JP2006261667A - Lithography equipment and device, namely, integrated circuit, manufacturing method of flat panel display, and compensation method of cupping - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a system which can change a pattern more quickly and at less cost compared with a mask base system. <P>SOLUTION: Wide range contrast can be attained in such a way that an inclination and location of individually controllable element are adjusted simultaneously. This can be used to compensate a cupping of the individually controllable element. Simultaneous adjustment of location and inclination of the individually controllable element can be attained by two electrodes capable of operating over a range of values. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  This specification is a continuation of US patent application Ser. No. 11/078711 (filed Mar. 14, 2005), which is incorporated herein by reference in its entirety.

  The present invention relates to a lithographic apparatus and a device manufacturing method.

  A lithographic apparatus is an apparatus that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. Lithographic apparatus can be used, for example, in the manufacture of flat panel displays, integrated circuits (ICs), micro machines (MEMS) and other devices involving fine structures. In conventional apparatus, contrast or pattern equipment, referred to as a mask or reticle, is used to generate circuit patterns corresponding to individual layers of a flat panel display or other device. This pattern is transferred onto a target portion (eg including part of, one, or several dies) on a substrate (eg a glass plate). The transfer of the pattern is typically done via imaging onto a radiation sensitive material (eg resist) layer provided on the substrate.

  Instead of a circuit pattern, a pattern device can be used to generate other patterns, such as a color filter pattern or a dot matrix. Instead of a mask, the patterning device can comprise a patterning array that includes an array of individually controllable elements. The advantage of such a system compared to a mask-based system is that the pattern can be changed more quickly and at a lower cost.

  In general, flat panel display substrates are rectangular in shape. In general, known lithographic apparatus designed to expose this type of substrate provides an exposure area that covers the entire width of a rectangular substrate or covers a portion of the width (eg, approximately half the width). . The substrate is scanned directly under the exposure area, while the mask or reticle is scanned synchronously through the beam. In this way, the pattern is transferred to the substrate. If the exposed area covers the entire width of the substrate, the exposure is completed in a single scan. If the exposure area is, for example, half the width of the substrate, after the first scan, the substrate is moved laterally and a second scan is performed to expose the rest of the substrate.

  Another method of imaging includes pixel grid imaging where the pattern is realized by continuous spot exposure.

  The individually controllable elements are either in one of two ways: (1) by controlling the tilt of the individually controllable element, or (2) the position of the individually controllable element (of the individually controllable element Controlled in a direction perpendicular to the plane). The tilt of the individually controllable element is used to deflect a portion of the radiation beam either to the beam towards the substrate or away from the substrate. The position of the individually controllable element changes the path length of a part of the radiation beam and is used to generate destructive interference. Each of these methods has different advantages. For example, the mirror position adjustment allows any phase to be imparted to the reflected beam, and therefore any type of mask (eg, binary mask, halftone phase shift mask, arbitrary phase Allows the use of an emulator of a mask, such as a vortex mask, while the tilt adjustment is either in phase with the incident beam or with a strictly opposite phase reflection (with a constant limited amplitude) Can create strength.

  Therefore, what is needed is a system and method that uses the beneficial effects of adjusting both the tilt and position of individually controllable elements.

  One embodiment of the invention provides a lithographic apparatus that includes an illumination system, a patterning array, and a projection system. The illumination system is configured to condition the radiation beam. The patterning array includes individually controllable elements that can adjust the cross-section of the radiation beam. The projection system is configured to project a conditioned radiation beam onto a target portion of the substrate. The patterning array includes equipment assembled to simultaneously adjust the linear position and tilt of each individually controllable element.

  Other embodiments of the present invention include adjusting the radiation beam using an array of individually controllable elements, projecting the adjusted beam onto the substrate, and each position of the individually controllable elements. And a device manufacturing method including simultaneously adjusting the tilt.

  Other embodiments, features and advantages of the present invention as well as the configuration and implementation of the various embodiments of the present invention are described in detail below with reference to the accompanying drawings.

