JP2006315310A - Manufacturing method for liquid ejecting head, liquid ejecting head and liquid ejector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively avoid damage of eaves brought about because of a flattening pattern even when a nozzle end face is flattened by formation of the flattening pattern, by patterning a head chip by the shape of a liquid chamber, then forming a coating layer, removing a member of the patterning, thereby forming the liquid chamber and the like in application of a manufacturing method for a liquid ejecting head, a liquid ejecting head and a liquid ejector to, for example, a line printer by an ink jet system. <P>SOLUTION: In a process of working the coating layer, when the flattening pattern is removed by a process of removing the pattern, the coating layer is projected like the eaves to form an opening in the range of 4-0.3 [μm] from an outside wall face of a gap formed by the removal of the flattening pattern. By so forming the opening, the generation of cracks and the like can be effectively avoided even if the wiping process is repeatedly carried out. Thus the damage of the eaves brought about because of the flattening pattern can be avoided effectively. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a liquid discharge head, a liquid discharge head, and a liquid discharge apparatus, and can be applied to, for example, an inkjet line printer. In the present invention, by setting the projection of the eaves to be in a range of 4 to 0.3 [μm], after patterning the head chip according to the shape of the liquid chamber or the like, a covering layer is formed to form a patterning member. Even when the nozzle end face is flattened by forming a liquid chamber by removing the liquid chamber and the like, damage to the eaves caused by the flattening pattern can be effectively avoided. Like that.

  In recent years, with the development of personal computers and the widespread use of electronic still cameras, printers using an ink jet method have been widely used for hard copying electronic data. This ink jet printer is driven by an energy generating element such as a heat generating element, so that ink droplets held in a liquid chamber are ejected from minute nozzles, and the ink droplets are attached to a sheet to form a desired image or the like. To print. In addition, a head chip is created by integrating a plurality of energy generating elements, and a liquid chamber, nozzles, etc. are created on the head chip to create a printer head, thereby ensuring high resolution by arranging nozzles at high density. Configured as follows.

  Conventionally, in such a printer, after a plurality of head chips are formed on a semiconductor wafer, a liquid chamber and a nozzle are formed in each head chip, and then each head chip is separated, thereby collecting the plurality of head chips. To improve productivity.

  Regarding such a head chip creation method, Japanese Patent No. 3143307 discloses that a liquid chamber or the like is easily created by patterning the shape of the ink flow path on the head chip and then forming and removing the coating layer. A method has been proposed. That is, according to the method disclosed in Japanese Patent No. 3143307, as shown in FIG. 9A, after the head chip 1 is formed by forming a heating element or the like on a semiconductor substrate, an ink flow path or the like is formed using a predetermined resin material. Then, the shape (sacrificial layer 2) of the portion that becomes a void such as the liquid chamber 3 is formed by this resin material. Further, an epoxy resin having a concentration of 30 to 70 [wt%] is spin-coated so as to cover the sacrificial layer 2, and then a nozzle 5 is formed and cured, whereby the coating layer 4 is formed. Further, as shown in FIG. 9B, the sacrificial layer 2 is dissolved and removed, thereby forming the liquid chamber 3 and the ink flow path.

  When the printer head is produced in this manner, the thickness from the surface of the head chip 1 to the surface of the coating layer 4 is D + H at the thickest portion where D is the thickness of the sacrificial layer 2 and H is the thickness of the coating layer 4. In contrast, the thinnest portion is H, and as a result, the printer head 6 is uneven. Further, the central portion of the liquid chamber 3 becomes the thickest portion as described above, and the thickness gradually decreases toward the peripheral side of the liquid chamber 3. Accordingly, if the nozzle 5 is formed at a position deviated from the center of the liquid chamber 3 to the peripheral side, it becomes difficult to make the end surface of the nozzle 5 flat, and the ejection direction of the ink droplets may be inclined.

  For this reason, Japanese Patent Application Laid-Open No. 10-157150 proposes a method of flattening the end face of the nozzle by creating a flattening pattern using a dummy pattern. That is, in this method, as shown in FIGS. 10 (A1) and (A2), the flattened pattern 8 is formed by the sacrificial layer on the side where the nozzle 5 is biased from the center of the liquid chamber 3, and then the coating layer 4 is formed. As a result, the surface of the coating layer 4 is flattened at the location where the nozzle 5 is formed, and the ejection direction of the ink droplets is stabilized. Further, when the nozzle 5 is formed, an opening 9 is also formed on the surface of the coating layer 4, and when the liquid chamber 3 is formed, this flattening pattern 8 is also removed. Prevents deformation of the created part.

