JP2006233180A - Thermoplastic resin composition - Google Patents
Thermoplastic resin composition Download PDFInfo
- Publication number
- JP2006233180A JP2006233180A JP2005349433A JP2005349433A JP2006233180A JP 2006233180 A JP2006233180 A JP 2006233180A JP 2005349433 A JP2005349433 A JP 2005349433A JP 2005349433 A JP2005349433 A JP 2005349433A JP 2006233180 A JP2006233180 A JP 2006233180A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- aromatic amide
- group
- resin composition
- block copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 63
- 239000011342 resin composition Substances 0.000 title claims abstract description 46
- 150000008430 aromatic amides Chemical class 0.000 claims abstract description 67
- 229920001400 block copolymer Polymers 0.000 claims abstract description 52
- 229920000728 polyester Polymers 0.000 claims abstract description 17
- 229920001577 copolymer Polymers 0.000 claims abstract description 15
- 239000004417 polycarbonate Substances 0.000 claims abstract description 12
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 12
- 229920000098 polyolefin Polymers 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 125000005702 oxyalkylene group Chemical group 0.000 claims description 7
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical group O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 claims description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 5
- 229920000412 polyarylene Polymers 0.000 claims description 5
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 239000012766 organic filler Substances 0.000 claims description 4
- 229920006122 polyamide resin Polymers 0.000 claims description 4
- 229920006324 polyoxymethylene Polymers 0.000 claims description 4
- 229930182556 Polyacetal Natural products 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 229920001610 polycaprolactone Polymers 0.000 claims description 2
- -1 poly(oxyalkylene) Polymers 0.000 abstract description 49
- 125000001931 aliphatic group Chemical group 0.000 abstract description 5
- 150000001875 compounds Chemical class 0.000 description 45
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 38
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- 239000010408 film Substances 0.000 description 22
- 230000001588 bifunctional effect Effects 0.000 description 20
- 230000015572 biosynthetic process Effects 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- 229920000642 polymer Polymers 0.000 description 20
- 238000003786 synthesis reaction Methods 0.000 description 20
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 18
- 229920001971 elastomer Polymers 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 13
- 238000002156 mixing Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 239000005060 rubber Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 239000008188 pellet Substances 0.000 description 8
- 239000004734 Polyphenylene sulfide Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920000069 polyphenylene sulfide Polymers 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 0 C**CCc1ccc(C)cc1 Chemical compound C**CCc1ccc(C)cc1 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 6
- 229920001778 nylon Polymers 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 150000001408 amides Chemical group 0.000 description 4
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical group COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000012456 homogeneous solution Substances 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000000967 suction filtration Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 229920012196 Polyoxymethylene Copolymer Polymers 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 125000006353 oxyethylene group Chemical group 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 3
- KCVHYRQVGPQSRV-UHFFFAOYSA-N 1-n,4-n-bis(4-hydroxyphenyl)benzene-1,4-dicarboxamide Chemical compound C1=CC(O)=CC=C1NC(=O)C1=CC=C(C(=O)NC=2C=CC(O)=CC=2)C=C1 KCVHYRQVGPQSRV-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical group COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- 229920005177 Duracon® POM Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Chemical group 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Chemical group 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 2
- BLFLLBZGZJTVJG-UHFFFAOYSA-N benzocaine Chemical compound CCOC(=O)C1=CC=C(N)C=C1 BLFLLBZGZJTVJG-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical group COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 2
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 2
- FHESUNXRPBHDQM-UHFFFAOYSA-N diphenyl benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OC=2C=CC=CC=2)=CC=1C(=O)OC1=CC=CC=C1 FHESUNXRPBHDQM-UHFFFAOYSA-N 0.000 description 2
- HPGJOUYGWKFYQW-UHFFFAOYSA-N diphenyl benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OC=2C=CC=CC=2)C=CC=1C(=O)OC1=CC=CC=C1 HPGJOUYGWKFYQW-UHFFFAOYSA-N 0.000 description 2
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical group O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical group CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- CTSLXHKWHWQRSH-UHFFFAOYSA-N oxalyl chloride Chemical compound ClC(=O)C(Cl)=O CTSLXHKWHWQRSH-UHFFFAOYSA-N 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- YVOFTMXWTWHRBH-UHFFFAOYSA-N pentanedioyl dichloride Chemical compound ClC(=O)CCCC(Cl)=O YVOFTMXWTWHRBH-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 229920006346 thermoplastic polyester elastomer Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- ORTVZLZNOYNASJ-UPHRSURJSA-N (z)-but-2-ene-1,4-diol Chemical compound OC\C=C/CO ORTVZLZNOYNASJ-UPHRSURJSA-N 0.000 description 1
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical group O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- CSLLAXPANGSRKM-UHFFFAOYSA-N 1,4-bis(7-oxoazepan-2-yl)butane-1,4-dione Chemical compound C1CCCC(=O)NC1C(=O)CCC(=O)C1CCCCC(=O)N1 CSLLAXPANGSRKM-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- QYKFBCQOEBIMNS-UHFFFAOYSA-N 1-N,3-N-bis[4-(2-hydroxyethylcarbamoyl)phenyl]benzene-1,3-dicarboxamide Chemical compound OCCNC(=O)C1=CC=C(C=C1)NC(=O)C1=CC(=CC=C1)C(=O)NC1=CC=C(C=C1)C(NCCO)=O QYKFBCQOEBIMNS-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- ROPWKTMJGAJOQG-UHFFFAOYSA-N 2,5,5-triphenylcyclohexa-1,3-diene Chemical group C1(=CC=CC=C1)C1(CC=C(C=C1)C1=CC=CC=C1)C1=CC=CC=C1 ROPWKTMJGAJOQG-UHFFFAOYSA-N 0.000 description 1
- ZWNMRZQYWRLGMM-UHFFFAOYSA-N 2,5-dimethylhexane-2,5-diol Chemical compound CC(C)(O)CCC(C)(C)O ZWNMRZQYWRLGMM-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- SEFYJVFBMNOLBK-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCC1CO1 SEFYJVFBMNOLBK-UHFFFAOYSA-N 0.000 description 1
- IYBOGQYZTIIPNI-UHFFFAOYSA-N 2-methylhexano-6-lactone Chemical compound CC1CCCCOC1=O IYBOGQYZTIIPNI-UHFFFAOYSA-N 0.000 description 1
- SDQROPCSKIYYAV-UHFFFAOYSA-N 2-methyloctane-1,8-diol Chemical compound OCC(C)CCCCCCO SDQROPCSKIYYAV-UHFFFAOYSA-N 0.000 description 1
- OOJRTGIXWIUBGG-UHFFFAOYSA-N 2-methylpropane-1,2,3-triol Chemical compound OCC(O)(C)CO OOJRTGIXWIUBGG-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明は耐熱性、剛性、耐衝撃性に優れる熱可塑性樹脂組成物に関するものである。 The present invention relates to a thermoplastic resin composition excellent in heat resistance, rigidity and impact resistance.
電子機器や、FA機器等は近年高性能化が進み、耐熱性、剛性、耐衝撃性に優れた材料の開発が求められている。 In recent years, electronic devices, FA devices, and the like have been improved in performance, and the development of materials excellent in heat resistance, rigidity, and impact resistance is required.
この様な状況下、耐熱性に優れた熱可塑性樹脂に柔軟性に富む熱可塑性エラストマーを特定量配合することにより、要求特性を満足する材料、成形体を得る方法が数多く提案されている。例えば、ポリアリーレンスルフィド樹脂は耐熱性、耐薬品性に優れたエンジニアリングプラスチックの一種であるが、伸びが小さく、耐衝撃性に劣ることが知られている。この問題を解決する目的で、ポリアリーレンスルフィド樹脂にポリエステル系エラストマーやポリアミド系エラストマー等を添加する方法が提案されている(例えば、特許文献1、2参照)。また、芳香族ポリエステル樹脂にポリエステル系エラストマーやポリアミド系エラストマーを配合することにより、耐熱性、剛性、耐衝撃性に優れた樹脂組成物を得る方法も提案されている(例えば特許文献3、4参照)。 Under such circumstances, many methods have been proposed for obtaining a material and a molded body satisfying the required characteristics by blending a specific amount of a flexible thermoplastic elastomer with a thermoplastic resin having excellent heat resistance. For example, polyarylene sulfide resin is a kind of engineering plastic having excellent heat resistance and chemical resistance, but is known to have low elongation and poor impact resistance. In order to solve this problem, a method of adding a polyester-based elastomer, a polyamide-based elastomer or the like to a polyarylene sulfide resin has been proposed (for example, see Patent Documents 1 and 2). There has also been proposed a method for obtaining a resin composition having excellent heat resistance, rigidity and impact resistance by blending a polyester elastomer or polyamide elastomer with an aromatic polyester resin (see, for example, Patent Documents 3 and 4). ).
しかしながら、特許文献1〜4に提案の方法では、成形加工温度が高いために熱可塑性エラストマーの分解が生じ、成形加工時に蒸発ガス、分解ガスが発生する等の問題があった。また、得られる樹脂組成物の耐衝撃性改良効果は小さいばかりでなく、成形品の外観不良を招く等の問題を有していた。 However, the methods proposed in Patent Documents 1 to 4 have a problem that the thermoplastic elastomer is decomposed due to a high molding processing temperature, and evaporative gas and decomposition gas are generated during the molding processing. Moreover, the resin composition obtained has not only a small impact resistance improvement effect, but also has problems such as inferior appearance of the molded product.
そこで、本発明の目的は、成形加工時の諸問題を解決し、耐熱性、剛性、耐衝撃性に優れた熱可塑性樹脂組成物を提供することである。 Therefore, an object of the present invention is to solve various problems during molding and provide a thermoplastic resin composition having excellent heat resistance, rigidity and impact resistance.
本発明者らは、上記課題を達成するため鋭意検討した結果、ハードセグメントに特定の芳香族アミド単位を用いた芳香族アミドブロック共重合体及び熱可塑性樹脂からなる組成物が、耐熱性、剛性、耐衝撃性に優れることを見出し、本発明を完成するに至った。 As a result of intensive studies to achieve the above-mentioned problems, the present inventors have found that a composition comprising an aromatic amide block copolymer using a specific aromatic amide unit in a hard segment and a thermoplastic resin has heat resistance, rigidity, The present inventors have found that it has excellent impact resistance and have completed the present invention.
すなわち、本発明は、下記一般式(1)で示される芳香族アミド単位と、ポリエステル、脂肪族ポリ(オキシアルキレン)、ポリカーボネート、ポリオレフィン、ポリオルガノシロキサン、ポリジエンまたはこれらの共重合体よりなる群から選ばれる1種以上の単位からなる芳香族アミドブロック共重合体(A)99.9〜0.1重量%、熱可塑性樹脂(B)0.1〜99.9重量%からなる熱可塑性樹脂組成物に関するものである。 That is, the present invention is from the group consisting of an aromatic amide unit represented by the following general formula (1) and a polyester, aliphatic poly (oxyalkylene), polycarbonate, polyolefin, polyorganosiloxane, polydiene or a copolymer thereof. A thermoplastic resin composition comprising 99.9 to 0.1% by weight of an aromatic amide block copolymer (A) composed of one or more selected units and 0.1 to 99.9% by weight of a thermoplastic resin (B). It is about things.