  The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate one or more embodiments of the invention and, together with the description, further one or more implementations of the invention. It serves to clarify the principles of the examples and allows those skilled in the art to make and use one or more of the embodiments of the present invention.

  The present invention will be described below with reference to the accompanying drawings. In the drawings, like reference numbers indicate identical or functionally similar elements.

Overview and Terminology As used herein, the terms “contrast instrument”, “patterning device”, “patterning array” or “array of individually controllable elements” refer to a beam of radiation that produces a pattern on a target portion of a substrate. It should be broadly construed to refer to any device that may be used to adjust the cross section. It should be noted that the pattern imparted to the radiation beam may not exactly match the desired pattern in the target portion of the substrate, for example if the pattern includes phase shift features or so-called assist features. Similarly, in some cases, the pattern generated on the substrate may not match the pattern formed on the array of individually controllable elements at any point in time. This is the pattern formed on each part of the substrate over a given period or a given number of exposures as the pattern on the relative position of the array of individually controllable elements and / or the substrate changes. This is the case of the configuration in which are stacked. In general, the pattern generated on the target portion of the substrate will match a particular functional layer in a device made in the target portion, such as an integrated circuit. The terms “light valve” and “spatial light modulator (SLM)” are also used in this context.

Programmable mirror array This can include an addressable matrix surface having a control layer and a reflective surface that are viscoelastic (eg, viscous at the same time as the elastic properties). The basic principle behind such a device is, for example, that the addressed area of the reflective surface reflects incident light as diffracted light, whereas the non-addressed area reflects incident light as non-diffracted light. It is. By using an appropriate spatial filter, the non-diffracted light is blocked from the reflected beam and reaches the substrate leaving only the diffracted light. In this way, the beam is patterned by the address pattern of the addressable matrix surface.

  Alternatively, it should be understood that the filter may block diffracted light and allow only non-diffracted light to reach the substrate.

  Again, an array of light diffractive MEMS devices (micromachines) may be used in a corresponding manner. Each optical diffractive MEMS device is a device composed of a plurality of reflective ribbons that can be deformed relative to one another to form a grating that reflects incident light as diffracted light.

  Yet another alternative embodiment of the programmable mirror array is a matrix of small mirrors, each of which can be individually tilted about an axis by applying an appropriate localized electric field or by using piezoelectric actuation means An array is used. Again, these mirrors are matrix-addressable, and the addressed mirror will reflect the incoming radiation beam in a different direction than the unaddressed mirror, and is thus reflected. The beam is patterned by a matrix addressable mirror addressing pattern. The required matrix addressing is performed using suitable electronic means. Mirror arrays are described, for example, in US Pat. Nos. 5,296,891 and 5,523,193, and PCT International Applications WO 98/38597 and WO 98/33096, which are incorporated by reference in their entirety. Is hereby incorporated by reference.

  A programmable LCD array is another example. A programmable LCD array is described, for example, in US Pat. No. 5,229,872, which is hereby incorporated by reference in its entirety.

  The lithographic apparatus can include one or more patterned arrays. For example, a lithographic apparatus can have an array of a plurality of individually controllable elements, each controlled independently of each other. In such a configuration, some or all of the array of individually controllable elements may have a common lighting system (or part of the lighting system), a common support structure for the array of individually controllable elements, and a common At least one of the projection systems (or part of the projection system).

  As used herein, the term “projection system” includes or uses a refractive optical system, a reflective optical system, a catadioptric optical system, a magnetic optical system, an electromagnetic optical system, and an electrostatic optical system. Widely interpreted as encompassing any type of projection system, including any combination thereof, suitable for the exposure radiation applied, or suitable for other factors such as using immersion liquid or vacuum It should be. Any use of the term “projection lens” herein may be considered as synonymous with the more general term “projection system”.