  In Japanese Patent No. 341082, the width L1 of the flattening pattern 8 formed in this way and the width L2 of the opening are set to 5 wider than the width L1 as shown by the partially enlarged arrow A. It is made larger than [μm] or larger, or the width L2 is made smaller than width L1 by 5 [μm] or more, thereby preventing fine protrusions from being generated on the inner surface of the portion from which the flattened pattern 8 has been removed. A method for preventing the occurrence of the above has been proposed.

  In this type of printer, the ink overflowing from the nozzle 5 and the ink mist adhere to the surface of the coating layer 4 to form an ink reservoir. When the ink reservoir becomes large, ink droplets cannot be ejected from the nozzle 5. . As a result, the printer is configured to move the cleaning member against the surface of the coating layer 4 with constant use, thereby removing the ink reservoir (hereinafter referred to as such ink reservoir removal processing). Is called a wipe process).

By the way, when the opening width L2 is made smaller than the width L1 of the flattening pattern 8 by 5 [μm] or more by the method disclosed in the above-mentioned Japanese Patent No. 341082, the coating layer 4 is formed on the portion where the flattening pattern 8 is removed. The eaves 10 are formed longer. In the eaves 10 as described above, there is a problem that the base part is cracked by repeating the wiping process (FIG. 10B), and finally the eaves 10 are broken. Specifically, when the projection dL of the eaves 10 is set to 10 [μm], the thickness of the coating layer 4 is set to 5 [μm], and the wiping process is repeated 10,000 times, the root portion of the eaves 10 is cracked. Admitted. In particular, in the case of high-speed printing, since the growth rate of the ink reservoir is high, it is necessary to frequently perform a wiping process, and thus the eaves 10 are easily broken. In addition, in the eaves 10 folded in this way, it becomes dust and prevents stable printing.
Japanese Patent No. 3143307 JP-A-10-157150 Japanese Patent No. 341082

  The present invention has been made in consideration of the above points, and after patterning the head chip according to the shape of the liquid chamber, a liquid chamber or the like is created by forming a coating layer and removing the patterning member. Even when the end face of the nozzle is flattened by forming a flattening pattern, a liquid discharge head manufacturing method, a liquid discharge head, and a liquid discharge head that can effectively avoid damage to the eaves caused by the flattening pattern The device is to be proposed.

  In order to solve this problem, the invention according to claim 1 is applied to a method of manufacturing a liquid discharge head in which the liquid held in the liquid chamber is discharged from the nozzle by driving the energy generation element, and the energy generation element is placed on the substrate. A substrate processing step to be formed, a pattern according to the shape of the liquid chamber, a pattern according to the shape of a flow path for guiding the liquid to the liquid chamber, and a flattening pattern for flattening the end face of the nozzle are formed on the substrate. A pattern creation step, a pattern according to the shape of the liquid chamber, a pattern according to the shape of the flow path, a coating layer creation step of forming a coating layer that covers the planarization pattern, and the nozzle in the coating layer And a coating layer processing step for forming an opening in the flattening pattern portion of the coating layer, a pattern according to the shape of the liquid chamber, and a pattern according to the shape of the flow path. A pattern removing step for removing the planarization pattern, and the coating layer processing step is formed by removing the planarization pattern when the planarization pattern is removed by the pattern removal step. The opening is formed so that the coating layer protrudes in an eaves shape in the range of 4 to 0.3 [μm] from the outer wall surface of the gap.

  The invention of claim 4 is applied to a liquid discharge head for discharging the liquid held in the liquid chamber from the nozzle by driving the energy generation element, and the shape of the liquid chamber is formed on the substrate on which the energy generation element is arranged. A pattern according to the shape of the flow path for guiding the liquid to the liquid chamber, a flattening pattern for flattening the end face of the nozzle, a pattern according to the shape of the liquid chamber, a pattern according to the shape of the flow path A coating layer covering the planarization pattern is formed, the nozzle is formed in the coating layer, and an opening is formed at a location of the planarization pattern of the coating layer, and the pattern according to the shape of the liquid chamber, By removing the pattern according to the shape of the flow path and the flattening pattern, the liquid chamber and the flow path are formed, and the liquid chamber has 4 to 4 coating layers from the wall surface. Is formed such that the opening protrudes to the eaves in the range of .3 [μm].