(ここで、R1およびR2は、それぞれ独立して炭素数1〜20の二価のオキシアルキレン基、アルキレンカルバモイル基、またはアリーレンカルバモイル基を示す。)
以下に本発明を詳細に説明する。
(Here, R 1 and R 2 each independently represent a divalent oxyalkylene group having 1 to 20 carbon atoms, an alkylenecarbamoyl group, or an arylenecarbamoyl group.)
The present invention is described in detail below.
本発明の熱可塑性樹脂組成物は、上記一般式(1)で示される芳香族アミド単位と、ポリエステル、脂肪族ポリ(オキシアルキレン)、ポリカーボネート、ポリオレフィン、ポリオルガノシロキサン、ポリジエンまたはこれらの共重合体よりなる群から選ばれる1種以上の単位からなる芳香族アミドブロック共重合体と熱可塑性樹脂よりなる樹脂組成物である。 The thermoplastic resin composition of the present invention comprises an aromatic amide unit represented by the above general formula (1), polyester, aliphatic poly (oxyalkylene), polycarbonate, polyolefin, polyorganosiloxane, polydiene or a copolymer thereof. A resin composition comprising an aromatic amide block copolymer composed of one or more units selected from the group consisting of a thermoplastic resin.
ここで、本発明の熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体を構成する一般式(1)で示される芳香族アミド単位中のR1およびR2は、それぞれ独立して炭素数1〜20の二価のオキシアルキレン基、アルキレンカルバモイル基、またはアリーレンカルバモイル基であり、R1、R2はそれぞれ同一でも異なっていてもよく、また直鎖状又は分岐状であってもよい。 Here, R 1 and R 2 in the aromatic amide unit represented by the general formula (1) constituting the aromatic amide block copolymer used in the thermoplastic resin composition of the present invention are each independently a carbon number. 1 to 20 divalent oxyalkylene group, alkylenecarbamoyl group, or arylenecarbamoyl group, and R 1 and R 2 may be the same or different, and may be linear or branched.
該オキシアルキレン基としては、例えばオキシエチレン基、オキシトリメチレン基、オキシテトラメチレン基、オキシペンタメチレン基、オキシヘキサメチレン基等の無置換オキシアルキレン基またはこれらにメチル基、エチル基等のアルキル置換基もしくはフェニル基等のアリール置換基が1個以上結合したものが挙げられる。さらには、上記の無置換オキシアルキレン基単位やアルキルまたはアリール置換オキシアルキレン基単位が任意に2個以上結合したものであっても良く、これらの1種または2種以上が使用される。中でも、オキシエチレン基、オキシプロピレン基が好ましい。なお、これらオキシアルキレン基中の酸素原子は、一般式(1)において直接ベンゼン環に結合することが好ましい。 Examples of the oxyalkylene group include unsubstituted oxyalkylene groups such as oxyethylene group, oxytrimethylene group, oxytetramethylene group, oxypentamethylene group and oxyhexamethylene group, or alkyl substitution such as methyl group and ethyl group. Group or one or more aryl substituents such as phenyl group bonded thereto. Furthermore, two or more of the above unsubstituted oxyalkylene group units and alkyl or aryl-substituted oxyalkylene group units may be bonded together, and one or more of these may be used. Of these, an oxyethylene group and an oxypropylene group are preferable. In addition, it is preferable that the oxygen atom in these oxyalkylene groups couple | bonds with a benzene ring directly in General formula (1).
該アルキレンカルバモイル基としては、例えばメチレンカルバモイル基、エチレンカルバモイル基、トリメチレンカルバモイル基、テトラメチレンカルバモイル基、ペンタメチレンカルバモイル基、2,2−ジメチルトリメチレンカルバモイル基、ネオペンチルカルバモイル基、ヘキサメチレンカルバモイル基、3−メチルペンタメチレンカルバモイル基、2−メチルヘプタメチレンカルバモイル基、ヘプタメチレンカルバモイル基、オクタメチレンカルバモイル基、ノナメチレンカルバモイル基、デカメチレンカルバモイル基、1,4−シクロヘキシレンカルバモイル基等を挙げることができ、これらの1種または2種以上が使用される。中でもエチレンカルバモイル基が好ましい。 Examples of the alkylenecarbamoyl group include a methylenecarbamoyl group, an ethylenecarbamoyl group, a trimethylenecarbamoyl group, a tetramethylenecarbamoyl group, a pentamethylenecarbamoyl group, a 2,2-dimethyltrimethylenecarbamoyl group, a neopentylcarbamoyl group, and a hexamethylenecarbamoyl group. , 3-methylpentamethylenecarbamoyl group, 2-methylheptamethylenecarbamoyl group, heptamethylenecarbamoyl group, octamethylenecarbamoyl group, nonamethylenecarbamoyl group, decamethylenecarbamoyl group, 1,4-cyclohexylenecarbamoyl group, etc. One or more of these can be used. Of these, an ethylenecarbamoyl group is preferable.
該アリーレンカルバモイル基としては、例えば2−ベンジルカルバモイル基、3−ベンジルカルバモイル基、4−ベンジルカルバモイル基、1,2−フェニレンカルバモイル基、1,3−フェニレンカルバモイル基、1,4−フェニレンカルバモイル基等を挙げることができ、これらの1種または2種以上が使用される。 Examples of the arylenecarbamoyl group include 2-benzylcarbamoyl group, 3-benzylcarbamoyl group, 4-benzylcarbamoyl group, 1,2-phenylenecarbamoyl group, 1,3-phenylenecarbamoyl group, 1,4-phenylenecarbamoyl group and the like. One or more of these may be used.
本発明の熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体を構成するポリエステル、脂肪族ポリ(オキシアルキレン)、ポリカーボネート、ポリオレフィン、ポリオルガノシロキサン、ポリジエンまたはこれらの共重合体よりなる群から選ばれる1種以上の単位とは、公知のものであれば特に制限はない。 Selected from the group consisting of polyester, aliphatic poly (oxyalkylene), polycarbonate, polyolefin, polyorganosiloxane, polydiene or copolymers thereof constituting the aromatic amide block copolymer used in the thermoplastic resin composition of the present invention The one or more units to be used are not particularly limited as long as they are known.
該ポリエステルは、例えばジカルボン酸あるいはジカルボン酸無水物と短鎖ポリオールを縮合重合することによって得ることができる。該ジカルボン酸あるいはジカルボン酸無水物成分としては、例えばコハク酸、グルタル酸、アジピン酸、アゼライン酸、セバシン酸、ドデカン酸、フタル酸、イソフタル酸、テトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、無水マレイン酸、フマル酸、イタコン酸等が挙げられ、これらの1種または2種以上が使用される。一方、該短鎖ポリオール成分としては、例えば脂肪族、脂環式、芳香族、置換脂肪族または複素環式のジヒドロキシ化合物;トリヒドロキシ化合物;テトラヒドロキシ化合物等を挙げることでき、具体的な短鎖ポリオール成分としては、例えば1,2−エタンジオール、1,3−プロパンジオール、1,4−ブタンジオール、ブテンジオール、3−メチル−1,5−ペンタンジオール、1,6−ヘキサンジオール、1,10−デカメチレンジオール、2,5−ジメチル−2,5−ヘキサンジオール、ネオペンチルグリコール、ジエチレングリコール、1,4−シクロヘキサンジメタノール、2−メチル−1,8−オクタンジオール、1,9−ノナンジオール、ビス(β−ヒドロキシエトキシ)ベンゼン、p−キシレンジオール、ジヒドロキシエチルテトラヒドロフタレート、トリメチロールプロパン、グリセリン、2−メチルプロパン−1,2,3−トリオール、1,2,6−ヘキサントリオール等が挙げられ、これらの1種または2種以上が使用される。 The polyester can be obtained, for example, by condensation polymerization of a dicarboxylic acid or dicarboxylic acid anhydride and a short chain polyol. Examples of the dicarboxylic acid or dicarboxylic anhydride component include succinic acid, glutaric acid, adipic acid, azelaic acid, sebacic acid, dodecanoic acid, phthalic acid, isophthalic acid, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, maleic anhydride , Fumaric acid, itaconic acid and the like, and one or more of these are used. On the other hand, examples of the short-chain polyol component include aliphatic, alicyclic, aromatic, substituted aliphatic or heterocyclic dihydroxy compounds; trihydroxy compounds; tetrahydroxy compounds, and the like. Examples of the polyol component include 1,2-ethanediol, 1,3-propanediol, 1,4-butanediol, butenediol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, 1, 10-decamethylenediol, 2,5-dimethyl-2,5-hexanediol, neopentyl glycol, diethylene glycol, 1,4-cyclohexanedimethanol, 2-methyl-1,8-octanediol, 1,9-nonanediol Bis (β-hydroxyethoxy) benzene, p-xylenediol, dihydroxy Chill tetrahydrophthalate, trimethylolpropane, glycerin, 2-methylpropane-1,2,3-triol, 1,2,6-hexane triol and the like, one or more of these can be used.
該ポリエステルを得る別の方法として、例えばβ−プロピオラクトン、ピバロラクトン、δ−バレロラクトン、β−メチル−δ−バレロラクトン、ε−カプロラクトン、メチル−ε−カプロラクトン、ジメチル−ε−カプロラクトン、トリメチル−ε−カプロラクトン等のラクトン化合物の1種または2種以上をヒドロキシ化合物と共に反応せしめる方法によることも可能である。 Other methods for obtaining the polyester include, for example, β-propiolactone, pivalolactone, δ-valerolactone, β-methyl-δ-valerolactone, ε-caprolactone, methyl-ε-caprolactone, dimethyl-ε-caprolactone, trimethyl- It is also possible to use a method in which one or more lactone compounds such as ε-caprolactone are reacted with a hydroxy compound.
該脂肪族ポリ(オキシアルキレン)としては、例えばポリ(オキシエチレン)、ポリ(オキシプロピレン)、ポリ(オキシテトラメチレン)、ポリ(オキシヘキサメチレン)、エチレンオキシドとプロピレンオキシドの共重合体、エチレンオキシドとテトラヒドロフランの共重合体、ポリ(プロピレンオキシド)のエチレンオキシド付加重合体などが挙げられ、これらの1種または2種以上が使用される。 Examples of the aliphatic poly (oxyalkylene) include poly (oxyethylene), poly (oxypropylene), poly (oxytetramethylene), poly (oxyhexamethylene), a copolymer of ethylene oxide and propylene oxide, and ethylene oxide and tetrahydrofuran. And an ethylene oxide addition polymer of poly (propylene oxide), and one or more of these are used.
該ポリカーボネートは、例えばジヒドロキシ化合物の1種または2種以上と、ジアリルカーボネート、ジアルキルカーボネート、エチレンカーボネート等のカーボネート化合物とのエステル交換法、あるいはカーボネート化合物の代わりにホスゲンを用いることによって得られ、具体的なポリカーボネートとしては、例えばポリ(1,6−ヘキサメチレンカーボネート)、ポリ(2,2’−ビス(4−ヒドロキシヘキシル)プロピレンカーボネート)等が挙げられる。 The polycarbonate is obtained by, for example, a transesterification method of one or more dihydroxy compounds with a carbonate compound such as diallyl carbonate, dialkyl carbonate, or ethylene carbonate, or by using phosgene instead of the carbonate compound. Examples of such polycarbonates include poly (1,6-hexamethylene carbonate) and poly (2,2′-bis (4-hydroxyhexyl) propylene carbonate).
