JP2006278654A - Method and apparatus for processing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing apparatus capable of stabilizing the suction speed of droplets of a processing liquid remaining and adhering on a nozzle or a supplying means connected to the nozzle in a first stage of suction. <P>SOLUTION: An opening/closing valve 81 is opened during executing rinse processing to introduce a part of DIW supplied to a processing liquid supply 43 to the inside of a suction piping 82. In this way, the inside of the suction piping 82 is filled with the liquid (DIW) when suction of a liquid reservoir starts. Since a liquid rarely changes its volume due to compression differently from a gas, the liquid reservoir is not sucked at a rapid speed in the initial stage of suction. Also, since a liquid is the only fluid flowing through needle valves 84, 85 in the first stage of suction, the gas and the liquid (liquid droplets) can be prevented from mixedly flowing through the needle, and the suction speed of the liquid reservoir can be prevented from disturbed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention supplies a processing liquid to various substrates such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, and an optical disk substrate, and performs a process such as a cleaning process on the substrate. The present invention relates to a substrate processing apparatus and a substrate processing method.

  Conventionally, as this type of substrate processing apparatus, a chemical solution is directed toward the lower surface (back surface) of the wafer, rotating holding means for rotating the wafer while holding the peripheral portion of the wafer, which is a kind of substrate, by holding means such as holding pins. There is a substrate processing apparatus including a nozzle for supplying a processing liquid such as pure water at a predetermined flow rate (see Patent Document 1). In the substrate processing apparatus described in Patent Document 1, a wafer is supplied by supplying a processing liquid (rinsing liquid) from the nozzle to the center of the lower surface of the wafer while rotating the rotation holding means with a motor or the like while holding the wafer. A rinsing process is performed on the lower surface. The nozzle is connected to a suction device such as an aspirator or a vacuum pump via an open / close valve. After the rinsing process, the suction device is operated, and the open / close valve (suction valve) is opened to supply the inside of the nozzle and the processing liquid to the nozzle. The liquid droplets of the processing liquid remaining on the open / close valve (processing liquid supply valve) interposed between the two are sucked and removed. Next, the wafer is dried by spraying nitrogen gas onto the lower surface of the wafer through the nozzle while rotating the wafer at a predetermined number of revolutions. Thereby, generation | occurrence | production of the mist of the process liquid inside the nozzle at the time of gas injection is prevented, and generation | occurrence | production of a watermark is suppressed.

Japanese Patent Laying-Open No. 2003-309102 (page 7 to page 11, FIG. 6)

  By the way, it is desirable that the suction of the droplets of the processing liquid remaining and adhering inside the nozzle and the processing liquid supply valve (supply means) connected to the nozzle is performed as slowly as possible for the following reasons. The reason is that if the suction speed of the treatment liquid droplets is too high, many droplets remain without being sucked into the nozzle or the treatment liquid supply valve. If droplets of the processing liquid (rinsing liquid) remain inside the nozzle or the processing liquid supply valve in this way, the rinsing liquid droplets are discharged together with the chemical liquid at the start of the chemical liquid processing. As a result, in spite of the desire to collect only the chemical solution and reduce the running cost, it becomes impossible to collect only the chemical solution, thereby reducing the chemical solution recovery rate. In addition, droplets adhering to the vicinity of the nozzle cause water marks and particles to adhere to the wafer.

  Therefore, for example, by providing a flow rate adjusting valve such as a needle valve between the suction valve and the suction device and adjusting the flow rate of the fluid flowing through the flow rate adjusting valve, the residual adhering to the nozzle or the processing liquid supply valve. Although the processing liquid droplet suction speed is set to a relatively low speed, it has been difficult to stabilize the processing liquid droplet suction speed at a low speed for the following reason. That is, before the suction is started, the inside of the pipe on the suction device side is in a gas (air) state with respect to the suction valve by the previous suction operation. When the suction operation is started in such a state, that is, when the suction device is operated and the suction valve is opened, the gas in the pipe on the suction device side is compressed to cause a volume change. As a result, the droplets remaining and adhering to the inside of the nozzle and the processing liquid valve are sucked at a rapid speed.

  In addition, the needle portion (fluid passage portion) of the needle valve is narrow because the flow rate of the fluid passing therethrough is reduced, but if a mixture of gas and liquid (droplet) passes through the needle portion, the droplet The suction speed is disturbed and stable suction is not possible. Specifically, when the gas passes through the needle portion, the suction speed increases. On the other hand, when the liquid passes through, the suction speed becomes slow and the suction speed becomes unstable. That is, at the initial stage of suction, the suction speed of the droplets of the processing liquid remaining and adhering inside the nozzle and the processing liquid supply valve cannot be stabilized at a low speed.

  As a result, many liquid droplets remain inside the nozzle and the processing liquid supply valve (supply means) to reduce the chemical recovery rate, and the liquid droplets remaining in the vicinity of the nozzle may cause water mark or particle adhesion to the wafer. It will cause defects. However, in the conventional apparatus, no consideration has been given to the suction speed of the droplets at the initial stage of suction.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a substrate processing method capable of stabilizing the suction speed of a treatment liquid droplet adhering to a nozzle or a supply means connected to the nozzle in an initial suction stage. It is another object of the present invention to provide a substrate processing apparatus.

  In order to achieve the above object, a substrate processing method and a substrate processing apparatus according to the present invention are configured as follows. In one aspect of the substrate processing method according to the present invention, the first processing liquid is supplied to the nozzle via the supply means connected to the nozzle, so that the first processing liquid is discharged from the nozzle toward the substrate to the substrate. A rinsing process for rinsing with the first treatment liquid and a droplet of the first treatment liquid adhering to the nozzle and the supply means are sucked along a suction path whose one end is connected to the supply means. And a suction step for removing droplets of the first processing liquid from the nozzle and the supply means, and the first processing liquid is supplied to the suction path through the supply means during the rinsing step. 1 treatment liquid is filled. Another aspect of the substrate processing apparatus according to the present invention is a substrate processing apparatus for performing a rinsing process with a first processing liquid on a substrate by discharging the first processing liquid from the nozzle toward the substrate. A supply means for discharging the first treatment liquid from the nozzle by guiding the first treatment liquid to the nozzle, and a nozzle and a supply means after the rinsing process along a suction path whose one end is connected to the supply means A suction means for sucking and removing the droplets of the first processing liquid adhering to the nozzle and the supply means; and while the rinsing process is being performed, the first processing liquid is supplied to the suction path via the supply means. By supplying, the suction path is filled with the first processing liquid.

  In the invention thus configured, the first processing liquid is supplied to the suction path while the rinsing process using the first processing liquid is being performed, and the suction path is filled with the first processing liquid. Therefore, the suction path is already filled with the liquid (first processing liquid) at the start of suction. Since liquid hardly undergoes volume change due to compression compared to gas, as described in the section “Problems to be Solved by the Invention”, droplets that remain attached to nozzles and supply means in the initial stage of suction Is not sucked at a rapid rate. As a result, the droplet suction speed can be stabilized in the initial stage of suction, and it is possible to prevent the droplets from remaining on the nozzle and the supply means.

