JP2006332100A5 - - Google Patents

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Publication number
JP2006332100A5
JP2006332100A5 JP2005149329A JP2005149329A JP2006332100A5 JP 2006332100 A5 JP2006332100 A5 JP 2006332100A5 JP 2005149329 A JP2005149329 A JP 2005149329A JP 2005149329 A JP2005149329 A JP 2005149329A JP 2006332100 A5 JP2006332100 A5 JP 2006332100A5
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JP
Japan
Prior art keywords
optical element
gas
exposure apparatus
wafer
final optical
Prior art date
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Application number
JP2005149329A
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Japanese (ja)
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JP4708860B2 (en
JP2006332100A (en
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Priority to JP2005149329A priority Critical patent/JP4708860B2/en
Priority claimed from JP2005149329A external-priority patent/JP4708860B2/en
Publication of JP2006332100A publication Critical patent/JP2006332100A/en
Publication of JP2006332100A5 publication Critical patent/JP2006332100A5/ja
Application granted granted Critical
Publication of JP4708860B2 publication Critical patent/JP4708860B2/en
Expired - Fee Related legal-status Critical Current
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Claims (4)

最終光学素子の下の液膜を介してウエハを露光する液浸露光装置において、
前記最終光学素子の周辺に配置されたノズルユニットを有し、
前記ノズルユニットには、気体を供給する気体供給口設けられており
前記最終光学素子液膜の除去時、前記最終光学素子前記気体供給口から高湿度の気体を供給することを特徴とする露光装置。
In an immersion exposure apparatus that exposes a wafer through a liquid film under the final optical element ,
A nozzle unit disposed around the final optical element;
Wherein the nozzle unit, the gas supply port is provided for supplying gas,
It said final upon removal of the lower liquid film of the optical element, exposure apparatus and supplying the high humidity of the gas from the gas supply port below the last optical element.
前記ノズルユニットに、前記気体供給口と前記最終光学素子の下とを含む空間を囲む壁が設けられていることを特徴とする請求項1記載の露光装置。 Wherein the nozzle unit, the exposure apparatus according to claim 1, characterized in that the wall surrounding the space is provided comprising a lower of said gas supply port and the last optical element. 前記ノズルユニットの前記よりも気体を回収する気体回収口設けられており、
前記気体回収口は、前記最終光学素子の下の液膜の除去時、前記最終光学素子の下の高湿度の気体を回収することを特徴とする請求項2記載の露光装置。
On the inner side of the wall of the nozzle unit, and a gas recovery port is provided to recover the gas,
3. The exposure apparatus according to claim 2 , wherein the gas recovery port recovers a high-humidity gas under the final optical element when the liquid film under the final optical element is removed .
ウエハを保持し移動する2つのウエハステージ有し、
前記2つのウエハステージを前記最終光学素子の下で交換しながらウエハを露光
前記2つのウエハステージの少なくとも一方ウエハステージが前記最終光学素子の下に常に存在することを特徴とする請求項1〜3のいずれか一項記載の露光装置。
Holding the wafer has two wafer stages move,
Exposing the wafer while exchanging the two wafer stages under the final optical element,
The exposure apparatus according to claim 1, wherein at least one of the two wafer stages is always present under the final optical element .
JP2005149329A 2005-05-23 2005-05-23 Immersion exposure equipment Expired - Fee Related JP4708860B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005149329A JP4708860B2 (en) 2005-05-23 2005-05-23 Immersion exposure equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005149329A JP4708860B2 (en) 2005-05-23 2005-05-23 Immersion exposure equipment

Publications (3)

Publication Number Publication Date
JP2006332100A JP2006332100A (en) 2006-12-07
JP2006332100A5 true JP2006332100A5 (en) 2008-07-03
JP4708860B2 JP4708860B2 (en) 2011-06-22

Family

ID=37553519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005149329A Expired - Fee Related JP4708860B2 (en) 2005-05-23 2005-05-23 Immersion exposure equipment

Country Status (1)

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JP (1) JP4708860B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4899473B2 (en) * 2005-12-28 2012-03-21 株式会社ニコン Imaging optical system, exposure apparatus, and device manufacturing method
US7866637B2 (en) 2007-01-26 2011-01-11 Asml Netherlands B.V. Humidifying apparatus, lithographic apparatus and humidifying method
JP5157637B2 (en) * 2008-05-21 2013-03-06 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050110033A (en) * 2003-03-25 2005-11-22 가부시키가이샤 니콘 Exposure system and device production method
KR101364889B1 (en) * 2003-04-10 2014-02-19 가부시키가이샤 니콘 Environmental system including vaccum scavange for an immersion lithography apparatus
KR101686762B1 (en) * 2003-06-19 2016-12-28 가부시키가이샤 니콘 Exposure device and device producing method
JP2005064210A (en) * 2003-08-12 2005-03-10 Nikon Corp Method for exposure, and method of manufacturing electronic device and exposure device utilizing the method

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