JP2006267051A - Device and system for detecting article damage - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable detection of article damages, regardless of the presence of a package and an attitude of an article. <P>SOLUTION: A device for detecting article damages includes a detection plate 3 composed of a deformable plate, a semiconductor chip 4 having a strain sensor 15 bonded to the detecting plate 3, and a communication section 5 that wirelessly transmits the output of the strain sensor to the outside and are detected, by sticking the device for detecting article damages to an objective article 7, to transmit a read command from a reader 2, and then transmitting the detected output of the sensor 15 to the reader 2 from the communications section 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an article damage detection device and damage detection system, and more particularly to an apparatus suitable for managing the presence or absence of article damage in a physical distribution process.

  In the logistics process of goods such as goods and products, the goods may be damaged for some reason. For example, when an article is dropped during loading or unloading of a truck, stacked on a shelf in a warehouse, or stored, the article may be damaged due to an external force for some reason. In addition, there may be a case where the packaging of the article or the package is damaged. Since the damaged article cannot be put on the market as it is, it is necessary to inspect whether the article is damaged at an appropriate stage of distribution. When such an inspection is performed manually, not only a large number of inspection personnel are required, but also the inspection takes time, which hinders the distribution of goods.

  Therefore, in Patent Document 1, when a truck or the like on which an article is loaded passes through the receiving gate of the container terminal, the article is irradiated with light, and the illuminance of the reflected light is measured. Has proposed an article damage detection device that determines that there is damage when the value is too low. According to this apparatus, since the presence or absence of damage to the article can be automatically detected by a flow operation, not only inspection personnel can be reduced, but also the inspection time can be shortened.

Japanese Patent Laid-Open No. 8-219998

  However, the prior art described in Patent Document 1 does not consider the case where the article is packed. That is, the method of irradiating an article with light and detecting damage based on the illuminance of the reflected light can detect damage to the packaging surface that is exposed to light, but can detect damage to the article inside the packaging. I can't. Further, when a large number of articles are stored in one package, damage cannot be detected unless the articles are unpacked, the articles are taken out, and light is irradiated one by one.

  Moreover, even if the article is not packed, the conventional technique described in Patent Document 1 cannot detect damage on the back surface of the article that is not exposed to light. Therefore, it is necessary to detect the presence or absence of damage while changing the posture of the article by a method such as rotating the article.

  An object of the present invention is to make it possible to detect damage to an article regardless of the presence or absence of packaging and the attitude of the article.

  In order to solve the above-mentioned problems, a first aspect of the article damage detection device of the present invention is an article to be inspected with a strain sensor having a strain sensor element of an impurity diffusion layer formed on a single crystal silicon substrate. It is characterized in that damage to the article is detected by the output of the strain sensor.

  That is, by simply attaching the strain sensor to the inspection object, if the article receives external force or the like and is damaged such as deformation, it can be detected by the output of the strain sensor. In particular, by forming a strain sensor using an impurity diffusion layer formed on a crystalline silicon substrate, it is more resistant to intergranular corrosion and fatigue than a resistance wire type strain sensor, thus ensuring the reliability of strain detection. . That is, a semiconductor typified by silicon has a significantly higher yield strength than a strain gauge using a general metal foil. Therefore, since the strain sensor using a semiconductor has a small plastic deformation component even when it receives the same deformation amount, the fatigue life with respect to a high cycle is remarkably high. Therefore, there is an advantage that long-term strain measurement can be performed stably. In addition, as strain sensors using semiconductors, there are strain sensors using polycrystalline silicon, but since polycrystalline silicon has a large number of grain boundaries inside, polycrystalline silicon has preferential environmental corrosion. Occurs, resulting in a decrease in measurement accuracy and disconnection. On the other hand, when single crystal silicon is used, since it does not include crystal grain boundaries at all, there is an advantage that it is possible to eliminate the influence of environmental corrosion at the crystal grain boundaries and to have excellent long-term reliability.

  Moreover, the strain sensor formed using the impurity diffusion layer cannot detect the isotropic strain of the article that is deformed so that the balloon is inflated. However, this property is advantageous in the case of damage that causes unidirectional strain.

  According to a second aspect of the article damage detection device of the present invention, in the first aspect, the detection plate made of a plastically deformable plate material is attached to the inspection object, and the strain sensor is attached to the detection plate. The present invention is characterized in that it is configured to detect the damage of the.