  According to a fifth aspect of the present invention, the energy generating element is applied to a liquid ejecting apparatus that ejects liquid held in a liquid chamber of the liquid ejecting head from a nozzle by driving an energy generating element provided in the liquid ejecting head. On the substrate on which the liquid chamber is formed, a pattern according to the shape of the liquid chamber, a pattern according to the shape of the flow path for guiding the liquid to the liquid chamber, and a flattening pattern for flattening the end face of the nozzle are created. A coating layer that covers the pattern according to the shape of the channel, the pattern according to the shape of the flow path, and the planarization pattern is formed, and the nozzle is formed in the coating layer, and an opening is formed at the location of the planarization pattern of the coating layer. The liquid chamber and the flow path are formed by removing the formed pattern according to the shape of the liquid chamber, the pattern due to the shape of the flow path, and the flattening pattern. Is, the liquid chamber is formed such that the cover layer from the wall surface is the opening protrudes to the eaves in the range of 4 to 0.3 [μm].

  The substrate processing step of forming the energy generating element on the substrate by applying the energy generating element to the method of manufacturing a liquid discharge head that discharges the liquid held in the liquid chamber from the nozzle by driving the energy generating element. And a pattern creating step for forming a pattern on the substrate according to the shape of the liquid chamber, a pattern based on the shape of a flow path for guiding the liquid to the liquid chamber, and a flattening pattern for flattening the end face of the nozzle; , A pattern according to the shape of the liquid chamber, a pattern according to the shape of the flow path, a coating layer forming step of forming a coating layer covering the planarization pattern, and forming the nozzle in the coating layer, Processing step of covering layer for forming opening at location of flattening pattern, pattern by shape of liquid chamber, pattern by shape of flow path, flattening pattern A pattern removing step of removing the pattern, and after patterning the head chip according to the shape of the liquid chamber, a coating layer is formed and the patterning member is removed to create a liquid chamber or the like. Thus, the nozzle end face can be flattened by forming a flattening pattern. Further, in the coating layer processing step, when the planarization pattern is removed by the pattern removal step, the coating layer is 4 to 0.3 μm from the outer wall surface of the gap formed by the removal of the planarization pattern. ] If the opening is formed so that it protrudes in the form of an eave within the range of the above-mentioned range, the occurrence of cracks and the like can be effectively avoided even with repeated wiping treatment, and this is caused by the flattening pattern. Damage to the eaves can be effectively avoided.

  Thereby, according to the structure of Claim 4 and Claim 5, after patterning a head chip with the shape of a liquid chamber, a coating layer is formed and a liquid chamber etc. are created by removing a patterning member. Even when the nozzle end face is flattened by forming a flattening pattern, it is possible to provide a liquid discharge head and a liquid discharge apparatus capable of effectively avoiding damage to the eaves caused by the flattening pattern. .

  According to the present invention, after patterning the head chip according to the shape of the liquid chamber, the coating layer is formed and the patterning member is removed to create the liquid chamber and the like, and the nozzle end face is formed by the formation of the flattening pattern. Even when flattening is performed, damage to the eaves caused by the flattening pattern can be effectively avoided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.

(1) Configuration of Embodiment FIG. 2 is a perspective view showing a line printer according to the present invention. The line printer 21 is a full line type line printer, and a printer main body 22 is formed in a substantially rectangular shape. The line printer 21 is created so that the paper 23 can be fed by mounting a paper tray 24 containing the paper 23 to be printed from a tray entrance formed in front of the printer main body 22.

  In the line printer 21, when the paper tray 24 is attached to the printer main body 22 and printing is instructed by the user, the line printer 21 moves to the back side of the printer main body 22 by the rotation of the paper feed roller provided in the printer main body 22. The paper 23 is sent out from the paper tray 24 toward the front, and the feeding direction of the paper 23 is switched to the front direction by a reversing roller provided on the back side of the printer main body 22. In the line printer 21, the paper 23 whose paper feeding direction has been switched to the front direction is conveyed so as to cross the paper tray 24, and is discharged to the tray 25 from the discharge port disposed on the front side of the line printer 21. The

  The line printer 21 is provided with an upper lid 26 on the upper end surface, and the head cartridge 28 is disposed so as to be replaceable as indicated by an arrow A in the middle of the upper lid 26 and in the middle of conveying the paper in the front direction.