  The projection system can image a pattern on an array of individually controllable elements, so that the pattern is formed coherently on the substrate. Alternatively, the projection system can image a second source where elements in the array of individually controllable elements act as shutters. In this regard, the projection system may be, for example, a microlens array (known as MLA) or a Fresnel lens array to form a second source and image a spot on the substrate. Such an array of focusing elements can be included. In such an array, each focusing element in the array of focusing elements is associated with one of the individually controllable elements in the array of individually controllable elements. Alternatively, the projection system allows the radiation to flow from a plurality of individually controllable elements in the array of individually controllable elements to one of the focusing elements in the array of focusing elements and to one of the focusing elements. May be configured to be guided from above onto the substrate.

  As shown in later figures herein, the device is reflective (eg, using a reflective array of individually controllable elements). Alternatively, the device may be transmissive (eg, using a transmissive array of individually controllable elements).

  The lithographic apparatus may be of a type having two (eg, two stages) or more substrate tables (eg, multiple stages). In such “multi-stage” devices, additional tables are used in parallel, ie preliminary steps are performed on one or more tables, while the other table or tables are exposed. Used for.

  The lithographic apparatus may be of a type that allows at least a portion of the substrate to be covered with an “immersion liquid” having a relatively high refractive index, eg, water, so as to fill a space between the projection system and the substrate. An immersion liquid may also be applied to other spaces in the lithographic apparatus, for example, between the contrast apparatus and the projection system. Immersion techniques for increasing the numerical aperture of projection systems are well known in the art. The term “immersion” as used herein does not mean one configuration, for example, the substrate must be immersed in the liquid, but rather between the projection system and the substrate during exposure. It only means that the liquid is placed.

  In another embodiment, the present invention provides a computer program containing one or more series of machine-readable instructions describing the method disclosed above, or a data store storing such a computer program. It can take the form of a medium (eg, a semiconductor storage device, a magnetic disk, or an optical disk).

  FIG. 1 schematically depicts a lithographic projection apparatus 100 according to one embodiment of the invention. The apparatus 100 includes at least one radiation system 102, an array of individually controllable elements 104 (eg, a contrast device or patterning device), an object table 106 (eg, a substrate table), and a projection system (“lens”). 108.

  The radiation system 102 is used in this special case to provide a beam 110 of radiation that also includes a radiation source 112 (eg, UV radiation, 248 nm, 193 nm, 157 nm, etc.).

  An array of individually controllable elements 104 (eg, a programmable mirror array) is used to apply a pattern to the beam 110. In general, the position of the array of individually controllable elements 104 is fixed relative to the projection system 108. However, in an alternative configuration (not shown), the array of individually controllable elements 104 is connected to a positioning device (not shown) to accurately position it with respect to the projection system 108. As shown here, the array of individually controllable elements 104 is of a reflective type (eg, having a reflective array of individually controllable elements).

  The object table 106 is provided with a substrate support (not explicitly shown) that supports a substrate 114 (for example, a silicon wafer or glass substrate covered with a resist). Connected to a positioning device 116 to position the substrate 114 with respect to the system 108.

Projection system 108 (eg, a quartz and / or CaF ₂ lens system, or a catadioptric system that includes a lens element made of such a material, or a mirror system) includes a directing device 118 (eg, a beam Used to project the patterned beam received from the splitter.

  The light beam is directed at the directing device 118 and reaches the target portion 120 (eg, one or more dies) of the substrate 114. Projection system 108 projects an image of array 104 of individually controllable elements onto substrate 114. Alternatively, the projection system 108 can project an image of a second source in which the elements of the array of individually controllable elements 104 act as a shutter for the second source.

  In the imaging grid array embodiment, the projection system 108 also includes a micro lens array (MLA) to form a second source and project the micro spot onto the substrate 114. For example, see FIG.

  A source 112 (eg, an Nd: YAG laser frequency triple in pixel grid image mode, or another mode of excimer laser) generates a beam of radiation 122. The beam 122 is introduced into the illumination system (eg, illuminator) 124 either directly or after traversing a conditioning device 126, such as a beam expander.