  In other words, if a detection plate made of a plastically deformable plate is affixed to an article to be detected, the memory effect that the deformation state is maintained when the detection plate is deformed by receiving an external force that can damage the article. There is. In other words, when an article receives a large external force by mistake at some point in the physical distribution process, the large deformation or load once received is stored as a deformation of the detection plate, so that it can be read anytime thereafter. Therefore, by measuring the output of the strain sensor several times at an appropriate stage of the physical distribution process, it is possible to detect in which process the article has been damaged.

  In particular, since the damage detection device according to the present invention is directly attached to an article, it is possible to detect damage to the article regardless of the presence or absence of packaging and the attitude of the article. In addition, since it is not a detection method using optics as in the past, by providing damage detection devices on both the front and back surfaces of the article, it is possible to prevent damage on both sides regardless of how the article is placed. Can detect presence or absence.

  Moreover, the 3rd aspect of the damage detection device of this invention can be comprised including the communication means which transmits the output of a strain sensor to the exterior wirelessly. According to this, by receiving the output of the strain sensor transmitted from the communication means by, for example, a reader equipped with the communication means, it is possible to automatically detect whether or not the article is damaged without touching the article. In addition, even when an article is packed in a large amount, it can be detected whether the article is damaged by simply communicating with the damage detection device attached to the packed article using electromagnetic waves. There is no need to check. Moreover, even when the article is packaged, the electromagnetic wave can pass through the packaging material, so that the presence or absence of damage can be detected without removing the packaging.

  Further, as a fourth aspect of the damage detection device of the present invention, the electromagnetic wave energy received by the antenna that receives the electromagnetic waves of the communication means can be used as an operation power source of the damage detection device. According to this, since it is not necessary to provide an internal power source such as a battery in the damage detection device, the damage detection device can be reduced in size and thickness. However, the damage detection device of the present invention is not limited to this, and an independent built-in power source such as a battery, solar power generation, vibration power generation, and temperature difference power generation can be attached as an energy source.

  In the case of the damage detection device of the present invention provided with a built-in power supply, when the output of the strain sensor exceeds a set value, there can be provided history storage means for storing the output of the strain sensor and the date and time thereof in a memory. According to this, by reading the contents of the memory, it is possible to know the history of damage to the article, so that the cause and improvement measures can be rationally established.

  The damage detection system of the present invention is a damage detection device comprising a detection plate made of a plastically deformable plate, a strain sensor affixed to the detection plate, and a communication means that communicates with the outside wirelessly. A reader having communication means that communicates wirelessly with the communication means of the damage detection device, the detection plate of the damage detection device is affixed to an article to be inspected, and the reader It can be set as the structure which detects the presence or absence of the damage of the said article by communicating with a communication means and reading the output of the said strain sensor.

  By the way, damage to an article may be damaged, for example, by opening an article or package in a bag, extracting an article in the bag, and sealing the bag or package again. Such damage is caused by sticking the damage detection device of the present invention to a sealing material such as packing of an article, or by forming a sealing material such as packing using the damage detection device of the present invention, It is possible to reliably detect the damage of unpacking. That is, when a bag-like article or the like is opened, a large strain is generated. However, since the detection plate of the present invention can maintain a large strain at that time, it can be detected at any time after that.

  Further, by forming the strain sensor and the communication circuit according to the present invention on the semiconductor chip, the damage detection device can be formed extremely small and thin, so that even a small article can be attached. Furthermore, since it can be manufactured by the manufacturing process of the semiconductor device, it can be manufactured in large quantities and at low cost.

  According to the present invention, damage to an article can be detected regardless of the presence or absence of packaging and the attitude of the article.

  Hereinafter, the present invention will be described based on embodiments.

(Embodiment 1)
1 and 2 are schematic configuration diagrams of an embodiment of an article damage detection system according to the present invention. The damage detection system according to this embodiment includes a damage detection device 1 and a reader 2. FIG. 1 shows a cross-sectional view of the damage detection device 1, and FIG. 2 shows a plan view. The damage detection device 1 includes a detection plate 3 made of a plastically deformable plate, a semiconductor chip 4 attached to the detection plate 3, and a communication unit 5. The semiconductor chip 4 and the communication unit 5 are connected by wiring 6. The damage detection device 1 configured as described above is used by attaching one surface of the detection plate 3 to the surface of the article 7 to be inspected for damage.