  Here, the head cartridge 28 is a full-line type printer head with four colors of yellow, magenta, cyan, and black, and ink tanks 29Y, 29M, 29C, and 29K for each color are provided on the upper side. The head cartridge 28 includes a head assembly 30 that is an assembly of printer heads related to the ink tanks 29Y, 29M, 29C, and 29K, and a head cap 31 that is provided on the paper 23 side of the head assembly 30. As a result, the line printer 21 prints a desired image or the like in color by causing the ink droplets of each color to adhere to the paper 23 by driving the head assembly 30 provided in the head cartridge 28.

  Here, as shown in FIG. 3A, the head cap 31 is disposed so as to cover the side surface of the paper of the head assembly 30 when not in use, thereby blocking the nozzle row provided on the side surface of the paper and Prevent drying. Also, at the start of printing, as shown in FIGS. 3B and 3C, it moves in the front direction and retreats to a predetermined retreat position, thereby exposing the nozzle row and causing ink droplets to adhere to the paper. To be able to. When the printing is finished, as shown in FIGS. 3D and 3E, the head assembly 30 is moved back to the original position covering the paper side surface, thereby preventing the ink from drying. Further, the head cap 31 once returns from the retracted position to the original position by a predetermined amount of printing, and then returns to the retracted position again.

  The head cap 31 is provided with a roller 33 serving as a cleaning member on the inner side, and when the head cap 31 is retracted to the retracted position or when returning to the original position from the retracted position, the roller 33 rubs the paper side surface of the head assembly 30. Thereby, the wiping process is executed. Here, an elastic member having a hygroscopic property such as urethane foam is applied to the roller 33. In place of such a roller 33, an elastic piece having a hygroscopic property may be rubbed to perform the wiping process. As a result, the printer 21 prevents the growth of the ink reservoir.

  That is, as shown in FIGS. 4A and 4B, the head assembly 30 has a head chip for each color of yellow Y, magenta M, cyan C, and black K on the surface to which the roller 33 is pressed. 35 are sequentially arranged. Here, the head chip 35 is a semiconductor substrate in which a plurality of energy generating elements, a driving circuit for driving each energy generating element, and the like are integrated, and each energy generating element is supplied with an ink liquid chamber and each ink liquid chamber is supplied with ink. A leading ink flow path is created. In this embodiment, a heating element is applied to the energy generating element.

  In the head assembly 30, the arrangement of the head chips 35 forms a nozzle row of the nozzles 36 according to the paper width for each color, and the ink flow path formed in each head chip 35 is connected via the ink supply pipe 38. Ink is supplied from the corresponding ink tanks 29Y, 29M, 29C, and 29K. As a result, the head assembly 30 ejects ink droplets from the nozzles 36 formed on the head chips 35 toward the paper to print an image or the like, and the surface on the nozzle 36 side is rubbed by the roller 33. Ink pool growth caused by ejection of ink droplets is prevented.

  FIG. 5 is a cross-sectional view showing the head chip 35. In the head chip 35, a MOS transistor 42 for driving an energy generating element, a MOS transistor 43 constituting a drive circuit for the MOS transistor 42, and the like are formed on a substrate 41 made of a semiconductor wafer. The wiring pattern 45 is formed, and the MOS transistors 42 and 43 are connected by the wiring pattern 45 in the first layer. Subsequently, after the interlayer insulating film 46 is formed, a heating element 47 which is an energy generating element is formed. Subsequently, a second-layer wiring pattern 48 is created, and the heating element 47 is connected to the transistor 42 and the power source by the second-layer wiring pattern 48. In the head chip 35, the insulating protective layer 49 is subsequently formed, and the anticavitation layer 50 is formed on the heating element 47.