  In one embodiment, when the device 100 is operating in pixel grid image mode, the illumination device 124 includes an adjustment device 128 that adjusts the spot size of the beam 122 by zooming. In addition, the illuminator 124 typically includes various other components such as a spot generator 130 and a condenser 132. For example, spot generator 130 may be, but is not limited to, a refractive or diffraction grating, a segment mirror array, a waveguide, or the like. In this way, the beam 110 impinging on the array of individually controllable elements 104 will have the desired zoom, spot size, cross-sectional uniformity and intensity distribution.

  In other embodiments, when the apparatus 100 is operating in other modes, the illuminator 124 may have radial ranges outside and / or inside the intensity distribution in the beam 122 (commonly referred to as σ outer and σ inner, respectively). ) Includes an adjustment device 128 for setting. In addition, the lighting device 124 generally includes various other components. In this example, the element 130 may be an integrator 130 and the element 132 may be a capacitor 132 as compared to the previous example. In this way, the beam 110 impinging on the array of individually controllable elements 104 has the desired uniformity and intensity distribution in the cross section.

  Note that with reference to FIG. 1, the source 112 is in the housing of the lithographic projection apparatus 100. In an alternative embodiment, the source 112 may be remote from the lithographic projection apparatus 100. In this case, the radiation beam 122 is directed towards the device 100 (eg, using a suitable guide mirror). It should be understood that both of these cases are intended within the scope of the present invention.

  The beam 110 is then guided using the guidance device 118 and then captures the array 104 of individually controllable elements. Reflected by the array of individually controllable elements 104, the beam 110 passes through the projection system 108, which focuses the beam 110 onto the target portion 120 of the substrate 114.

  Using the positioning device 116 (and possibly the interferometric device 134 on the base plate 136 that receives the interfering beam 138 via the beam splitter 140), the substrate table 106 is moved to another path in the path of the beam 110. The target portion 120 is positioned. If used, a positioning device (not shown) for the array of individually controllable elements 104 is used to modify the position of the array of individually controllable elements 104 relative to the path of the beam 110, for example, during a scan. To do. In general, the movement of the object table 106 is realized using a long stroke module (coarse positioning) and a short stroke module (fine positioning), which are not explicitly shown in FIG. A similar system can be used to position an array 104 of individually controllable elements. The beam 110 can alternatively / additionally move, while the object table 106 and / or the array 104 of individually controllable elements 104 have a fixed position and the required relative movement. It will also be appreciated that it can be provided.

  In an alternative configuration of that embodiment, the substrate table 106 is fixed and the substrate 114 can move over the substrate table 106. In this case, the substrate table 106 is provided with a number of openings in the flat top surface and gas is supplied through the openings to provide a gas cushion that can support the substrate 114. This is conventionally referred to as an air bearing configuration. The substrate 114 is moved over the substrate table 106 using one or more actuators (not shown) that can position the substrate 114 relative to the path of the beam 110. Alternatively, the substrate 114 is moved over the substrate table 106 by selectively starting and stopping gas passages through the openings.

  Although lithographic apparatus 100 according to the present invention is described herein as for exposing a resist on a substrate, the present invention is not limited to this use, and apparatus 100 is used for resistless lithography. It will also be appreciated that the patterning beam 110 can be used to project to:

  The illustrated apparatus 100 can be used in multiple modes.

  1. Step mode: The entire pattern on the array of individually controllable elements 104 is projected once onto the target portion 120 (ie, a single “flash”). The substrate table 106 is then moved to different positions for different target portions 120 in the x and / or y direction and illuminated by the patterning beam 110.

  2. Scan mode: Similar to step mode except that a given target portion 120 is not exposed with a single “flash”. Instead, the array of individually controllable elements 104 is moved at a velocity v in a given direction (so-called “scan direction”, eg, the y direction) so that the patterned beam 110 is an array of individually controllable elements. 104 is scanned. In parallel with this, the substrate table 106 is moved simultaneously at the speed V = Mv in the same direction or in the opposite direction. Here, M is the magnification of the projection system 108. In this way, a relatively wide target portion 120 can be exposed without compromising resolution.