  Here, the detection plate 3 can be made of a metal material mainly composed of at least one of elements such as A1, Cu, Fe, Zn, Ni, Ti, Cr, W, and Sn. A magnetic metal material is desirable, but an organic material may be used. The material and thickness of the detection plate 3 are determined according to the expected impact strength, and the size of the detection plate 3 is preferably larger than that of the semiconductor chip 4.

  As shown in FIG. 3 or 4, a strain sensor unit 15 is formed on the semiconductor chip 4. The strain sensor unit 15 is formed by forming a Wheatstone bridge with an impurity diffusion layer using a piezoresistance effect. FIG. 3 shows an example using a P-type impurity diffusion layer, and FIG. 4 shows an example using an N-type impurity diffusion layer. As shown in FIG. 3, the strain sensor elements 15a and 15b of the P-type impurity diffusion layer are formed so that the crystal direction [110] of the single crystal silicon of the semiconductor chip 4 is the longitudinal direction, that is, the direction of current flow. Yes. Thereby, the detection sensitivity of distortion can be increased. On the other hand, the dummy resistance elements 15c and 15d of the P-type impurity diffusion layer are formed so that the crystal direction [100] perpendicular to the longitudinal direction of the strain sensor elements 15a and 15b is the longitudinal direction, that is, the direction of current flow. . Thereby, even if the same strain as the strain sensor elements 15a and 15b is applied to the dummy resistance elements 15c and 15d, the resistance value does not change because the sensitivity of the dummy resistance elements 15c and 15d is low. Therefore, temperature compensation of the strain sensor unit 15 having temperature dependent characteristics can be performed with high accuracy. When an N-type impurity diffusion layer is used, as shown in FIG. 4, the strain sensor elements 15a and 15b are formed so that the crystal direction [010] of single crystal silicon is the longitudinal direction, that is, the direction of current flow. The dummy resistance elements 15c and 15d are formed so that the [001] direction is the longitudinal direction, that is, the direction in which current flows. A DC power source Vin is supplied between the connection point between the strain sensor element 15a and the dummy resistance element 15c and the connection point between the strain sensor element 15b and the dummy resistance element 15d, and the connection between the strain sensor element 15a and the dummy resistance element 15d. The voltage between the point and the connection point of the strain sensor element 15b and the dummy resistance element 15c is configured as the detection output Vout.

  As shown in the block diagram of FIG. 5, the communication unit 5 includes an antenna 8, a radio frequency (RF) analog circuit unit 9, a communication control circuit unit 10, a sensor analog circuit unit 11, and an amplifier circuit unit 12. Yes. The RF analog circuit unit 9 is configured to perform modulation and demodulation of a signal communicated wirelessly via the antenna 8. The sensor analog circuit unit 11 has an AD conversion function. The detection output Vout supplied from the strain sensor unit 15 via the wiring 6 is amplified by the amplifier circuit unit 12 and converted into a digital signal by the sensor analog circuit unit 11. The detection output Vout converted into a digital signal can be transmitted from the antenna 8 to the outside via the communication control circuit unit 10 and the RF analog circuit unit 9. In the case of this embodiment, the communication unit 5 includes a power supply unit 13, and the power supply unit 13 extends from the high frequency (RF) analog circuit unit 9, the communication control circuit unit 10, the sensor analog circuit unit 11, the amplification circuit unit 12, and A DC power source Vin is supplied to the strain sensor unit 15. As the power supply unit 13, a so-called positive power supply such as a battery, solar power generation, vibration power generation, and temperature difference power generation can be used. However, the present invention is not limited to this, and a so-called passive power source that generates a DC power source from electromagnetic waves received from the antenna 8 can be used as will be described later.

  On the other hand, the reader 2 is, for example, a portable receiving device having a wireless communication function. As shown in the block diagram of FIG. 6, the antenna 16, the RF analog circuit unit 17, the communication control circuit unit 18, and the damage detection unit 19 are used. The display unit 20 and the power supply unit 21 are included. The RF analog circuit unit 17 is configured to modulate and demodulate a signal communicated wirelessly via the antenna 16. The communication control circuit unit 18 outputs a reading command of the detection output Vout of the strain sensor unit 15 to the communication unit 5 based on an inspection command input from an input unit (not shown). In response to the reading command, the damage detection unit 19 takes in the detection output Vout of the strain sensor unit 15 input via the communication control circuit unit 18 and compares it with a preset determination reference value Vset. ing. When Vout ≦ Vset, it is determined that there is no damage, and that effect is displayed on the display unit 20, and when Vout> Vset, it is determined that there is damage, and that effect is displayed on the display unit 20. .