  In these series of steps, as shown in FIG. 6, the head chip 35 is formed with the alignment reference mark M at the same time when the second-layer wiring pattern 48 is formed. Here, the reference mark M is a reference mark for alignment (LSA: Laser Step Alignment) in the exposure apparatus, as shown enlarged by an arrow B. In the exposure apparatus, the reference mark is scanned by a laser beam. The position coordinates of each exposure position are detected by detecting the diffracted light generated by M, and the semiconductor wafer is aligned for each head chip or for each predetermined chip. A similar reference mark is also formed on the reticle. In the exposure apparatus, the reticle is aligned with the reference mark on the reticle side, and the exposure process is executed by correctly positioning the reticle with respect to the reticle.

  In this embodiment, the reference mark M is formed by arranging a fine pattern P having a rectangular shape in a matrix in the vertical direction and the horizontal direction. The positioning reference mark M is not limited to the example shown in FIG. 6, and various positioning reference marks can be widely applied. Further, when a practically sufficient positioning accuracy can be ensured, it may be formed at the same time when the anti-cavitation layer 50 is formed.

  After a plurality of chips are formed on the semiconductor wafer in this manner, the head chip 35 is formed on each heat generating element 47 and then an ink flow path for guiding ink to the liquid chamber is formed. The head chips 35 are separated by processing. In the head chip 35, the liquid chamber and the ink flow path are formed by patterning using the reference mark M. Further, in order to improve the positioning accuracy of patterning using the reference mark M, it is formed after the formation of the reference mark M so that the reference mark M is exposed when the sacrificial layer related to the liquid chamber is formed. Patterning of the insulating protective layer 49 and the anti-cavitation layer 50 is performed.

  That is, when the anticavitation layer 50 is formed, a positive resist 61 is applied to the surface of the head chip 35 by spin coating as shown in FIG. Subsequently, the head chip 35 is developed by the exposure device according to the shape of the ink liquid chamber, the shape of the ink flow path for guiding ink to the ink liquid chamber, and the shape of the flattening pattern, and then developed, whereby FIG. As shown in B), an ink liquid chamber, a sacrificial layer 62 related to the ink flow path, and a planarization pattern 63 are formed. At this time, for each predetermined number of head chips 35, the semiconductor wafer is aligned using the reference marks M, and the reticle is similarly aligned, so that the exposure position is positioned using the reference marks M. Then, the exposure process is executed. As a result, in the manufacturing process of the head chip 35, the sacrificial layer 62 and the flattening pattern 63 relating to the ink liquid chamber and the ink flow path are formed by patterning by positioning using the positioning reference mark M by the second wiring pattern layer. Is created. Also in this case, patterning is performed so that the reference mark M is exposed. The exposure apparatus is a general i-line stepper.

  In this embodiment, the energy generating element 47 is formed so that the head chip 35 is continuous from the front side to the back side of the paper surface in FIG. 1. In the flattening pattern 63, the head chip 35 extends in the direction of this nozzle row. It is elongated and is formed in common by a plurality of energy generating elements 47 formed on one head chip 35.

  Subsequently, as shown in FIG. 1C, a predetermined resin material is applied to the head chip 35 by spin coating, thereby forming a covering layer 64 that covers the sacrificial layer 62 and the planarization pattern 63. In this embodiment, a photosensitive negative resist made of epoxy acrylate is used as the resin material.

  Subsequently, the head chip 35 is exposed to the coating layer 64 using an exposure device, then cured, and then developed, whereby the sacrificial layer 62 and the planarization pattern 63 are formed as shown in FIG. A nozzle 36 and an opening 66 are formed in the region. In this process, the head chip 35 is subjected to alignment processing for the predetermined number of head chips 35 using the reference mark M and the alignment process for the reticle in the same manner, whereby exposure is performed using the reference mark M. The exposure process is executed after positioning the position. Thereby, in the manufacturing process of the head chip 35, the nozzle 36 is formed in the covering layer 64 by patterning by positioning using the positioning reference mark by the second wiring pattern layer, and the covering layer 64 is flattened. An opening 66 is formed at the pattern 63. The exposure apparatus is a general i-line stepper.

  In this processing, a plurality of head chips 35 are formed on one head chip 35 in the same manner as the flattening pattern 63 on the short side of the flattening pattern 63 at a substantially central portion of the flattening pattern 63. The energy generating element 47 is formed in an elongated shape in common. Further, the opening 66 is formed in a smaller size than the width on the short side of the planarization pattern 63.

