JP2006233307A5 - - Google Patents

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Publication number
JP2006233307A5
JP2006233307A5 JP2005052982A JP2005052982A JP2006233307A5 JP 2006233307 A5 JP2006233307 A5 JP 2006233307A5 JP 2005052982 A JP2005052982 A JP 2005052982A JP 2005052982 A JP2005052982 A JP 2005052982A JP 2006233307 A5 JP2006233307 A5 JP 2006233307A5
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JP
Japan
Prior art keywords
electroless plating
inert material
plating film
forming
compound containing
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Pending
Application number
JP2005052982A
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Japanese (ja)
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JP2006233307A (en
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Priority to JP2005052982A priority Critical patent/JP2006233307A/en
Priority claimed from JP2005052982A external-priority patent/JP2006233307A/en
Publication of JP2006233307A publication Critical patent/JP2006233307A/en
Publication of JP2006233307A5 publication Critical patent/JP2006233307A5/ja
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Claims (8)

不活性素材の表面に固体を接触させて付着させる感受性化処理方法であって、
前記固体は、２価のスズを含む化合物を含有することを特徴とする感受性化処理方法。 A sensitizing treatment method in which a solid is brought into contact with and attached to the surface of an inert material,
The said solid contains the compound containing bivalent tin, The sensitization processing method characterized by the above-mentioned. 前記２価のスズを含む化合物は、ＳｎＯ、ＳｎＣ2Ｏ4、ＳｎＣｌ2・２Ｈ2Ｏ及びＳｎＳＯ4からなる群から選択される、請求項１に記載の感受性化処理方法。 The sensitizing treatment method according to claim 1, wherein the compound containing divalent tin is selected from the group consisting of SnO, SnC 2 O 4 , SnCl 2 .2H 2 O, and SnSO 4 . 前記不活性素材は、ガラス基板又はアルミナ系セラミックス基板である、請求項１又は２に記載の感受性化処理方法。 The sensitizing treatment method according to claim 1, wherein the inert material is a glass substrate or an alumina-based ceramic substrate. 不活性素材の表面に２価のスズを含む化合物を含有する固体を接触させて付着させる感受性化処理工程と、
無電解めっき液に、不活性素材を浸漬して、当該不活性素材の表面に無電解めっき皮膜を形成する皮膜形成工程とを含むことを特徴とする無電解めっき皮膜の形成方法。 A sensitizing treatment step in which a solid containing a compound containing divalent tin is brought into contact with and attached to the surface of the inert material;
A method of forming an electroless plating film, comprising: a film forming step of immersing an inert material in an electroless plating solution to form an electroless plating film on the surface of the inert material. 不活性素材の表面の一定領域に２価のスズを含む化合物を含有する固体を付着させる感受性化処理工程と、
無電解めっき液に、不活性素材を浸漬して、当該不活性素材の表面の一定領域に無電解めっき皮膜を形成する皮膜形成工程とを含むことを特徴とする無電解めっき皮膜の形成方法。 A sensitizing treatment step of adhering a solid containing a compound containing divalent tin to a certain region of the surface of the inert material;
A method of forming an electroless plating film, comprising: a film forming step of immersing an inert material in an electroless plating solution to form an electroless plating film in a certain region of the surface of the inert material. 不活性素材の表面の一定領域に２価のスズを含む化合物を含有する固体を塗着させる感受性化処理工程と、
無電解めっき液に、不活性素材を浸漬して、当該不活性素材の表面の一定領域に無電解めっき皮膜を形成する皮膜形成工程とを含むことを特徴とする無電解めっき皮膜の形成方法。 A sensitizing treatment step of applying a solid containing a compound containing divalent tin to a certain region of the surface of the inert material;
A method of forming an electroless plating film, comprising: a film forming step of immersing an inert material in an electroless plating solution to form an electroless plating film in a certain region of the surface of the inert material. さらに、触媒を含有する水溶液である無電解めっき用触媒液で、感受性化処理が施された不活性素材を処理して触媒を付着させる活性化処理工程とを含む、請求項４〜６のいずれかに記載の無電解めっき皮膜の形成方法。 And an activation treatment step of treating the inactive material subjected to the sensitization treatment with the catalyst solution for electroless plating, which is an aqueous solution containing a catalyst, and depositing the catalyst. A method for forming an electroless plating film according to claim 1. 前記触媒は、パラジウムである、請求項７に記載の無電解めっき皮膜の形成方法。 The method for forming an electroless plating film according to claim 7 , wherein the catalyst is palladium.
JP2005052982A 2005-02-28 2005-02-28 Sensitizing method and method for forming electroless plating film using the same Pending JP2006233307A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005052982A JP2006233307A (en) 2005-02-28 2005-02-28 Sensitizing method and method for forming electroless plating film using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005052982A JP2006233307A (en) 2005-02-28 2005-02-28 Sensitizing method and method for forming electroless plating film using the same

Publications (2)

Publication Number Publication Date
JP2006233307A JP2006233307A (en) 2006-09-07
JP2006233307A5 true JP2006233307A5 (en) 2006-12-14

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JP2005052982A Pending JP2006233307A (en) 2005-02-28 2005-02-28 Sensitizing method and method for forming electroless plating film using the same

Country Status (1)

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JP (1) JP2006233307A (en)

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