  Next, the operation of the damage detection system of the present embodiment configured as described above will be described. First, the detection plate 3 of the damage detection device 1 is affixed to an appropriate place on the article 7 to be inspected. At this time, the communication unit 5 is also attached to the surface of the article 7 to place the article 7 in the physical distribution process. When an inspection command is input to the reader 2 at an appropriate time in the distribution process, for example, when loading on a truck, when unloading from a truck, or when stored in a warehouse shelf, the reader 2 communicates with the damage detection device 1. A reading command for the detection output Vout of the strain sensor unit 15 is output to the unit 5.

  When the reading command is received by the communication unit 5 of the damage detection device 1, the communication unit 5 operates, the DC power source Vin is supplied to the strain sensor unit 15, and the detection output Vout at that time is captured. The communication unit 5 amplifies the detection output Vout and converts it into a digital signal, and outputs it from the antenna 8 on a carrier wave for wireless communication.

  The detection output Vout output from the antenna 8 is received by the antenna 16 of the reader 2, and reception processing such as demodulation and amplification is performed in the RF analog circuit unit 17. The communication control circuit unit 18 transfers the detected detection output Vout to the damage detection unit 19. The damage detection unit 19 compares the detection output Vout with a preset determination reference value Vset, determines that there is no damage when Vout ≦ Vset, displays that fact on the display unit 12, and when Vout> Vset Determines that there is damage, and displays that fact on the display unit 12. If there is damage, an alarm or the like can be output.

  By operating in this way, the inspector can easily determine whether or not the article 7 is damaged. For example, when there is damage, the article 7 can be extracted, the site and degree of damage can be confirmed, and measures can be taken as necessary.

  As described above, according to the present embodiment, when an impact that causes damage to the article 7 is applied, the detection plate 3 is deformed, and the deformation of the detection plate 3 is captured by the strain sensor unit 15 to cause damage. Presence or absence is determined. FIG. 19 shows an example of plastic deformation data of the detection plate 3. The horizontal axis in FIG. 19 is strain (%), and the vertical axis is stress (MPa). Therefore, by utilizing the plastic deformability of the detection plate 3, the presence or absence of damage can be detected without constantly monitoring the article 7. In addition, since there is no need to constantly sense or send radio waves, the energy required for damage detection can be reduced, and the system can be operated for a long time.

  In this embodiment, as shown in FIG. 3 or FIG. 4, the two strain sensor elements 15a and 15b and the two dummy resistance elements 15c and 15d are formed by an impurity diffusion layer using a piezoresistance effect. In addition, the strain sensor unit 15 is configured by arranging them orthogonally to each other and connecting them in a bridge. In particular, since the direction in which the current of the strain sensor elements 15a and 15b flows is set to a direction in which the strain detection sensitivity is high, the dummy resistance elements 15c and 15d have a low strain resistance sensitivity and the temperature dependence is dominant. Become. As a result, when the temperature of the article 7 changes, the temperature dependence of the strain sensor elements 15a and 15b can be corrected by the dummy resistance elements 15c and 15d. As a result, it is possible to detect an accurate strain independent of temperature.

  In addition, by forming the strain sensor unit 15 as shown in FIG. 3 or FIG. 4, unlike conventional strain gauges, the sensitivity to the in-plane equivalent strain is small, and the deviation between the vertical and horizontal strains is large. Can be detected with high sensitivity. As a result, there is no sensitivity to the deformation caused by the volume expansion of the article 7 itself, and a large sensitivity is exhibited only when the vertical and horizontal deviations such as a drop impact are large. Therefore, it does not react to a change in the volume of the article 7 caused by a change in temperature or atmospheric pressure, but reacts with high sensitivity only to an external force that may cause damage, and thus has characteristics suitable for detecting damage to the article.

