JP2006303283A - Flexible wiring board mounted with light-emitting-diode - Google Patents

Flexible wiring board mounted with light-emitting-diode Download PDF

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Publication number
JP2006303283A
JP2006303283A JP2005124663A JP2005124663A JP2006303283A JP 2006303283 A JP2006303283 A JP 2006303283A JP 2005124663 A JP2005124663 A JP 2005124663A JP 2005124663 A JP2005124663 A JP 2005124663A JP 2006303283 A JP2006303283 A JP 2006303283A
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Prior art keywords
emitting diode
wiring board
flexible wiring
light emitting
lands
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JP2005124663A
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Japanese (ja)
Inventor
興治 ▲崎▼山
Koji Sakiyama
Sukefumi Seo
右文 瀬尾
Kenji Furuichi
健二 古市
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Fujikura Ltd
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Fujikura Ltd
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Priority to JP2005124663A priority Critical patent/JP2006303283A/en
Publication of JP2006303283A publication Critical patent/JP2006303283A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce a cost without discarding the whole of a module, by easily replacing only a faulty LED by new one. <P>SOLUTION: In a flexible wiring board, conductive-material layers 4 are formed on a base material 10, and an insulating coat 2 of a flexible wiring board 1 having the coat 2 wherewith the conductive-material layers 4 are coated is so opened as to mount a light emitting diode 3 on exposed lands 5 of the conductive-material layers 4. With respect to the flexible wiring board, preliminary lands 6 are so formed near the place whereon the light emitting diode 3 is mounted as to expose to the external the same conductive-material layers 4 as the lands 5. When the faulty light emitting diode 3 is present on the end side of the flexible wiring board 1, the end side of the flexible wiring board 1 is so cut off constitutionally as to be able to mount a new light emitting diode 30 on the preliminary lands 6. Alternatively, when the preliminary lands 6 are formed on the end side of the flexible wiring board 1, the faulty light emitting diode 3 is so shifted from its disposed place and the end side of the flexible wiring board 1 is so folded constitutionally as to be able to mount the new light emitting diode 30 on the positions of the lands 6 by superimposing the lands 6 on the positions of the lands 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、自動車のマークプレート、車体側面のサイドモール、室内の各種表示灯などに用いて好適な発光ダイオード実装フレキシブル配線板に関する。   The present invention relates to a light-emitting diode-mounted flexible wiring board suitable for use in automobile mark plates, side moldings on the side of a vehicle body, various indoor indicator lights, and the like.

従来、フレキシブルプリント基板に所定間隔をおいて発光ダイオード(LED)を装着したものを車体の側面に取付けてサイドモールとしたものが知られている。フレキシブルプリント基板を車体に両面テープで固着し、LEDを覆うようにインナーレンズを取付け、さらにアウターレンズを取付けてある(特許文献1参照)。
特公平7−70244号公報(第3頁、第7図)
2. Description of the Related Art Conventionally, a flexible printed circuit board in which light emitting diodes (LEDs) are mounted at predetermined intervals is attached to a side surface of a vehicle body to form a side molding. A flexible printed circuit board is fixed to the vehicle body with double-sided tape, an inner lens is attached to cover the LED, and an outer lens is further attached (see Patent Document 1).
Japanese Examined Patent Publication No. 7-70244 (page 3, FIG. 7)

従来例は、LEDを使用した取付交換容易なモジュール化された照明装置であるが、LEDが1つでも発光しなくなった際にはモジュールごと交換しなければならないものであった。したがって、コスト面でも不利であった。また故障した発光ダイオードを交換する場合は、はんだ付けまたは導電性接着剤による接合部を解体する必要があるため、工数面から現実的なものではなかった。   The conventional example is a modularized lighting device that uses LEDs for easy mounting and replacement. However, when even one LED stops emitting light, the entire module must be replaced. Therefore, it was disadvantageous in terms of cost. Further, when replacing a failed light emitting diode, it is necessary to dismantle the joint portion by soldering or a conductive adhesive, which is not realistic in terms of man-hours.

そこで、本発明は、発光しなくなったLEDのみの交換を容易に行えるようにして、コスト削減を図った発光ダイオード実装フレキシブル配線板を提供することを目的とする。   Therefore, an object of the present invention is to provide a light-emitting diode-mounted flexible wiring board that can easily replace only an LED that has stopped emitting light, thereby reducing costs.

