JP2006286265A - Connector with built-in substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector with a built-in substrate that can suppress degradation of electric performance due to peeling-off of a land by improving peeling strength of the land for cable conductor connection formed to a printed circuit board. <P>SOLUTION: The printed circuit board 12 for impedance matching is built in the connector with a built-in substrate. The land 35c for soldering the cable conductor 2 is formed to one end of the printed circuit board 12. A part of the land 35c is covered with a solder resist r1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a board built-in connector including a printed circuit board for impedance matching.

  As shown in FIG. 3A to FIG. 3E and FIG. 4, a general board built-in connector 30 includes a connector main body 31 including a printed board 32 housed in a metal shield case 33. It is a thing. The connector main body 31 is configured by connecting a terminal portion of a plurality of cables 1 and plugs 34 to a substrate 32.

  A metal conductor is patterned on the insulators which are the upper and lower (front and back) surfaces of the substrate 32. The metal conductor includes a soldering land 35c for connecting a cable conductor formed on one end (one end) of the substrate 32, and a soldering land for connecting a plug formed on the other end (opposite end) of the substrate 32 (card edge connection type). In the case of a connector, a receptacle fitting land) 35p, an impedance-matched signal line wiring pattern 36 for electrically connecting the lands 35c and 35p, and a GND (ground) wiring pattern are used.

  Further, the insulator on the substrate 32 and the metal conductor excluding the lands 35c and 35p are covered with a solder resist r.

  The cable 1 is provided with two signal transmission cores formed by covering a cable conductor 2 with a cable insulator 3 in parallel, covering these two parallel cores with a cable shield 4, and further covering the shield 4 with a sheath (not shown). A coated differential cable. The plug 34 includes a plurality of plug-side wirings 37 corresponding to the cable 1 and a plug-side wiring board 38 on which a signal line wiring pattern and a GND wiring pattern are formed.

  When the board built-in connector 30 is manufactured, each cable 1 subjected to terminal processing is arranged so that the respective cores are arranged in tandem. The cable conductor 2 is disposed on each land 35 c and soldered, and the cable 1 is connected to the substrate 32. A plug-side wiring 37 is solder-connected to each land 35p, and a plug 34 is connected to the substrate 32.

  The prior art document information related to the invention of this application includes the following.

JP 2003-257558 A

  However, the conventional board built-in connector 30 has the following problems.

  When soldering the cable conductor 2 and the land 35c, there are cases where the land pattern is peeled off from the insulator of the substrate 32 when using a soldering iron having a large heat capacity or when a long time is required for soldering.

  There is a case where stress / tension is applied to the solder connection portion where the cable conductor 2 and the land 35c are soldered by repeated bending and stretching of the cable 1 and the land 35c is peeled off from one end side of the substrate 32.

  When the land 35 c is peeled off from the insulator of the substrate 32, impedance mismatch occurs at the peeled land 35 c, and transmission loss is increased or the cable conductor 2 is broken.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a connector with a built-in board that improves the peel strength of a land for connecting a cable conductor formed on a printed circuit board and suppresses deterioration of electrical performance caused by the peel of the land. .

  The present invention was devised to achieve the above object, and the invention of claim 1 is a board built-in connector having a printed circuit board for impedance matching, in which a cable conductor is soldered to one end of the printed circuit board. This is a connector with a built-in board in which a land is formed and a part of the land is covered with a solder resist.

  The invention according to claim 2 is the connector with built-in board according to claim 1, wherein the end of the land which is one end side of the printed board is covered with a solder resist.

  The invention according to claim 3 is the board built-in connector according to claim 1, wherein both ends of the land are covered with a solder resist.

  The invention according to claim 4 is the board built-in connector according to any one of claims 1 to 3, wherein the land is formed in a rectangular shape, and a corner portion thereof is covered with a solder resist.

  The invention of claim 5 is the board built-in connector according to any one of claims 1 to 4, wherein the land is covered with a solder resist at a predetermined interval.

  The invention according to claim 6 is the board built-in connector according to claim 1 or 5, wherein the land has an inner edge covered with a solder resist.

  ADVANTAGE OF THE INVENTION According to this invention, the peeling strength of the land formed in the printed circuit board improves, and the outstanding effect that deterioration of the electrical performance resulting from peeling of a land can be suppressed is exhibited.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

  1A is a plan view of a main part of a connector with a built-in board showing a preferred embodiment of the present invention (a top view of the connector body), and FIG. 1B is a plan view of the printed circuit board (a top view). 1C is a cross-sectional view taken along line 1c-1c in FIG. 1B, FIG. 1D is a cross-sectional view taken along line 1d-1d in FIG. 1B, and FIG. 1E is FIG. It is 1e-1e sectional view taken on the line.

  As shown in FIGS. 1 (a) to 1 (e), the board built-in connector according to the present embodiment is the same as that shown in FIGS. 3 (a) to 3 (e) and FIG. This is basically the same configuration as the conventional board built-in connector 30 described in the above.

  That is, the board built-in connector according to the present embodiment has a connector main body 11 provided with a printed circuit board (paddle card) 12 as a metal shield case (shield) (not shown) in order to realize impedance matching mainly in the GHz region. A board built-in connector for high-speed transmission housed in a cover or housing. The connector body 11 is configured by connecting the terminal portions of a plurality of cables 1 and plugs 34 to the substrate 12.