また該ポリジエンとしては、例えばポリブタジエン、ポリイソプレン等が挙げられる。 Examples of the polydiene include polybutadiene and polyisoprene.
該ポリオレフィンとしては、例えばポリジエンを水素添加したポリオレフィン;エチレン、プロピレン、イソブチレン等のオレフィン類の単独重合体;ランダム共重合体;交互共重合体;ブロック共重合体等が挙げられる。 Examples of the polyolefin include polyolefins obtained by hydrogenating polydiene; homopolymers of olefins such as ethylene, propylene, and isobutylene; random copolymers; alternating copolymers; block copolymers.
該ポリオルガノシロキサンとしては、例えばポリ(ジメチルシロキサン)、ポリ(ジフェニルシロキサン)、ポリ(メチルフェニルシロキサン)等が挙げられる。 Examples of the polyorganosiloxane include poly (dimethylsiloxane), poly (diphenylsiloxane), poly (methylphenylsiloxane) and the like.
これらの中でも、耐熱性に優れた熱可塑性樹脂組成物が得られることから、芳香族アミドブロック共重合体が、一般式(1)で示される芳香族アミド単位とポリエステルからなることが好ましく、特に一般式(1)で示される芳香族アミド単位とポリ(ε−カプロラクトン)からなることが好ましい。 Among these, since a thermoplastic resin composition having excellent heat resistance can be obtained, the aromatic amide block copolymer is preferably composed of an aromatic amide unit represented by the general formula (1) and a polyester. It preferably comprises an aromatic amide unit represented by the general formula (1) and poly (ε-caprolactone).
本発明の熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体は、一般式(1)で示される芳香族アミド単位と、ポリエステル、脂肪族ポリ(オキシアルキレン)、ポリカーボネート、ポリオレフィン、ポリオルガノシロキサン、ポリジエンまたはこれらの共重合体よりなる群から選ばれる1種以上の単位が直接結合していても、他の化合物残基を含有していても良い。他の化合物残基としては、例えば二官能性ハライド化合物、二官能性イソシアネート化合物、二官能性カーボネート化合物、二官能性エステル化合物、二官能性アシルラクタム化合物、二官能性エポキシ化合物、二官能性テトラカルボン酸無水物等から誘導される化合物残基が挙げられ、これらの1種または2種以上を含有していても良い。 The aromatic amide block copolymer used in the thermoplastic resin composition of the present invention includes an aromatic amide unit represented by the general formula (1), polyester, aliphatic poly (oxyalkylene), polycarbonate, polyolefin, and polyorganosiloxane. One or more units selected from the group consisting of polydienes or copolymers thereof may be directly bonded or may contain other compound residues. Examples of other compound residues include bifunctional halide compounds, difunctional isocyanate compounds, difunctional carbonate compounds, bifunctional ester compounds, bifunctional acyllactam compounds, bifunctional epoxy compounds, and bifunctional tetra compounds. The compound residue derived from a carboxylic anhydride etc. is mentioned, These 1 type (s) or 2 or more types may be contained.
二官能性ハライド化合物から誘導される化合物残基としては、例えばシュウ酸ジクロライド、マロン酸ジクロライド、コハク酸ジクロライド、グルタル酸ジクロライド、アジピン酸ジクロライド、ピメリン酸ジクロライド、スベリン酸ジクロライド、アゼライン酸ジクロライド、セバシン酸ジクロライド、ドデカン酸ジクロライド、テレフタル酸ジクロライド、イソフタル酸ジクロライド、フタル酸ジクロライド等の二官能性酸クロライドから誘導される化合物残基;シュウ酸ジブロマイド、マロン酸ジブロマイド、コハク酸ジブロマイド、グルタル酸ジブロマイド、アジピン酸ジブロマイド、ピメリン酸ジブロマイド、スベリン酸ジブロマイド、アゼライン酸ジブロマイド、セバシン酸ジブロマイド、ドデカン酸ジブロマイド、テレフタル酸ジブロマイド、イソフタル酸ジブロマイド、フタル酸ジブロマイド等の二官能性酸ブロマイドから誘導される化合物残基等を挙げることができる。 Examples of the compound residue derived from a bifunctional halide compound include oxalic acid dichloride, malonic acid dichloride, succinic acid dichloride, glutaric acid dichloride, adipic acid dichloride, pimelic acid dichloride, suberic acid dichloride, azelaic acid dichloride, and sebacic acid. Compound residues derived from bifunctional acid chlorides such as dichloride, dodecanoic acid dichloride, terephthalic acid dichloride, isophthalic acid dichloride, phthalic acid dichloride; oxalic acid dibromide, malonic acid dibromide, succinic acid dibromide, glutaric acid dichloride Bromide, adipic acid dibromide, pimelic acid dibromide, suberic acid dibromide, azelaic acid dibromide, sebacic acid dibromide, dodecanoic acid dibromide, terephthalate It can be exemplified dibromide, isophthalic acid dibromide, etc. compound residue derived from difunctional acids bromide such as phthalic acid dibromide.
二官能性イソシアネート化合物から誘導される化合物残基としては、例えばジフェニルメタン−4,4’−ジイソシアネート、トルエンジイソシアネート、フェニレンジイソシアネート、キシレンジイソシアネート、キシリレンジイソシアネート、テトラメチルキシレンジイソシアネート、ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、ナフタレンジイソシアネート、2,2,4−トリメチルヘキサメチレンジイソシアネート、2,4,4−トリメチルヘキサメチレンジイソシネート、ダイマー酸ジイソシアネート、ジシクロヘキシルメタンジイソシアネート、メチルシクロヘキサンジイソシアネート、ノルボルネンジイソシアネート等から誘導される化合物残基が挙げられ、これらは単独で用いてもよいし、2種以上併用してもよい。これらの中でも特に反応性に優れ、効率よく熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体が得られることから、ジフェニルメタン−4,4’−ジイソシアネート、トルエンジイソシアネート、ヘキサメチレンジイソシアネート、ジシクロヘキシルメタンジイソシアネート、イソホロンジイソシアネート等から誘導される化合物残基が好ましく用いられる。 Examples of the compound residue derived from the bifunctional isocyanate compound include diphenylmethane-4,4′-diisocyanate, toluene diisocyanate, phenylene diisocyanate, xylene diisocyanate, xylylene diisocyanate, tetramethylxylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, Compound residues derived from naphthalene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, dimer acid diisocyanate, dicyclohexylmethane diisocyanate, methylcyclohexane diisocyanate, norbornene diisocyanate, etc. These may be used alone or in combination of two or more. It may be. Among these, since the aromatic amide block copolymer which is particularly excellent in reactivity and used efficiently in the thermoplastic resin composition can be obtained, diphenylmethane-4,4′-diisocyanate, toluene diisocyanate, hexamethylene diisocyanate, dicyclohexylmethane diisocyanate A compound residue derived from isophorone diisocyanate or the like is preferably used.
二官能性カーボネート化合物から誘導される化合物残基としては、例えばジメチルカーボネート、ジエチルカーボネート、ジプロピルカーボネート、ジブチルカーボネート、ジフェニルカーボネート等から誘導される化合物残基が挙げられ、その中でも特に反応性に優れ、効率よく熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体が得られることから、ジメチルカーボネート、ジフェニルカーボネート等から誘導される化合物残基が好ましい。 Examples of the compound residue derived from a bifunctional carbonate compound include compound residues derived from dimethyl carbonate, diethyl carbonate, dipropyl carbonate, dibutyl carbonate, diphenyl carbonate, etc. Among them, particularly excellent in reactivity. A compound residue derived from dimethyl carbonate, diphenyl carbonate or the like is preferable because an aromatic amide block copolymer used for the thermoplastic resin composition can be obtained efficiently.
二官能性エステル化合物から誘導される化合物残基としては、例えばテレフタル酸ジフェニル、イソフタル酸ジフェニル、フタル酸ジフェニル、2,6−ナフタレンジカルボン酸ジフェニル、2,7−ナフタレンジカルボン酸ジフェニル、4,4−ビフェニルジカルボン酸ジフェニル、テレフタル酸ジメチル、イソフタル酸ジメチル、フタル酸ジメチル、2,6−ナフタレンジカルボン酸ジメチル、2,7−ナフタレンジカルボン酸ジメチル、4,4−ビフェニルジカルボン酸ジメチル、テレフタル酸ジエチル、イソフタル酸ジエチル、フタル酸ジエチル、2,6−ナフタレンジカルボン酸ジエチル、2,7−ナフタレンジカルボン酸ジエチル、4,4−ビフェニルジカルボン酸ジエチル等から誘導される化合物残基が挙げられ、その中でも特に反応性に優れ、効率よく熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体が得られることから、テレフタル酸ジフェニル、テレフタル酸ジメチル、イソフタル酸ジフェニル、イソフタル酸ジメチル等から誘導される化合物残基が好ましい。 Examples of the compound residue derived from the bifunctional ester compound include diphenyl terephthalate, diphenyl isophthalate, diphenyl phthalate, diphenyl 2,6-naphthalenedicarboxylate, diphenyl 2,7-naphthalenedicarboxylate, 4,4- Diphenyl biphenyl dicarboxylate, dimethyl terephthalate, dimethyl isophthalate, dimethyl phthalate, dimethyl 2,6-naphthalenedicarboxylate, dimethyl 2,7-naphthalenedicarboxylate, dimethyl 4,4-biphenyldicarboxylate, diethyl terephthalate, isophthalic acid Compound residues derived from diethyl, diethyl phthalate, diethyl 2,6-naphthalenedicarboxylate, diethyl 2,7-naphthalenedicarboxylate, diethyl 4,4-biphenyldicarboxylate, etc. Therefore, it is possible to obtain an aromatic amide block copolymer used in a thermoplastic resin composition efficiently. Therefore, the compound residue derived from diphenyl terephthalate, dimethyl terephthalate, diphenyl isophthalate, dimethyl isophthalate, etc. Groups are preferred.
二官能性アシルラクタム化合物から誘導される化合物残基としては、例えばテレフタロイルビス(ε−カプロラクタム)、イソフタロイルビス(ε−カプロラクタム)、アジポイルビス(ε−カプロラクタム)、スクシニルビス(ε−カプロラクタム)等から誘導される化合物残基が挙げられ、その中でも特に反応性に優れ、効率よく熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体が得られることから、テレフタロイルビス(ε−カプロラクタム)から誘導される化合物残基が好ましい。 Examples of the compound residue derived from a bifunctional acyllactam compound include terephthaloyl bis (ε-caprolactam), isophthaloyl bis (ε-caprolactam), adipyl bis (ε-caprolactam), succinyl bis (ε-caprolactam). ) And the like. Among them, terephthaloyl bis (ε-) is particularly preferable because it is excellent in reactivity and can efficiently obtain an aromatic amide block copolymer used in a thermoplastic resin composition. Compound residues derived from caprolactam are preferred.