  Here, the suction speed of the droplets of the first processing liquid may be set by at least one or more flow rate adjusting valves that are interposed in the suction route and adjust the flow rate of the fluid flowing in the suction route. With this configuration, the droplet suction speed can be set to an arbitrary speed by adjusting the flow rate of the fluid flowing in the suction path. In addition, at the start of suction, the flow rate adjustment portion (fluid passage portion) of the flow rate adjustment valve interposed in the suction route, that is, the flow rate adjustment valve is filled with the liquid. Therefore, since the fluid passing through the flow rate adjustment valve is only liquid (first processing liquid) in the initial stage of suction, as described in the section “Problems to be solved by the invention”, gas is supplied to the flow rate adjustment portion. And the liquid (droplet) are mixed and passed, and the suction speed of the droplet is not disturbed. As a result, the droplet suction speed can be stabilized in the initial stage of suction.

  The droplet suction speed may be maintained constant, but may be accelerated in at least two stages from the first speed to the second speed higher than the first speed. That is, immediately after the start of suction, the amount of sucked droplets tends to increase, and the droplets tend to remain in the nozzle. Therefore, it is desirable to suck the droplets slowly in order to reduce the remaining of the droplets. Therefore, the first half of the suction process with a large amount of liquid droplets is sucked relatively slowly to prevent the liquid droplets from remaining on the nozzle, while the second half of the suction process sucks the liquid droplets by increasing the suction speed. As a result, the time required for removing the droplets can be shortened and the throughput of the apparatus can be improved.

  According to another aspect of the substrate processing method of the present invention, a nozzle is provided by supplying a first processing liquid to a nozzle via a supply means connected to a nozzle disposed away from the lower surface of the substrate while rotating the substrate. A first step of discharging the first processing liquid from the tip of the substrate toward the lower surface of the substrate to supply the first processing liquid to the entire lower surface of the substrate, and a second processing liquid to the nozzle via the supply means after the first step A second step of discharging the second processing liquid from the nozzle tip toward the lower surface of the substrate to form a liquid pool between the center of the lower surface of the substrate and the nozzle tip, and one end thereof is And a third step of removing the liquid reservoir from between the central portion of the lower surface of the substrate and the nozzle tip portion by sucking the liquid reservoir from the nozzle tip portion along the suction path connected to the supply means, Before the process, either one of the first treatment liquid and the second treatment liquid It is filled with the treatment liquid suction passage by supplying management solution to suction passage through the feed means.

  In the invention configured as described above, when the processing using the first processing liquid (first step) is executed, relatively large droplets remain in the central portion of the lower surface of the substrate. That is, the action of the centrifugal force due to the rotation of the substrate is different between the central portion of the lower surface of the wafer and the peripheral portion of the lower surface, and the droplets adhering to the central portion of the lower surface of the wafer have a relatively large size. Since only a relatively small centrifugal force acts on the wafer, it remains in the center of the lower surface of the wafer. Therefore, following the first step, the second processing liquid is discharged from the nozzle tip toward the lower surface of the substrate, and a liquid pool is formed between the center of the lower surface of the substrate and the nozzle tip (second step). . At this time, the liquid droplets remaining at the center of the lower surface of the substrate and the tip of the nozzle after the first step are taken into the liquid reservoir. Thus, the liquid reservoir containing the residual liquid droplets is sucked along the suction path and removed from between the lower surface center portion of the substrate and the nozzle tip portion (third step).

  Here, before the third step, one of the first processing liquid and the second processing liquid is supplied to the suction path, and the suction path is filled with the processing liquid. That is, the suction path is filled with the processing liquid during the first process or the second process. Therefore, at the start of suction, the suction path is already filled with a liquid (treatment liquid). Since the liquid hardly changes in volume as compared with the gas, the liquid reservoir containing the remaining droplets is not sucked at a rapid speed in the initial suction stage. As a result, the suction speed of the liquid pool can be stabilized in the initial suction stage. As a result, the remaining droplets at the center of the lower surface of the substrate and the tip of the nozzle can be reliably removed.

  In another aspect of the substrate processing apparatus according to the present invention, the first processing liquid is discharged from the tip of a nozzle disposed away from the lower surface of the substrate toward the center of the lower surface of the substrate while rotating the substrate. A substrate processing apparatus that performs rinsing with the first processing liquid on the entire lower surface of the substrate, and guides the second processing liquid to the nozzle so that the second processing liquid is directed from the tip of the nozzle toward the lower surface of the substrate subjected to the rinsing processing. (2) A supply means for discharging a processing liquid to form a liquid reservoir between the central portion of the lower surface of the substrate and the tip of the nozzle, and a nozzle at the tip of the nozzle along the suction path connected to the supply means. Suction means for removing the liquid pool from between the lower surface center portion of the substrate and the nozzle tip portion by suction, and before the liquid pool suction operation, the first processing liquid and the second processing liquid are supplied via the supply means. Supply either treatment liquid to the suction path Meets suction passage with said treatment liquid Rukoto.

  In the invention configured as described above, the supply unit guides the second processing liquid to the nozzle, so that a liquid pool is formed between the center portion of the lower surface of the substrate that has already undergone the predetermined processing and the tip portion of the nozzle. In this way, relatively large droplets remain at the center of the lower surface of the substrate before forming the liquid reservoir, that is, immediately after rinsing, but the residual droplet is taken into the liquid reservoir by forming the liquid reservoir. . Further, the suction means sucks the liquid pool to remove the liquid pool from between the central portion of the lower surface of the substrate and the tip of the nozzle. Here, before the liquid pool suction operation, one of the first processing liquid and the second processing liquid is supplied to the suction path, and the suction path is filled with the processing liquid. For this reason, the liquid reservoir containing residual droplets is not sucked at a rapid speed in the initial stage of suction. As a result, the suction speed of the liquid pool can be stabilized at the initial suction stage, and the residual liquid droplets at the center of the lower surface of the substrate and the tip of the nozzle are reliably removed.

  Here, the suction speed of the liquid pool may be set by at least one flow rate adjustment valve that is interposed in the suction route and adjusts the flow rate of the fluid flowing in the suction route. With this configuration, the suction speed of the liquid pool can be set to an arbitrary speed by adjusting the flow rate of the fluid flowing in the suction path. In addition, the flow rate adjustment portion (fluid passage portion) of the flow rate adjustment valve already interposed in the suction path is filled with liquid at the start of suction. Therefore, since the fluid passing through the flow rate adjustment valve in the initial stage of suction is only the liquid (first processing liquid or second processing liquid), the liquid pool is obtained by passing a mixture of gas and liquid in the flow rate adjustment portion. The suction speed is not disturbed. As a result, the suction speed of the liquid pool can be stabilized in the initial suction stage.

  Here, the type of the second processing liquid used for forming the liquid pool is arbitrary, but a liquid having the same component as the first processing liquid is used as the second processing liquid, or a cleaning liquid for cleaning nozzles, pipes, and the like. May be used. In particular, in the former case, since the liquid pool is formed by the liquid of the same component, the liquid pool can be formed satisfactorily. In addition, since there is no need to switch between the liquid used in the first step, the liquid forming the liquid pool, and the liquid satisfying the suction path, the liquid can be introduced smoothly and the throughput can be improved. Control is also easy. In the latter case, by performing the liquid pool formation (second process) and the liquid pool removal (third process), in addition to the residual liquid droplet removing action, a cleaning action for nozzles and pipes can be obtained at the same time. It is done. Therefore, the nozzle and the piping can be kept clean by this cleaning action.