  3. Pulsed mode: The array of individually controllable elements 104 is essentially kept stationary and the entire pattern is projected onto the target portion 120 of the substrate 114 using the pulsed radiation system 102. The substrate table 106 is basically moved at a substantially constant speed, so that the patterning beam 110 is scanned linearly across the substrate 106. The pattern on the array of individually controllable elements 104 is updated as needed during the pulses of the radiation system 102 so that the continuous target portion 120 is exposed to the required location on the substrate 114. Time is decided. Accordingly, the patterning beam 110 is scanned across the substrate 114 and the entire pattern can be exposed to a band of the substrate 114. This process is repeated until the entire substrate 114 is exposed line by line.

  4). Continuous scan mode: When a substantially constant radiation system 102 is used and the pattern on the array of individually controllable elements 104 is scanned by the patterning beam 110 across the substrate 114 to expose the substrate. It is similar to the pulse mode except that it is updated.

  In these first four modes, “partially coherent imaging” is generally done for integrated circuit formation. Using this imaging, each element in the array of individually controllable elements has a unique slope. The array is arranged on the object plane, and the substrate is positioned on the imaging plane of the imaging projection optics. Various illumination modes such as annular, general, quadrupole, dipole, etc. may be applied. Again different configurations such as phase-step mirror, application of large tilt, mirror shape (butterfly, H-shape), etc. may be used to increase the “negative black” value.

  5. Pixel grid imaging mode: This pattern formed on the substrate 114 is realized by subsequent exposure of the spots formed by the spot generator 130 and directed onto the array 104. The exposed spots have approximately the same shape. The spots are printed on the substrate 114 almost in a lattice. In one embodiment, the spot size is larger than the pitch of the printed pixel grid, but smaller than the exposure spot grid. By changing the intensity of the printed spot, a pattern is realized. The intensity distribution on the spot surface can be changed between exposure flashes. In this mode, commonly used for forming flat panel displays, the individually controllable elements can be grouped in the upper pixel. One upper pixel adjusts the light of one spot at the substrate. The upper pixel is imaged at the entrance of the MLA within the pupil exit of each spot to be printed. The spot shape may be affected by the illuminator through the use of spot definition elements (eg, spot generators), blazing function zooms, and the like.

  Combinations and / or variations thereof or the use of entirely different modes may also be utilized when using the aforementioned modes.

  FIG. 2 depicts a lithographic apparatus 200 according to one embodiment of the invention. For example, apparatus 200 is particularly useful for manufacturing flat panel displays using the pixel grid imaging mode described above.

  As shown in FIG. 2, the projection system 208 includes a beam expander having two lenses 250 and 252. The first lens 250 is positioned to receive the conditioned radiation beam 210 and is focused through the aperture in the aperture stop 254. In one embodiment, lens 256 is located within the aperture. The radiation beam 110 then diverges and is focused by a second lens 252 (eg, a field lens).

  Projection system 208 includes a lens array 258 (eg, a microlens array (MLA)) that is arranged to receive diverged and conditioned radiation 110. Different portions of the radiation beam 110 tuned corresponding to one or more of the individually controllable elements of the pattern or contrast device 204 pass through respective lenses 260 in the MLA 258. Each lens 260 focuses a respective portion of the radiation beam 110 adjusted to a point placed on the substrate 214. In this way, an array of radiation spots 262 is exposed on the substrate 214. Although only eight lenses 260 are shown, the MLA 258 can include thousands of lenses, the number of which can be individually controlled within an array of individually controllable elements used as a pattern or contrast device 204. This also applies to the number of possible elements.

  FIG. 3 schematically illustrates how a pattern is generated on a substrate 314 according to one embodiment of the present invention. For example, this embodiment may be done using pixel grid imaging.

  A black circle 362 shows a spot recently projected on the substrate 314 by the MLA in the projection system, for example in the projection system shown in FIG. The substrate 314 is moved in the Y direction relative to the projection system as a series of exposures are made on the substrate 314.