二官能性エポキシ化合物から誘導される化合物残基としては、例えばテレフタル酸ジグリシジルエステル、イソフタル酸ジグリシジルエステル、フタル酸ジグリシジルエステル等の芳香族ジカルボン酸ジグリシジルエステルから誘導される化合物残基;p−フェニレンジグリシジルエーテル等の芳香族ジグリシジルエーテルから誘導される化合物残基;ジエチレングリコールジグリシジルエステル等の脂肪族ジカルボン酸ジグリシジルエステルから誘導される化合物残基;ジエチレングリコールジグリシジルエーテル等の脂肪族ジカルボン酸ジグリシジルエーテルから誘導される化合物残基等が挙げられる。 Examples of the compound residue derived from a bifunctional epoxy compound include a compound residue derived from an aromatic dicarboxylic acid diglycidyl ester such as terephthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, and phthalic acid diglycidyl ester; Compound residue derived from aromatic diglycidyl ether such as p-phenylene diglycidyl ether; Compound residue derived from aliphatic dicarboxylic acid diglycidyl ester such as diethylene glycol diglycidyl ester; Aliphatic such as diethylene glycol diglycidyl ether Examples thereof include a compound residue derived from dicarboxylic acid diglycidyl ether.
二官能性芳香族テトラカルボン酸無水物から誘導される化合物残基としては、例えばピロメリット酸二無水物、1,4,5,8−ナフタレンテトラカルボン酸二無水物、3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物、3,3’,4,4’−ビフェニルテトラカルボン酸二無水物等から誘導される化合物残基が挙げられる。 Examples of the compound residue derived from a bifunctional aromatic tetracarboxylic anhydride include pyromellitic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 3,3 ′, 4 , 4'-benzophenonetetracarboxylic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, and the like.
また、本発明の熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体における芳香族アミド単位の含有量は特に制限はなく、耐熱性、剛性、耐衝撃に優れた熱可塑性樹脂組成物が得られることから、芳香族アミド単位の含有量は5〜95重量%の範囲が好ましく、特に5〜50重量%、さらに15〜45重量%の範囲であることが好ましい。 Further, the content of the aromatic amide unit in the aromatic amide block copolymer used in the thermoplastic resin composition of the present invention is not particularly limited, and a thermoplastic resin composition excellent in heat resistance, rigidity and impact resistance is obtained. Therefore, the content of the aromatic amide unit is preferably in the range of 5 to 95% by weight, particularly preferably in the range of 5 to 50% by weight, and more preferably in the range of 15 to 45% by weight.
本発明の熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体は、ゲル・パーミエーション・クロマトグラフィー(以下、GPCと記す。)で測定した標準ポリスチレン換算の数平均分子量が10000〜1000000であることが好ましく、特に30000〜500000であることが好ましい。また、該芳香族アミドブロック共重合体は、硬さがタイプAデュロメータ硬さ(JIS K6253:1997年)が60〜99であることが好ましく、特に80〜98であることが好ましい。 The aromatic amide block copolymer used in the thermoplastic resin composition of the present invention has a standard polystyrene equivalent number average molecular weight of 10,000 to 1,000,000 as measured by gel permeation chromatography (hereinafter referred to as GPC). It is preferable that it is especially 30000-500000. The aromatic amide block copolymer preferably has a hardness of type A durometer (JIS K6253: 1997) of 60 to 99, particularly preferably 80 to 98.
本発明の熱可塑性樹脂組成物に用いる芳香族アミドブロック共重合体の製造方法としては、一般式(1)で示されるアミド単位と、ポリエステル、脂肪族ポリ(オキシアルキレン)、ポリカーボネート、ポリオレフィン、ポリオルガノシロキサン、ポリジエンまたはこれらの共重合体よりなる群から選ばれる1種以上の単位からなる芳香族アミドブロック共重合体を製造することが可能な限りにおいていかなる方法を用いてもよく、例えば一般式(1)で示されるアミド単位を含み両末端にカルボン酸基あるいは水酸基を有するモノマーと、両末端に水酸基あるいはカルボン酸基を含有するポリエステル、脂肪族ポリ(オキシアルキレン)、ポリカーボネート、ポリオレフィン、ポリオルガノシロキサン、ポリジエンまたはこれらの共重合体よりなる群から選ばれる1種以上の単位を含有する化合物を直接反応させる方法;一般式(1)で示されるアミド単位を含み両末端に水酸基を有するモノマーと、両末端に水酸基を含有するポリエステル、脂肪族ポリ(オキシアルキレン)、ポリカーボネート、ポリオレフィン、ポリオルガノシロキサン、ポリジエンまたはこれらの共重合体よりなる群から選ばれる1種以上の単位とを反応させる際に、二官能性ハライド化合物、二官能性イソシアネート化合物、二官能性カーボネート化合物、二官能性エステル化合物、二官能性アシルラクタム化合物、二官能性エポキシ化合物、二官能性テトラカルボン酸無水物等よりなる群から選ばれる1種以上の鎖延長剤単位の存在下に反応させる方法;一般式(1)で示されるアミド単位を含み両末端に水酸基を有するモノマーとε−カプロラクトンのような環状エステル化合物を反応しプレポリマーを得た後、上述した鎖延長剤を1種以上添加し反応させる方法等が挙げられる。その際の重合方法としては、例えば溶液重合法、溶融重合法、界面重合法、固相重合法等が挙げられ、これらを組み合わせて製造してもよい。その中でも容易に分子量を増大させた芳香族アミドブロック共重合体が得られることから、溶液重合法を行った後に溶融縮合を行うことが好ましい。 The method for producing the aromatic amide block copolymer used in the thermoplastic resin composition of the present invention includes an amide unit represented by the general formula (1), polyester, aliphatic poly (oxyalkylene), polycarbonate, polyolefin, poly Any method may be used as long as it is possible to produce an aromatic amide block copolymer comprising one or more units selected from the group consisting of organosiloxane, polydiene or a copolymer thereof. A monomer having an amide unit represented by (1) and having a carboxylic acid group or a hydroxyl group at both ends, a polyester having a hydroxyl group or a carboxylic acid group at both ends, an aliphatic poly (oxyalkylene), a polycarbonate, a polyolefin, a polyorgano Siloxane, polydiene or their copolymers A method of directly reacting a compound containing one or more units selected from the group consisting of: a monomer containing an amide unit represented by the general formula (1) and having hydroxyl groups at both ends; and a polyester containing hydroxyl groups at both ends A bifunctional halide compound, a bifunctional compound, when reacting with one or more units selected from the group consisting of aliphatic poly (oxyalkylene), polycarbonate, polyolefin, polyorganosiloxane, polydiene or copolymers thereof. One or more chain extensions selected from the group consisting of a functional isocyanate compound, a bifunctional carbonate compound, a bifunctional ester compound, a bifunctional acyllactam compound, a bifunctional epoxy compound, a bifunctional tetracarboxylic acid anhydride, and the like A method of reacting in the presence of a drug unit; including both amide units represented by the general formula (1) After obtaining the reaction was prepolymer cyclic ester compounds such as monomers and ε- caprolactone having a hydroxyl group, a method, and the like to the addition of the chain extender described above one or more reactions. Examples of the polymerization method at that time include a solution polymerization method, a melt polymerization method, an interfacial polymerization method, a solid phase polymerization method, and the like. Among them, since an aromatic amide block copolymer having an increased molecular weight can be easily obtained, it is preferable to perform melt condensation after performing a solution polymerization method.
本発明の熱可塑性樹脂組成物に用いる熱可塑性樹脂としては特に制限はなく公知のものを使用でき、例えばポリエチレン、ポリプロピレン、エチレン/α−オレフィン共重合体等のポリオレフィン系樹脂;ポリ塩化ビニル;ポリ酢酸ビニル;ポリスチレン;アクリル樹脂;ポリアクリロニトリル;ポリエチレンテレフタレート、ポリトリメチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレン−2,6−ナフタレンジカルボキシレート、ポリブチレン−2,6−ナフタレンジカルボキシレート、液晶ポリマー等の芳香族ポリエステル樹脂;6−ナイロン、6,6−ナイロン、4,6−ナイロン、半芳香族ポリアミド等のポリアミド樹脂;ポリフェニレンスルフィド、ポリフェニレンスルフィドケトン、ポリフェニレンスルフィドスルホン等のポリアリーレンスルフィド樹脂;ポリオキシメチレンホモポリマー、ポリオキシメチレンコポリマー、ポリオキシメチレンブロックコポリマー等のポリアセタール樹脂;ポリカーボネート;変性ポリフェニレンオキシド;ポリスルホン;ポリエーテルスルホン;ポリエーテルケトン;ポリエーテルエーテルケトン;ポリイミド;ポリアミドイミド;ポリエーテルイミド;フッ素樹脂;シリコーン樹脂;フェノキシ樹脂等の単独重合体、ランダム、ブロック又はグラフト共重合体等を挙げることができ、その中でも耐熱性、剛性に優れた熱可塑性樹脂組成物が得られることからポリアリーレンスルフィド樹脂、芳香族ポリエステル樹脂、ポリアセタール樹脂、ポリアミド樹脂が好ましく、特にポリフェニレンスルフィド、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリオキシメチレンコポリマー、6,6−ナイロンが好ましい。これらの熱可塑性樹脂は1種又は2種以上が使用できる。 The thermoplastic resin used in the thermoplastic resin composition of the present invention is not particularly limited, and known resins can be used. For example, polyolefin resins such as polyethylene, polypropylene, ethylene / α-olefin copolymers; polyvinyl chloride; Acrylic such as vinyl acetate; polystyrene; acrylic resin; polyacrylonitrile; polyethylene terephthalate, polytrimethylene terephthalate, polybutylene terephthalate, polyethylene-2,6-naphthalene dicarboxylate, polybutylene-2,6-naphthalene dicarboxylate, liquid crystal polymer, etc. Polyamide resin; polyamide resin such as 6-nylon, 6,6-nylon, 4,6-nylon, semi-aromatic polyamide; polyphenylene sulfide, polyphenylene sulfide ketone, polyphenylene sulfi Polyarylene sulfide resins such as sulfones; Polyacetal resins such as polyoxymethylene homopolymers, polyoxymethylene copolymers, polyoxymethylene block copolymers; Polycarbonates; Modified polyphenylene oxides; Polysulfones; Polyethersulfones; Polyether ketones; Polyimide; Polyamideimide; Polyetherimide; Fluororesin; Silicone resin; Homopolymer such as phenoxy resin, random, block or graft copolymer, and the like. Among them, thermoplastic resin having excellent heat resistance and rigidity. Polyarylene sulfide resins, aromatic polyester resins, polyacetal resins, and polyamide resins are preferred because the composition is obtained. Lenterephthalate, polybutylene terephthalate, polyoxymethylene copolymer and 6,6-nylon are preferred. One or more of these thermoplastic resins can be used.
本発明の熱可塑性樹脂組成物における芳香族アミドブロック共重合体(A)と熱可塑性樹脂(B)との混合比率は、芳香族アミドブロック共重合体(A)99.9〜0.1重量%、熱可塑性樹脂(B)0.1〜99.9重量%であり、その中でも剛性、耐衝撃性に優れる熱可塑性樹脂組成物が得られることから芳香族アミドブロック共重合体(A)50〜1重量%、熱可塑性樹脂(B)50〜99重量%であることが好ましく、さらに好ましくは芳香族アミドブロック共重合体(A)30〜5重量%、熱可塑性樹脂(B)70〜95重量%である。芳香族アミドブロック共重合体(A)の配合量が0.1重量%未満では、熱可塑性樹脂組成物の耐衝撃性が劣り、また、99.9重量%を越えると熱可塑性樹脂組成物の剛性が低下するため、好ましくない。 The mixing ratio of the aromatic amide block copolymer (A) to the thermoplastic resin (B) in the thermoplastic resin composition of the present invention is 99.9 to 0.1 weight by weight of the aromatic amide block copolymer (A). % Of the thermoplastic resin (B) 0.1 to 99.9% by weight, and among them, an aromatic amide block copolymer (A) 50 is obtained because a thermoplastic resin composition having excellent rigidity and impact resistance can be obtained. It is preferable that they are 1 to 1 weight%, a thermoplastic resin (B) 50 to 99 weight%, More preferably, an aromatic amide block copolymer (A) 30 to 5 weight%, A thermoplastic resin (B) 70 to 95 % By weight. If the blending amount of the aromatic amide block copolymer (A) is less than 0.1% by weight, the impact resistance of the thermoplastic resin composition is inferior, and if it exceeds 99.9% by weight, the thermoplastic resin composition This is not preferable because the rigidity is lowered.