  Further, the suction speed of the liquid pool may be maintained constant, but may be accelerated in at least two stages. That is, in order to reliably and continuously remove and remove the liquid pool, it is desirable to slowly suck the liquid pool in a stationary state at the start of suction to prevent the liquid pool from being separated. Therefore, while removing the liquid pool from between the center of the lower surface of the substrate and the tip of the nozzle, the liquid is prevented from remaining at the center of the lower surface of the substrate or the tip of the nozzle by sucking relatively slowly. Thus, after the liquid is sucked into the nozzle, the suction speed may be increased within a range where separation of the liquid pool does not become a problem, thereby shortening the time required for removing the liquid pool and improving the throughput.

  According to the present invention, the processing liquid is supplied to the suction path before the suction starts, and the suction path is filled with the processing liquid. Since liquid (treatment liquid) hardly undergoes volume change due to compression compared to gas, droplets remaining and adhering to the nozzle and the supply means connected to the nozzle are sucked at a rapid speed at the initial stage of suction. There is no end. As a result, the suction speed of the droplets can be stabilized at the initial stage of suction, and the droplets can be prevented from remaining on the nozzle and the supply means.

  In addition, when a flow rate adjustment valve that adjusts the flow rate of the fluid flowing in the suction path to set the suction speed of droplets is installed in the suction path, the flow rate adjustment part (fluid passage part) of the flow rate adjustment valve at the start of suction is It will be filled with liquid (treatment liquid). For this reason, since only the liquid passes through the flow rate adjustment valve in the initial stage of suction, gas and liquid (droplets) do not pass through the flow rate adjustment portion, and the suction speed of the droplets is disturbed. There is no such thing. As a result, the droplet suction speed can be stabilized in the initial stage of suction.

  FIG. 1 is a view showing an embodiment of a substrate processing apparatus according to the present invention. This substrate processing apparatus supplies a chemical solution to the upper and lower surfaces of a semiconductor wafer (hereinafter simply referred to as “wafer”) W, which is a kind of “substrate” of the present invention, and performs chemical treatment such as etching. It is an apparatus that spin-drys after rinsing with a rinsing liquid such as pure water or DIW (= deionized water) after the treatment. In this substrate processing apparatus, a hollow rotary shaft 1 is connected to a rotary shaft of a motor 3 and can be rotated around a vertical axis by driving the motor 3. A disc-shaped spin base 5 is integrally connected to the upper end portion of the rotating shaft 1 by a fastening component such as a screw. A plurality of support pins 7 that support the wafer W while being in contact with the outer peripheral edge of the wafer W are provided near the periphery of the spin base 5. The wafer W is horizontally supported by a plurality of support pins 7 while being separated from the spin base 5 facing the lower surface of the wafer W by a predetermined distance. Thus, in this embodiment, the substrate support means for supporting the wafer (substrate) W is constituted by the spin base 5 and the plurality of support pins 7.

  Above the spin base 5, an atmosphere blocking member 9 having an opening at the center is disposed. The atmosphere blocking member 9 is slightly larger than the diameter of the wafer W and is attached to the lower end portion of a hollow cylindrical support shaft 11 so as to be integrally rotatable. The support shaft 11 is connected to a cutoff drive mechanism (not shown), and the atmosphere cutoff member 9 is rotated around the vertical axis J together with the support shaft 11 by driving a motor of the cutoff drive mechanism. Has been. In addition, the atmosphere blocking member 9 can be brought close to the spin base 5 or can be separated from the spin base 5 by operating a lifting drive actuator (for example, an air cylinder) of the blocking drive mechanism.

  An upper cleaning nozzle 12 is coaxially provided in the hollow portion of the support shaft 11, and a chemical solution, pure water, or the like is provided near the rotation center of the upper surface of the wafer W supported by the support pins 7 from the nozzle port 12 a at the lower end portion thereof. The treatment liquid (chemical liquid or rinse liquid) can be supplied. That is, the upper cleaning nozzle 12 is connected to the processing liquid supply source 15 through the on-off valve 13 and is controlled from the upper cleaning nozzle 12 to the wafer W by the on-off control of the on-off valve 13 by the control unit 17 that controls the entire apparatus. A chemical solution and a rinse solution (pure water, DIW, etc.) are supplied to the upper surface of the substrate.

  Further, a gap between the inner wall surface of the hollow portion of the support shaft 11 and the outer wall surface of the upper cleaning nozzle 12 serves as a gas supply path 18. The gas supply path 18 is continuously connected to a gas supply source 21 via an on-off valve 19. Then, after performing chemical processing and rinsing processing by the upper cleaning nozzle 12, a gas such as nitrogen gas is supplied to the upper surface of the wafer W through the gas supply path 18 by opening / closing control of the opening / closing valve 19 by the control unit 17. The wafer W can be dried.

  Further, a side cleaning nozzle 23 for supplying DIW between the atmosphere blocking member 9 and the upper surface of the wafer W or between the upper surface of the spin base 5 and the lower surface of the wafer W is provided on the side of the spin base 5. ing. The side cleaning nozzle 23 is connected to a DIW supply source 27 through an on-off valve 25. The side cleaning nozzle 23 is connected to a vertical lifting mechanism (not shown) so that the nozzle 23 can be positioned in the vertical direction in accordance with a control command from the control unit 17. The controller 17 adjusts the opening / closing timing of the on-off valve 25 while controlling the height position of the side cleaning nozzle 23, so that the DIW is transferred from the side cleaning nozzle 23 to the upper surface of the atmosphere blocking member 9 and the wafer W. Is supplied to the lower surface of the atmosphere blocking member 9 or is supplied to the opposite surface of the spin base 5 through the space between the opposite surface of the spin base 5 and the lower surface of the wafer W.

  A lower cleaning nozzle 29 corresponding to the “nozzle” of the present invention is coaxially provided in the hollow portion of the rotating shaft 1. A supply / suction mechanism 33 is connected to the lower cleaning nozzle 29. A cylindrical gas supply path 59 is formed in the gap between the inner wall surface of the rotating shaft 1 and the outer wall surface of the lower cleaning nozzle 29, and the distal end of the gas supply path 59 is a gas outlet 61. A gas such as nitrogen gas is supplied from the gas outlet 61 to the space between the lower surface of the wafer W and the surface facing the spin base 5. The gas outlet 61 is connected to a gas supply source 67 through an on-off valve 63 and a flow rate adjustment valve 65 that are controlled to open and close by the control unit 17.

