JP2006303829A - Electrodynamic type loudspeaker - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the thickness of a product is increased at a neck in the height of the solder fillet of lead-wire soldering. <P>SOLUTION: A magnetic circuit is constituted by insert-molding a yoke 2 to a case 2 and laminating and joining a magnet and a top plate on the top face of the yoke 2. A voice coil is positioned in a magnetic gap formed between the inner peripheral section of the side wall of the yoke 2 and the outer peripheral section of the top plate. In an electrodynamic type loudspeaker, the outer periphery of a diaphragm is fixed to the top face of the case 1, the voice coil is held to the underside of the case 1 and a protector 7 with a plurality of sound discharging holes coating the diaphragm is fixed to the upper section of the case 1. In the electrodynamic type loudspeaker, a double-sided substrate 8 is fixed to the underside of the case 1, a connecting-terminal pattern 9 is disposed on a surface on the protector 7 side outside the outer periphery of the loudspeaker in the substrate 8 and a lead wire 10 is soldered to the connecting-terminal pattern 9 by solder 11. The solder fillet can be restrained within the thickness of the loudspeaker, and the loudspeaker can be thinned. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electrodynamic speaker that is incorporated in a mobile communication device such as a mobile phone and informs a user of an incoming call by sound.

2. Description of the Related Art Conventionally, various electronic devices such as personal computers and mobile phones have been provided with speakers for outputting various kinds of information as audio. Recently, along with the miniaturization of these electronic devices, it is necessary to reduce the size and efficiency of the speakers provided therewith. Such an electrodynamic speaker has been proposed. (For example, see Patent Document 1)
JP2002-152882 (2nd page, FIG. 9)

  As shown in FIGS. 5 and 6, the electrodynamic speaker structure disclosed in Patent Document 1 has a plastic case 21 in which a bowl-shaped yoke 22 made of a magnetic material is insert-molded, A magnet 23 is fixed to the upper surface of the yoke 22, and a top plate 24 made of a magnetic material is joined to the upper surface of the magnet 23. Thus, a magnetic circuit is formed, and a magnetic gap is generated between the inner peripheral portion of the side wall of the yoke 22 and the outer peripheral portion of the top plate 24.

  The outer periphery of the diaphragm 26 is fixed to the upper part of the case 21, and the voice coil 25 is fixed to the lower surface of the diaphragm 26. The voice coil 25 is located in a magnetic circuit formed by the top plate 24 and the yoke 22. A protector 27 such as a light metal is fixed to the upper portion of the case 21 so as to cover the diaphragm 26. The case 21 and the protector 27 are each provided with a plurality of sound emission holes.

  The two winding terminals 29 of the voice coil 25 are bonded along the lower surface of the diaphragm 26, pulled out to the outside of the case 21, passed through a recess provided on the side surface of the case 21, and the lower end of the case 21. Leading to. A substrate 28 made of glass epoxy resin or the like is bonded to the lower surface of the case 21, and two connection terminal patterns 30 are provided on the substrate 28 as shown in FIG. They are connected by solder 31. The connection terminal pattern 30 has a branched shape, and a winding terminal 29 is soldered to one branch 30a, and a lead wire (not shown) that connects the speaker to the device is soldered to the other branch 30b.

  7 and 8 show a state in which the lead wire 32 is connected to the connection terminal pattern 30 with the solder 33, and two connection terminal patterns 30 are provided, and one pattern of the connection terminal pattern 30 is shown. A winding terminal (not shown) is soldered to 30 a, and a lead wire 32 that connects the speaker to the device is connected to the other pattern 30 b with solder 33.

  The operation of such an electrodynamic speaker is such that when a signal current is passed through the voice coil, the voice coil and the diaphragm integrated therewith vibrate due to the electromagnetic action of the current and the magnetic flux generated in the magnetic gap. Generate sound.

  The problem to be solved is that when the lead wire is soldered to the connection terminal pattern in the structure of the electrodynamic speaker disclosed in Patent Document 1, the height of the solder fillet and the lead wire protection portion becomes a bottleneck. The thickness of the product becomes thicker. As shown in FIG. 7, the height of the solder 33 protrudes from the lower surface of the yoke 22, and the solder fillet cannot be suppressed within the thickness of the speaker. Thinning the product is difficult. There were problems such as.

  The present invention eliminates the above-mentioned drawbacks, and the object thereof is to arrange the connection terminal pattern surface on the surface on the protector side, thereby utilizing the space up to the thickness of the speaker, and thereby solder fillets and lead wires. It is an object of the present invention to provide an electrodynamic speaker that can eliminate the interference with the height of the protective portion, suppress the solder fillet within the thickness of the speaker, and reduce the thickness of the product.

  In order to achieve the above object, an electrodynamic speaker according to the present invention is a plastic case in which a bowl-shaped yoke made of a magnetic material is insert-molded, a magnet fixed to the upper surface of the yoke, and an upper surface of the magnet A magnetic coil is formed by bonding a top plate made of a magnetic material to a magnetic coil formed between the inner peripheral portion of the side wall of the yoke of the magnetic circuit and the outer peripheral portion of the top plate; An electrodynamic device in which the outer periphery of the diaphragm is fixed to the upper surface of the case, the voice coil is held on the lower surface of the diaphragm, and a protector having a plurality of sound emitting holes covering the diaphragm is fixed to the upper portion of the case Type speaker, a double-sided substrate made of glass epoxy resin or the like is fixed to the lower surface of the case, and the protector side outside the outer periphery of the speaker is fixed to the substrate Connected to the surface terminal pattern is disposed, it is characterized in that the soldered lead wires to the connection terminal pattern.