本発明の熱可塑性樹脂組成物は、剛性に優れた熱可塑性樹脂組成物が得られることから芳香族アミドブロック共重合体(A)と熱可塑性樹脂(B)との合計量100重量部に対して、無機充填剤及び/又は有機充填剤を300重量部以下含有することが好ましく、特に10〜100重量部含有することが好ましい。 Since the thermoplastic resin composition of the present invention provides a thermoplastic resin composition having excellent rigidity, the total amount of the aromatic amide block copolymer (A) and the thermoplastic resin (B) is 100 parts by weight. The inorganic filler and / or the organic filler is preferably contained in an amount of 300 parts by weight or less, particularly preferably 10 to 100 parts by weight.
該無機充填剤としては、無機充填剤であれば如何なるものでもよく、例えばガラス繊維、金属繊維、炭素繊維、チタン酸金属カリウムウィスカー、マイカ、タルク、シリカ、硫酸バリウム、カオリン、クレー、パイロフェライト、ベントナイト、セリサイト、ゼオライト、雲母、ネフェリンシナイト、アタパルジャイト、ウォラストナイト、フェライト、ケイ酸カルシウム、炭酸カルシウム、炭酸マグネシウム、ドロマイト、三酸化アンチモン、酸化亜鉛、酸化チタン、酸化マグネシウム、酸化鉄、二硫化モリブデン、黒鉛、石膏、ガラスビーズ、ガラスパウダー、ガラスバルーン、石英、石英ガラス、カーボンナノチューブ及びその化学修飾物、フラーレン類及びその化学修飾物等が挙げられる。 The inorganic filler may be any inorganic filler, such as glass fiber, metal fiber, carbon fiber, potassium metal titanate whisker, mica, talc, silica, barium sulfate, kaolin, clay, pyroferrite, Bentonite, sericite, zeolite, mica, nepheline cinnite, attapulgite, wollastonite, ferrite, calcium silicate, calcium carbonate, magnesium carbonate, dolomite, antimony trioxide, zinc oxide, titanium oxide, magnesium oxide, iron oxide, two Examples thereof include molybdenum sulfide, graphite, gypsum, glass beads, glass powder, glass balloon, quartz, quartz glass, carbon nanotubes and chemically modified products thereof, fullerenes and chemically modified products thereof.
該有機充填剤としては、有機充填剤であれば如何なるものでもよく、例えばアラミド繊維、芳香族ポリエステル繊維、液晶ポリマー繊維、ポリイミド繊維、高分子微粒子、木材チップ、澱粉、穀物粉、骨粉等が挙げられる。 The organic filler may be any organic filler, such as aramid fiber, aromatic polyester fiber, liquid crystal polymer fiber, polyimide fiber, polymer fine particle, wood chip, starch, cereal powder, and bone powder. It is done.
また、本発明の熱可塑性樹脂組成物には、例えばワックス等の離型剤;シラン系、チタネート系等のカップリング剤;滑剤;可塑剤;帯電防止剤;導電剤;加水分解防止剤;結晶核剤;耐光性安定剤;発泡剤;防錆剤;イオントラップ剤;難燃剤または難燃助剤;増粘剤;分岐形成剤として作用する多官能性エポキシ化合物、多官能性イソシアネート化合物等を必要に応じて加えることができる。 Further, the thermoplastic resin composition of the present invention includes, for example, a release agent such as wax; a coupling agent such as silane and titanate; a lubricant; a plasticizer; an antistatic agent; a conductive agent; Nucleating agent; Light-resistant stabilizer; Foaming agent; Rust preventive agent; Ion trap agent; Flame retardant or flame retardant aid; Thickener; Multifunctional epoxy compound acting as branching agent, polyfunctional isocyanate compound, etc. Can be added as needed.
本発明の熱可塑性樹脂組成物は、芳香族アミドブロック共重合体(A)と熱可塑性樹脂(B)を混合することにより得られ、これらは一度に混合してもよいし、良好な分散状態を達成するために、二段もしくはそれ以上の多段で混合してもかまわない。混合方法としては、例えばドライブレンド、溶液混合、溶融混合等の方法が挙げられ、その中でも効率よく混合できることから溶融混合が好ましく用いられる。 The thermoplastic resin composition of the present invention is obtained by mixing the aromatic amide block copolymer (A) and the thermoplastic resin (B), and these may be mixed at once or in a good dispersion state. In order to achieve the above, it may be mixed in two or more stages. Examples of the mixing method include dry blending, solution mixing, and melt mixing. Among them, melt mixing is preferably used because it can be efficiently mixed.
溶融混合には、例えばバンバリーミキサー(ファレル社製)、加圧ニーダー((株)森山製作所製)、インターナルミキサー(栗本鉄工所製)、インテンシブミキサー(日本ロール製造(株)製)等の機械加圧式混練機;ロール成形機、単軸押出し機、二軸押出し機等の押出し成形機;等のプラスチックまたはゴムの加工に使用される混練成形機が使用できる。溶融混合する際の温度は適宜選定することができ、その中でも120〜400℃が好ましく、特に好ましくは150〜330℃である。 For melt mixing, for example, a machine such as a Banbury mixer (manufactured by Farrell), a pressure kneader (manufactured by Moriyama Seisakusho), an internal mixer (manufactured by Kurimoto Iron Works), an intensive mixer (manufactured by Nippon Roll Manufacturing Co., Ltd.) A kneading and molding machine used for processing plastics or rubber, such as a pressure kneader; an extrusion molding machine such as a roll molding machine, a single screw extruder, or a twin screw extruder; can be used. The temperature at the time of melt mixing can be appropriately selected, and among them, 120 to 400 ° C is preferable, and 150 to 330 ° C is particularly preferable.
本発明の熱可塑性樹脂組成物は、射出成形、押出成形、トランスファー成形、インフレーション成形、ブロー成形、加熱成形、圧縮成形、真空成形等、通常の熱可塑性樹脂の成形方法により成形加工でき、例えばコネクタ、筐体等の射出成形体;パイプ、チューブ等の押出成形体;タンク、ボトル等のブロー成形体、;フィルム・シート;繊維;ボード;発泡体;等の成形体とすることができ、その中でもフィルム・シート、射出成形体に好ましく用いられる。 The thermoplastic resin composition of the present invention can be molded by ordinary thermoplastic resin molding methods such as injection molding, extrusion molding, transfer molding, inflation molding, blow molding, heat molding, compression molding, vacuum molding, etc. Injection molded bodies such as casings; Extrusion molded bodies such as pipes and tubes; Blow molded bodies such as tanks and bottles; Films and sheets; Fibers; Boards; Foams; Among them, it is preferably used for a film / sheet and an injection-molded body.
そして、成形体の用途例としては、例えばオルタネータ部品、コンデンサーケース、自動車センサー、ウェザーストリップ等の自動車部品;コネクタ、チップ等の電機・電子部品;各種筐体;磁気テープ、強磁性薄膜テープ等のテープ;写真フィルム、包装用フィルム、電子部品用フィルム、電機絶縁フィルム、金属板ラミネート用フィルム、ガラスディスプレイ用フィルム等のフィルム;液晶表示装置用部材のプリズムレンズシート;タッチパネル、バックライト等のベースフィルム;偏光板、光学レンズ、各種計器のカバー、自動車、電車等の窓ガラスに用いられる反射防止用フィルム;ディスプレイ防爆用フィルムのベースフィルム;半導電フィルム、帯電防止フィルム、医薬フィルム、光学用フィルム等のフィルム;化粧板;静電防止シート、ルーフィング用シート等のシート;液晶表示用基板、有機EL表示素子基板、カラーフィルター用基板、タッチパネル用基板、太陽電池用基板等の光学シート;光学レンズ、スクリーン等に用いるレンズシート;舞台照明用カラーフィルター、光選択吸収フィルター等の光学フィルター;救急絆創こう、サージカルテープ、リハビリテープ等の医療補助用テープの基材;消炎、鎮痛、血行促進等の疾患治療用テープの基材;手術用手袋;紙おむつ、ナプキン等の衛生用品固定用テープの基材;スポーツ衣料用途;コンベヤベルト、樹脂コンベヤベルト、急傾斜コンベヤ、円筒コンベヤベルト等の搬送用コンベヤベルト類;Vベルト、歯付きベルト等の動力伝達ベルト類;帯電ベルト、転写ベルト、給紙ベルト、定着ベルト等のOA機器用ベルト;空圧ホース、油圧ホース、熱収縮ホース、酸素ホース、蒸気用ホース、送吸油ホース、ガス用ホース、編み上げホース、布巻きホース、高圧ホース、サクションホース、ダクトホース、スプレーホース、送排水用ホース、耐圧補強ホース、静電気防止ホース等のホース類;座席シート;空圧チューブ、油圧チューブ、熱収縮チューブ等のチューブ類;印刷用ロール、製紙用ロール、紡績用ロール、製鉄用ロール、染色化繊用ロール等の工業用ロール;事務機器用ロール、帯電ロール、転写ロール、給紙ロール、定着ロール等のOA機器用ロール;自動化機器用ロール等の各種機器用ロール;もみすり機等の農業機械用ロール;ラック&ピニオンブーツ、等速ジョイントブーツ、ステアリングブーツ、ダストブーツ、サスペンションブーツ等のブーツ類;エアーダクト;自動車用、鉄道用、産業機械用、建築土木用等の防振・免振ゴム;防舷材、金属をはじめとする各種素材のライニング;携帯電話、電化製品、リモコン等のパッキン;シーリング材、防水材、オイルシール、メカニカルシール、成形パッキン、グランドパッキン等の運動用シール;Oリング、ガスケット等の固定用シール;シリンジ用、建築用ガスケット;マスク;サック;手袋;コンドーム;水枕;哺乳器用乳首;キャップ容器;レインウェア;エアバック;ダイヤフラム;ラバーダム;ガスのう膜;オイルフェンス;フレキシブルコンテナ;ゴルフボール、サッカーボール等のボール類;スポーツ床;フェンス用緩衝ゴム;チェーン;舗装用ブロック;手すり;滑り止め;エアータイト;スペーサー;合わせガラス;止水板;伸縮可とう継ぎ手;糸ゴム;ゴムひも;ハンドレール;プラ磁石;ゴム磁石;電線;コード;キャスター;ベアリング;カップリング;クッション;グロメット;インシュレーター;ストッパー;ワイパーブレード;ジョイント;制振ゴム;ゴムスイッチ;玩具;靴;足ゴム;ゴルフクラブ、テニスラケット、スキーポール等のグリップ部分;スポーツ用品;シーラント;タイヤ;精密機器、精密加工機類の振動吸収材;日用雑貨;;座席シート;水着、スキーウェアー、サイクリングウェアー、レオタード、ランジェリー、ファンデーション、肌着等の衣料;パンティストッキング、靴下、サポーター、帽子、手袋、パワーネット、包帯等の雑品;カーシート地糸、ロボットアーム用金属被覆糸、不織布等が挙げられる。 Examples of applications of the molded body include, for example, automobile parts such as alternator parts, capacitor cases, automobile sensors, and weather strips; electrical and electronic parts such as connectors and chips; various housings; magnetic tapes, ferromagnetic thin film tapes, etc. Tapes: photographic films, packaging films, films for electronic components, electrical insulation films, films for laminating metal plates, films for glass displays, prism lens sheets for liquid crystal display members, base films for touch panels, backlights, etc. ; Anti-reflection film used for polarizing plates, optical lenses, cover of various instruments, window glass of automobiles, trains, etc .; Base film for display explosion-proof film; Semiconductive film, anti-static film, pharmaceutical film, optical film, etc. Film; decorative board; antistatic Sheets, sheets such as roofing sheets; optical sheets such as liquid crystal display substrates, organic EL display element substrates, color filter substrates, touch panel substrates, solar cell substrates; lens sheets used for optical lenses, screens, etc .; stage lighting Optical filters such as color filters and light selective absorption filters; base materials