JP2006311105A - Acoustical sensor - Google Patents

Acoustical sensor Download PDF

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Publication number
JP2006311105A
JP2006311105A JP2005130078A JP2005130078A JP2006311105A JP 2006311105 A JP2006311105 A JP 2006311105A JP 2005130078 A JP2005130078 A JP 2005130078A JP 2005130078 A JP2005130078 A JP 2005130078A JP 2006311105 A JP2006311105 A JP 2006311105A
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receiving element
circuit board
front wall
rear surface
wave receiving
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Toshihiko Takahata
利彦 高畑
Mitsuhide Maeda
光英 前田
Yoshiharu Sanagawa
佳治 佐名川
Naoki Ushiyama
直樹 牛山
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an acoustic sensor in which desired frequency characteristics can be derived with good repeatability while a miniaturization is attained. <P>SOLUTION: The acoustic sensor includes a shielding case 5 by which sealing is performed to a printed circuit board 2 so that a hydrophone element 1 and an electronic part 3 may be surrounded between printed circuit boards 2 as circuit substrates. The hydrophone element 1 is an electrostatic capacity type hydrophone element with which a backing-plate part 14 is formed in the rear face side of a diaphragm-like vibration cone part 12 through a spacer part 13. In the shielding case 5, a sound hole 51 is formed in the front wall 5a which counters the vibration cone part 12 of the hydrophone element 1, and intersects an overlap region of the hydrophone element 1 of the hydrophone element 1 on the rear surface of the front wall 5a. A channel 52 for ventilation is formed to communicate with a space between the hydrophone element 1 and the printed circuit board 2 and the sound hole 51 between the hydrophone element 1 and the printed circuit board 2, the supporting part 11 of the hydrophone element 1 is adhered to the rear surface of the front wall 5a with resin for sealing except the part superposed with the channel 52 for the ventilation. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、例えば、携帯電話、補聴器などの音声入力用途に利用される小型の音響センサに関するものである。   The present invention relates to a small acoustic sensor used for voice input applications such as a mobile phone and a hearing aid.

従来から、振動板およびバックプレートを有する静電容量型の受波素子と、受波素子の後面側に配置され受波素子から出力された受波信号を信号処理する電子部品が受波素子との対向面側に実装されたプリント基板からなる回路基板と、回路基板との間で受波素子および電子部品を囲むように回路基板に封着されたシールドケースとを備えた音響センサが提案されている(例えば、特許文献1参照)。   Conventionally, a capacitive receiving element having a diaphragm and a back plate, and an electronic component that is disposed on the rear side of the receiving element and that processes a received signal output from the receiving element, An acoustic sensor comprising a circuit board made of a printed circuit board mounted on the opposite surface side of the substrate and a shield case sealed on the circuit board so as to surround the wave receiving element and the electronic component between the circuit board and the circuit board is proposed. (For example, refer to Patent Document 1).

ここで、上記特許文献1に開示された音響センサにおけるシールドケースは、受波素子の振動板に対向する前壁に音孔が形成されるとともに、前壁の後面に受波素子と回路基板との間の空間と音孔を連通させる通気用溝が形成されている。なお、上記特許文献1に開示された音響センサでは、上述の通気用溝が形成されているので、受波素子と回路基板との間の空間に配置された電子部品の発熱に起因した空気の膨張収縮により周波数特性が変動するのを抑制することができる。   Here, the shield case in the acoustic sensor disclosed in Patent Document 1 has a sound hole formed in the front wall facing the diaphragm of the wave receiving element, and the wave receiving element and the circuit board on the rear surface of the front wall. A ventilation groove is formed to communicate the space between and the sound hole. In the acoustic sensor disclosed in Patent Document 1, since the ventilation groove described above is formed, air generated due to heat generation of the electronic component disposed in the space between the wave receiving element and the circuit board is formed. It is possible to suppress the frequency characteristics from fluctuating due to expansion and contraction.

また、従来から、受波素子として、例えば、シリコン基板などをマイクロマシンニング技術などにより加工して形成され、枠状の支持部の内側に連続一体に形成されたダイヤフラム状の振動板部からなる可動電極の後面側に絶縁材料からなるスペーサ部を介して背板部からなる固定電極が設けられた静電容量型の受波素子が提案されている(例えば、特許文献2参照)。
特開平6−339192号公報(段落〔0002〕−〔0007〕、および図5) 特開2003−31820号公報(段落〔0002〕−〔0003〕、および図1)
Conventionally, as a wave receiving element, for example, a movable substrate comprising a diaphragm-like diaphragm portion formed by processing a silicon substrate or the like by a micromachining technique or the like and continuously formed integrally inside a frame-like support portion. There has been proposed a capacitive receiving element in which a fixed electrode made of a back plate portion is provided on a rear surface side of an electrode via a spacer portion made of an insulating material (see, for example, Patent Document 2).
JP-A-6-339192 (paragraphs [0002]-[0007] and FIG. 5) JP 2003-31820 A (paragraphs [0002]-[0003] and FIG. 1)

ところで、上記特許文献1に開示された音響センサの小型化を図るために、受波素子として上記特許文献2に記載されているようにマイクロマシンニング技術を利用して形成された静電容量型の受波素子を用いることが考えられる。   By the way, in order to reduce the size of the acoustic sensor disclosed in the above-mentioned Patent Document 1, a capacitive type formed using a micromachining technique as described in Patent Document 2 as a receiving element. It is conceivable to use a receiving element.

しかしながら、シールドケースの前壁と受波素子の支持部との互いの対向面の平面度の違いに起因して通気用溝以外の部位に通気経路が形成されてしまい、音響抵抗が通気用溝の形状により決まる音響抵抗よりも低くなって低周波数領域のカットオフ周波数が設計値よりも高くなるとともに、センサ毎にカットオフ周波数がばらついて、所望の周波数特性を得ることができないとう知見を得た。なお、上記特許文献1には、組立後に音響抵抗を調整するようにした音響センサも開示されているが、音響センサの組立時に音響抵抗を調整するためのボルトやチューブを回路基板に取り付けておき、組立後に音響抵抗を調整する作業が必要なので、生産性が低かった。   However, a ventilation path is formed in a portion other than the ventilation groove due to the difference in flatness between the opposing walls of the front wall of the shield case and the support portion of the wave receiving element, and the acoustic resistance is reduced to the ventilation groove. Acquired knowledge that the cut-off frequency in the low-frequency region becomes higher than the design value because it is lower than the acoustic resistance determined by the shape of the sensor, and the cut-off frequency varies from sensor to sensor, making it impossible to obtain the desired frequency characteristics. It was. The above-mentioned Patent Document 1 also discloses an acoustic sensor that adjusts the acoustic resistance after assembly. However, a bolt or tube for adjusting the acoustic resistance at the time of assembly of the acoustic sensor is attached to the circuit board. Since the work to adjust the acoustic resistance after assembly is necessary, the productivity was low.