  A white circle 364 indicates a spot that has been previously exposed on the substrate 314. As shown, each spot 362 projected onto the substrate 314 using a lens array in the projection system exposes a row 366 of spot exposure portions 362/364 on the substrate 314. The overall pattern on the substrate 314 is generated by the sum of all rows 366 of the spot exposure unit 364 exposed by each of the spots 362. Such an arrangement as described above is commonly referred to as “pixel grid imaging”.

  It can be seen that the array of radiation spots 362 is arranged at an angle θ relative to the substrate 314 (ie, when the ends of the substrate 314 are placed parallel to the X and Y directions). This is done so that when the substrate 314 is moved in the scan direction (eg, the Y direction), each radiation spot 362 passes over a different area of the substrate 314 so that the entire substrate is driven by an array of radiation spots. Allows to be covered. It will be appreciated that in FIG. 3 the angle θ is exaggerated for ease of illustration.

  Although a 5 × 5 spot is shown between two adjacent spots in the MLA, it should be understood that up to about 100 × 100 spots can be used in one embodiment.

  In one embodiment, the spot grid at the substrate is about half the minimum line width to be printed (eg, from about 0.1 μm to several μm), while the spot pitch at the MLA is about 100 μm. To a few hundred μm.

  FIG. 4 schematically illustrates how the entire flat panel display substrate 414 is exposed in a single scan by using multiple optical engines according to one embodiment of the present invention. ing. Eight arrays of radiation spots 468 are caused by eight optical engines (not shown) so that the end of one array of radiation spots slightly overlaps the end of the array of adjacent radiation spots (eg, scan direction). Y) In this manner, the “checkerboard pattern” configuration is arranged in two rows 470 and 472 and generated. In this example, a single band of radiation extends across the width of the substrate 414 so that the entire substrate can be exposed in a single scan. It will be appreciated that any suitable number of optical engines may be used.

  In one embodiment, each optical engine can include a separate illumination system, patterning device, and / or projection system, as described above. However, it should be understood that two or more optical engines can share at least a portion of one or more of the illumination system, patterning device, and projection system.

  5A, 5B and 5C show different arrangements of individually controllable elements according to one embodiment of the present invention.

  FIG. 5A shows that the slope of the individually controllable element 20 is adjusted to a path difference of λ / 2 (λ divided by 2, where λ = the wavelength of light used), thus resulting in zero reflection intensity. .

  FIG. 5B shows that the arrangement of individually controllable elements 20 is adjusted to a path difference of λ / 2.

  FIG. 5C shows that both mirror tilt and placement are adjusted. In this embodiment, a combination of both individually controllable element tilt and placement results in a greater desired range of contrast than a single adjustment, and the contrast can be adjusted more linearly.

  FIG. 6 shows the range of contrast obtained with different adjustments for the individually controllable element 20 according to one embodiment of the invention. The inclination adjustment (following trajectory 1) of the individually controllable element becomes a limited contrast range like the adjustment of only the position of the individually controllable element 20 (following trajectory 2). However, when both the tilt and the position of the mirror 20 are adjusted (following trajectory 4), a greater range of contrast can be achieved. Further, the simultaneous adjustment of the inclination and the position is a substantially linear contrast adjustment.

  FIG. 7 shows a pattern forming apparatus PD according to an embodiment of the present invention. The individually controllable elements 20 forming the patterning device PD are controlled / adjusted by a control / adjustment device 25 which ensures that the tilt and position of the individually controllable elements 20 are adjusted linearly at the same time. For example, see the tracing track 4 in FIG.

  In one embodiment, the adjustment device 25 has a tilt adjustment range of at least an angle range of 3λ / 2L radians, where L is the length of the individually controllable element and λ is the wavelength of the radiation beam. In other embodiments, the adjustment device 25 also linearly adjusts the linear position within the range of the radiation beam wavelength λ, and adjusts the slope over an angular range of λ / L radians.

  In one embodiment, the adjustment device 25 is controlled by a single control signal, thereby maximizing the range of intensity generated by each of the individually controllable elements.