上述の目的を達成するため、本発明は、ベース材上に導電材層を形成し、この導電材層を絶縁被覆で覆ったフレキシブル配線板の絶縁被覆が開口されて発光ダイオードが導電材層が露出するランド部に実装された発光ダイオード実装フレキシブル配線板において、前記発光ダイオードが実装された個所近傍に同一の導電材層を露出した予備用ランド部を形成し、故障した発光ダイオードが先端側にあるときは、フレキシブル配線板の先端側を切り離し予備用ランド部に新しい発光ダイオードを実装できるように構成し、あるいは、予備用ランド部をフレキシブル配線板の先端側に形成したときは、故障した発光ダイオードを設置個所からずらし、フレキシブル配線板の先端側を折り畳んで予備用ランド部をランド部の位置に重ねて新しい発光ダイオードを実装できるように構成したものである。   In order to achieve the above-described object, the present invention provides a light-emitting diode having a conductive material layer formed by forming a conductive material layer on a base material and opening the insulating coating of a flexible wiring board covered with the conductive coating. In the flexible wiring board mounted with the light emitting diode mounted on the exposed land portion, a spare land portion with the same conductive material layer exposed is formed in the vicinity of the portion where the light emitting diode is mounted, and the failed light emitting diode is on the front end side. In some cases, the tip of the flexible circuit board is cut off and a new light emitting diode can be mounted on the spare land. Alternatively, if the spare land is formed on the tip of the flexible circuit board, New light emission by shifting the diode from the installation location, folding the tip of the flexible wiring board, and placing the spare land on the land Diode is obtained by configured to implement.

本発明によれば、ベース材上に導電材層を形成し、この導電材層を絶縁被覆で覆ったフレキシブル配線板の絶縁被覆が開口されて発光ダイオードが導電材層が露出するランド部に実装された発光ダイオード実装フレキシブル配線板において、前記発光ダイオードが実装された個所近傍に同一の導電材層を露出した予備用ランド部を形成し、故障した発光ダイオードが先端側にあるときは、フレキシブル配線板の先端側を切り離し予備用ランド部に新しい発光ダイオードを実装できるように構成し、あるいは、予備用ランド部をフレキシブル配線板の先端側に形成したときは、故障した発光ダイオードを設置個所からずらし、フレキシブル配線板の先端側を折り畳んで予備用ランド部をランド部の位置に重ねて新しい発光ダイオードを実装できるように構成したので、発光しなくなったLEDのみの交換を可能とし、かつ容易に行え、コスト削減を可能とした。   According to the present invention, the conductive material layer is formed on the base material, and the insulating coating of the flexible wiring board in which the conductive material layer is covered with the insulating coating is opened, and the light emitting diode is mounted on the land portion where the conductive material layer is exposed. In the light-emitting diode-mounted flexible wiring board, a preliminary land portion that exposes the same conductive material layer is formed in the vicinity of the portion where the light-emitting diode is mounted. When the front end side of the board is separated and a new light emitting diode can be mounted on the spare land part, or when the spare land part is formed on the front end side of the flexible wiring board, the failed light emitting diode is shifted from the installation location. Folding the front end of the flexible wiring board and stacking the spare land on the land position allows mounting of a new light emitting diode Since it is configured so as to enable the exchange of only the LED no longer emits light, and easy to made it possible to reduce costs.

以下に、この発明の実施形態を図面を参照にして説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1及び図2では、フレキシブル配線板1の絶縁被覆2が開口されて導電材層4が露出するランド部5に発光ダイオード(LED)3が実装されている。導電材層4は、ベース材10上に印刷されている。このLED3が実装された個所近傍に、この例では先端側に同一の導電材層4を露出した予備用ランド部6を形成してある。この図1及び図2に示す実施形態では、予備用ランド部6は先端側に形成してあり、通常使用する状態においては、図3に示すように先端側部分のAの個所をフレキシブル配線板1の裏側に折り曲げて使用する。このように使用している最中にLED3が故障した場合、このLED3を設置個所からずらし、図4に示すように、新規のLED30を予備用ランド部6に実装する。先端側の予備用ランド部6に新しいLED30を取付けたものは、図5に示すように先端側をフレキシブル配線板1の表側に折り曲げるとともに、途中からその先端側を反対方向に折り曲げてLED30が図3に示すと同様の位置となるようにして使用する。図4で符号Aは最初に折り曲げる位置を示し、Bは次いでその次に折り曲げる位置をそれぞれ示すものである。LED3を交換した後のフレキシブル配線板1の先端側の折り曲げの仕方は、図3や図5のようにすることで、LED3とLED30の設置位置は交換前と交換後で変わることがない。このように故障したLED3のみを交換することができるため、モジュールごと交換する必要はなくなる。   1 and 2, a light emitting diode (LED) 3 is mounted on a land portion 5 where the insulating coating 2 of the flexible wiring board 1 is opened and the conductive material layer 4 is exposed. The conductive material layer 4 is printed on the base material 10. In this example, a spare land portion 6 with the same conductive material layer 4 exposed is formed on the tip side in the vicinity of the place where the LED 3 is mounted. In the embodiment shown in FIG. 1 and FIG. 2, the spare land portion 6 is formed on the tip side, and in the state of normal use, as shown in FIG. Fold the back side of 1 to use. When the LED 3 breaks down during use, the LED 3 is shifted from the installation location, and a new LED 30 is mounted on the spare land 6 as shown in FIG. In the case where a new LED 30 is attached to the spare land portion 6 on the front end side, the front end side is folded to the front side of the flexible wiring board 1 as shown in FIG. As shown in FIG. In FIG. 4, symbol A indicates the first folding position, and symbol B indicates the second folding position. The way of bending the distal end side of the flexible wiring board 1 after the replacement of the LED 3 is as shown in FIGS. 3 and 5, so that the installation positions of the LED 3 and the LED 30 do not change before and after the replacement. Since only the failed LED 3 can be replaced in this way, there is no need to replace the entire module.