  2A and 2B are views showing the upper end of the lower cleaning nozzle. FIG. 2A is a plan view and FIG. 2B is a cross-sectional view. A flat blocking member 30 is attached to the tip of the nozzle body 29 a at the tip of the lower cleaning nozzle 29, and its upper surface 30 a faces the lower surface of the wafer W supported by the support pins 7. Yes. Further, in the blocking member 30, a discharge port 30b is provided at a substantially central portion thereof, and a processing liquid such as a chemical solution or a rinsing liquid can be discharged toward the lower surface of the wafer W through the discharge port 30b. On the other hand, an annular portion surrounding the discharge port 30 b covers the upper side of the gas jet port 61. Therefore, the gas ejected from the gas ejection port 61 is supplied to the space between the lower surface of the wafer W and the opposing surface of the spin base 5 through the gap between the lower surface of the blocking member 30 and the opposing surface of the spin base 5. . Although the planar size D of the blocking member 30 is arbitrary, it is set so as to block the gas outlet 61 as described above, or the planar size D is further expanded so that the rotary shaft 1 and the spin base 5 are connected. In order to connect, you may comprise so that the fastening components fastened by the connection part of both may be covered. In order to cover the fastening part in this way, the plane size D may be set to 50 mm or more, for example, and this effectively prevents the chemical solution or the rinse liquid from entering the part of the fastening part, for example, a screw groove. it can. Further, as the plane size D becomes larger, the liquid pool becomes larger, and the time required to remove the droplets from the center of the lower surface of the wafer W and the lower cleaning nozzle 29 becomes longer as will be described later. Further, when the wafer W is transferred, there is a problem that it interferes with the wafer transfer mechanism. Therefore, considering these points, it is desirable to set the plane size D to 120 mm or less, for example.

  Next, the supply / suction mechanism 33 will be described with reference to FIG. FIG. 3 is a block diagram showing a schematic configuration of the supply / suction mechanism. The supply / suction mechanism 33 has two main functions: (1) a function of supplying a chemical solution or a rinse liquid to the lower cleaning nozzle 29, and (2) a wafer W as described later through the lower cleaning nozzle 29. It also has a function of sucking and removing a liquid pool formed between the central portion of the lower surface and the blocking member 30.

  First, the supply function will be described. In the supply / suction mechanism 33, a processing liquid supply section 43 for guiding the chemical liquid from the chemical liquid supply source and DIW from the DIW supply source to the lower cleaning nozzle 29 is provided as the “supply means” of the present invention. One end side of the processing liquid supply unit 43 is connected to the rear end part of the lower cleaning nozzle 29, while the other end side of the processing liquid supply unit 43 is connected to the suction pipe 82 via the opening / closing valve 81. In addition, one end of a pipe 31 having an opening / closing valve 51 is connected to the nozzle side of the other end side of the processing liquid supply unit 43 and the opening / closing valve 81, and the other end side of the pipe 31 is The first DIW supply source 35 is connected in communication.

  The pipe 31 is provided with a pressure regulator 37 for adjusting the flow rate of DIW from the first DIW supply source 35. A flow meter 39 that measures the supply amount of DIW from the first DIW supply source 35 is provided in the pipe 31 on the downstream side of the pressure regulator 37. The controller 17 obtains a difference between the supply amount measured by the flow meter 39 and a preset supply amount (first supply amount SV1), and the electropneumatic converter 41 is based on a command voltage based on the difference. Adjusts the air pressure to the pressure regulator 37.

  Further, the processing liquid supply unit 43 can independently adjust the amount of each fluid introduced into the processing liquid supply unit 43 from one end side (nozzle side) connected to the lower cleaning nozzle 29 to the other end side. In order to do so, it has functions of an on-off valve and a flow rate control valve, and is connected to three introduction valves 45, 47, and 49. The first introduction valve 45 communicates with the first chemical solution supply source 53, adjusts the amount of the first chemical solution introduced into the processing solution supply unit 43, and the second introduction valve 47 provides the second chemical solution. It communicates with the supply source 55 and adjusts the amount of the second chemical liquid introduced into the processing liquid supply unit 43. The third introduction valve 49 communicates with the second DIW supply source 57 and adjusts the amount of DIW introduced into the processing liquid supply unit 43. The first chemical solution and the second chemical solution may be, for example, an etching solution, and may be different from each other. The opening / closing control of the opening / closing valves 51, 81 and the introduction valves 45, 47, 49 is entirely controlled by the control unit 17.

  With such a configuration, when chemical processing is performed on the lower surface of the wafer W, the control unit 17 adjusts the introduction valves 45 and 47 to introduce a required amount of the first or second chemical into the processing liquid supply unit 43. . That is, the first chemical liquid can be introduced into the processing liquid supply unit 43 by closing the introduction valves 47 and 49 and the on-off valve 51 and opening the introduction valve 45. In addition, the second chemical liquid can be introduced into the processing liquid supply unit 43 by closing the introduction valves 45 and 49 and the on-off valve 51 and opening the introduction valve 47. On the other hand, when rinsing the lower surface of the wafer W, the control unit 17 opens the on-off valve 51 and adjusts the first supply amount SV1 by the pressure regulator 37 via the electropneumatic converter 41. Then, the DIW from the first DIW supply source 35 is introduced into the processing liquid supply unit 43, and is adjusted by the introduction valve 49 so that the second supply amount SV2 is smaller than the first supply amount SV1. The DIW from the second DIW supply source 57 is introduced into the processing liquid supply unit 43. Therefore, a large flow amount of DIW, which is the sum of the first supply amount SV1 and the second supply amount SV2, is supplied to the lower surface of the wafer W.

  Next, the suction function will be described. As described above, the other end side of the processing liquid supply unit 43 is connected to one end of the suction pipe 82 (corresponding to the “suction path” of the present invention) via the on-off valve 81. The other end of the suction pipe 82 is connected to a diffuser type comb 83 that functions as the “suction means” of the present invention. The convam 83 is connected to a compressed air supply source (not shown) (a pressurized air pipe or a compressor in the factory), and the compressed air is supplied from the compressed air supply source to the convam 83 so that the suction pipe 82 has a negative pressure. Suction is possible. For this reason, not only the liquid components inside the lower cleaning nozzle 29 and the processing liquid supply unit 43 but also the liquid components inside the lower cleaning nozzle 29 and the processing liquid supply unit 43 are opened by opening the on-off valve 81 in a state where the supply of the chemical solution and DIW is stopped as described below. The formed liquid reservoir can also be removed by suction. Further, the liquid sucked by the comb 83 is drained to the drain on the downstream side of the comb 83. The “suction means” is not limited to a convam, and an aspirator, a vacuum pump, or the like may be used.

  The suction pipe 82 includes a main pipe 82a and branch pipes 82b and 82c branched into two from the main pipe 82a. In order to set the suction speed of the liquid pool, a needle valve 84 is interposed in one branch pipe 82b while a needle valve 84 is interposed in the main pipe 82a. These needle valves 84 and 85 are valves for adjusting the flow rate of the fluid flowing in the suction pipe 82, and are set so that the flow rate of the needle valve 84 flowing in the main pipe 82a is adjusted to the first flow rate FV1. On the other hand, the flow rate of the needle valve 85 flowing through the branch pipe 82b is set to be adjusted to a second flow rate FV2 smaller than the first flow rate FV1. In addition, an opening / closing valve (air valve) 86 that is controlled to open and close by the control unit 17 is interposed in the other branch pipe 82c. Thus, in this embodiment, the needle valves 84 and 85 function as the “flow rate adjusting valve” of the present invention.

