks. Such an electronic mask is disclosed in, for example, US Pat. No. 6,778,257. Here, this US Pat. No. 6,778,257 is incorporated by reference.

  Note that the above-described electronic mask is a concept including both a non-light-emitting image display element and a self-light-emitting image display element. Here, the non-light-emitting image display element is also called a spatial light modulator, and is an element that spatially modulates the amplitude, phase, or polarization state of light. It can be divided into a reflective spatial light modulator. The transmissive spatial light modulator includes a transmissive liquid crystal display (LCD), an electrochromic display (ECD), and the like. In addition, reflective spatial light modulators include DMD (Digital Mirror Device or Digital Micro-mirror Device), reflective mirror array, reflective liquid crystal display element, electrophoretic display (EPD), electronic paper (or electronic ink). ), Grating Light Value, etc. are included.

  Self-luminous image display elements include CRT (Cathod Ray Tube), inorganic EL (Electro Luminescence) display, field emission display (FED), plasma display (PDP), A solid light source chip having a light emitting point, a solid light source chip array in which a plurality of chips are arranged in an array, or a solid light source array in which a plurality of light emitting points are formed on a single substrate (for example, an LED (Light Emitting Diode) display, OLED) (Organic Light Emitting Diode) display, LD (Laser Diode) display, etc.). Note that when a fluorescent material provided in each pixel of a known plasma display (PDP) is removed, a self-luminous image display element that emits light in the ultraviolet region is obtained.

  In the semiconductor device, the steps of device manufacture and performance design, the step of manufacturing a reticle based on this design step, the step of manufacturing a wafer W from a silicon material, and the pattern of the reticle on the wafer W by the exposure apparatus 100 of the above-described embodiment. It is manufactured through a transfer step, a memory repair step, a device assembly step (including a dicing process, a bonding process, and a packaging process), an inspection step, and the like.

  In the above embodiment, the case where the present invention is applied to an exposure apparatus for manufacturing a semiconductor has been described. However, the present invention is not limited to this. For example, the present invention is also applied to an exposure apparatus that transfers a circuit pattern onto a glass substrate or a silicon wafer in order to manufacture a reticle or mask used in an optical exposure apparatus, EUV exposure apparatus, X-ray exposure apparatus, electron beam exposure apparatus, or the like. The invention can be applied. Here, in an exposure apparatus using DUV (far ultraviolet) light, VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used, and the reticle substrate is quartz glass, fluorine-doped quartz glass, or fluorite. , Magnesium fluoride, or quartz is used. Further, in a proximity type X-ray exposure apparatus or an electron beam exposure apparatus, a transmission mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate.

  The present invention also provides an exposure apparatus for transferring a device pattern used for manufacturing a thin film magnetic head onto a ceramic wafer, an exposure apparatus for transferring a device pattern used for manufacturing a display including a liquid crystal display element onto a glass plate, The present invention can also be applied to an exposure device used for manufacturing an image pickup device (CCD or the like), an organic EL, a micromachine, a DNA chip, or the like.

  Furthermore, the present invention can be suitably applied to a processing apparatus that needs to control the environment in the apparatus even if it is an inspection apparatus or processing apparatus other than the exposure apparatus.

  As described above, the adjustment method of the present invention is suitable for controlling the environment in the apparatus.

1 is a drawing schematically showing an overall configuration of an exposure apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line A-A ′ of FIG. 1. FIG. 2 is a block diagram schematically showing a control system related to temperature control of the exposure apparatus of FIG. 1. It is a flowchart which shows the optimization process of a control parameter. It is a flowchart which shows the process of a simplex method. It is a figure which shows notion simplex in k-dimensional vector space notionally.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Pressure detector, 12 ... Main body chamber, 14 ... Machine room, 16 ... Exposure room (large room), 16a ... Pressure sampling board, 16b ... Solenoid valve, 18 ... Reticle loader room (small room), 18a ... Pressure sampling Board, 18b ... Solenoid valve, 19a ... Flow rate adjusting throttle, 20 ... Wafer loader chamber (small chamber), 20a ... Pressure sampling board, 20b ... Solenoid valve, 21a ... Flow rate adjusting throttle, 22 ... Exposure apparatus main body, 24 ... Air supply line 24a, 24b, 24c ... branch path, 26 ... connection part, 30 ... wafer stage chamber, 34 ... main column, 34a ... pressure sampling board, 34b ... solenoid valve, 40 ... return part, 42 ... return duct, 44 ... return 46, return part, 48 ... return duct, 50 ... OA port, 50a ... flow adjustment throttle, 52 ... cooler (dry coil) 54 ... 1st temperature sensor, 55 ... 2nd temperature sensor, 56 ... 1st heater, 58 ... 1st fan, 60 ... Branch, 60a ... Member for bellows, 62 ... 2nd heater, 64 ... 2nd fan, 66 Reference numeral: Return duct, 66a: Flow rate adjusting throttle, 68: Drain pan, 70: Control device, 72: Third temperature sensor, 74: Fourth temperature sensor, 80: Reticle library, 82: Reticle loader, 84: Wafer carrier, 86 ... Robot, 88 ... Wafer transfer device, 90 ... Ejection port, 92 ... Reticle transfer area, 100 ... Exposure device, AF1, AF2, AF3, AF4 ... Filter box, CF1a, CF2a, CF1b, CF2b ... Chemical filter, CR1 ... Pressure Sampling board, CR2 ... solenoid valve, F ... floor, IF1, IF2 ... laser interferometer, M1, M2 ... mirror, PM ... pressure sensor, PL ... projection optical system, R ... reticle, RST ... reticle stage, W ... wafer, WST ... wafer stage.

Claims (6)

An adjustment method for adjusting the environment in the exposure apparatus,
While changing the set value of the environment control parameter group for controlling the environment in the exposure apparatus using a predetermined optimization method, information on the exposure accuracy of the exposure apparatus and the inside of the apparatus that affects the exposure accuracy A first step of repeatedly performing a process of monitoring at least one of the environmental information and calculating a value of an evaluation function using the exposure accuracy as an evaluation index based on the monitoring result;
A second step of determining a set value of the environmental control parameter group having a good value of the evaluation function as a target value of the environmental control parameter group during operation of the apparatus.   2. The adjustment method according to claim 1, wherein the environment in the apparatus that affects the exposure accuracy is at least one of pressure, temperature, humidity, and fluid flow in at least a part of the apparatus.   The adjustment method according to claim 1, wherein the information related to the exposure accuracy of the exposure apparatus includes measurement reproducibility per unit time of a measurement apparatus that measures displacement of components in the apparatus.   4. The adjustment method according to claim 3, wherein the unit time is determined according to a time during which one point on the object to be exposed is continuously exposed.   5. The environment control parameter includes a rotation speed of an inverter provided in an adjustment device that adjusts at least a part of the environment in the exposure apparatus. 6. Adjustment method. The adjustment method according to claim 1, wherein the predetermined optimization method is at least one of a genetic algorithm and a simplex method.

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