  8, 9, 10 and 11 illustrate various aspects of individually controllable elements according to one embodiment of the present invention.

  FIG. 8 shows the tilt and position adjustment of the individually controllable element 20 using two electrodes 22, 23 on either side of the hinge 21 that bisects the individually controllable element 20. Each electrode 22, 23 is operable over a range of values, i.e. each electrode can provide multiple shades of gray. For example, if both electrodes are operable over a range of 1 to 100 and both electrodes are moved at 50 (as shown in FIG. 5B), the position of individually controllable element 20 will change. In other embodiments, if one electrode is moved at 50 and the other at 0, a tilt (as shown in FIG. 5A) will result. In other embodiments, moving one electrode at 100 and the other at 50 will change both the position and tilt of the individually controllable element 20 (as shown in FIG. 5C).

  In one embodiment, before using the electrode shown in FIG. 8 for exposure of the substrate W, the results stored in the storage of the optical sensor and the controller 25 (FIG. 7) are used. Use is calibrated.

  FIG. 9 shows an example individually controllable element 20 when one or more individually controllable elements 20 are not perfectly flat. For example, it is a case of a cup shape as shown in FIG. The edges of the individually controllable elements are often rounded towards the incident beam, referred to as so-called “cupping”. This is caused by distortion in the upper layer of the individually controllable element as a result of the processing of the individually controllable element. As a result, the reflection from the target individually controllable element 20 changes. As a compensation for this, the position of the individually controllable element 20 is adjusted.

  FIG. 10 shows an alternative embodiment to the embodiment shown in FIG. 8, where an additional electrode 24 is used. The electrode draws individually controllable elements 20 to compensate for cupping. Due to the rigidity of the hinge 21, it may be difficult to adjust the position of the individually controllable element.

  FIG. 11 shows an embodiment in which the stiffness in the direction of the hinge 21 may be reduced by cutting away the portion of the hinge.

  In one embodiment, as a result of a certain degree of cupping, the position of the individually controllable element needs to be adjusted, the amount of which is stored in the controller 25 and is therefore an appropriate value if necessary. May be applied. Furthermore, the amount of cupping may be varied by the inclination of the individually controllable elements. The amount by which cupping varies with tilt is also calibrated and stored in controller 25.

CONCLUSION While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only and not limitation. It will be apparent to those skilled in the art that various modifications, in shape and detail, can be made without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should not be limited by any of the above-described exemplary embodiments, but should be limited only by the appended claims and their equivalents.

  It will be understood that portions of the detailed description and portions that are not summaries and abstracts are intended to be used for interpreting the scope of the claims. The summary and abstract of the specification may explain one or more, but not all of the exemplary embodiments of the invention contemplated by the inventors, and thus more or less of the invention and the appended claims. It is not intended to limit the scope.

1 shows a lithographic apparatus according to one embodiment of the invention. FIG. 1 depicts a lithographic apparatus that can be used, for example, in the manufacture of flat panel displays, according to one embodiment of the invention. FIG. 3 shows a pattern transfer mode to a substrate using a lithographic apparatus according to an embodiment of the invention. FIG. 2 illustrates an optical engine arrangement for exposing a pattern on a substrate used, for example, in flat panel display manufacturing, according to one embodiment of the present invention. FIG. 4 shows different arrangements of individually controllable elements according to one embodiment of the invention. FIG. 4 shows different arrangements of individually controllable elements according to one embodiment of the invention. FIG. 4 shows different arrangements of individually controllable elements according to one embodiment of the invention. FIG. 4 shows the contrast range provided by different adjustments of individually controllable elements according to one embodiment of the invention. 1 is a diagram illustrating a pattern forming apparatus according to an embodiment of the present invention. FIG. 6 illustrates various aspects of individually controllable elements according to one embodiment of the present invention. FIG. 6 illustrates various aspects of individually controllable elements according to one embodiment of the present invention. FIG. 6 illustrates various aspects of individually controllable elements according to one embodiment of the present invention. FIG. 6 illustrates various aspects of individually controllable elements according to one embodiment of the present invention.