As described above, the damage detection system of the present embodiment includes the detection plate 3 made of a plate material that can plastically deform the damage detection device 1, the strain sensor 15 attached to the detection plate 3, and the outside wirelessly. Since it comprises the communication part 5 which is a communication means which communicates, and is comprised including the reader 2 which has the communication means 5 which communicates with the communication part 5 of the damage detection device 1 wirelessly, damage detection The detection plate 3 of the device 1 is affixed to the article 7 to be inspected, and the reader 2 communicates with the communication unit 5 to read the output of the strain sensor 15 to detect whether the article 7 is damaged. As a result, the following effects can be achieved.
(1) Even when the article 7 is packed in a packaging material such as a container, the article 7 can be damaged only by performing wireless communication with each damage detection device 1 provided in the packed article 7 using electromagnetic waves. Therefore, it is not necessary to take out the article 7 from the container for confirmation.
(2) Even when the article 7 is packaged, since electromagnetic waves can pass through the packaging member, it is possible to detect whether the article 7 is damaged without removing the packaging.
(3) By attaching the damage detection device 1 to various parts of the surface of the article 7, the presence or absence of damage without rotating or turning the article 7 whatever the posture of the article 7 is placed. Can be detected.
(4) In the case of the bag-like article 7, since the large strain at the time of opening remains in the detection plate 3 by sticking the damage detection device 1 to the opening part, it is once sealed and then sealed However, it is possible to detect the presence of opening at any time.
(5) Since the detection plate 3 of the damage detection device 1 retains deformation caused by a large load once received, measure the detection output of the strain sensor several times in the physical distribution process and compare the measured values. For example, it is possible to clarify where the large deformation occurred. As a result, it is possible to devise an improvement measure so that the article is not damaged.
(6) Since the damage detection device 1 can be formed in a very small size, it can be attached to a small article 7.
(7) Since the damage detection device 1 can be manufactured by a semiconductor device manufacturing process, it can be manufactured in large quantities and at low cost.

(Modification of Embodiment 1)
According to the first embodiment, the memory effect can be expected by providing the detection plate 3 that is a plastically deformable plate. However, the present invention is not limited to this, and the detection plate 3 is not provided. The semiconductor chip 4 having the strain sensor unit 15 may be directly attached to the article 7. In this case, if the article 7 is deformed due to an impact and returns to its original state, the detection output Vout of the strain sensor unit 15 is reduced below the determination reference value. In some cases, no damage can be detected during reading by 2. Therefore, when the detection plate 3 is not provided, it is also necessary to constantly monitor whether or not an external force such as dropping is applied by constantly monitoring the distortion of the article 7.

  Further, the shape of the detection plate 3 is not limited to a square as shown in FIG. For example, as shown in FIG. 7, a rectangular shape is used, and the direction in which the currents of the strain sensor elements 15 a and 15 b flow can be substantially matched with the long side direction. In such a detection plate 3, the vertical deformation that is bent with the deformation axis 22 at the center in the long axis direction symmetrical occurs more easily than the horizontal deformation. Therefore, when a complicated external force is applied, the vertical deformation is caused. Become dominant. Therefore, when the direction of the current flowing through the strain sensor elements 15a and 15b of the impurity diffusion layer is made substantially parallel to the long side of the detection plate 3, the deformation is emphasized, and the sensitivity is increased.

  Further, it is preferable to select one or a plurality of positions where the damage detection device 1 is attached to the article 7 according to each target article 7 as the most susceptible to damage. For example, as shown in FIG. 8, the damage detection device 1 can be reliably detected by attaching the damage detection device 1 to the corners of the article 7 or by attaching the damage detection device 1 to the four corners. it can.

  Furthermore, since the built-in power supply is attached to the damage detection device 1, the damage detection device 1 can be operated independently. Therefore, when the output of the strain sensor 15 exceeds the set value, a memory for storing the output of the strain sensor 15 and the date and time thereof can be provided. According to this, by reading the contents of the memory, it is possible to know the history of damage to the article, so that the cause and improvement measures can be rationally established.

  Moreover, it is preferable to coat the entire semiconductor chip 4 and communication unit 5 mounted on the detection plate 3 with a mold resin.

(Embodiment 2)
9 and 10 are schematic configuration diagrams of another embodiment of the article damage detection system of the present invention. 9 shows a cross-sectional view of the damage detection device 1, and FIG. 10 shows a plan view. The damage detection system according to the second embodiment is different from the first embodiment shown in FIGS. 1 and 2 in that the circuit unit of the communication unit 5 of the damage detection device 1 is incorporated in the semiconductor chip 4 except for the antenna 8, and the semiconductor chip. 4, a DC power is generated from electromagnetic waves received via the antenna 8 to form a power supply unit that obtains an operating power supply for the damage detection device 1. Since the other points are the same as those of the first embodiment, the same reference numerals are given and description thereof is omitted.