図6は他の実施形態を示すものであり、ランド部5は先端側に形成してあり、この先端側に実装されたLED3は、図7に示すように最初にAの個所で折り曲げ次いでBの個所で反対側に折り曲げて使用する。このような使用方法において、図7に示すLED3が故障した時、図8に示すようにAの個所でフレキシブル配線板1の先端側を切り取る。予備用ランド部6には新しいLED30を実装して用いれば、図7に示すLED3と同じ位置に新しいLED30が位置することとなる。   FIG. 6 shows another embodiment, and the land portion 5 is formed on the tip side, and the LED 3 mounted on the tip side is first bent at a position A as shown in FIG. Fold it to the opposite side at the point of use. In such a usage method, when the LED 3 shown in FIG. 7 breaks down, as shown in FIG. 8, the front end side of the flexible wiring board 1 is cut off at a position A. If a new LED 30 is mounted on the spare land 6 and used, the new LED 30 is positioned at the same position as the LED 3 shown in FIG.

図9は、図6と同様に先端側にLED3を実装したフレキシブル配線板1を示し、この状態でLED3を使用する場合、LED3が故障した時、Aの個所でフレキシブル配線板1を切断し、この故障したLED3を含む先端側を破棄し、接続用ランド部7が形成され、新しいLED30が実装された接続用ピース8をフレキシブル配線板1の予備用ランド部6に接続する。その接続態様は、図11及び図12に示すように予備用ランド部6と接続用ランド部7とが電気的に接続するように接続用ピース8のCの個所を折り曲げる。この接続は、かしめやピアッシングなどの端子を用いて接続する。   FIG. 9 shows the flexible wiring board 1 in which the LED 3 is mounted on the tip side as in FIG. 6. When the LED 3 is used in this state, when the LED 3 breaks down, the flexible wiring board 1 is cut at the point A, The tip side including the failed LED 3 is discarded, the connection land portion 7 is formed, and the connection piece 8 on which the new LED 30 is mounted is connected to the spare land portion 6 of the flexible wiring board 1. As shown in FIGS. 11 and 12, the connection mode is such that the portion C of the connection piece 8 is bent so that the spare land portion 6 and the connection land portion 7 are electrically connected. This connection is made using terminals such as caulking and piercing.

本発明の実施形態を示す斜視図。The perspective view which shows embodiment of this invention. 図1の断面図。Sectional drawing of FIG. 図1の使用状態を示す斜視図。The perspective view which shows the use condition of FIG. 予備用ランド部に新しいLEDを実装した斜視図。The perspective view which mounted new LED in the reserve land part. 図4に示すものの使用状態を示す斜視図。The perspective view which shows the use condition of what is shown in FIG. 他の実施形態を示す斜視図。The perspective view which shows other embodiment. 図6の使用状態を示す斜視図。The perspective view which shows the use condition of FIG. 図6のLEDが故障した時に先端側を切り落とす状態の斜視図。The perspective view of the state which cuts off the front end side when LED of FIG. 6 fails. さらに別の実施形態を示す斜視図。The perspective view which shows another embodiment. 図9において故障したLEDを切り離し、別個の接続用ピースを接続する斜視図。FIG. 10 is a perspective view of disconnecting the failed LED in FIG. 9 and connecting separate connection pieces. 接続用ピースを接続した状態の斜視図。The perspective view of the state which connected the piece for connection. 図11の側面図。The side view of FIG.