  With such a configuration, it is possible to set the suction speed of the liquid pool in two stages by controlling opening and closing of the on-off valve 86. That is, when the convertor 83 is operated with the on-off valve 86 closed, the liquid pool is sucked through the needle valve 84 and the needle valve 85. Since the needle valve 85 is adjusted to a second flow rate FV2 that is smaller than the first flow rate FV1, the suction speed of the liquid pool is set to a relatively low first speed V1 that is limited by the needle valve 85. . On the other hand, when the open / close valve 86 is opened while the convertor 83 is operated, the liquid pool is sucked through the needle valve 84 and the branch path 82c in which the open / close valve 86 is provided. That is, the suction speed of the liquid pool is set to the second speed V2 that is higher than the first speed determined by the needle valve 84.

  Next, the operation of the substrate processing apparatus configured as described above will be described in detail with reference to FIGS. FIG. 4 is a flowchart showing the operation of the substrate processing apparatus of FIG. 5 to 7 schematically show the operation of the substrate processing apparatus of FIG. Specifically, FIGS. 5 to 7 show processing operations for the lower surface side of the wafer W. FIG. In this substrate processing apparatus, when an unprocessed wafer W is transferred to the substrate processing apparatus by a substrate transfer robot (not shown) and placed on the support pins 7, the control unit 17 controls each part of the apparatus as follows. Then, chemical processing, rinsing processing, liquid pool formation processing, liquid pool removal processing and drying processing are executed. When the wafer W is transferred by the substrate transfer robot, the atmosphere blocking member 9, the support shaft 11 and the upper cleaning nozzle 12 are integrally separated and retreated above the spin base 5. Further, all the introduction valves 45, 47, 49 and the on-off valves 51, 81, 86 are closed.

  When the wafer W is set on the support pins 7 as described above, the atmosphere blocking member 9, the support shaft 11, and the upper cleaning nozzle 12 are integrally lowered to place the atmosphere blocking member 9 in proximity to the wafer W. Subsequently, the motor 3 rotates to rotate the wafer W at the first rotation speed. At this time, the atmosphere blocking member 9 is rotated around the vertical axis J together with the support shaft 11 by driving a motor of a blocking drive mechanism (not shown). Then, along with the start of rotation of the wafer W at the first rotational speed, the control unit 17 opens the introduction valve 45 to process a predetermined amount of chemical liquid from the first chemical liquid supply source 53 as shown in FIG. The liquid is introduced into the liquid supply unit 43, the first chemical liquid is supplied from the discharge port 30b of the lower cleaning nozzle 29 to the lower surface of the wafer W, and the lower surface of the wafer W is processed with the chemical liquid (Step S1). When the first chemical solution is an etching solution, bevel etching may be performed in which the first chemical solution is introduced around the periphery of the upper surface of the wafer W for etching.

  At this time, the first chemical solution that has reached the outer peripheral portion of the wafer W is shaken off to the side by the centrifugal force of the rotating wafer W and is collected by a collection port (not shown). After the processing of the wafer W with the first chemical solution is continued for a certain time, the introduction valve 45 is closed under the control of the control unit 17 and the discharge of the first chemical solution is stopped. Depending on the type of the wafer W to be processed, the lower surface of the wafer W is processed with the second chemical solution instead of the first chemical solution. In that case, the second chemical liquid is recovered by a recovery port different from the recovery port for recovering the first chemical liquid.

  Then, the control part 17 performs a rinse process using DIW as a rinse liquid as follows (step S2-1; 1st process). That is, the control unit 17 opens the on-off valve 51 while rotating the wafer W, and the DIW adjusted to the first supply amount SV1 by the pressure regulator 37 via the electropneumatic converter 41 is changed to the first. The DIW supply source 35 introduces the DIW adjusted to the second supply amount SV2 by the introduction valve 49 from the second DIW supply source 57 to the treatment liquid supply unit 43. (FIG. 5B). As a result, a large flow amount of DIW, which is the sum of the first supply amount SV1 and the second supply amount SV2, is supplied from the lower cleaning nozzle 29 to the lower surface of the wafer W, and DIW is applied to the lower surface of the wafer W that has been in contact with the chemical solution. Washing with, that is, pre-rinsing is performed. At this point, the liquid droplets of the chemical solution remain partially attached to the blocking member 30 of the lower cleaning nozzle 29 and the opposing surface of the spin base 5.

  Further, in parallel with the pre-rinsing process of the wafer lower surface by DIW, the control unit 17 opens the on-off valve 13 to clean the atmosphere blocking member 9, and from the processing liquid supply source 15 through the upper cleaning nozzle 12, The supply of DIW is started on the upper surface of the wafer W, and a DIW protective film is formed on the upper surface of the wafer W. Further, with this protective film formed, the controller 17 opens the on-off valve 25 and opens DIW into the space between the atmosphere blocking member 9 and the upper surface of the wafer W from the DIW supply source 27 via the side cleaning nozzle 23. Start supplying. Thereby, the atmosphere blocking member 9 can be cleaned while protecting the upper surface of the wafer W.

  Subsequently, the control unit 17 lowers the side cleaning nozzle 23 between the wafer W and the spin base 5. Thereby, the DIW supply to the atmosphere blocking member 9 is stopped and the atmosphere blocking member 9 is dried, while the DIW supply destination from the side cleaning nozzle 23 is the lower surface of the wafer W and the opposite surface of the spin base 5. The opposing surfaces of the support pin 7 and the spin base 5 located in the space are cleaned.

  Further, the control unit 17 rotates the wafer W again at the first rotational speed and opens the introduction valve 49 and the opening / closing valve 51, and the lower cleaning nozzle 29 supplies DIW to the lower surface of the wafer W rotated at high speed. Is supplied at a large flow rate as a rinsing liquid. Therefore, similarly to the above-described pre-rinsing process, the lower surface of the wafer W is again cleaned with DIW. Further, the control unit 17 opens the on-off valve 13 and supplies DIW to the upper surface of the wafer W from the processing liquid supply source 15 through the upper cleaning nozzle 12. In this way, DIW is supplied to the entire wafer W and the raster process is executed.

  Further, as shown in FIG. 5C, during the execution of the above-described rinsing process, the control unit 17 operates the convam 83 to make the inside of the suction pipe 31 have a negative pressure, and opens the on-off valve 81 to open the suction pipe. A part of DIW supplied to the processing liquid supply unit 43 in 82 is guided into the suction pipe 82 (step S2-2). As a result, the inside of the suction pipe 82 filled with gas (air) is replaced with liquid (DIW). That is, in the processing of the previous wafer W, the suction is performed for a sufficient amount of time so that no liquid droplets remain in the lower cleaning nozzle 29 or the processing liquid supply unit 43 by the liquid pool suction operation described later. Although the inside of the suction pipe 82 is a gas, a part of DIW supplied to the processing liquid supply unit 43 is guided to fill the inside of the suction pipe 82 with DIW instead of the gas. When the inside of the suction pipe 82, specifically, the inside of the main pipe 82 a and the branch pipes 82 b and 82 c is filled with DIW, the control unit 17 closes the on-off valve 81. The effect of filling the suction pipe 82 with DIW will be described later.

  Here, since the rinsing process is performed while rotating the wafer W, most of the rinsing liquid is spun off from the wafer W. However, a part of the rinsing liquid drops on the lower surface of the wafer W or the tip of the lower cleaning nozzle 29. It will remain in the shape. In addition, the action of the centrifugal force accompanying the rotation of the substrate is different between the lower surface center portion and the lower surface peripheral portion of the wafer, and the droplets adhering to the lower surface center portion of the wafer have a relatively large size. Since only a relatively small centrifugal force acts on the liquid droplets, relatively large droplets remain in the central portion of the lower surface of the wafer W or the tip of the nozzle among the remaining droplets, and these residual droplets L are formed as watermarks or particles. It becomes one of the generation factors.