本発明は上記事由に鑑みて為されたものであり、その目的は、小型化を図りながらも所望の周波数特性を再現性良く得ることができる音響センサを提供することにある。   The present invention has been made in view of the above reasons, and an object of the present invention is to provide an acoustic sensor capable of obtaining a desired frequency characteristic with good reproducibility while achieving downsizing.

請求項1の発明は、音波を受波するとともに受波した音波を電気信号である受波信号に変換する受波素子と、受波素子の後面側に配置され受波素子から出力された受波信号を信号処理する信号処理回路を構成する電子部品が受波素子との対向面側に実装された回路基板と、回路基板との間で受波素子および電子部品を囲むように回路基板に封着されたシールドケースとを備え、受波素子は、枠状の支持部の内側に連続一体に形成されたダイヤフラム状の振動板部の後面側にスペーサ部を介して背板部が設けられた静電容量型の受波素子であり、シールドケースは、受波素子の振動板部に対向する前壁に音孔が形成されるとともに、前壁の後面において受波素子の支持部と重なる領域に交差し受波素子と回路基板との間の空間と音孔を連通させる通気用溝が形成されており、前壁の後面に受波素子の支持部が通気用溝と重なる部位を除いてシール用の樹脂により接着されてなることを特徴とする。   According to the first aspect of the present invention, there is provided a wave receiving element that receives a sound wave and converts the received sound wave into a wave receiving signal that is an electric signal, and a wave receiving element that is disposed on the rear surface side of the wave receiving element and is output from the wave receiving element. An electronic component constituting a signal processing circuit for processing a wave signal is mounted on the circuit board so as to surround the wave receiving element and the electronic component between the circuit board mounted on the surface facing the wave receiving element and the circuit board. The receiving element is provided with a back plate portion through a spacer portion on the rear surface side of the diaphragm-like diaphragm portion formed continuously and integrally inside the frame-shaped support portion. In addition, the shield case has a sound hole formed in the front wall facing the diaphragm portion of the wave receiving element, and overlaps the support portion of the wave receiving element on the rear surface of the front wall. Crossing the area and communicating the sound hole with the space between the receiving element and the circuit board Ventilation groove is formed, the supporting portion of the wave receiving element on the rear surface of the front wall, characterized in that formed by bonding a resin for sealing except for the portion overlapping with the ventilation groove.

この発明によれば、シールドケースの前壁の後面に受波素子の支持部が通気用溝と重なる部位を除いてシール用の樹脂により接着されているので、シールドケースの前壁と受波素子の支持部との互いの対向面の平面度の違いに起因して通気用溝以外の部位に通気経路が形成されるのを防止することができ、通気用溝以外の部位に通気経路が形成されてしまう場合に比べて音響抵抗が高くなってカットオフ周波数が低くなるとともに音響センサ毎の音響抵抗およびカットオフ周波数のばらつきが小さくなるから、小型化を図りながらも所望の周波数特性を再現性良く得ることができる。   According to the present invention, since the support portion of the wave receiving element is bonded to the rear surface of the front wall of the shield case with the sealing resin except for the portion overlapping the ventilation groove, the front wall of the shield case and the wave receiving element It is possible to prevent a ventilation path from being formed in a portion other than the ventilation groove due to a difference in flatness of the mutually facing surfaces with the support portion, and a ventilation path is formed in a portion other than the ventilation groove. The acoustic resistance increases and the cut-off frequency decreases, and the variation in the acoustic resistance and cut-off frequency for each acoustic sensor is reduced. Therefore, the desired frequency characteristics can be reproduced while miniaturizing. Can get well.

請求項2の発明は、請求項1の発明において、シールドケースは、前壁の後面における通気用溝の幅方向の両側に通気用溝への樹脂の流入を阻止する流入阻止用凸部が突設されてなることを特徴とする。   According to a second aspect of the present invention, in the first aspect of the invention, the shielding case has an inflow prevention convex portion for preventing inflow of resin into the ventilation groove on both sides in the width direction of the ventilation groove on the rear surface of the front wall. It is characterized by being provided.

この発明によれば、通気用溝に樹脂が流入するのを阻止することができるので、通気用溝への樹脂の流入量の違いに起因した音響抵抗の違いにより周波数特性がばらつくのを防止することができる。   According to the present invention, since the resin can be prevented from flowing into the ventilation groove, it is possible to prevent the frequency characteristics from being varied due to the difference in acoustic resistance caused by the difference in the amount of the resin flowing into the ventilation groove. be able to.

請求項3の発明は、請求項1の発明において、シールドケースは、前壁の後面にシール用の樹脂を充填する樹脂充填用凹部が通気用溝に連続して形成されるとともに、通気用溝の幅方向の両側で通気用溝の長手方向において樹脂充填用凹部の内部空間を2つの樹脂充填室に分ける仕切壁が樹脂充填用凹部の内底面から突設されてなることを特徴とする。   According to a third aspect of the present invention, in the first aspect of the present invention, the shield case is formed with a resin filling concave portion for filling a sealing resin on the rear surface of the front wall continuously with the ventilation groove, and the ventilation groove. A partition wall that divides the internal space of the resin filling concave portion into two resin filling chambers in the longitudinal direction of the ventilation groove on both sides in the width direction is projected from the inner bottom surface of the resin filling concave portion.

この発明によれば、組立時に2つの樹脂充填室のうちの一方のみに樹脂を充填する場合と両方に樹脂を充填する場合とで通気用溝の実効的な長さを変化できて音響抵抗を調整することができるから、周波数特性を調整することができる。   According to the present invention, the effective length of the ventilation groove can be changed between the case where the resin is filled in only one of the two resin filling chambers during assembly and the case where both are filled with the resin, thereby reducing the acoustic resistance. Since the frequency characteristics can be adjusted, the frequency characteristics can be adjusted.