  Subsequently, in the head chip 35, after an opening 68 for introducing ink into the ink flow path is formed, the sacrificial layer 62 and the flattening pattern 63 are removed by elution using a predetermined solution. As shown, an ink liquid chamber 67 is created. Thus, after the head chip 35 is patterned according to the shape of the liquid chamber, a coating layer is formed and the patterning member is removed to create a liquid chamber and the like, and the end surface of the nozzle 36 is flattened.

  Further, the head chip 35 is flattened because the liquid chamber 67 and the like are created in this way, and the opening 66 is made smaller than the width of the short side of the flattened pattern 63. In the part where the pattern 63 is removed, the covering layer 64 is formed so as to project from the outer wall surface of the gap formed by the flattening pattern 63 into an eaves shape when viewed in a cross section on the short side. The

  The head chip 35 is set to be in the range of 4 to 0.3 [μm] so that the protrusion in the form of a peak is larger than the maximum value of the positioning error of the opening 66 with respect to the planarization pattern 63. More specifically, in this embodiment, as shown in FIG. 8, the width of the short side of the flattening pattern is formed by 50 [μm], and the opening 66 is formed by 49 [μm]. The pop-out was set to 0.5 [μm]. In this embodiment, the maximum value of the positioning error of the opening 66 with respect to the planarization pattern 63 is 0.3 [μm]. As a result, even when the positioning of the opening 66 with respect to the flattening pattern 63 varies, the head chip 35 can form an eaves-like protrusion, and the eave-like protrusion does not become large enough to crack. Created as

(2) Operation of Embodiment In the above configuration, in this line printer 21 (FIG. 2), by driving the head cartridge 28 by image data, text data or the like used for printing, a sheet 23 to be recorded is fed to a predetermined sheet feeding mechanism. Ink droplets are ejected from the head assembly 30 provided in the head cartridge 28 while being conveyed, and the ink droplets adhere to the sheet 23 being conveyed to print an image, text, or the like.

  Correspondingly, in the head assembly 30 of the head cartridge 28 (FIGS. 2 and 4), the ink in the ink tanks 29Y, 29M, 29C, and 29K is guided to the head chip 35, and the heating element provided in the head chip 35 Ink droplets are ejected from the nozzles 36 by increasing the pressure of the ink held in the ink chamber 67 by driving 47 (FIG. 5) (FIG. 1). Thus, the line printer 21 can print a desired image or the like. In addition, by ejecting ink droplets from the nozzles 36 in this way, ink reservoirs are formed on the side surfaces of the nozzles of the head chip 35, and the ink reservoirs grow larger as printing is performed.

  As a result, in this head chip 35, at the start of printing, at the end of printing, by a predetermined amount of printing, the roller 33 moves so as to rub the side surface of the nozzle 36 of the head chip 35. Is prevented. In addition, as a result, the head chip 35 is subjected to a pressing force by the roller 33 on the side surface of the nozzle 36 every time it is wiped.

  In the head chip 35 according to the printer 21, after the energy generating element 47 and the drive circuit are integrally formed on the semiconductor substrate (FIG. 5), the shapes of the ink liquid chamber, the ink flow path, and the like are patterned on the head chip. Thus, the sacrificial layer 62 is formed. After the coating layer 64 is formed, the sacrificial layer 62 is removed, thereby creating an ink liquid chamber 67, an ink flow path, and the like, thereby easily creating a liquid chamber and the like. Further, when the sacrificial layer 62 is formed, a flattened pattern 63 is formed by a dummy pattern, whereby the end face of the nozzle 36 is flattened.

  Thus, in the case where the end face of the nozzle 36 is flattened by the flattening pattern 63 in this way, when the width of the opening is made smaller than the width of the sacrificial layer, the cover layer 4 is not covered by the covering layer 4. The eaves are formed and damaged by repeated wiping.

  As a result, in this embodiment, even when the positioning of the opening 66 with respect to the flattening pattern 63 varies, it is possible to form an eaves-like protrusion, and the eave-like protrusion does not become large enough to crack. Thus, an opening 66 is created.

  That is, in this embodiment, more specifically, in this embodiment, the eave-like protrusion is set to 0.5 [μm] so that the eave-like protrusion is in the range of 4 to 0.3 [μm]. Thus, even when the wiping process is repeated, damage to the eaves can be effectively avoided. Specifically, it was confirmed that no cracks or the like were generated even when the wiping process was executed 10,000 times.