  Further, the frame of the case in the vicinity of the substrate on which the connection terminal pattern is disposed is extended, and a groove is disposed in the extended portion, and the lead wire is fixed to the groove.

  The electrodynamic speaker of the present invention can provide an electrodynamic speaker capable of suppressing the solder fillet and reducing the thickness of the product within the thickness of the speaker.

  The electrodynamic speaker of the present invention will be described with reference to the drawings.

  1 and 2 relate to a first embodiment of the present invention, FIG. 1 is a cross-sectional view of a principal part of an electrodynamic speaker, and FIG. 2 is a plan view of FIG. 1 and 2, similarly to the conventional example, a plastic case 1 is insert-molded with a flange 2 made of a magnetic material and a top plate made of a magnet and a magnetic material (not shown) on the upper surface of the yoke 2. Are joined together to form a magnetic circuit. A magnetic gap is generated between the inner periphery of the side wall of the yoke 2 and the outer periphery of the top plate.

  As in the conventional example, the outer periphery of the diaphragm is fixed to the upper portion of the case 1, and a voice coil is fixed to the lower surface of the diaphragm. The voice coil is located in a magnetic circuit formed by the top plate and the yoke 2. A protector 7 such as a light metal is fixed to the upper portion of the case 1 so as to cover the diaphragm. The case 1 and the protector 7 are each provided with a plurality of sound emission holes.

  On the lower surface of the case 1, a double-sided substrate 8 such as a glass epoxy resin is caulked and fixed by a caulking portion 8a. A part of the substrate 8 is exposed to the outside of the case 1. Two connection terminal patterns 9 are provided on the surface of the substrate 8 on the protector 7 side. The connection terminal pattern 9 has a winding terminal (not shown) at one end 9a and a winding end at the other end 9b. The lead wire 10 connecting the speaker to the device is soldered with solder 11.

  The operation and effect of the electrodynamic speaker having the above-described configuration will be described. In the electrodynamic speaker of the present invention, the connection terminal pattern 9 is arranged on the protector 7 side on the outer periphery of the speaker, and the lead wire 10 is soldered with the solder 11, thereby suppressing the solder fillet within the thickness of the speaker. It becomes possible, and it becomes possible to make a speaker thin.

  3 and 4 relate to the second embodiment of the present invention, FIG. 3 is a cross-sectional view of the main part of the electrodynamic speaker, and FIG. 4 is a plan view of FIG. 3 and 4, the difference from the first embodiment described above is that the frame 1a of the case 1 in the vicinity of the substrate 8 on which the connection terminal pattern 9 is disposed is extended, and the groove 1b is arranged in the extended portion. The lead wire 10 is fixed to the groove 1b. In the connection terminal pattern 9, a winding terminal (not shown) is soldered to one end portion 9a, and a lead wire 10 for connecting the speaker to a device is soldered to the other end portion 9b with solder 11.

  The operation and effect of the electrodynamic speaker having the above-described configuration will be described. Similar to the first embodiment, the connection terminal pattern 9 is arranged on the protector 7 side on the outer periphery of the speaker, and the lead wire 10 is soldered with the solder 11, thereby suppressing the solder fillet within the thickness of the speaker. At the same time, the lead wire 11 can be further fixed to the groove 1a formed in the case 1 to prevent the lead wire 11 from being disconnected.

  As described above, by arranging the connection terminal pattern on the protector side of the outer periphery of the speaker and soldering the lead wire, it becomes possible to suppress the solder fillet within the thickness of the speaker, and the speaker can be made thinner. Is possible. It is also possible to prevent disconnection of the lead wire.

It is principal part sectional drawing of the electrodynamic type speaker concerning Example 1 of this invention. It is a top view of FIG. It is principal part sectional drawing of the electrodynamic type speaker concerning Example 2 of this invention. FIG. 4 is a plan view of FIG. 3. It is sectional drawing of the conventional electrodynamic type speaker. FIG. 6 is a bottom view of FIG. 5. It is sectional drawing of the other conventional electrodynamic type speaker. FIG. 8 is a bottom view of FIG. 7.

DESCRIPTION OF SYMBOLS 1 Case 1b Groove 2 Yoke 7 Protector 8 Board | substrate 9 Connection terminal pattern 10 Lead wire 11 Solder

Claims (2)

  A magnet-shaped yoke made of a magnetic material is insert-molded in a plastic case, and a magnet fixed to the upper surface of the yoke and a top plate made of a magnetic material are joined to the upper surface of the magnet to constitute a magnetic circuit, A voice coil located in a magnetic gap formed between the inner peripheral portion of the side wall of the yoke of the magnetic circuit and the outer peripheral portion of the top plate; and the outer periphery of the diaphragm is fixed to the upper surface of the case; In the electrodynamic type speaker in which the voice coil is held on the lower surface of the case and the protector having a plurality of sound emitting holes covering the diaphragm is fixed on the upper portion of the case, the lower surface of the case has both surfaces made of glass epoxy resin or the like A substrate is fixed, and a connection terminal pattern is disposed on the surface of the protector side outside the outer periphery of the speaker, and leads are connected to the connection terminal pattern. Electro-dynamic speaker, characterized in that the soldered. 2. The electrodynamic type according to claim 1, wherein a frame of a case in the vicinity of the substrate on which the connection terminal pattern is disposed is extended, a groove is disposed in the extension portion, and the lead wire is fixed to the groove. speaker

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