請求項4の発明は、音波を受波するとともに受波した音波を電気信号である受波信号に変換する受波素子と、受波素子の後面側に配置され受波素子から出力された受波信号を信号処理する信号処理回路を構成する電子部品が受波素子との対向面側に実装された回路基板と、回路基板との間で受波素子および電子部品を囲むように回路基板に封着されたシールドケースとを備え、受波素子は、枠状の支持部の内側に連続一体に形成されたダイヤフラム状の振動板部の後面側にスペーサ部を介して背板部が設けられた静電容量型の受波素子であり、シールドケースは、受波素子の振動板部に対向する前壁に音孔が形成されるとともに、前壁の後面において受波素子の支持部と重なる領域に交差し受波素子と回路基板との間の空間と音孔を連通させる通気用パイプが前壁の後面側で支持部との間に配置されており、前壁の後面に通気用パイプおよび受波素子の支持部がシール用の樹脂により接着されてなることを特徴とする。   According to a fourth aspect of the present invention, there is provided a wave receiving element that receives a sound wave and converts the received sound wave into a wave receiving signal that is an electric signal, and a wave receiving element that is disposed on the rear surface side of the wave receiving element and is output from the wave receiving element. An electronic component constituting a signal processing circuit for processing a wave signal is mounted on the circuit board so as to surround the wave receiving element and the electronic component between the circuit board mounted on the surface facing the wave receiving element and the circuit board. The receiving element is provided with a back plate portion through a spacer portion on the rear surface side of the diaphragm-like diaphragm portion formed continuously and integrally inside the frame-shaped support portion. In addition, the shield case has a sound hole formed in the front wall facing the diaphragm portion of the wave receiving element, and overlaps the support portion of the wave receiving element on the rear surface of the front wall. Crossing the area and communicating the sound hole with the space between the receiving element and the circuit board The ventilation pipe is disposed between the rear wall side of the front wall and the support portion, and the ventilation pipe and the support portion of the wave receiving element are bonded to the rear surface of the front wall with a sealing resin. To do.

この発明によれば、シールドケースの前壁の後面に受波素子の支持部が全周に亘ってシール用の樹脂により接着されているので、シールドケースの前壁と受波素子の支持部との互いの対向面の平面度の違いに起因して通気用パイプの内部空間以外の通気経路が形成されるのを防止することができるから、通気用パイプ以外の部位に通気経路が形成されてしまう場合に比べて音響抵抗が高くなってカットオフ周波数が低くなるとともに音響センサ毎の音響抵抗およびカットオフ周波数のばらつきが小さくなるから、小型化を図りながらも所望の周波数特性を再現性良く得ることができる。しかも、通気用パイプの長さおよび内径を適宜設定することにより音響抵抗を調整することができる。   According to the present invention, since the support portion of the wave receiving element is bonded to the rear surface of the front wall of the shield case over the entire circumference by the sealing resin, the front wall of the shield case and the support portion of the wave receiving element are Since it is possible to prevent the formation of a ventilation path other than the internal space of the ventilation pipe due to the difference in flatness between the mutually facing surfaces, the ventilation path is formed in a portion other than the ventilation pipe. As a result, the acoustic resistance increases and the cutoff frequency decreases, and the variation in acoustic resistance and cutoff frequency for each acoustic sensor is reduced. Therefore, the desired frequency characteristics can be obtained with good reproducibility while downsizing. be able to. Moreover, the acoustic resistance can be adjusted by appropriately setting the length and the inner diameter of the ventilation pipe.

請求項5の発明は、請求項4の発明において、シールドケースは、前壁の後面において受波素子の支持部と重なる領域に交差し通気用パイプを位置決めする位置決め溝が形成されてなることを特徴とする。   According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the shield case is formed with a positioning groove for positioning the ventilation pipe crossing a region overlapping the support portion of the wave receiving element on the rear surface of the front wall. Features.

この発明によれば、組立時に通気用パイプの位置がずれるのを防止することができ、組立性が向上する。   According to the present invention, it is possible to prevent the position of the ventilation pipe from being shifted during assembly, and the assemblability is improved.

本発明では、小型化を図りながらも所望の周波数特性を再現性良く得ることができるという効果がある。   In the present invention, there is an effect that a desired frequency characteristic can be obtained with good reproducibility while achieving miniaturization.

(実施形態1)
本実施形態の音響センサは、図1(a)および図2に示すように、音波を受波するとともに受波した音波を電気信号である受波信号に変換する受波素子1と、受波素子1の後面側(図1(a)における下面側)に配置され受波素子1から出力された受波信号を信号処理する信号処理回路を構成する複数の電子部品3が受波素子1との対向面側(図1(a)における上面側)に実装されたプリント基板2と、プリント基板2との間で受波素子1および各電子部品3を囲むようにプリント基板2に封着された金属製のシールドケース5とを備えている。なお、電子部品3としては、例えば、ノイズ除去回路を構成する表面実装型の抵抗および表面実装型のコンデンサや、増幅回路用のFETなどがある。
(Embodiment 1)
As shown in FIG. 1A and FIG. 2, the acoustic sensor of the present embodiment receives a sound wave and converts the received sound wave into a received signal, which is an electrical signal, A plurality of electronic components 3 constituting a signal processing circuit disposed on the rear surface side of the element 1 (the lower surface side in FIG. 1A) and processing the received signal output from the receiving element 1 are Between the printed circuit board 2 mounted on the opposite surface side (the upper surface side in FIG. 1A) and the printed circuit board 2, and is sealed to the printed circuit board 2 so as to surround the wave receiving element 1 and each electronic component 3. And a metal shielding case 5. Examples of the electronic component 3 include a surface-mounted resistor and a surface-mounted capacitor that constitute a noise removal circuit, and an FET for an amplifier circuit.