Claims (20)

An illumination system for adjusting the radiation beam;
A patterning array comprising individually controllable elements for adjusting the radiation beam and adjustment devices for simultaneously adjusting the linear position and tilt of each of the individually controllable elements;
A lithographic apparatus comprising: a projection system that projects the adjusted beam onto a target portion of a substrate;   The lithographic apparatus according to claim 1, wherein the linear position of the individually controllable elements is adjustable in a direction perpendicular to a plane on which the array of individually controllable elements is placed.   The lithographic apparatus according to claim 1, wherein the adjustment device has a linear alignment range of at least a wavelength λ of the radiation beam.   The adjustment device has a tilt adjustment range of an angle of at least 3λ / 2L radians, where L is the length of the individually controllable element and λ is the wavelength of the radiation beam. The lithographic apparatus described.   A lithographic apparatus according to claim 1, wherein the adjusting device simultaneously adjusts the linear position linearly to the range of the wavelength λ of the radiation beam and adjusts the tilt over an angular range of λ / L radians. .   A lithographic apparatus according to claim 1, wherein a single control signal controls the conditioning device, whereby the range of intensity generated by each of the individually controllable elements is maximized. Each of the individually controllable elements includes a hinge line located in its plane, the hinge line dividing the individually controllable element into two parts;
The device further comprises two electrodes, each electrode being arranged to adjust the slope of the individually controllable element over a range of at least three values, and each electrode being a different part of the individually controllable element The lithographic apparatus according to claim 1, wherein the lithographic apparatus is located opposite the first side.   A lithographic apparatus according to claim 7, wherein both of the electrodes are located opposite the same face of the individually controllable element.   Storing a compensation value applied to the adjusting device to compensate for the respective non-planar degree of the individually controllable element by changing the linear position of the individually controllable element using the electrode; The lithographic apparatus according to claim 7, further comprising a memory.   The lithographic apparatus according to claim 1, wherein the at least one individually controllable element includes a hinge line in its plane, and a portion of the individually controllable element is removed along the hinge line. The individually controllable element comprises a hinge in its plane;
The lithographic apparatus according to claim 1, wherein the lithographic apparatus further comprises an electrode for controlling the position of the hinge.   Further comprising two electrodes, wherein one of said electrodes is arranged to adjust the slope of said individually controllable element over a range of at least three values, each electrode being a different part of said individually controllable element The lithographic apparatus according to claim 1, wherein the lithographic apparatus is disposed opposite the lithographic apparatus. Each of the individually controllable elements includes a hinge line in its plane, the hinge line dividing the individually controllable element into two parts;
The apparatus further comprises two electrodes, each electrode being arranged to adjust the slope of the individually controllable element over a range of at least three values, each electrode being a different part of the individually controllable element A lithographic apparatus according to claim 1, wherein Individually controllable elements for adjusting the radiation beam;
A patterning array including an adjustment device configured to simultaneously adjust the linear position and tilt of each of the individually controllable elements. Each of the individually controllable elements includes a hinge line in its plane, the hinge line dividing the individually controllable element into two parts;
The apparatus further comprises two electrodes, each of the two electrodes adjusting the slope of the individually controllable element over a range of at least three values, opposite the different parts of the individually controllable element. The patterning array of claim 14, wherein the patterning array is disposed.   15. The patterning array of claim 14, wherein at least one of the individually controllable elements includes a hinge line in its plane, and a portion of the individually controllable element is removed along the hinge line. . Adjusting the radiation beam using an array of individually controllable elements;
Projecting the conditioned beam of radiation onto a substrate;
A device manufacturing method comprising simultaneously adjusting a position and an inclination of each of the individually controllable elements.   The method of claim 17, wherein the position and tilt of each of the individually controllable elements is adjusted using two electrodes, each of the two electrodes being moved over a range of values.   An integrated circuit manufactured according to the method of claim 17.   A flat panel display manufactured according to the method of claim 17.