for medical aids such as emergency bonds, surgical tapes, rehabilitation tapes; base materials for tapes for treatment of diseases such as anti-inflammatory, analgesic and blood circulation promotion; Gloves; Base materials for fixing sanitary goods such as paper diapers and napkins; Sports clothing applications; Conveyor belts such as conveyor belts, resin conveyor belts, steeply inclined conveyors, cylindrical conveyor belts; V belts, toothed belts, etc. Power transmission belts; OA for charging belt, transfer belt, paper feed belt, fixing belt, etc. Equipment belt: pneumatic hose, hydraulic hose, heat shrink hose, oxygen hose, steam hose, oil supply / absorption hose, gas hose, braided hose, cloth winding hose, high pressure hose, suction hose, duct hose, spray hose, water supply / drainage Hoses, pressure hose, antistatic hose, etc .; seat sheets; pneumatic tubes, hydraulic tubes, heat shrinkable tubes, etc .; printing rolls, paper rolls, spinning rolls, iron rolls, dyeing Industrial rolls such as synthetic fiber rolls; Office equipment rolls, charging rolls, transfer rolls, paper feed rolls, fixing rolls and other OA equipment rolls; automation equipment rolls and other equipment rolls; Machine rolls; rack and pinion boots, constant velocity joint boots, steering boots, dust boots, suspension Boots such as boots; Air ducts; Anti-vibration and vibration-isolating rubbers for automobiles, railways, industrial machines, and civil engineering; Lining of various materials including fenders and metals; mobile phones and electrical appliances Seals, waterproofing materials, oil seals, mechanical seals, molded packings, gland packings and other motion seals; O-rings, gaskets and other fixed seals; syringes, architectural gaskets; masks; Gloves; Condom; Water pillow; Nipple for baby bottle; Cap container; Rainware; Airbag; Diaphragm; Rubber dam; Gas sac; Oil fence; Flexible container; Balls such as golf balls and soccer balls; Rubber; Chain; Paving block; Handrail; Anti-slip; Air tight; Spacer Laminated glass; Water stop plate; Stretchable joint; Yarn rubber; Rubber strap; Hand rail; Plastic magnet; Rubber magnet; Electric wire; Cord; Caster; Bearing; Coupling; Rubber dampers; Toys; Shoes; Foot rubber; Grip parts of golf clubs, tennis rackets, ski poles, etc .; Sporting goods; Sealants; Tires; Vibration absorbers for precision equipment and precision processing machines; Miscellaneous goods ;; seat seats; swimwear, ski wear, cycling wear, leotards, lingerie, foundation, underwear, etc .; miscellaneous goods such as pantyhose, socks, supporters, hats, gloves, power nets, bandages; car seat ground yarn, robots Metal armored yarn for arm, non-woven fabric, etc. It is.
本発明は、新規な耐熱性、剛性、耐衝撃性に優れる熱可塑性樹脂組成物を提供することができる。 The present invention can provide a novel thermoplastic resin composition excellent in heat resistance, rigidity, and impact resistance.
以下、本発明を実施例によって詳細に説明するが、本発明はこれら実施例に限定されるものではない。なお、用いた試薬等は断りのない限り市販品を用いた。 EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these Examples. The reagents used were commercially available unless otherwise noted.
評価・分析に用いた機器及び方法を以下に示す。 The equipment and methods used for evaluation and analysis are shown below.
〜ポリフェニレンスルフィド樹脂の溶融粘度の測定〜
溶融粘度は高化式フローテスターを用いて315℃、せん断速度=200(秒)−1のときの値を求めた。
-Measurement of melt viscosity of polyphenylene sulfide resin-
The melt viscosity was determined using a Koka flow tester at 315 ° C. and a shear rate of 200 (seconds) −1 .
〜芳香族アミドブロック共重合体(A)の数平均分子量の測定〜
カラム(東ソー(株)製、商品名TSK−GEL GMHHR−H)を装着したGPC装置(東ソー(株)製、商品名HLC−8020)により、カラム温度40℃、流量0.4ml/分の条件下で、溶離液に20mmol/lの塩化リチウム−N−メチル−2−ピロリドン溶液を用いて測定し、標準ポリスチレン換算で算出した。
-Measurement of number average molecular weight of aromatic amide block copolymer (A)-
Conditions of column temperature of 40 ° C. and flow rate of 0.4 ml / min using a GPC apparatus (trade name HLC-8020, manufactured by Tosoh Corporation) equipped with a column (trade name: TSK-GEL GMHHR-H, manufactured by Tosoh Corporation) Below, it measured using 20 mmol / l lithium chloride-N-methyl-2-pyrrolidone solution for an eluent, and computed it in standard polystyrene conversion.
〜芳香族アミドブロック共重合体(A)中の芳香族アミド単位含有量の測定〜
核磁気共鳴測定装置(日本電子製、商品名JNM−GSX270型)を用い、重水素化ジメチルスルホキシド中、室温の条件で1H−NMRを測定し、芳香族基とラクトン単位のメチレン基のピーク強度比より算出した。
-Measurement of aromatic amide unit content in aromatic amide block copolymer (A)-
Using a nuclear magnetic resonance measuring apparatus (manufactured by JEOL Ltd., trade name JNM-GSX270 type), 1 H-NMR was measured in deuterated dimethyl sulfoxide at room temperature, and the peak of the methylene group of the aromatic group and the lactone unit was measured. Calculated from the intensity ratio.
〜芳香族アミドブロック共重合体(A)の融点測定〜
示差走査熱量計(セイコー電子工業製、商品名DSC200)を用い、昇温速度10℃/分、−100〜300℃の範囲で測定した。
~ Measurement of melting point of aromatic amide block copolymer (A) ~
A differential scanning calorimeter (manufactured by Seiko Denshi Kogyo Co., Ltd., trade name DSC200) was used, and the temperature was measured at a temperature rising rate of 10 ° C./min and in the range of −100 to 300 ° C.
〜芳香族アミドブロック共重合体(A)のタイプAデュロメータ硬さ〜
芳香族アミドブロック共重合体を圧縮成形した厚さ2mmのシートを用いて、タイプAデュロメータ硬さ(JIS K6253:1997年)を測定した。
~ Type A durometer hardness of aromatic amide block copolymer (A) ~
Type A durometer hardness (JIS K6253: 1997) was measured using a 2 mm thick sheet obtained by compression molding of an aromatic amide block copolymer.
〜熱可塑性樹脂組成物射出成形品の評価〜
ノッチ付アイゾット衝撃強度はASTM D256(1995年)に、曲げ強度はASTM D638(1995年)に準拠し測定した。
-Evaluation of injection molding products of thermoplastic resin compositions-
The notched Izod impact strength was measured according to ASTM D256 (1995), and the bending strength was measured according to ASTM D638 (1995).
〜熱可塑性樹脂組成物フィルムの評価〜
引張弾性率は、フィルムを20×120mmの試験片に裁断した後、テンシロン引張試験機を用いて引張速度5mm/minで測定した。衝撃強度は、フィルムを100×100mmの試験片に裁断した後、前記試験片をパンクチャー衝撃試験機に固定し、1/2インチ径半球衝撃ヘッドでフィルム下面より突き刺し、そのときの破壊エネルギーをフィルムインパクトテスターで測定した。
-Evaluation of thermoplastic resin composition film-
The tensile modulus was measured at a tensile speed of 5 mm / min using a Tensilon tensile tester after cutting the film into 20 × 120 mm test pieces. The impact strength is determined by cutting the film into 100 × 100 mm test pieces, fixing the test piece to a puncture impact tester, and piercing it from the lower surface of the film with a ½ inch diameter hemispherical impact head. Measured with a film impact tester.
合成例1(ポリフェニレンスルフィドの合成)
脱水塔、温度計および攪拌翼を備えた15LオートクレーブにN−メチル−2−ピロリドンを5L仕込み、120℃に昇温した後、硫化ナトリウム(純度:60.7重量%)1866gを仕込み、約2時間かけて攪拌しながら徐々に205℃まで昇温して、水を410g留出させた。この系を140℃まで冷却した後、p−ジクロロベンゼン2101gを添加し、225℃に昇温し3時間重合した後、250℃に昇温し、さらに250℃にて3時間重合した。重合終了後、室温まで冷却したスラリーを大量の水中に投入して重合体を析出させ、濾別、純水による洗浄を行った後、一晩真空乾燥を行うことにより重合体を単離した。このようにして得た重合体をさらに空気雰囲気下235℃で加熱硬化処理し、溶融粘度2560ポイズのポリフェニレンスルフィドを得た。以下、PPSと記す。
Synthesis Example 1 (Synthesis of polyphenylene sulfide)
A 15 L autoclave equipped with a dehydration tower, a thermometer and a stirring blade was charged with 5 L of N-methyl-2-pyrrolidone, heated to 120 ° C., and then charged with 1866 g of sodium sulfide (purity: 60.7 wt%). While stirring over time, the temperature was gradually raised to 205 ° C. to distill 410 g of water. After cooling this system to 140 ° C., 2101 g of p-dichlorobenzene was added, the temperature was raised to 225 ° C. and polymerized for 3 hours, then the temperature was raised to 250 ° C. and further polymerized at 250 ° C. for 3 hours. After completion of the polymerization, the slurry cooled to room temperature was poured into a large amount of water to precipitate the polymer, filtered, washed with pure water, and then vacuum dried overnight to isolate the polymer. The polymer thus obtained was further heat-cured at 235 ° C. in an air atmosphere to obtain polyphenylene sulfide having a melt viscosity of 2560 poise. Hereinafter referred to as PPS.