  Now, a plurality of solder lands 35c for connecting the cable conductors are formed in a vertically long rectangular shape at one end on the insulator which becomes the front and back surfaces of the substrate 12. As a part of each land 35c, one end portion of each land 35c which is one end side of the substrate 12 is covered with a strip-shaped solder resist r1 so as to cross the length direction of each land 35c.

  The metal conductor except for the other end of each land 35c and the land 35p on the insulator of the substrate 12 is covered with a solder resist r as in the conventional case. The solder resists r1 and r are formed so as to be integrated as a whole.

  The operation of the present embodiment will be described.

  The separation of the land 35c is caused by heating with a soldering iron or stress / tension applied to the cable conductor 2 as the cable 1 is bent, and in particular, the land 35c is often peeled off from one end of the land 35c on one end side of the substrate 12.

  The board built-in connector including the board 12 has a structure in which one end of each land 35c on one end side of the board 12 is covered with the solder resist r1 so that the one end of the land 35c and the insulator of the board 12 are in close contact with each other. The strength is improved, and it is possible to prevent the transmission performance from being lowered and the cable conductor 2 from being disconnected due to the separation of the land 35c. That is, the land 35c does not easily peel from the insulator of the substrate 12.

  As a result, when the cable conductor 2 is connected to the land 35c or after the connection, the resistance to peeling of the land 35c due to mechanical and thermal stress applied to the land 35c is increased, and the long-term reliability of the mechanical and electrical performance is improved. improves.

  Therefore, in the board built-in connector according to the present embodiment, the peel strength of the land 35c is improved by covering a part of each land 35c formed on the board 12 with the solder resist r1, and this is caused by the peeling of the land 35c. Deterioration of electrical performance can be suppressed.

  This board built-in connector is very effective when applied to a connector requiring impedance matching such as high-speed transmission.

  Next, a modified example of the substrate 12, that is, another example in which a part of each land 35c is covered with a solder resist will be described with reference to FIGS. 2 (a) to 2 (f).

  As shown in FIG. 2A, the substrate 12a is formed by covering both corners of one end of each land 35c with a substantially triangular solder resist ra. A substrate 12b shown in FIG. 2B is obtained by covering both ends of each land 35c with a strip-shaped solder resist r1. The substrate 12c shown in FIG. 2C is obtained by covering the inner edge (land side) of each land 35c with a frame-shaped solder resist rc. A substrate 12d shown in FIG. 2D is obtained by covering both corners of both ends of each land 35c with a substantially triangular solder resist ra.

  A substrate 12e shown in FIG. 2 (e) has both ends of each land 35c covered with a strip-shaped solder resist r1 and also covered with a strip-shaped solder resist re so as to cross the central portion in the length direction of each land 35c. It is. That is, each land 35c is covered with the strip-shaped solder resists r1, re, r1 at a predetermined interval from one end to the other end.

  A substrate 12f shown in FIG. 2 (f) is configured by combining the substrate 12c of FIG. 2 (c) and the substrate 12e of FIG. 2 (e).

  The same effects as the board built-in connector incorporating the substrate 12 of FIG. 1B can be obtained by the board built-in connector incorporating the boards 12a to 12f of FIGS. 2A to 2F. In addition, you may combine suitably the board | substrates 12a-12f of Fig.2 (a)-FIG.2 (f).

1A is a plan view showing a main part of a board built-in connector according to a preferred embodiment of the present invention, FIG. 1B is a plan view of a printed circuit board, and FIG. 1C is a plan view of FIG. FIG. 1C is a sectional view taken along line 1c-1c, FIG. 1D is a sectional view taken along line 1d-1d in FIG. 1B, and FIG. 1E is a sectional view taken along line 1e-1e in FIG. 2 (a) to 2 (f) are plan views showing modifications of FIG. 1 (b). 3A is a plan view showing the main part of the board built-in connector according to the background art, FIG. 3B is a plan view of the printed circuit board, and FIG. 3C is a cross-sectional view taken along line 3c-3c in FIG. 3D is a cross-sectional view taken along the line 3d-3d in FIG. 3B, and FIG. 3E is a vertical cross-sectional view of the board built-in connector according to the background art. It is a disassembled perspective view of the board | substrate built-in connector of background art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cable 2 Cable conductor 11 Connector main body 12 Printed circuit board 34 Plug 35c Land r, r1 Solder resist for cable conductor connection

Claims (6)

  A board built-in connector incorporating a printed circuit board for impedance matching, wherein a land for soldering a cable conductor is formed at one end of the printed circuit board, and a part of the land is covered with a solder resist. Built-in connector.   The board built-in connector according to claim 1, wherein the land has an end that is one end side of the printed board covered with a solder resist.   The board built-in connector according to claim 1, wherein both ends of the land are covered with a solder resist.   The board built-in connector according to any one of claims 1 to 3, wherein the land is formed in a rectangular shape, and corners thereof are covered with a solder resist.   The board built-in connector according to claim 1, wherein the land is covered with a solder resist at a predetermined interval. The board built-in connector according to claim 1, wherein an inner edge of the land is covered with a solder resist.

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