  Further, the droplets L remain inside the lower cleaning nozzle 29 and the processing liquid supply unit 43. If the rinse liquid droplet L remains in the nozzle 29 or the processing liquid supply unit 43 as described above, the chemical solution is removed from the lower cleaning nozzle via the processing liquid supply unit 43 when the next wafer W is subjected to the chemical processing. When the liquid 29 is ejected, a droplet of the rinsing liquid is ejected together with the chemical liquid. When this liquid droplet is collected, the chemical liquid concentration changes and the etching rate fluctuates. Therefore, although there is a request to collect only the chemical solution and reduce the running cost, the chemical solution cannot be collected from the beginning, and the chemical solution recovery rate is reduced (see FIG. 6A). ).

Therefore, the droplet L is removed by executing a liquid pool forming process (second process) and a liquid pool removing process (third process). More specifically, in step S3, the control unit 17 sets the DIW flow rate and the wafer rotation number as the “second processing liquid” and “nozzle cleaning liquid” of the present invention to conditions suitable for the formation of the liquid pool. Here, the flow rate and rotation speed of DIW can be set as follows, for example.
DIW flow rate: 1000 cm ³ / min or less Wafer rotation speed: 200 rpm or less
DIW flow rate: 400 cm ³ / min or less Wafer rotation speed: 0 to 50 rpm
It is more preferable to set to.

  Under such conditions, DIW whose flow rate has been adjusted by the introduction valve 49 is injected from the second DIW supply source 57 to the processing liquid supply unit 43 and directed from the discharge port 30b of the lower cleaning nozzle 29 toward the lower surface of the wafer W. Discharged. Further, the rotation of the motor 3 is controlled to set the wafer W to a wafer rotation speed suitable for forming a liquid pool, so that the nozzle cleaning liquid (DIW) is removed between the lower surface of the wafer W and the entire upper surface 30a of the blocking member 30. A liquid reservoir P is formed (step S3).

  By setting the flow rate of the nozzle cleaning liquid and the number of rotations of the wafer, a liquid pool P (FIG. 6B) is formed, and immediately after the rinsing process (first step), the center of the lower surface of the wafer W and the tip of the nozzle 29 are formed. The droplet L remaining in the part is taken into the liquid reservoir P. Further, DIW is supplied as the nozzle cleaning liquid over the entire upper surface 30a of the blocking member 30, and the nozzle cleaning is performed reliably. In addition, after the liquid reservoir P is formed, the above-mentioned setting conditions may be maintained for a predetermined time so that the nozzle cleaning is performed reliably, or immediately after the liquid reservoir P is formed, the next liquid reservoir is removed. You may do it.

  In the next step S4, the control unit 17 closes the introduction valve 49 to stop the supply of DIW to the lower washing nozzle 29, and opens the on-off valve 81 with the on-off valve 86 closed in the stopped state (FIG. 6 (c)). As a result, the liquid component and the liquid reservoir P inside the lower cleaning nozzle 29 and the processing liquid supply unit 43 are connected to the main pipe 82a interposing the needle valve 84 and the branch pipe 82b interposing the needle valve 85 from the discharge port 30b. The liquid pool P existing between the lower surface center portion of the wafer W and the entire upper surface 30a of the blocking member 30 is removed. Here, since the needle valve 85 is adjusted to a second flow rate FV2 that is smaller than the first flow rate FV1, the suction speed of the liquid reservoir P is limited by the needle valve 85, and the liquid reservoir P is set to a relatively low speed. Suction is performed at the first speed V1.

  At this time, if the suction speed is set to a high speed, a part of the liquid pool P may be separated during the suction process and may partially remain. It is desirable to set the speed V1. That is, when the suction speed of the liquid reservoir P is too high, the liquid is attracted as a lump of droplets by the liquid surface tension (liquid cohesive force). When the operation is performed at a suction speed that results in a large suction pressure, the liquid pool P as a lump of liquid droplets collapses, and the liquid droplets remain on the lower surface of the wafer W and the lower cleaning nozzle 29. Therefore, the suction speed of the liquid reservoir P in the first half of the suction process, that is, the first speed needs to be a suction speed that provides a suction pressure equal to or lower than the surface tension of the liquid. Note that the suction speed at which the surface tension and the suction pressure of the liquid are almost the same is the film type of the wafer W, the material of the blocking member 30, the planar size D of the blocking member 30, and the rinse liquid (first processing liquid). ) And the type of nozzle cleaning liquid (second processing liquid) and the like, but can be obtained by experiments or numerical analysis based on these factors.

  Further, in this embodiment, since the inside of the suction pipe 82 is filled with DIW during the previous rinsing process, the suction pipe 82 can be sucked at a low and stable speed for the following reason. That is, if the inside of the suction pipe 82 is gas, the gas in the suction pipe 82 is compressed as soon as the on-off valve 81 is opened, causing a volume change, and the liquid pool P is sucked at a rapid rate. As a result, the suction speed of the liquid pool P at the start of suction becomes too fast, and droplets remain on the lower surface of the wafer W and the upper surface 30a of the blocking member 30. However, in this embodiment, the suction pipe 82 is filled with liquid (DIW) at the start of suction, and unlike the gas, the liquid in the suction pipe 82 hardly changes in volume due to compression. Therefore, the liquid pool P is not sucked at a rapid speed in the initial suction stage, and the liquid pool P can be sucked with the suction speed stabilized at a low speed. As a result, the liquid pool P is separated and liquid droplets are prevented from remaining on the lower surface of the wafer W and the upper surface 30a of the blocking member 30.

  Further, in this embodiment, the suction speed of the liquid reservoir P is set by adjusting the flow rate of the fluid flowing through the suction pipe 82 by the needle valves 84 and 85. Here, if liquid and gas flow mixedly in the needle portions of the needle valves 84 and 85, that is, the portions where the flow rate is adjusted by narrowing the fluid flow path, the suction speed of the liquid pool can be disturbed and stabilized. Disappear. However, in this embodiment, as shown in FIG. 8, by filling the suction pipe 82 with DIW during the rinsing process, the needle portion NP (fluid passage portion) of the needle valves 84 and 85 is liquid (DIW) at the start of suction. ). Therefore, since the fluid passing through the needle valves 84 and 85 is only liquid at the initial stage of suction, gas and liquid (droplets) do not pass through the needle portion NP and the liquid pool P is sucked. The speed is not disturbed. As a result, the suction speed of the liquid reservoir P can be stabilized in the initial suction stage.

  As described above, in the initial stage of the suction removal, by sucking the liquid pool P at a low speed (first speed V1) and at a stable suction speed, a part of the liquid pool P is separated and the lower surface of the wafer W or the blocking member. It is possible to reliably prevent the remaining on the upper surface 30a of 30.