  That is, as shown in the block diagram of FIG. 11, the semiconductor chip 4 of this embodiment includes a high frequency (RF) analog circuit unit 9, a communication control circuit unit 10, a sensor analog circuit unit 11, an amplifier circuit unit 12, and a strain sensor unit. 15 and a power supply unit 24. The power supply unit 24 generates direct-current power from electromagnetic waves received by the RF analog circuit unit 11 via the antenna 8. The generated DC power is supplied to each circuit unit constituting the damage detection device 1 as an operation power source. For example, the power supply unit 24 is configured to receive a carrier wave transmitted from the reader 2 when a reading command is input from the reader 2, and to convert the energy into direct current and supply it as an operating power source for each unit. Has been.

  As the antenna 8, as shown in FIG. 10, a loop antenna 26 formed in a loop shape on the periphery of a resin film 25 that is sufficiently larger than the semiconductor chip 4 can be used. In this case, the antenna 8 can be mounted on a semiconductor chip 4 attached to the surface of the detection plate 3 as shown in the cross-sectional view of FIG.

  The antenna 8 is not limited to the loop antenna shown in FIG. 10, and a dipole antenna 27 can be used as shown in FIG. The dipole antenna 27 is desirable because it does not take up space in the case of the rectangular detection plate 3.

  In the case of this embodiment, as shown in FIG. 13, a high permeability member 28 made of a high permeability material can be disposed between the detection plate 3 and the antenna 8. As the high magnetic permeability member 28, a member having a magnetic permeability higher than at least the magnetic permeability of the detection plate 3 is preferable. Specifically, a resin obtained by mixing particles or powder with high magnetic permeability such as cobalt can be used. Here, the magnetic permeability μ is a material property indicating the ease of magnetization with respect to a magnetic field applied from the outside. When the strength of the magnetic field changes like an electromagnetic wave, the magnetic flux density does not catch up with the change, and the phase changes. Is delayed. Therefore, the magnetic permeability μ is represented by being divided into a real term μ ′ (easy to be magnetized) and an imaginary term μ ″ (size of phase shift). As an example of the high magnetic permeability member 28, the real term μ A magnetic permeability μ of '= 10 H / m or more and an imaginary term μ ″ = 5 H / m or more is selected.

  By disposing such a high magnetic permeability member 28, even when a metal plate is applied as the detection plate 3, it is possible to reduce the deterioration of radio waves from the antenna 8. As a result, there is an advantage that the communication distance is increased. This is more effective when the article 7 is a metal.

  Next, the operation of the second embodiment configured as described above will be described. As in the case of the first embodiment, the detection plate 3 of the damage detection device 1 is affixed to an appropriate place of the article 7 to be inspected, and the article 7 is put in the physical distribution process. When an inspection command is input to the reader 2 at an appropriate time in the physical distribution process, a reading command for the detection output Vout of the strain sensor unit 15 is output from the reader 2 to the damage detection device 1.

  When the reading command is received by the RF analog circuit unit 9 via the antenna 8 of the damage detection device 1, DC power is generated from the received carrier wave by operating the power supply unit 25, and each of the strain sensor unit 15 and the like is generated. Supplied to the circuit unit. When the DC power source Vin is supplied to the strain sensor unit 15, the detection output Vout from the strain sensor unit 15 is taken into the sensor analog circuit unit 11 through the amplifier circuit unit 12 and converted into a digital signal. The detection output Vout converted into the digital signal is taken into the communication control circuit unit 10 to be formed into a predetermined communication signal, and is output from the antenna 8 on the carrier wave for wireless communication by the RF analog circuit unit 9.

  The detection output Vout output from the antenna 8 is received by the antenna 16 of the reader 2 as in the case of the first embodiment, and the detection output Vout subjected to reception processing is transferred to the damage detection unit 19 to determine whether there is damage. Is done. The determination result is displayed on the display unit 12, and an alarm or the like is output as necessary.

  Since it operates in this way, the following effect is obtained in addition to the effect of the first embodiment. Since the damage detection device 1 is driven using electromagnetic waves from the reader 2 as energy, an internal power source such as a battery is not required for the damage detection device 1, so that the battery does not run out and is excellent in maintenance. Furthermore, since there is no failure related to the internal power supply, highly reliable measurement can be performed accordingly. Further, since the size of the damage detection device 1 can be minimized and reduced in weight, it does not take a place, so that it does not deteriorate appearance even if it is attached to an article, and does not lead to an increase in transportation cost. In addition, according to the damage detection device 1 of the present embodiment, since the configuration is more suitable for mass production than in the case of the first embodiment, the price can be further reduced.