合成例2(ジヒドロキシ芳香族アミド化合物(a)の合成)
窒素導入管、温度計および攪拌翼を備えた10Lの4つ口フラスコに、窒素雰囲気下でp−アミノフェノール763g(7.0モル)及びN−メチル−2−ピロリドン(以下、NMPと記す。)2.1L、トルエン1.4Lを加え50℃に昇温し均一溶液を得た。別途、窒素導入管を備えた3L滴下ロートに、テレフタル酸ジクロライド710g(3.5モル)、NMP0.3L、トルエン1.4Lを加えて均一溶液とした。この溶液を先の溶液中に80℃を保ちながら30分かけて滴下し、さらに80℃で2時間反応させた。
Synthesis Example 2 (Synthesis of dihydroxy aromatic amide compound (a))
In a 10 L four-necked flask equipped with a nitrogen inlet tube, a thermometer, and a stirring blade, 763 g (7.0 mol) of p-aminophenol and N-methyl-2-pyrrolidone (hereinafter referred to as NMP) are added under a nitrogen atmosphere. ) 2.1 L and 1.4 L of toluene were added and the temperature was raised to 50 ° C. to obtain a uniform solution. Separately, 710 g (3.5 mol) of terephthalic acid dichloride, 0.3 L of NMP, and 1.4 L of toluene were added to a 3 L dropping funnel equipped with a nitrogen introduction tube to obtain a uniform solution. This solution was dropped into the previous solution over 30 minutes while maintaining 80 ° C., and further reacted at 80 ° C. for 2 hours.
室温まで冷却後、固形分を吸引濾過により回収し、メタノール7Lで2回攪拌洗浄し、N,N’−ビス(4−ヒドロキシフェニル)−1,4−ベンゼンジカルボキサミドを得た。 After cooling to room temperature, the solid content was collected by suction filtration and washed twice with 7 L of methanol to obtain N, N′-bis (4-hydroxyphenyl) -1,4-benzenedicarboxamide.
続いて、窒素導入管、温度計および攪拌翼を備えた10Lの4つ口フラスコに、窒素雰囲気下でN,N’−ビス(4−ヒドロキシフェニル)−1,4−ベンゼンジカルボキサミド1045g(3.0モル)、炭酸エチレン555g(6.3モル)、触媒として炭酸ナトリウム0.95g(9.0ミリモル)、NMP6.0Lを加え、180℃で3時間反応させた。室温まで冷却後、固形分を吸引ろ過により回収し、NMP5L、次いでメタノール7.5Lで2回攪拌洗浄し、N,N’−ビス(4−(2−ヒドロキシエトキシ)フェニル)−1,4−ベンゼンジカルボキサミド1110g(収率85%)を得た。その構造式を下記に示す。この化合物を(a)と記す。 Subsequently, 1045 g (3 of N, N′-bis (4-hydroxyphenyl) -1,4-benzenedicarboxamide was added to a 10 L four-necked flask equipped with a nitrogen introduction tube, a thermometer and a stirring blade under a nitrogen atmosphere. 0.0 mol), 555 g (6.3 mol) of ethylene carbonate, 0.95 g (9.0 mmol) of sodium carbonate as a catalyst, and 6.0 L of NMP were added and reacted at 180 ° C. for 3 hours. After cooling to room temperature, the solid content was collected by suction filtration, washed by stirring twice with NMP5L and then with 7.5L of methanol, and N, N′-bis (4- (2-hydroxyethoxy) phenyl) -1,4- 1110 g (yield 85%) of benzenedicarboxamide was obtained. Its structural formula is shown below. This compound is referred to as (a).
窒素導入管、温度計および攪拌翼を備えた10Lの4つ口フラスコに、4−アミノ−N−(2−ヒドロキシエチル)ベンズアミド1600g(8.9モル)、NMP4.0Lを加え均一溶液を得た。別途に、窒素導入管を備えた3L滴下ロートに、イソフタル酸ジクロライド901g(4.4モル)、NMP2.0Lを加え、撹拌し均一溶液とし、この溶液を先の溶液中に1時間かけて滴下した。さらに50℃で2時間反応させた後、得られたスラリーをアセトン25Lに投入し、吸引ろ過により白色固体を回収した。得られた固体をNMPにより再結晶を行い、N,N’−ビス(4−(2−ヒドロキシエチルカルバモイル)フェニル)−1,3−ベンゼンジカルボキサミド1873g(収率86%)を得た。その構造式を下記に示す。この化合物を(b)と示す。
4-amino-N- (2-hydroxyethyl) benzamide 1600 g (8.9 mol) and NMP 4.0 L were added to a 10 L four-necked flask equipped with a nitrogen inlet tube, a thermometer and a stirring blade to obtain a homogeneous solution. It was. Separately, 901 g (4.4 mol) of isophthalic acid dichloride and 2.0 L of NMP were added to a 3 L dropping funnel equipped with a nitrogen introduction tube, stirred to obtain a homogeneous solution, and this solution was dropped into the previous solution over 1 hour. did. Furthermore, after making it react at 50 degreeC for 2 hours, the obtained slurry was thrown into acetone 25L, and white solid was collect | recovered by suction filtration. The obtained solid was recrystallized with NMP to obtain 1873 g (yield 86%) of N, N′-bis (4- (2-hydroxyethylcarbamoyl) phenyl) -1,3-benzenedicarboxamide. Its structural formula is shown below. This compound is indicated as (b).
窒素導入管、温度計および攪拌翼を備えた10Lの4つ口フラスコに、4−アミノ安息香酸エチル826g(5.0モル)、NMP4.0Lを加え均一溶液を得た。別途に、窒素導入管を備えた3L滴下ロートに、テレフタル酸ジクロライド914g(4.5モル)、NMP2.0Lを加え、撹拌し均一溶液とし、この溶液を先の溶液中に1時間かけて滴下した。さらに80℃で2時間反応させた後、得られたスラリーをメタノール25Lに投入し、吸引ろ過により白色固体を回収した。得られた固体をNMPにより再結晶を行い、N,N’−ビス(4−エトキシカルボニルフェニル)−1,4−ベンゼンジカルボキサミド1865g(収率90%)を得た。その構造式を下記に示す。この化合物を(c)と示す。
To a 10 L four-necked flask equipped with a nitrogen introduction tube, a thermometer and a stirring blade, 826 g (5.0 mol) of ethyl 4-aminobenzoate and 4.0 L of NMP were added to obtain a homogeneous solution. Separately, 914 g (4.5 mol) of terephthalic acid dichloride and 2.0 L of NMP were added to a 3 L dropping funnel equipped with a nitrogen introduction tube, stirred to obtain a homogeneous solution, and this solution was dropped into the previous solution over 1 hour. did. Furthermore, after making it react at 80 degreeC for 2 hours, the obtained slurry was thrown into methanol 25L, and white solid was collect | recovered by suction filtration. The obtained solid was recrystallized with NMP to obtain 1865 g (yield 90%) of N, N′-bis (4-ethoxycarbonylphenyl) -1,4-benzenedicarboxamide. Its structural formula is shown below. This compound is indicated as (c).
窒素導入管を備えた15Lのオートクレーブに、窒素雰囲気下で化合物(a)896g(2.1モル)、ε−カプロラクトン2342g(20.5モル)、NMP5380gを仕込み、180℃に昇温した後、テトラブチルチタネート1.4g(4.1ミリモル)を加え、180℃で2時間開環重合を行った。引き続いて、テレフタロイルビス(ε−カプロラクタム)731g(2.1モル)を添加し、180℃で5時間反応させた。その後、内温を250℃まで昇温しながら、NMP及び副生成物のε−カプロラクタムを減圧下で2時間かけて留去し、更に250℃で1時間反応させた。続いて、系内を加圧にした後、オートクレーブ下部から溶融状態のポリマーをストランドとして抜き出し、カッティングして芳香族アミドブロック共重合体のペレット3100gを得た。
In a 15 L autoclave equipped with a nitrogen introduction tube, 896 g (2.1 mol) of compound (a), 2342 g (20.5 mol) of ε-caprolactone and 5380 g of NMP were charged under a nitrogen atmosphere, and the temperature was raised to 180 ° C. Tetrabutyl titanate (1.4 g, 4.1 mmol) was added, and ring-opening polymerization was performed at 180 ° C. for 2 hours. Subsequently, 731 g (2.1 mol) of terephthaloyl bis (ε-caprolactam) was added and reacted at 180 ° C. for 5 hours. Thereafter, while raising the internal temperature to 250 ° C., NMP and ε-caprolactam as a by-product were distilled off under reduced pressure over 2 hours, and further reacted at 250 ° C. for 1 hour. Subsequently, after the inside of the system was pressurized, the polymer in a molten state was extracted as a strand from the lower part of the autoclave and was cut to obtain 3100 g of pellets of an aromatic amide block copolymer.
得られた芳香族アミドブロック共重合体は、数平均分子量78000、融点225℃、タイプAデュロメータ硬さ95、芳香族アミド単位含量29重量%であった。この共重合体をポリマーIとする。 The obtained aromatic amide block copolymer had a number average molecular weight of 78000, a melting point of 225 ° C., a type A durometer hardness of 95, and an aromatic amide unit content of 29% by weight. This copolymer is designated as Polymer I.
合成例6(芳香族アミドブロック共重合体の合成)
窒素導入管を備えた15Lのオートクレーブに、窒素雰囲気下で化合物(a)1309g(3.0モル)、ε−カプロラクトン1710g(15.0モル)、NMP5380gを仕込み、180℃に昇温した後、テトラブチルチタネート1.4g(4.1ミリモル)を加え、180℃で2時間開環重合を行った。引き続いて、テレフタロイルビス(ε−カプロラクタム)1068g(3.0モル)を添加し、180℃で5時間反応させた。その後、内温を260℃まで昇温しながら、NMP及び副生成物のε−カプロラクタムを減圧下で2時間かけて留去し、更に260℃で1時間反応させた。続いて、系内を加圧にした後、オートクレーブ下部から溶融状態のポリマーをストランドとして抜き出し、カッティングして芳香族アミドブロック共重合体のペレット3000gを得た。
Synthesis Example 6 (Synthesis of aromatic amide block copolymer)
A 15 L autoclave equipped with a nitrogen introduction tube was charged with 1309 g (3.0 mol) of compound (a), 1710 g (15.0 mol) of ε-caprolactone and 5380 g of NMP in a nitrogen atmosphere, and the temperature was raised to 180 ° C. Tetrabutyl titanate (1.4 g, 4.1 mmol) was added, and ring-opening polymerization was performed at 180 ° C. for 2 hours. Subsequently, 1068 g (3.0 mol) of terephthaloyl bis (ε-caprolactam) was added and reacted at 180 ° C. for 5 hours. Thereafter, while raising the internal temperature to 260 ° C., NMP and ε-caprolactam as a by-product were distilled off under reduced pressure over 2 hours, and further reacted at 260 ° C. for 1 hour. Subsequently, after the inside of the system was pressurized, the molten polymer was extracted as a strand from the lower part of the autoclave and cut to obtain 3000 g of aromatic amide block copolymer pellets.
得られた芳香族アミドブロック共重合体は、数平均分子量72000、融点230℃、タイプAデュロメータ硬さ98、芳香族アミド単位含量44重量%であった。この共重合体をポリマーIIとする。 The obtained aromatic amide block copolymer had a number average molecular weight of 72,000, a melting point of 230 ° C., a type A durometer hardness of 98, and an aromatic amide unit content of 44% by weight. This copolymer is designated as Polymer II.