  Subsequently, when the liquid pool P is sucked from the lower surface of the wafer W and the upper surface 30a of the blocking member 30 and taken into the nozzle body 29a, the inert gas adjusted to an appropriate flow rate by the on-off valve 19 shown in FIG. While supplying the gas from the supply source 21 toward the upper surface of the wafer W through the gas supply path 18, the on-off valve 63 is opened, and the inert gas adjusted to an appropriate flow rate by the flow rate adjusting valve 65 is supplied from the gas supply source 67. The gas is supplied from the gas outlet 61 toward the lower surface of the wafer W through the gas supply path 59. Then, the rotation of the motor 3 is set to a higher rotational speed from the first rotational speed. Thus, the inert gas is supplied to the upper and lower surfaces of the wafer W while the wafer W is rotated at a higher speed than the first rotation speed, and the wafer W is dried (step S5-1).

  Further, when the liquid pool P is sucked from the lower surface of the wafer W and the upper surface 30a of the blocking member 30 and is taken into the nozzle body 29a, the control unit 17 opens the on-off valve 86. Thereby, the liquid reservoir taken in the nozzle body 29a is sucked through the needle valve 84 and the branch pipe 82c in which the open / close valve 86 is interposed (step S5-2). That is, the suction speed of the liquid reservoir P is switched to the second speed V2 that is faster than the first speed V1 that is limited by the needle valve 84 (FIG. 7A). When the inside of the nozzle pipe is sucked, it is not necessary to consider the separation of the liquid pool P. Thus, by increasing the suction speed in the middle of the processing, the time required for the suction processing is shortened and the throughput is improved. ing. Thereafter, the suction process is executed at a high speed (second speed V2) (FIG. 7B). In addition, the control part 17 closes the on-off valve 81 after predetermined time progress, and stops the suction from the discharge outlet 30b.

  Thus, since the suction speed is increased in the second half of the suction process, the suction process can be completed during the drying process of the wafer W. Then, after the drying process in step S5-1 is completed, the control unit 17 outputs a drive stop of the motor 3 to the motor 3 to stop the rotation of the wafer W (FIG. 7C). Thereby, a series of operations of the cleaning process, the rinse process, the liquid pool forming process, the liquid pool removing process, and the drying process are completed.

  As described above, according to this embodiment, by supplying DIW to the suction pipe 82 during the rinsing process, the suction pipe 82 is filled with the liquid (DIW) when the suction of the liquid reservoir P is started. It is in the state. Since the liquid hardly undergoes a volume change due to compression compared to the gas, the liquid reservoir P is not sucked at a rapid speed in the initial suction stage. Thereby, the suction speed of the liquid reservoir P can be stabilized in the initial stage of suction.

  Further, since the needle portion NP (fluid passage portion) of the needle valves 84 and 85 is filled with the liquid (DIW) during the rinsing process, the fluid passing through the needle valves 84 and 85 is only liquid in the initial suction stage. . Therefore, the suction speed of the liquid reservoir P is not disturbed by the mixture of gas and liquid (droplets) passing through the needle portion NP. Thereby, the suction speed of the liquid reservoir P can be stabilized in the initial stage of suction.

  In this way, the suction speed of the liquid reservoir P in the initial suction stage can be stabilized, so that it is possible to prevent rinsing liquid droplets from remaining in the lower cleaning nozzle 29 and the processing liquid supply unit 43. As a result, it is possible to prevent the rinsing liquid droplets from being discharged during the discharge of the chemical liquid, thereby improving the chemical liquid recovery rate and reducing the chemical liquid consumption. Further, by preventing droplets from remaining in the vicinity of the lower cleaning nozzle 29, it is possible to effectively suppress generation of watermarks and adhesion of particles during spin drying.

  Further, according to this embodiment, since the suction is performed while accelerating the suction speed of the liquid reservoir P in two stages, it is possible to prevent droplets from remaining in the lower cleaning nozzle 29 and the processing liquid supply unit 43. The suction process can be completed during the spin drying process, and the throughput can be improved. That is, while removing the liquid pool P from between the lower surface central portion of the wafer W and the upper surface 30 a of the blocking member 30, liquid is sucked into the lower surface central portion of the wafer W and the upper surface 30 a of the blocking member 30. While preventing droplets from remaining, the time required for removing the liquid pool P can be shortened by increasing the suction speed within a range where separation of the liquid pool P does not become a problem after being taken into the nozzle body 29a. Throughput can be improved.

  Here, when attention is paid to the throughput, the following effects can be expected in this embodiment. That is, in the conventional apparatus in which it is difficult to make the suction speed of the droplets constant, the suction time on the recipe is set longer in order to prevent the droplets from remaining in the nozzle and the processing liquid supply unit. It was. This is because in the conventional apparatus, in order to prevent the remaining of the droplets, the flow rate adjustment valve has to be set so that the suction speed becomes slower in consideration of fluctuations in the suction speed. As a result, in order to suck all the liquid droplets adhering to the nozzle and the pipe of the processing liquid supply unit, it is necessary to set the suction time longer. On the other hand, in this embodiment, since the suction speed can be stabilized, it is possible to set the suction speed relatively high enough to prevent droplets from remaining. As a result, the suction time can be set short, and this embodiment is very effective in improving the throughput.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above embodiment, the suction pipe 82 is filled with the liquid (first processing liquid) by supplying the first processing liquid to the suction pipe 82 during the rinsing process (first step) with the first processing liquid. However, when forming the liquid pool with the second processing liquid (second step), the suction pipe 82 is filled with the liquid (second processing liquid) by supplying the second processing liquid to the suction pipe 82. You may do it. In short, the inside of the suction pipe 82 may be filled with liquid at the start of suction.

  In the above embodiment, DIW is used as the first processing liquid and the second processing liquid, and DIW is supplied to the suction pipe 82 to fill the suction pipe 82 with DIW. The type of the two treatment liquids is arbitrary. Therefore, the second processing liquid used to form the liquid reservoir does not have to be the same component as the first processing liquid. However, in order to reliably take in the residual liquid droplet L into the liquid reservoir P, the wafer W is rinsed by rinsing. It is desirable to use a liquid that is compatible with the rinse liquid (first treatment liquid) adhering to the lower surface of the nozzle and the nozzle tip. In the above embodiment, the same rinse liquid is used as the second treatment liquid. For this reason, the residual liquid L can be taken in and the liquid reservoir P can be formed favorably. In addition, since it is not necessary to switch between the liquid used for the rinsing process, the liquid that forms the liquid pool, and the liquid that fills the suction pipe 82, the liquid can be introduced smoothly and the throughput can be improved. Control is also easy. Since the rinsing liquid also has a cleaning action for the nozzles and pipes, in the above embodiment, the nozzles and pipes are cleaned simultaneously with the removal of the residual droplets L. Therefore, a series of substrate processes from the cleaning process to the drying process can be satisfactorily performed without preventing a reduction in throughput while keeping the nozzles and pipes clean.

  Further, in the above embodiment, a nozzle having a facing surface (the upper surface 30a of the blocking member 30) facing the lower surface of the wafer W at the nozzle tip, from a so-called umbrella-shaped nozzle to the center of the lower surface of the wafer W, The present invention is applied to a substrate processing apparatus that discharges a nozzle cleaning liquid or the like. However, the application target of the present invention is not limited to this, and the present invention can be applied to a substrate processing apparatus of an arbitrary nozzle form. For example, in the above embodiment, the upper surface of the blocking member faces the lower surface of the wafer in parallel, but it may be inclined downward in a mortar shape toward the substantially central discharge port. By doing so, the suction and removal of the liquid pool becomes smoother.