(Embodiment 3)
FIG. 14 shows a block diagram of another embodiment of a semiconductor chip according to the damage detection device 1 of the present invention. The semiconductor chip 30 of the present embodiment is different from the semiconductor chip 4 of FIG. 11 of the second embodiment in that an identification code (ID) issuing unit 31 is connected to the communication control circuit unit 10 to provide the communication control circuit unit 10. The unique identification code set for each damage detection device 1 is added to the communication signal generated in (1). Since other points are the same as those of the second embodiment, description thereof is omitted.

  With this configuration, the identification code of the damage detection device 1 is transmitted to the detection output Vout sent from the damage detection device 1 to the reader 2. As a result, the reader 2 can manage the detection output Vout and the corresponding identification code as a set, which is particularly useful when performing history management.

(Embodiment 4)
FIG. 15 shows an embodiment of a main part of a damage detection system to which the damage detection device 1 shown in FIG. 12 is applied. The present embodiment is a system that can confirm the opening of the bag-shaped article 7. As shown in FIG. 15, the damage detection device 1 having the detection plate 3 formed elongated along the opening 32 is attached to the vicinity of the opening 32 formed on one side of the bag.

  With this configuration, when the bag opening 32 is opened, a large strain is generated in the vicinity of the opening and the detection plate 3 is plastically deformed. Since the deformation of the detection plate 3 remains even if the opening 32 is closed, by detecting this with the strain sensor 15, it can be easily determined whether the detection plate 3 has been opened or not.

  Moreover, as shown in FIG. 16, it is preferable to affix the damage detection device 1 on both surfaces of the opening 32 of the bag. According to this, whether the opening 32 is opened or simply bent depending on whether the direction (polarity) of the strain change amount (polarity) of the detection plate 3 of the damage detection device 1 on both sides is the same direction or the opposite direction. Can improve the reliability of opening confirmation.

  Further, by providing the damage detection device 1 of this embodiment with a function of issuing an identification code, the reader 2 can manage the opening history together with the identification code. Furthermore, if the date and time when the opening is detected by the reader 2 is recorded and managed, the expiry date of the article is searched, and if the period after opening exceeds the expiry date, the disposal of the article is recommended. It becomes possible to do.

  In the fourth embodiment, the case where the present invention is applied to a bag-shaped article has been described. However, in the case of an article that can be opened, and the vicinity of the opening is easily distorted when opened. The fourth embodiment can be applied.

(Embodiment 5)
FIG. 17 shows an embodiment of a damage detection system applied when the article 7 is stored in a packing material such as a box. In the example of FIG. 17, the damage detection device 1 of the present invention is attached to a tape-shaped sealing material 36 that seals the opening / closing part of the packaging box 35. Thus, when the damage detection device 1 is attached to the sealing material 36 and the sealing material 36 is intentionally peeled off, strain remains on the detection plate 3 of the damage detection device 1. Therefore, by reading the detection output of the strain sensor 15 of the damage detection device 1, it is possible to detect whether the packaging box 35 has been opened.

  That is, conventionally, the sealing material 36 is sealed by stamping or the like, but according to the present embodiment, the identification of the sealing material 36 and the opening date and time of the sealing material 36 can be managed simultaneously. In particular, since the damage detection device 1 of the present invention can be formed to be small and thin, it can be applied to a tape-shaped sealing material or a string-shaped sealing material.