受波素子1およびプリント基板2の外周形状は矩形状であり、シールドケース5は、後面が開口した矩形箱状の形状に形成されており、前壁5aに音波を導入するための複数の音孔51が形成され、周壁5bの後端縁がプリント基板2における電子部品3の実装面と略面一となるように配置されている。なお、シールドケース5の後端縁とプリント基板2の外周縁との間は、封止樹脂(例えば、エポキシ樹脂、シリコーン樹脂など)からなる封止部7により全周に亘って封着されている。また、各音孔51は円形状に開口されている。   The outer peripheral shape of the wave receiving element 1 and the printed circuit board 2 is rectangular, and the shield case 5 is formed in a rectangular box shape with an open rear surface, and a plurality of sounds for introducing sound waves into the front wall 5a. A hole 51 is formed, and the rear end edge of the peripheral wall 5 b is arranged so as to be substantially flush with the mounting surface of the electronic component 3 on the printed circuit board 2. A space between the rear end edge of the shield case 5 and the outer peripheral edge of the printed circuit board 2 is sealed all around by a sealing portion 7 made of a sealing resin (for example, epoxy resin, silicone resin, etc.). Yes. Each sound hole 51 is formed in a circular shape.

また、シールドケース5内には、受波素子1とプリント基板2とを電気的に接続するための導体パターン(電気配線)がメッキ技術およびレーザー加工技術を利用して形成された合成樹脂成形品からなる立体回路基板(MID基板)4が、受波素子1とプリント基板2との間に配置されている。ここにおいて、立体回路基板4の中央部には、各電子部品3の収納スペースを確保するとともに受波素子1の後面側に背室6を形成するための開口部42が形成されており、立体回路基板4の平面形状は矩形枠状となっている。   Further, a synthetic resin molded product in which a conductor pattern (electrical wiring) for electrically connecting the wave receiving element 1 and the printed board 2 is formed in the shield case 5 by using a plating technique and a laser processing technique. A three-dimensional circuit board (MID board) 4 is arranged between the wave receiving element 1 and the printed board 2. Here, an opening 42 for securing a storage space for each electronic component 3 and forming the back chamber 6 on the rear surface side of the wave receiving element 1 is formed at the center of the three-dimensional circuit board 4. The planar shape of the circuit board 4 is a rectangular frame.

立体回路基板4はプリント基板2における受波素子1との対向面側に配置されており、立体回路基板4の導体パターンがプリント基板2の回路パターンと電気的に接続されるとともに、立体回路基板4とプリント基板2との互いの対向面の周部同士が封止樹脂により封着されている。   The three-dimensional circuit board 4 is disposed on the surface of the printed board 2 facing the wave receiving element 1, and the conductor pattern of the three-dimensional circuit board 4 is electrically connected to the circuit pattern of the printed board 2, and the three-dimensional circuit board is provided. 4 and the peripheral part of the mutually opposing surface of the printed circuit board 2 are sealed with sealing resin.

なお、本実施形態では、プリント基板2が、信号処理回路を構成する電子部品3が受波素子1との対向面側に実装された回路基板を構成しているが、立体回路基板4の中央部に開口部42を設ける代わりに背室6を形成するための凹所を形成するとともに導体パターンのパターン設計を適宜変更して当該凹所の内底面に電子部品3を実装することでプリント基板2を用いないようにすれば、立体回路基板4が、信号処理回路を構成する電子部品が受波素子1との対向面側に実装された回路基板を構成することになる。   In the present embodiment, the printed circuit board 2 forms a circuit board in which the electronic components 3 constituting the signal processing circuit are mounted on the surface facing the wave receiving element 1. A printed circuit board is formed by forming a recess for forming the back chamber 6 instead of providing the opening 42 in the part and changing the pattern design of the conductor pattern as appropriate to mount the electronic component 3 on the inner bottom surface of the recess. If 2 is not used, the three-dimensional circuit board 4 constitutes a circuit board on which the electronic components constituting the signal processing circuit are mounted on the side facing the wave receiving element 1.

受波素子1は、半導体製造技術を応用したマイクロマシンニング技術を利用して形成された静電容量型の受波素子であり、枠状(本実施形態では、矩形枠状)の支持部11の内側に連続一体に形成されたダイヤフラム状の振動板部12の後面(背面)側に絶縁層(例えば、二酸化シリコン層)からなる複数のスペーサ部13を介して背板部14が設けられ、振動板部12と背板部14との間に空気層(エアギャップ)15が形成されている。また、背板部14には複数の排気孔14aが厚み方向に貫設されており、振動板部12の振動時に排気孔14aを空気が通過するようにしてある。したがって、振動板部12が音波の圧力を受けて振動する際に振動板部12と背板部14との間の空気層15により過度に制動を受けないようにすることができ、広い周波数帯域にわたる平坦な周波数特性と広いダイナミックレンジとを得ることが可能となる。なお、本実施形態の受波素子1は、厚み方向の中間部にシリコン酸化膜からなる絶縁膜を有する所謂SOIウェハとシリコンウェハとを二酸化シリコン層が介在する形で貼り合わせた後でシリコンウェハを所定厚さ(ここでは、背板部14の設計厚さ)まで研磨した多層構造ウェハを用いて形成されており、SOIウェハの主表面側のシリコン層の一部により形成される振動板部12に予め不純物をドーピングすることで振動板部12に導電性を付与してあって、振動板部12が可動電極を構成し、また、シリコンウェハの一部により形成される背板部14に予め不純物をドーピングすることで背板部14に導電性を付与してあって、背板部14が固定電極を構成している。ここにおいて、受波素子1の基礎となる多層構造ウェハの構造は特に限定するものではなく、例えば、二酸化シリコン層を形成したシリコンウェハと振動板部12の基礎になる高濃度不純物層を形成したシリコンウェハとを貼り合わせたものを用いてもよい。   The wave receiving element 1 is an electrostatic capacity type wave receiving element formed by using a micromachining technique applying a semiconductor manufacturing technique, and is a frame-shaped (in this embodiment, a rectangular frame-shaped) support portion 11. A back plate portion 14 is provided on the rear surface (back surface) side of the diaphragm-shaped diaphragm portion 12 formed integrally and continuously on the inner side via a plurality of spacer portions 13 made of an insulating layer (for example, a silicon dioxide layer). An air layer (air gap) 15 is formed between the plate portion 12 and the back plate portion 14. The back plate portion 14 has a plurality of exhaust holes 14a penetrating in the thickness direction so that air passes through the exhaust holes 14a when the vibration plate portion 12 vibrates. Therefore, when the diaphragm 12 is vibrated by receiving the pressure of the sound wave, it can be prevented from being excessively braked by the air layer 15 between the diaphragm 12 and the back plate 14, and a wide frequency band. It is possible to obtain a flat frequency characteristic and a wide dynamic range. The wave receiving element 1 of the present embodiment includes a silicon wafer after a so-called SOI wafer having an insulating film made of a silicon oxide film in the middle in the thickness direction and a silicon wafer are bonded together with a silicon dioxide layer interposed therebetween. Is formed by using a multilayer structure wafer polished to a predetermined thickness (here, the design thickness of the back plate portion 14), and is formed by a part of the silicon layer on the main surface side of the SOI wafer. 12 is doped with impurities in advance to impart conductivity to the diaphragm 12, and the diaphragm 12 constitutes a movable electrode, and the back plate 14 formed by a part of the silicon wafer Conductivity is imparted to the back plate portion 14 by doping impurities in advance, and the back plate portion 14 constitutes a fixed electrode. Here, the structure of the multilayer structure wafer that is the basis of the wave receiving element 1 is not particularly limited. For example, a silicon wafer on which a silicon dioxide layer is formed and a high-concentration impurity layer that is the basis of the diaphragm 12 are formed. You may use what stuck together the silicon wafer.