  In this embodiment, when the second wiring pattern 48 of the head chip 35 is created, a reference mark M for positioning is created (FIG. 6). The anti-cavitation layer 50 or the like is formed so as not to cover the reference mark M, and the planarization pattern 63 and the opening 66 are formed by positioning with the reference mark M.

  Thereby, in this embodiment, the positioning accuracy of the opening 66 with respect to the flattening pattern 63 is sufficiently ensured, and even when the positioning of the opening 66 with respect to the flattening pattern 63 is varied in this way, the protrusion of the eaves is cracked. It can be prevented from becoming too large.

  Specifically, if the positioning is performed in this manner, the positional deviation of the opening 66 with respect to the planarization pattern 63 can be set to 0.3 [μm] or less. On the other hand, the protruding amount of the eaves can be set to be within the range of 0.2 to 0.8 [μm] even when the position is shifted because the designed value is 0.5 [μm]. Can sufficiently prevent damage.

(3) Effects of the embodiment According to the above configuration, the head chip is patterned according to the shape of the liquid chamber by setting the protrusion of the eaves to be in the range of 4 to 0.3 [μm], and then the coating is performed. Even when the nozzle end face is flattened by forming a liquid chamber or the like by forming a layer and removing the patterning member to form a liquid chamber, the eaves generated by this flattening pattern Damage can be effectively avoided.

  Also, by creating a reference mark for positioning by patterning the wiring layer and creating a flattened pattern and opening by patterning by positioning using this reference mark, variation in the positioning of the opening with respect to the flattened pattern can be made sufficiently small As a result, damage to the eaves can be reliably prevented.

  In the above-described embodiment, the case where the reference mark is created by the second-layer wiring pattern is described. However, the present invention is not limited to this, and the reference mark may be created by the sacrificial layer as shown in FIG. Good. FIG. 8 is an example in which a rectangular opening is formed in the resin material 70 for forming the sacrificial layer to form one pattern P of the reference mark.

  In the above-described embodiments, the case where the heat generating element is applied to the energy generating element has been described. However, the present invention is not limited to this, and may be widely applied to the case where a piezoelectric element or the like is applied to the energy generating element. it can.

  In the above-described embodiment, a case has been described in which the present invention is applied to a full-line type printer head for color printing to create four nozzle arrays. However, the present invention is not limited to this, for example, monochrome printing. For example, when the present invention is applied to a full-line type printer head for producing a single nozzle array, the present invention can be widely applied to the production of nozzle arrays with various numbers.

   In the above-described embodiment, the case where the present invention is applied to a full-line type printer head has been described. However, the present invention is not limited to this, and the present invention may be applied to a serial type printer head. .

  In the above-described embodiments, the case where the present invention is applied to a printer head to eject ink droplets has been described. However, the present invention is not limited to this, and instead of ink droplets, the droplets are liquids of various dyes. Droplets, liquid discharge heads that are droplets for forming a protective layer, etc., microdispensers where the droplets are reagents, various measuring devices, various test devices, and various types of droplets that are agents that protect members from etching The present invention can be widely applied to pattern drawing apparatuses and the like.

  The present invention relates to a method for manufacturing a liquid discharge head, a liquid discharge head, and a liquid discharge apparatus, and can be applied to, for example, an inkjet line printer.

It is sectional drawing with which it uses for description of the manufacturing process of the printer head based on the Example of this invention. 1 is a perspective view showing a printer according to an embodiment of the present invention. FIG. 3 is a cross-sectional view for explaining a wiping process in the printer of FIG. 2. It is the top view and side view which show the printer head applied to the printer of FIG. It is sectional drawing which shows the head chip applied to the printer of FIG. It is a top view with which it uses for description of the reference mark of the head chip of FIG. It is sectional drawing with which it uses for description of opening in the head chip of FIG. 6A and 6B are a plan view and a cross-sectional view illustrating a reference mark applied to the printer according to the second embodiment. It is sectional drawing which shows the conventional liquid chamber preparation method. FIG. 10 is a cross-sectional view showing a method for flattening the nozzle end surface by the liquid chamber creating method of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,35 ... Head chip, 2, 62 ... Sacrificial layer, 4, 64 ... Covering layer, 5, 36 ... Nozzle, 6 ... Printer head, 8, 63 ... Planarization pattern, 9, 66 ... ... opening, 33 ... roller, 47 ... energy generating element, 3, 67 ... ink chamber, M ... reference mark