  Further, in the above embodiment, the liquid pool P is formed after the rinsing process and the liquid pool P is removed by suction. However, the formation of the liquid pool P is not essential and is connected to the nozzle and the nozzle after the rinsing process. Alternatively, the rinse liquid droplet remaining and adhering to the treated liquid supply section (supply means) may be sucked. Also in this case, a part of the rinsing liquid (first processing liquid) supplied to the processing liquid supply unit in the suction pipe 82 during the rinsing process is guided into the suction pipe 82, so that the droplet suction start point is reached. The suction pipe 82 can be filled with the liquid (first processing liquid). Therefore, the suction speed of the droplets can be stabilized at the initial stage of suction, and it is possible to prevent the droplets from remaining in the nozzle and the processing liquid supply unit.

  In the above embodiment, the suction speed of the liquid pool (droplet) is accelerated in two stages from the first speed to the second speed. However, the suction speed of the liquid pool (droplet) is the first speed. The suction speed may be kept constant, or the suction speed may be gradually increased from the first speed to the second speed including the second speed, or continuously from the first speed to the second speed. The speed may be accelerated.

  As described above, in this embodiment, the present invention is applied to the substrate processing apparatus that cleans the upper and lower surfaces of the wafer W, which is a kind of substrate. However, the application target of the present invention is not limited to this, and the nozzle is spaced from the lower surface of the substrate, and the first processing liquid is discharged from the nozzle toward the lower surface of the substrate, thereby rinsing with the first processing liquid. A substrate processing apparatus that performs a rinsing process with a first processing liquid by discharging a first processing liquid from the nozzle toward the upper surface of the substrate, or a nozzle that is disposed on the substrate. First processing liquid from nozzle to substrate, such as a substrate processing apparatus that performs a rinsing process with the first processing liquid by discharging the first processing liquid from the nozzle toward the upper surface and / or lower surface of the substrate. Can be applied to all substrate processing apparatuses that perform a rinsing process using a first processing liquid.

It is a figure which shows one Embodiment of the substrate processing apparatus concerning this invention. It is a figure which shows the upper end part of a lower washing nozzle. It is a block diagram which shows schematic structure of a supply and suction mechanism. It is a flowchart which shows operation | movement of the substrate processing apparatus of FIG. It is a figure which shows typically operation | movement of the substrate processing apparatus of FIG. It is a figure which shows typically operation | movement of the substrate processing apparatus of FIG. It is a figure which shows typically operation | movement of the substrate processing apparatus of FIG. It is a figure which shows an example of the structure of a needle valve.

Explanation of symbols

29 ... Lower cleaning nozzle 43 ... Treatment liquid supply section (supply means)
82 ... Suction piping (suction path)
83 ... Combum (suction means)
84, 85 ... Needle valve (flow adjustment valve)
L ... (residual) droplet P ... Liquid reservoir V1 ... First speed V2 ... Second speed W ... Wafer (substrate)

Claims (9)

The first processing liquid is supplied to the nozzle through a supply means connected to the nozzle, so that the first processing liquid is discharged from the nozzle toward the substrate, and the substrate is rinsed by the first processing liquid. A rinsing step for performing the treatment;
A liquid droplet of the first treatment liquid remaining on and adhering to the nozzle and the supply means is sucked along a suction path connected at one end to the supply means, and the first treatment liquid is sucked from the nozzle and the supply means. A suction step for removing one treatment liquid droplet,
A substrate processing method, wherein the suction path is filled with the first processing liquid by supplying the first processing liquid to the suction path via the supply means during the rinsing step.   The suction step sucks the droplets of the first processing liquid while accelerating the suction speed of the droplets of the first processing liquid from a first speed to a second speed higher than the first speed in at least two stages. The substrate processing method according to claim 1. A first processing liquid is supplied to the nozzle through a supply means connected to a nozzle arranged away from the lower surface of the substrate while rotating the substrate, so that the tip of the nozzle faces the lower surface of the substrate. A first step of discharging the first processing liquid and supplying the first processing liquid to the entire lower surface of the substrate;
After the first step, the second processing liquid is supplied to the nozzle through the supply means, so that the second processing liquid is discharged from the tip of the nozzle toward the lower surface of the substrate, so that the central portion on the lower surface of the substrate. And a second step of forming a liquid pool between the nozzle tip and the nozzle tip,
The liquid reservoir is removed from between the central portion of the lower surface of the substrate and the nozzle tip portion by sucking the liquid reservoir from the nozzle tip portion along a suction path connected at one end to the supply means. A third step,
Filling the suction path with the processing liquid by supplying one of the first processing liquid and the second processing liquid to the suction path via the supply means before the third step. A substrate processing method.   The substrate processing method according to claim 3, wherein in the second step, a liquid having the same component as the first processing liquid is used as the second processing liquid.   In the third step, the suction speed of the liquid pool is suctioned from the nozzle tip at the first speed to remove the liquid pool from between the lower surface center part of the substrate and the nozzle tip, and then the suction. The substrate processing method according to claim 3, wherein the liquid pool taken in the nozzle is sucked at a second speed higher than the first speed by accelerating the speed. In the substrate processing apparatus for performing a rinsing process with the first processing liquid on the substrate by discharging the first processing liquid from the nozzle toward the substrate,
A supply means connected to the nozzle for discharging the first processing liquid from the nozzle by guiding the first processing liquid to the nozzle;
The nozzle and the supply unit are configured to suck a droplet of the first processing liquid that adheres to the nozzle and the supply unit after the rinsing process along a suction path connected at one end to the supply unit. A suction means for removing from,
A substrate processing apparatus, wherein the suction path is filled with the first processing liquid by supplying the first processing liquid to the suction path via the supply means while the rinsing process is performed.   The apparatus further comprises suction speed setting means for setting the suction speed of the droplets of the first processing liquid by at least one flow rate adjustment valve that is interposed in the suction path and adjusts the flow rate of the fluid flowing in the suction path. 6. The substrate processing apparatus according to 6. While rotating the substrate, the first processing liquid is discharged from the tip portion of the nozzle disposed away from the lower surface of the substrate toward the lower surface central portion of the substrate, and the first processing is performed on the entire lower surface of the substrate. In a substrate processing apparatus for rinsing with a liquid,
By guiding the second processing liquid to the nozzle, the second processing liquid is discharged from the nozzle tip toward the lower surface of the substrate that has undergone the rinsing process, so that the center of the lower surface of the substrate and the tip of the nozzle A supply means for forming a liquid pool therebetween;
Suction that removes the liquid reservoir from between the center of the bottom surface of the substrate and the nozzle tip by sucking the liquid reservoir from the nozzle tip along a suction path connected at one end to the supply means. Means and
Before the suction operation of the liquid reservoir, the processing liquid is supplied to the suction path by supplying one of the first processing liquid and the second processing liquid to the suction path through the supply unit. A substrate processing apparatus characterized by satisfying.   The substrate processing according to claim 8, further comprising: a suction speed setting unit configured to set a suction speed of the liquid reservoir by at least one flow rate adjustment valve that is interposed in the suction path and adjusts a flow rate of a fluid flowing in the suction path. apparatus.

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