上述の受波素子1では、振動板部12と背板部14とを電極とするコンデンサが形成されるから、振動板部12が音波の圧力を受けることにより振動板部12と背板部14との間の距離が変化し、振動板部12と背板部14とを電極とするコンデンサの静電容量が変化する。したがって、振動板部12および背板部14に設けたパッド(図示せず)間に直流バイアス電圧を印加しておけば、パッドの間には音波の圧力に応じて微小な電圧変化が生じるから、音波を電気信号に変換することができる。ここで、受波素子1の各パッドと立体回路基板4の導体パターンとは金属材料(例えば、金など)からなるバンプ(図示せず)を介して電気的に接続されているが、バンプに限らず、異方導電接着剤を用いて接続するようにしてもよい。ここに、立体回路基板4における開口部42の周部には上面および内側面が開放された凹所43が形成されており、凹所43の内底面に対応する部位で背板部14のパッドと導体パターンとが接続され、凹所43の周部で振動板部12のパッドと導体パターンとが接続されている。したがって、立体回路基板4の周部と受波素子1の周部との間には、受波素子1の外周面とシールドケース5の周壁5bの内周面との間の空間および背室6に連通する隙間が形成されている。なお、受波素子1は、振動板部12に導電性を付与せずに導電性材料(例えば、アルミニウムなど)からなる可動電極を積層するとともに、背板部14に導電性を付与せずに導電性材料(例えば、アルミニウムなど)からなる固定電極を積層するようにしてもよい。   In the above-described wave receiving element 1, a capacitor having the diaphragm 12 and the back plate 14 as electrodes is formed. Therefore, when the diaphragm 12 receives the pressure of sound waves, the diaphragm 12 and the back plate 14. And the capacitance of the capacitor having the diaphragm 12 and the back plate 14 as electrodes changes. Therefore, if a DC bias voltage is applied between the pads (not shown) provided on the diaphragm 12 and the back plate 14, a minute voltage change occurs between the pads in accordance with the pressure of the sound wave. Sound waves can be converted into electrical signals. Here, each pad of the wave receiving element 1 and the conductor pattern of the three-dimensional circuit board 4 are electrically connected via a bump (not shown) made of a metal material (for example, gold). The connection is not limited, and an anisotropic conductive adhesive may be used. Here, a recess 43 having an open upper surface and an inner surface is formed in the peripheral portion of the opening 42 in the three-dimensional circuit board 4, and the pad of the back plate 14 is formed at a portion corresponding to the inner bottom surface of the recess 43. And the conductor pattern are connected, and the pad of the diaphragm 12 and the conductor pattern are connected at the peripheral portion of the recess 43. Therefore, a space between the outer peripheral surface of the wave receiving element 1 and the inner peripheral surface of the peripheral wall 5b of the shield case 5 and the back chamber 6 between the peripheral portion of the three-dimensional circuit board 4 and the peripheral portion of the wave receiving element 1. A gap communicating with is formed. In addition, the wave receiving element 1 laminates a movable electrode made of a conductive material (for example, aluminum) without imparting conductivity to the diaphragm portion 12 and does not impart conductivity to the back plate portion 14. A fixed electrode made of a conductive material (for example, aluminum) may be laminated.

ところで、シールドケース5は、前壁5aの後面において受波素子1の支持部11と重なる領域に交差し受波素子1とプリント基板2との間の空間(つまり、背室6)と音孔51を連通させる細長の通気用溝52が形成されており、前壁5aの後面に受波素子1の支持部11が通気用溝52と重なる部位を除いてシール用の樹脂により接着されている。要するに、組立工程においてシールドケース5と受波素子1とをシール用の樹脂により接着するにあたっては、例えば、図1(b)に示すように、シールドケース5の前壁5aの後面に塗布したシール用の樹脂からなるシール用樹脂部8を設けてから、シールドケース5と受波素子1の支持部11とをシール用樹脂部8を介して接着すればよい。   By the way, the shield case 5 intersects a region overlapping the support portion 11 of the wave receiving element 1 on the rear surface of the front wall 5a, and a space between the wave receiving element 1 and the printed board 2 (that is, the back chamber 6) and a sound hole. An elongated ventilation groove 52 for communicating 51 is formed, and the support portion 11 of the wave receiving element 1 is bonded to the rear surface of the front wall 5a with a sealing resin except for a portion overlapping the ventilation groove 52. . In short, in adhering the shield case 5 and the wave receiving element 1 with a sealing resin in the assembly process, for example, as shown in FIG. 1B, a seal applied to the rear surface of the front wall 5a of the shield case 5 After providing the sealing resin portion 8 made of the resin for use, the shield case 5 and the support portion 11 of the wave receiving element 1 may be bonded via the sealing resin portion 8.