Claims (5)

In the method of manufacturing a liquid discharge head for discharging the liquid held in the liquid chamber from the nozzle by driving the energy generating element,
A substrate processing step of forming the energy generating element on the substrate;
A pattern creation step for forming a pattern on the substrate according to a shape of the liquid chamber, a pattern based on a shape of a flow path for guiding the liquid to the liquid chamber, and a flattening pattern for flattening an end face of the nozzle;
A pattern by the shape of the liquid chamber, a pattern by the shape of the flow path, a coating layer forming step of forming a coating layer covering the planarization pattern;
The nozzle is formed in the coating layer, and the coating layer processing step of forming an opening at the location of the planarization pattern of the coating layer;
A pattern according to the shape of the liquid chamber, a pattern according to the shape of the flow path, and a pattern removal step of removing the planarization pattern,
The coating layer processing step includes:
When the planarization pattern is removed by the pattern removal step, the coating layer protrudes in an eaves shape in the range of 4 to 0.3 [μm] from the outer wall surface of the gap formed by the removal of the planarization pattern. The method of manufacturing a liquid discharge head, wherein the opening is formed so as to be the opening. The substrate processing step includes:
By patterning the wiring layer, create a reference mark for wiring and positioning of the energy generating element,
The process of creating the pattern includes
By patterning by positioning using the positioning reference mark, the pattern due to the shape of the liquid chamber, the pattern due to the shape of the flow path, the resin material used for creating the planarization pattern is removed from above the reference mark, Create a pattern by the shape of the liquid chamber, a pattern by the shape of the flow path, the flattening pattern,
The coating layer processing step includes:
The method of manufacturing a liquid ejection head according to claim 1, wherein the nozzle and the opening are created by patterning by positioning using the reference mark for positioning. The process of creating the pattern includes
Along with the pattern according to the shape of the liquid chamber, the pattern according to the shape of the flow path, and the flattening pattern, a reference mark for positioning is created,
The coating layer processing step includes:
The method of manufacturing a liquid ejection head according to claim 1, wherein the nozzle and the opening are created by patterning by positioning using the reference mark for positioning. In the liquid discharge head for discharging the liquid held in the liquid chamber from the nozzle by driving the energy generating element,
A pattern according to the shape of the liquid chamber, a pattern according to the shape of a flow channel for guiding the liquid to the liquid chamber, and a flattening pattern for flattening the end face of the nozzle are formed on the substrate on which the energy generating element is arranged. ,
A pattern according to the shape of the liquid chamber, a pattern due to the shape of the flow path, and a covering layer that covers the planarization pattern are formed,
While the nozzle is created in the coating layer, an opening is formed at the location of the planarization pattern of the coating layer,
By removing the pattern due to the shape of the liquid chamber, the pattern due to the shape of the flow path, and the flattening pattern, the liquid chamber and the flow path are formed,
The liquid chamber is
A liquid discharge head, wherein the coating layer is formed so as to protrude from a wall surface in a shape of a peak in a range of 4 to 0.3 [μm] to be the opening. In a liquid ejection apparatus that ejects liquid held in a liquid chamber of the liquid ejection head from a nozzle by driving an energy generating element provided in the liquid ejection head.
A pattern according to the shape of the liquid chamber, a pattern according to the shape of a flow channel for guiding the liquid to the liquid chamber, and a flattening pattern for flattening the end face of the nozzle are formed on the substrate on which the energy generating element is arranged. ,
A pattern according to the shape of the liquid chamber, a pattern due to the shape of the flow path, and a covering layer that covers the planarization pattern are formed,
While the nozzle is created in the coating layer, an opening is formed at the location of the planarization pattern of the coating layer,
By removing the pattern due to the shape of the liquid chamber, the pattern due to the shape of the flow path, and the flattening pattern, the liquid chamber and the flow path are formed,
The liquid chamber is
The liquid ejecting apparatus, wherein the coating layer is formed so as to project from the wall surface in an eave shape in a range of 4 to 0.3 [μm] to be the opening.

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