符号の説明Explanation of symbols

1 フレキシブル配線板
2 絶縁被覆
3,30 LED
4 導電材層
5 ランド部
6 予備用ランド部
10 ベース材
1 Flexible wiring board 2 Insulation coating 3,30 LED
4 Conductive Material Layer 5 Land Part 6 Spare Land Part 10 Base Material

Claims (2)

ベース材上に導電材層を形成し、この導電材層を絶縁被覆で覆ったフレキシブル配線板の絶縁被覆が開口されて発光ダイオードが導電材層が露出するランド部に実装された発光ダイオード実装フレキシブル配線板において、
前記発光ダイオードが実装された個所近傍に同一の導電材層を露出した予備用ランド部を形成し、
故障した発光ダイオードが先端側にあるときは、フレキシブル配線板の先端側を切り離し予備用ランド部に新しい発光ダイオードを実装できるように構成し、
あるいは、予備用ランド部をフレキシブル配線板の先端側に形成したときは、故障した発光ダイオードを設置個所からずらし、フレキシブル配線板の先端側を折り畳んで予備用ランド部をランド部の位置に重ねて新しい発光ダイオードを実装できるように構成したことを特徴とする発光ダイオード実装フレキシブル配線板。
Light emitting diode mounting flexible in which a conductive material layer is formed on a base material, and the insulating coating of the flexible wiring board in which the conductive material layer is covered with the insulating coating is opened, and the light emitting diode is mounted on the land portion where the conductive material layer is exposed. In the wiring board,
Forming a preliminary land portion exposing the same conductive material layer in the vicinity of the place where the light emitting diode is mounted;
When the failed light emitting diode is on the tip side, the tip side of the flexible wiring board is cut off, and a new light emitting diode can be mounted on the spare land,
Alternatively, when the spare land portion is formed on the front end side of the flexible wiring board, the failed light emitting diode is shifted from the installation location, the front end side of the flexible wiring board is folded, and the spare land portion is overlaid on the land portion position. A flexible light-emitting board mounted with a light-emitting diode, characterized in that a new light-emitting diode can be mounted.
先端側発光ダイオードを含むフレキシブル配線板の先端側を切り離したとき、新しい発光ダイオードを実装した接続用ピースの接続用ランド部を予備用ランド部に接続することを特徴とする請求項1に記載の発光ダイオード実装フレキシブル配線板。   The connection land portion of the connection piece on which the new light emitting diode is mounted is connected to the spare land portion when the front end side of the flexible wiring board including the front end side light emitting diode is cut off. Light-emitting diode mounted flexible wiring board.
JP2005124663A 2005-04-22 2005-04-22 Flexible wiring board mounted with light-emitting-diode Pending JP2006303283A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012521016A (en) * 2009-03-17 2012-09-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ LED strip for small path identification characters
CN102856311A (en) * 2012-03-22 2013-01-02 创维液晶器件(深圳)有限公司 LED (Light-Emitting Diode) packaging module and packaging method
JP2014123688A (en) * 2012-12-22 2014-07-03 Nichia Chem Ind Ltd Light emitting device and manufacturing method of the same
JP2014130959A (en) * 2012-12-28 2014-07-10 Nichia Chem Ind Ltd Light-emitting device and method of manufacturing the same
JP2015079994A (en) * 2015-01-09 2015-04-23 シャープ株式会社 Light-emitting device and luminaire
US10690331B2 (en) 2017-04-10 2020-06-23 Teknoware Oy Luminaire circuit board and method for manufacturing a luminaire circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012521016A (en) * 2009-03-17 2012-09-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ LED strip for small path identification characters
CN102856311A (en) * 2012-03-22 2013-01-02 创维液晶器件(深圳)有限公司 LED (Light-Emitting Diode) packaging module and packaging method
JP2014123688A (en) * 2012-12-22 2014-07-03 Nichia Chem Ind Ltd Light emitting device and manufacturing method of the same
JP2014130959A (en) * 2012-12-28 2014-07-10 Nichia Chem Ind Ltd Light-emitting device and method of manufacturing the same
JP2015079994A (en) * 2015-01-09 2015-04-23 シャープ株式会社 Light-emitting device and luminaire
US10690331B2 (en) 2017-04-10 2020-06-23 Teknoware Oy Luminaire circuit board and method for manufacturing a luminaire circuit board

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