しかして、本実施形態の音響センサでは、シールドケース5の前壁5aの後面に受波素子1の支持部11が通気用溝52と重なる部位を除いてシール用の樹脂により接着されているので、シールドケース5の前壁5aと受波素子1の支持部11との互いの対向面の平面度の違いに起因して通気用溝52以外の部位に通気経路が形成されるのを防止することができ、通気用溝52以外の部位に通気経路が形成されてしまう場合に比べて音響抵抗が高くなってカットオフ周波数が低くなるとともに音響センサ毎の音響抵抗およびカットオフ周波数のばらつきが小さくなるから、小型化を図りながらも所望の周波数特性を再現性良く得ることができる。その結果、製造歩留まりの向上による低コスト化を図ることが可能となる。   Therefore, in the acoustic sensor of the present embodiment, the support portion 11 of the wave receiving element 1 is bonded to the rear surface of the front wall 5a of the shield case 5 with a sealing resin except for a portion overlapping the ventilation groove 52. Further, it is possible to prevent a ventilation path from being formed in a portion other than the ventilation groove 52 due to a difference in flatness between the opposing surfaces of the front wall 5a of the shield case 5 and the support portion 11 of the wave receiving element 1. Compared with the case where a ventilation path is formed in a part other than the ventilation groove 52, the acoustic resistance is increased and the cutoff frequency is lowered, and the variation in the acoustic resistance and the cutoff frequency for each acoustic sensor is small. Therefore, a desired frequency characteristic can be obtained with good reproducibility while reducing the size. As a result, it is possible to reduce the cost by improving the manufacturing yield.

(実施形態2)
本実施形態の音響センサの基本構成は実施形態1と略同じであって、図3に示すように、シールドケース5の前壁5aの後面における通気用溝52の幅方向の両側に、通気用溝52へのシール用の樹脂の流入を阻止する流入阻止用凸部53を突設することで、シール用樹脂部8の一部が通気用溝52内に形成されるのを防止している点に特徴がある。なお、他の構成は実施形態1と同じなので、図示および説明を省略する。
(Embodiment 2)
The basic configuration of the acoustic sensor of the present embodiment is substantially the same as that of the first embodiment. As shown in FIG. 3, on the both sides in the width direction of the ventilation groove 52 on the rear surface of the front wall 5 a of the shield case 5, By projecting the inflow prevention convex portion 53 that prevents the sealing resin from flowing into the groove 52, a part of the sealing resin portion 8 is prevented from being formed in the ventilation groove 52. There is a feature in the point. Since other configurations are the same as those of the first embodiment, illustration and description thereof are omitted.

しかして、本実施形態の音響センサでは、通気用溝52にシール用の樹脂が流入するのを阻止することができるので、通気用溝52へのシール用の樹脂の流入量の違いに起因した音響抵抗の違いにより周波数特性がばらつくのを防止することができる。   Thus, in the acoustic sensor of the present embodiment, the sealing resin can be prevented from flowing into the ventilation groove 52, which is caused by the difference in the amount of the sealing resin flowing into the ventilation groove 52. It is possible to prevent the frequency characteristics from varying due to the difference in acoustic resistance.

(実施形態3)
本実施形態の音響センサの基本構成は実施形態1と略同じであって、図4(a),(b)に示すように、シールドケース5の前壁5aの後面にシール用の樹脂を充填する樹脂充填用凹部54が通気用溝52に連続して形成されるとともに、通気用溝52の幅方向の両側で通気用溝52の長手方向(図4(a)における左右方向)において樹脂充填用凹部54の内部空間を2つの樹脂充填室54a,54aに分ける仕切壁54bが樹脂充填用凹部54の内底面から突設されている点に特徴がある。なお、他の構成は実施形態1と同じなので、図示および説明を省略する。
(Embodiment 3)
The basic configuration of the acoustic sensor of the present embodiment is substantially the same as that of the first embodiment, and as shown in FIGS. 4A and 4B, the rear surface of the front wall 5a of the shield case 5 is filled with a sealing resin. The resin filling recess 54 is formed continuously with the ventilation groove 52 and is filled with resin in the longitudinal direction of the ventilation groove 52 (left and right direction in FIG. 4A) on both sides in the width direction of the ventilation groove 52. The partition wall 54b that divides the internal space of the concave portion 54 for use into two resin filling chambers 54a and 54a is characterized in that it protrudes from the inner bottom surface of the concave portion 54 for resin filling. Since other configurations are the same as those of the first embodiment, illustration and description thereof are omitted.

しかして、本実施形態の音響センサでは、組立時に、図4(c)に示すように2つの樹脂充填室54a,54aのうちの一方のみにシール用の樹脂を充填してシール用樹脂部8を形成する場合(ただし、樹脂充填用凹部54のうち内部空間が仕切壁54bに仕切られていない内部空間には全体に亘ってシール用の樹脂を充填する)と、図4(d)に示すように2つの樹脂充填室54,54aの両方にシール用の樹脂を充填してシール用樹脂部8を形成する場合(ただし、樹脂充填用凹部54のうち内部空間が仕切壁54bに仕切られていない内部空間には全体に亘ってシール用の樹脂を充填する)とで通気用溝52の実効的な長さを変化できて音響抵抗を調整することができるから、周波数特性を調整することができる。なお、図4(c)と図4(d)とでは図4(d)の方が通気用溝52の実効的な長さが長くなり、音響抵抗が高くなる。   Therefore, in the acoustic sensor of the present embodiment, at the time of assembly, as shown in FIG. 4C, only one of the two resin filling chambers 54a and 54a is filled with the sealing resin, and the sealing resin portion 8 is filled. (However, in the resin-filling concave portion 54, the internal space is not partitioned by the partition wall 54b is filled with sealing resin over the entire area), as shown in FIG. Thus, when sealing resin is filled in both of the two resin filling chambers 54 and 54a to form the sealing resin portion 8, the internal space of the resin filling recess 54 is partitioned by the partition wall 54b. Since the effective length of the ventilation groove 52 can be changed and the acoustic resistance can be adjusted, the frequency characteristic can be adjusted. it can. 4 (c) and 4 (d), the effective length of the ventilation groove 52 is longer in FIG. 4 (d), and the acoustic resistance is higher.