合成例7(芳香族アミドブロック共重合体の合成)
窒素導入管を備えた15Lのオートクレーブに、窒素雰囲気下で化合物(a)716g(1.6モル)、ε−カプロラクトン3745g(32.8モル)、NMP4302gを仕込み、180℃に昇温した後、テトラブチルチタネート2.2g(6.5ミリモル)を加え、180℃で1時間開環重合を行った。引き続いて、テレフタロイルビス(ε−カプロラクタム)585g(1.6モル)を添加し、180℃で5時間反応させた。その後、内温を230℃まで昇温しながら、NMP及び副生成物のε−カプロラクタムを減圧下で2時間かけて留去し、更に230℃で1時間反応させた。続いて、系内を加圧にした後、オートクレーブ下部から溶融状態のポリマーをストランドとして抜き出し、カッティングして芳香族アミドブロック共重合体のペレット4300gを得た。
Synthesis Example 7 (Synthesis of aromatic amide block copolymer)
A 15 L autoclave equipped with a nitrogen introduction tube was charged with 716 g (1.6 mol) of compound (a), 3745 g (32.8 mol) of ε-caprolactone and 4302 g of NMP in a nitrogen atmosphere, and heated to 180 ° C. Tetrabutyl titanate (2.2 g, 6.5 mmol) was added, and ring-opening polymerization was performed at 180 ° C. for 1 hour. Subsequently, 585 g (1.6 mol) of terephthaloylbis (ε-caprolactam) was added and reacted at 180 ° C. for 5 hours. Thereafter, while raising the internal temperature to 230 ° C., NMP and ε-caprolactam as a by-product were distilled off under reduced pressure over 2 hours, and further reacted at 230 ° C. for 1 hour. Subsequently, after pressurizing the system, the melted polymer was extracted as a strand from the lower part of the autoclave and cut to obtain 4300 g of aromatic amide block copolymer pellets.
得られた芳香族アミドブロック共重合体は、数平均分子量82000、融点143℃、タイプAデュロメータ硬さ85、芳香族アミド単位含量17重量%であった。この共重合体をポリマーIIIとする。 The obtained aromatic amide block copolymer had a number average molecular weight of 82000, a melting point of 143 ° C., a type A durometer hardness of 85, and an aromatic amide unit content of 17% by weight. This copolymer is designated as Polymer III.
合成例8(芳香族アミドブロック共重合体の合成)
化合物(a)896gに変えて、化合物(b)1006g(2.1モル)を使用した以外は合成例5と同様の方法により、芳香族アミドブロック共重合体3120gを得た。
Synthesis Example 8 (Synthesis of aromatic amide block copolymer)
3120 g of an aromatic amide block copolymer was obtained in the same manner as in Synthesis Example 5, except that 1006 g (2.1 mol) of compound (b) was used instead of 896 g of compound (a).
得られた芳香族アミドブロック共重合体は、数平均分子量77000、融点210℃、タイプAデュロメータ硬さ95、芳香族アミド単位含量31重量%であった。この共重合体をポリマーIVとする。 The obtained aromatic amide block copolymer had a number average molecular weight of 77,000, a melting point of 210 ° C., a type A durometer hardness of 95, and an aromatic amide unit content of 31% by weight. This copolymer is designated as Polymer IV.
合成例9(芳香族アミドブロック共重合体の合成)
窒素導入管を備えた15Lのオートクレーブに、窒素雰囲気下で化合物(c)1934g(4.2モル)、ポリ(オキシテトラメチレン)ポリオール[保土谷化学工業製、商品名PTG−1000SN;数平均分子量=1038)]4360g(4.2モル)、フェノール系酸化防止剤(チバ・スペシャリティ・ケミカルズ製、商品名イルガノックス1010)6.2g、NMP3390g、テトラブチルチタネート14.2g(42ミリモル)を仕込み、エタノールを留去しながら210℃で2時間反応を行った。引き続いて、2時間かけて内温を240℃まで昇温し、NMPを減圧下で留去し、更に240℃で2時間反応させた。続いて、系内を加圧にした後、オートクレーブ下部から溶融状態のポリマーをストランドとして抜き出し、カッティングして芳香族アミドブロック共重合体のペレット5800gを得た。
Synthesis Example 9 (Synthesis of aromatic amide block copolymer)
In a 15 L autoclave equipped with a nitrogen introduction tube, 1934 g (4.2 mol) of compound (c), poly (oxytetramethylene) polyol [trade name PTG-1000SN, manufactured by Hodogaya Chemical Industry, Ltd., number average molecular weight under a nitrogen atmosphere = 1038)] 4360 g (4.2 mol), phenolic antioxidant (product name: Irganox 1010, manufactured by Ciba Specialty Chemicals) 6.2 g, NMP 3390 g, tetrabutyl titanate 14.2 g (42 mmol) were charged, The reaction was carried out at 210 ° C. for 2 hours while distilling off ethanol. Subsequently, the internal temperature was raised to 240 ° C. over 2 hours, NMP was distilled off under reduced pressure, and further reacted at 240 ° C. for 2 hours. Subsequently, after pressurizing the inside of the system, the melted polymer was extracted as a strand from the lower part of the autoclave and cut to obtain 5800 g of aromatic amide block copolymer pellets.
得られた芳香族アミドブロック共重合体は、数平均分子量72000、融点215℃、タイプAデュロメータ硬さ95であった。この共重合体をポリマーVとする。 The obtained aromatic amide block copolymer had a number average molecular weight of 72,000, a melting point of 215 ° C., and a type A durometer hardness of 95. This copolymer is referred to as polymer V.
実施例1〜10、比較例1〜5
合成例1で得たPPS、ポリマーI〜V、ガラス繊維(平均繊維径9μm、カット長3mmのチョップドストランド)、ポリエステル系エラストマー(東洋紡製、P−55B,以下TPEEと記す)を表1に示す割合で、二軸押出機を用いて310℃で溶融混練し熱可塑性樹脂組成物のペレットを得た。続いて、曲げ強度、アイゾット衝撃強度を評価するために射出成形機によって試験片を作成し、測定を行った。結果を表1にまとめた。比較例1〜5で得られた熱可塑性樹脂組成物は耐衝撃性に劣るものであった。
Examples 1-10, Comparative Examples 1-5
Table 1 shows the PPS, polymers I to V obtained in Synthesis Example 1, glass fibers (chopped strands having an average fiber diameter of 9 μm and a cut length of 3 mm), and polyester elastomer (P-55B, manufactured by Toyobo, hereinafter referred to as TPEE). At a ratio, the mixture was melt-kneaded at 310 ° C. using a twin-screw extruder to obtain pellets of a thermoplastic resin composition. Subsequently, in order to evaluate bending strength and Izod impact strength, test pieces were prepared by an injection molding machine and measured. The results are summarized in Table 1. The thermoplastic resin compositions obtained in Comparative Examples 1 to 5 were inferior in impact resistance.
ポリエチレンテレフタレート(帝人化成製TR−8550T,以下PETと記す)、ポリマーI、ポリマーV、TPEEを表2に示す割合でドライブレンドを行なった後、Tダイを備えた二軸押出機を用いて280℃で溶融押出し、キャスティングドラムに密着させて冷却し、熱可塑性樹脂組成物よりなるフィルムを得た。結果を表2にまとめた。比較例6〜8で得られたフィルムは耐衝撃性に劣るものであった。
Polyethylene terephthalate (TR-8550T manufactured by Teijin Chemicals, hereinafter referred to as PET), polymer I, polymer V, and TPEE were dry blended in the proportions shown in Table 2 and then 280 using a twin screw extruder equipped with a T die. The film was melt-extruded at 0 ° C., brought into close contact with a casting drum and cooled to obtain a film made of a thermoplastic resin composition. The results are summarized in Table 2. The films obtained in Comparative Examples 6 to 8 were inferior in impact resistance.
ポリブチレンテレフタレート[ポリプラスチックス(株)製、ジュラコン2002]50重量%、ポリマーI50重量%を、二軸押出機を用いて240℃で溶融混練し熱可塑性樹脂組成物のペレットを得た。続いて、曲げ強度、アイゾット衝撃強度を評価するために射出成形機によって試験片を作成し、測定を行った。曲げ強度60MPa、アイゾット衝撃強度は150J/mであった。
Polybutylene terephthalate [manufactured by Polyplastics Co., Ltd., Duracon 2002] 50 wt% and polymer I 50 wt% were melt-kneaded at 240 ° C. using a twin screw extruder to obtain pellets of a thermoplastic resin composition. Subsequently, in order to evaluate bending strength and Izod impact strength, test pieces were prepared by an injection molding machine and measured. The bending strength was 60 MPa, and the Izod impact strength was 150 J / m.
実施例15
ポリオキシメチレンコポリマー[ポリプラスチックス(株)製、ジュラコンM90]80重量%、ポリマーIII20重量%を、二軸押出機を用いて180℃で溶融混練し熱可塑性樹脂組成物のペレットを得た。続いて、曲げ強度、アイゾット衝撃強度を評価するために射出成形機によって試験片を作成し、測定を行った。曲げ強度75MPa、アイゾット衝撃強度は105J/mであった。
Example 15
80% by weight of polyoxymethylene copolymer [manufactured by Polyplastics Co., Ltd., Duracon M90] and 20% by weight of polymer III were melt-kneaded at 180 ° C. using a twin screw extruder to obtain pellets of a thermoplastic resin composition. Subsequently, in order to evaluate bending strength and Izod impact strength, test pieces were prepared by an injection molding machine and measured. The bending strength was 75 MPa, and the Izod impact strength was 105 J / m.
実施例16
6,6−ナイロン[宇部興産(株)製、UBEナイロン2020B]80重量%、ポリマーII20重量%を、二軸押出機を用いて280℃で溶融混練し熱可塑性樹脂組成物のペレットを得た。続いて、曲げ強度、アイゾット衝撃強度を評価するために射出成形機によって試験片を作成し、測定を行った。曲げ強度90MPa、アイゾット衝撃強度は100J/mであった。
Example 16
6,6-Nylon [Ube Industries, UBE Nylon 2020B] 80% by weight and Polymer II 20% by weight were melt-kneaded at 280 ° C. using a twin-screw extruder to obtain pellets of a thermoplastic resin composition. . Subsequently, in order to evaluate bending strength and Izod impact strength, test pieces were prepared by an injection molding machine and measured. The bending strength was 90 MPa, and the Izod impact strength was 100 J / m.
Claims (6)
(ここで、R1およびR2は、それぞれ独立して炭素数1〜20の二価のオキシアルキレン基、アルキレンカルバモイル基、またはアリーレンカルバモイル基を示す。) One or more kinds selected from the group consisting of an aromatic amide unit represented by the following general formula (1), polyester, aliphatic poly (oxyalkylene), polycarbonate, polyolefin, polyorganosiloxane, polydiene or a copolymer thereof. A thermoplastic resin composition comprising 99.9 to 0.1% by weight of an aromatic amide block copolymer (A) comprising units and 0.1 to 99.9% by weight of a thermoplastic resin (B). .
(Here, R 1 and R 2 each independently represent a divalent oxyalkylene group having 1 to 20 carbon atoms, an alkylenecarbamoyl group, or an arylenecarbamoyl group.)
The molded object which consists of a thermoplastic resin composition in any one of Claims 1-5.
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WO2013099671A1 (en) * | 2011-12-26 | 2013-07-04 | 古河電気工業株式会社 | Reflector, method for manufacturing reflector, and backlight panel |
CN103339434A (en) * | 2011-12-26 | 2013-10-02 | 古河电气工业株式会社 | Reflector, method for manufacturing reflector, and backlight panel |
JP5416317B2 (en) * | 2011-12-26 | 2014-02-12 | 古河電気工業株式会社 | Reflector and backlight panel |
JPWO2013099671A1 (en) * | 2011-12-26 | 2015-05-07 | 古河電気工業株式会社 | Reflector and backlight panel |
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