  Moreover, as shown in FIG. 18, the damage detection device 1 of the present invention can be provided on a sealing material 37 such as a gummed tape, and in this case as well, the presence / absence of opening and management as in the embodiment of FIG. It can be performed.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram of one Embodiment of the damage detection system of the articles | goods of this invention, and a damage detection device part is shown in a cross section. FIG. 2 shows a plan view of the damage detection device of FIG. 1. It is a block diagram of the strain sensor part using a P-type impurity diffusion layer. It is a block diagram of the strain sensor part using an N type impurity diffusion layer. It is a block block diagram of one Embodiment of a communication part. It is a block block diagram of one Embodiment of a reader. It is a block diagram of one Embodiment of the arrangement | positioning relationship between the detection board of a damage detection device, and a distortion sensor. It is a figure explaining the sticking position of an article | item and a damage detection device. It is a schematic block diagram of other embodiment of the damage detection system of the articles | goods of this invention, and a damage detection device part is shown in a cross section. FIG. 10 is a plan view of the damage detection device of FIG. 9. It is a block diagram of the circuit block formed in the semiconductor chip of the damage detection device of embodiment of FIG. It is a schematic block diagram of other embodiment of the flaw detection device which concerns on the damage detection system of the articles | goods of this invention. It is a general | schematic block diagram of other embodiment of the damage detection system of the articles | goods of this invention, and shows a damage detection device part in a cross section. It is a block diagram of the circuit block formed in the semiconductor chip of the damage detection device of embodiment of FIG. It is a block diagram of one Embodiment of the damage detection system applied to the opening confirmation of a bag-shaped article. It is a block diagram of other embodiment of the damage detection system applied to the opening confirmation of a bag-shaped article. It is a block diagram of one Embodiment of the damage detection system applied to the opening confirmation of a packing material. It is a block diagram of other embodiment of the damage detection system applied to the opening confirmation of a packing material. It is a diagram which shows an example of the plastic deformation data of a detection board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Damage detection device 2 Reader 3 Detection board 4 Semiconductor chip 5 Communication part 6 Wiring 7 Goods 8 Antenna 9 RF analog circuit part 10 Communication control circuit part 11 Sensor analog circuit part 12 Amplification circuit part 15 Strain sensor part 16 Antenna 13 Power supply part 21 Power supply unit 24 Power supply unit 31 Identification code issuing unit

Claims (15)

  A damage detection device for detecting a damage of an article by attaching a strain sensor having a strain sensor element of an impurity diffusion layer formed on a single crystal silicon substrate to the article to be inspected.   The damage detection according to claim 1, wherein a detection plate made of a plastically deformable plate material is attached to the article to be inspected, and the strain sensor is attached to the detection plate to detect damage to the article. device.   The damage detection device according to claim 1, further comprising a communication unit that wirelessly transmits an output of the strain sensor to the outside.   A damage detection device comprising: a detection plate made of a plastically deformable plate material; and a strain sensor attached to the detection plate.   The damage detection device according to claim 4, further comprising a communication unit that wirelessly transmits an output of the strain sensor to the outside.   6. The damage detection device according to claim 3, wherein the communication unit includes an antenna that receives electromagnetic waves, and includes a power supply unit that converts electromagnetic wave energy received by the antennas into an operating power supply. .   The damage detection device according to claim 4, wherein the strain sensor is formed using an impurity diffusion layer formed on a single crystal silicon substrate.   The strain sensor includes a strain sensor element including an impurity diffusion layer extending along one crystal direction of the single crystal silicon substrate, and an impurity extending along a crystal direction orthogonal to the one crystal direction. The damage detection device according to claim 4, further comprising a dummy resistance element made of a diffusion layer. A detection plate made of a plastically deformable plate material, a semiconductor chip mounted on one surface of the detection plate, and a flat antenna mounted on or over the semiconductor chip,
A damage detection device in which a strain sensor that detects deformation of the detection plate and a communication circuit that wirelessly transmits an output of the strain sensor are formed on the semiconductor chip.   The damage detection device according to claim 9, wherein a plate material having a higher magnetic permeability than the detection plate is disposed on a surface of the antenna on the detection plate side.   The damage detection device according to claim 9, wherein the semiconductor chip and the antenna mounted on the detection plate are covered with a resin.   A damage detection device comprising a detection plate made of a plastically deformable plate, a strain sensor affixed to the detection plate, and a communication means that communicates with the outside wirelessly, and the communication means of the damage detection device And a reader having a communication means that communicates wirelessly, affixing the detection plate of the damage detection device to an article to be inspected, and communicating with the communication means of the damage detection device by the reader A damage detection system that detects the presence or absence of damage of the article by reading the output of a sensor.   13. The damage detection according to claim 12, wherein when the output of the strain sensor exceeds a set value, the reader includes means for storing the output of the strain sensor and the date and time at that time in a memory. system.   The damage detection system according to claim 11, wherein the damage detection device is fixed to a sealing material of a packing material for the article.   The damage detection system according to claim 11, wherein the damage detection device is fixed to an opening portion of a packaging bag of the article.

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