(実施形態4)
本実施形態の音響センサの基本構成は実施形態1と略同じであって、実施形態1にて説明した通気用溝52をシールドケース5の前壁52の後面に形成する代わりに、図5に示すように、シールドケース5の前壁5aの後面において受波素子1の支持部11と重なる領域に交差し受波素子1とプリント基板2との間の空間と音孔51を連通させる通気用パイプ9を前壁5aの後面に配置し(つまり、通気用パイプ9は、前壁5aの後面側で受波素子1の支持部11との間に配置される)、前壁5aの後面に通気用パイプ9および受波素子1の支持部11をシール用の樹脂により接着している点が相違する。なお、実施形態1と同様の構成要素には同一の符号を付して説明を省略する。
(Embodiment 4)
The basic configuration of the acoustic sensor of the present embodiment is substantially the same as that of the first embodiment. Instead of forming the ventilation groove 52 described in the first embodiment on the rear surface of the front wall 52 of the shield case 5, FIG. As shown, the rear surface of the front wall 5a of the shield case 5 intersects the region overlapping the support portion 11 of the wave receiving element 1 and communicates the space between the wave receiving element 1 and the printed circuit board 2 with the sound hole 51. The pipe 9 is arranged on the rear surface of the front wall 5a (that is, the ventilation pipe 9 is arranged between the support portion 11 of the wave receiving element 1 on the rear surface side of the front wall 5a) and on the rear surface of the front wall 5a. The difference is that the ventilation pipe 9 and the support portion 11 of the wave receiving element 1 are bonded by a sealing resin. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

しかして、本実施形態の音響センサでは、シールドケース5の前壁5aの後面に受波素子1の支持部11が全周に亘ってシール用の樹脂により接着されているので、シールドケース5の前壁5aと受波素子1の支持部11との互いの対向面の平面度の違いに起因して通気用パイプ9の内部空間以外の通気経路が形成されるのを防止することができるから、通気用パイプ9以外の部位に通気経路が形成されてしまう場合に比べて音響抵抗が高くなってカットオフ周波数が低くなるとともに音響センサ毎の音響抵抗およびカットオフ周波数のばらつきが小さくなるから、小型化を図りながらも所望の周波数特性を再現性良く得ることができる。しかも、通気用パイプ9の長さおよび内径を適宜設定することにより音響抵抗を調整することができる。   Therefore, in the acoustic sensor of the present embodiment, the support portion 11 of the wave receiving element 1 is bonded to the rear surface of the front wall 5a of the shield case 5 over the entire circumference with a sealing resin. It is possible to prevent a ventilation path other than the internal space of the ventilation pipe 9 from being formed due to the difference in flatness between the opposing surfaces of the front wall 5a and the support portion 11 of the wave receiving element 1. Since the acoustic resistance becomes higher and the cut-off frequency is lower than the case where the ventilation path is formed in a portion other than the vent pipe 9, the variation in the acoustic resistance and the cut-off frequency for each acoustic sensor is reduced. Desired frequency characteristics can be obtained with good reproducibility while achieving miniaturization. Moreover, the acoustic resistance can be adjusted by appropriately setting the length and the inner diameter of the ventilation pipe 9.

(実施形態5)
本実施形態の音響センサの基本構成は実施形態4と略同じであって、図6(a),(b)に示すように、シールドケース5の前壁5aの後面に通気用パイプ9を位置決めする位置決め溝56が形成されている点が相違するだけである。他の構成は実施形態4と同じなので図示および説明を省略する。
(Embodiment 5)
The basic configuration of the acoustic sensor of the present embodiment is substantially the same as that of the fourth embodiment, and the ventilation pipe 9 is positioned on the rear surface of the front wall 5a of the shield case 5 as shown in FIGS. 6 (a) and 6 (b). The only difference is that the positioning groove 56 is formed. Since other configurations are the same as those of the fourth embodiment, illustration and description thereof are omitted.

しかして、本実施形態の音響センサでは、組立時に通気用パイプ9の位置がずれるのを防止することができ、組立性が向上する。   Therefore, in the acoustic sensor of the present embodiment, it is possible to prevent the position of the ventilation pipe 9 from being shifted during assembly, and the assemblability is improved.

実施形態1を示し、(a)は概略断面図、(b)は(a)の要部説明図である。Embodiment 1 is shown, (a) is a schematic cross-sectional view, (b) is a main part explanatory view of (a). 同上を示す概略分解斜視図である。It is a general | schematic disassembled perspective view which shows the same as the above. 実施形態2におけるシールドケースにシール用の樹脂を塗布した状態を示し、(a)は下面図、(b)は(a)のA−A’断面図である。The state which apply | coated the resin for sealing to the shield case in Embodiment 2 is shown, (a) is a bottom view, (b) is A-A 'sectional drawing of (a). 実施形態3におけるシールドケースを示し、(a)は下面図、(b)は(a)のB−B’断面図、(c),(d)はシール用の樹脂の充填例の説明図である。The shield case in Embodiment 3 is shown, (a) is a bottom view, (b) is a BB 'sectional view of (a), (c), (d) is an explanatory view of a filling example of resin for sealing. is there. 実施形態4におけるシールドケースにシール用の樹脂を塗布した状態を示し、(a)は下面図、(b)は(a)のB−B’断面図である。The state which apply | coated the resin for sealing to the shield case in Embodiment 4 is shown, (a) is a bottom view, (b) is B-B 'sectional drawing of (a). 実施形態4におけるシールドケースにシール用の樹脂を塗布した状態を示し、(a)は下面図、(b)は(a)のB−B’断面図である。The state which apply | coated the resin for sealing to the shield case in Embodiment 4 is shown, (a) is a bottom view, (b) is B-B 'sectional drawing of (a).

符号の説明Explanation of symbols

1 受波素子
2 プリント基板
3 電子部品
4 立体回路基板
5 シールドケース
5a 前壁
5b 周壁
8 シール用樹脂部
11 支持部
12 振動板部
13 スペーサ部
14 背板部
14a 排気孔
51 音孔
52 通気用溝
DESCRIPTION OF SYMBOLS 1 Reception element 2 Printed circuit board 3 Electronic component 4 Three-dimensional circuit board 5 Shield case 5a Front wall 5b Perimeter wall 8 Sealing resin part 11 Support part 12 Vibration board part 13 Spacer part 14 Back board part 14a Exhaust hole 51 Sound hole 52 For ventilation groove

Claims (5)

音波を受波するとともに受波した音波を電気信号である受波信号に変換する受波素子と、受波素子の後面側に配置され受波素子から出力された受波信号を信号処理する信号処理回路を構成する電子部品が受波素子との対向面側に実装された回路基板と、回路基板との間で受波素子および電子部品を囲むように回路基板に封着されたシールドケースとを備え、受波素子は、枠状の支持部の内側に連続一体に形成されたダイヤフラム状の振動板部の後面側にスペーサ部を介して背板部が設けられた静電容量型の受波素子であり、シールドケースは、受波素子の振動板部に対向する前壁に音孔が形成されるとともに、前壁の後面において受波素子の支持部と重なる領域に交差し受波素子と回路基板との間の空間と音孔を連通させる通気用溝が形成されており、前壁の後面に受波素子の支持部が通気用溝と重なる部位を除いてシール用の樹脂により接着されてなることを特徴とする音響センサ。   A receiving element that receives a sound wave and converts the received sound wave into a received signal that is an electrical signal, and a signal that performs signal processing on the received signal that is disposed on the rear surface side of the receiving element and that is output from the receiving element A circuit board on which an electronic component constituting the processing circuit is mounted on the side facing the wave receiving element, and a shield case sealed on the circuit board so as to surround the wave receiving element and the electronic component between the circuit board and the circuit board The wave receiving element is a capacitance type receiving device in which a back plate portion is provided via a spacer portion on the rear surface side of a diaphragm-like diaphragm portion formed continuously and integrally inside a frame-like support portion. The shield case has a sound hole formed in the front wall facing the diaphragm portion of the wave receiving element, and intersects a region overlapping the support portion of the wave receiving element on the rear surface of the front wall. A ventilation groove is formed to connect the sound hole with the space between the circuit board and the circuit board. And, acoustic sensor support portion of the wave receiving element on the rear surface of the front wall, characterized in that formed by bonding a resin for sealing except for the portion overlapping with the ventilation groove. シールドケースは、前壁の後面における通気用溝の幅方向の両側に通気用溝への樹脂の流入を阻止する流入阻止用凸部が突設されてなることを特徴とする請求項1記載の音響センサ。   The inflow prevention convex part which blocks | prevents the inflow of the resin to a ventilation groove on both sides of the width direction of the ventilation groove in the rear surface of a front wall is protrudingly provided in the shield case. Acoustic sensor. シールドケースは、前壁の後面にシール用の樹脂を充填する樹脂充填用凹部が通気用溝に連続して形成されるとともに、通気用溝の幅方向の両側で通気用溝の長手方向において樹脂充填用凹部の内部空間を2つの樹脂充填室に分ける仕切壁が樹脂充填用凹部の内底面から突設されてなることを特徴とする請求項1記載の音響センサ。   The shield case has a resin filling recess for filling the sealing resin on the rear surface of the front wall continuously with the ventilation groove, and the resin in the longitudinal direction of the ventilation groove on both sides in the width direction of the ventilation groove. The acoustic sensor according to claim 1, wherein a partition wall that divides the internal space of the filling recess into two resin filling chambers protrudes from the inner bottom surface of the resin filling recess. 音波を受波するとともに受波した音波を電気信号である受波信号に変換する受波素子と、受波素子の後面側に配置され受波素子から出力された受波信号を信号処理する信号処理回路を構成する電子部品が受波素子との対向面側に実装された回路基板と、回路基板との間で受波素子および電子部品を囲むように回路基板に封着されたシールドケースとを備え、受波素子は、枠状の支持部の内側に連続一体に形成されたダイヤフラム状の振動板部の後面側に絶縁材料からなるスペーサ部を介して背板部が設けられた静電容量型の受波素子であり、シールドケースは、受波素子の振動板部に対向する前壁に音孔が形成されるとともに、前壁の後面において受波素子の支持部と重なる領域に交差し受波素子と回路基板との間の空間と音孔を連通させる通気用パイプが前壁の後面側で支持部との間に配置されており、前壁の後面に通気用パイプおよび受波素子の支持部がシール用の樹脂により接着されてなることを特徴とする音響センサ。   A receiving element that receives a sound wave and converts the received sound wave into a received signal that is an electrical signal, and a signal that performs signal processing on the received signal that is disposed on the rear surface side of the receiving element and that is output from the receiving element A circuit board on which an electronic component constituting the processing circuit is mounted on the side facing the wave receiving element, and a shield case sealed on the circuit board so as to surround the wave receiving element and the electronic component between the circuit board and the circuit board The wave receiving element includes an electrostatic plate having a back plate portion provided through a spacer portion made of an insulating material on the rear surface side of the diaphragm-like diaphragm portion formed continuously and integrally inside the frame-shaped support portion. This is a capacitive receiving element. The shield case has a sound hole in the front wall facing the diaphragm part of the receiving element, and intersects the area overlapping the support part of the receiving element on the rear surface of the front wall. The space between the receiving element and the circuit board is connected to the sound hole. The air pipe is disposed between the rear wall side of the front wall and the support portion, and the ventilation pipe and the support portion of the wave receiving element are bonded to the rear surface of the front wall with a sealing resin. Acoustic sensor. シールドケースは、前壁の後面において受波素子の支持部と重なる領域に交差し通気用パイプを位置決めする位置決め溝が形成されてなることを特徴とする請求項4記載の音響センサ。   5. The acoustic sensor according to claim 4, wherein the shield case is formed with a positioning groove for positioning the ventilation pipe so as to intersect a region overlapping the support portion of the wave receiving element on the rear surface of the front wall.
JP2005130078A 2005-04-27 2005-04-27 Acoustical sensor Withdrawn JP2006311105A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008160546A (en) * 2006-12-25 2008-07-10 Audio Technica Corp Condenser microphone unit and manufacturing method thereof
JP2012517184A (en) * 2009-11-18 2012-07-26 ビーエスイー カンパニー リミテッド MEMS microphone package and packaging method
US11257472B2 (en) * 2015-06-26 2022-02-22 Underwater Communications & Navigation Laboratory (Limited Liability Company) Hydroacoustic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008160546A (en) * 2006-12-25 2008-07-10 Audio Technica Corp Condenser microphone unit and manufacturing method thereof
JP2012517184A (en) * 2009-11-18 2012-07-26 ビーエスイー カンパニー リミテッド MEMS microphone package and packaging method
US11257472B2 (en) * 2015-06-26 2022-02-22 Underwater Communications & Navigation Laboratory (Limited Liability Company) Hydroacoustic device

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