JP2006227042A - Manufacturing method of optical connecting apparatus, and optical connecting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make connection possible always stably and with a high coupling efficiency without being affected with the height of VCSEL wire mounted on a substrate, by further developing the technique of a self-forming waveguide for which reports are few on applications to an optical circuit at present. <P>SOLUTION: A light emitting element 10 is covered with a photosensitive medium 9 in a manner covering the entirety (S1); a hole array 20 is placed on the light emitting element 10 so as to enclose the photosensitive medium 9 inside (S2) and is then aligned (S3), wherein the hole array 20 is equipped with a spacer 27 having the ability of surrounding the light emitting element 10 and having a height giving no hindrance to the mounting, and is also equipped, on the upper face 21 of the spacer, with a hole part 23 having a prescribed size; the photosensitive medium 9 is formed with an optical waveguide 24 by irradiating the hole array 20 with ultraviolet rays from the above (S4); and thereafter, a cover member 30 is removed (S5). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical connection device manufacturing method and an optical connection device, and more particularly to an optical connection device manufacturing method and an optical connection device for enabling a light emitting element mounted on a substrate to be optically connected to an optical connector. .

  Along with the information-oriented society in recent years, the amount of information flowing on the network has been steadily increasing, and electronic devices such as exchanges are required to further increase the information processing capability. However, electrical signals have become prominent problems such as crosstalk, noise, reflection, and propagation delay due to a long wiring distance due to high-density mounting of electronic components on a substrate.

  As a means for solving this problem, attention has been focused on opticalizing signals. Compared to electrical signals, light has no problem of noise during signal propagation and can be mounted in parallel, so it is extremely effective as a high-speed, high-capacity transmission and ultra-high-density wiring technology. As a light source for such optical communication, VCSELs are currently attracting attention because of their low cost and excellent features such as arraying.

  By the way, a self-forming optical waveguide has been proposed as an effective method for optical connection. With this self-forming optical waveguide, for example, by irradiating an ultraviolet curable resin with ultraviolet rays as a fine light beam through an optical fiber or the like, generally, the refractive index is improved only at the irradiated part to produce a waveguide structure. (For example, JP2003-131063A, JP2003-131064A). In addition to ultraviolet rays, there are reports that the absorption peak of a photosensitive medium is changed by a dye and applied to other wavelength bands (for example, “Self-formed connection between GI-MMF and VCSEL by green laser light” Watanabe) Norito et al., IEICE Transactions C, VOL.J87-C No.5 pp.488-489 (2004.5).

  Since self-forming optical waveguides can be connected to the output end in an unaligned manner, they are also expected to be applied to optical connection devices as “optical solders” (for example, Naohiro Hirose, Osamu Ibaraki “Self-forming optical waveguides” Simple optical connection technology used "Journal of Japan Institute of Electronics Packaging, Vol.5, pp44 9-453, 2002).

  However, there are few reports of application examples to optical circuits at the present stage, and the manufacturing method has mainly been studied from the optical wiring side such as optical fiber and optical waveguide.

JP 2003-131063 A JP 2003-131064 A "Green laser light" self-forming connection between GI-MMF and VCSEL "Norito Watanabe et al., IEICE Transactions C, VOL.J87-C No.5 pp.488-489 (2004.5) Naohiro Hirose, Osamu Ibaraki “Easy Optical Connection Technology Using Self-Forming Optical Waveguide”, Journal of Japan Institute of Electronics Packaging, Vol.5, pp44 9-453,2002)

  The VCSEL described above is generally mounted on the light emitting surface side by wire bonding. As shown in FIG. 5, the height h of the wire 10 a of the VCSEL 10 mounted on the substrate 1 protrudes about 200 to 300 μm from the light emitting surface of the VCSEL 10 due to its configuration. For this reason, it is necessary to consider the height h of the wire 10a when attempting to optically couple with the multi-core optical connector 5 (MT connector or the like).

When the distance between the end faces of the optical connector with respect to the light emitting surface of the VCSEL is increased, the optical coupling efficiency is reduced and the mounting accuracy is deteriorated. The positional deviation tolerance in the optical axis direction of the optical connector depends on the emission angle of the light source and the core diameter of the optical fiber built in the optical connector. Normally, the emission angle of a VCSEL has a width of about 7 to 12 degrees in MM (multimode) and about 12 to 16 degrees (half angle, 1 / e ² ) in single mode. For example, in the case of coupling of MM-VCSEL with an irradiation angle of 7.5 degrees (half angle, 1 / e ² ) and GI-MMF (core 50 μm), the optical coupling efficiency is 200 μm away from the end face of the optical fiber. Is about -3.0 dB. As a solution in this case, for example, a coupling method using a lens is conceivable. That is, it is difficult to connect the VCSEL and the multi-core optical connector.

Therefore, the present invention has been made paying attention to such a conventional problem, and its object is to manufacture an optical connecting device and an optical connecting device for connecting an optical connector to a VCSEL mounted on a substrate. However, at the present stage, by further developing the self-formed waveguide technology, which has few reports on applications to optical circuits, it is always stable and high in coupling efficiency regardless of the height of the VCSEL wire mounted on the substrate. It is an object of the present invention to provide an optical connection device manufacturing method and an optical connection device that can be connected with each other.
It is another object of the present invention to provide an optical connection device manufacturing method and an optical connection device that are inexpensive and simple in structure.

  In order to solve the above-mentioned problems, the present invention according to claim 1 covers the entire light emitting element in a method of manufacturing an optical connecting device for enabling a light emitting element mounted on a substrate to be optically connected to an optical connector. In this manner, the photosensitive medium is coated with a photosensitive medium, a spacer having a height that can surround the light emitting element and does not hinder its mounting, and a hole array having a predetermined size hole portion on the upper surface side is photosensitive. A step of placing the medium inside the light emitting element so that the medium is contained therein, and irradiating light including light having a wavelength necessary for curing the photosensitive medium from above the hole array And a step of forming an optical waveguide in the photosensitive medium.

  A spacer higher than the VCSEL wire is attached to the hole array. By fabricating a self-forming optical waveguide from a substrate having a hole array, the VCSEL and the hole array are coupled without optical loss. Light from the VCSEL propagates in the waveguide without diffusing. As a result, since the optical connector and the self-forming optical waveguide are directly coupled, high coupling efficiency can be expected. The length of the self-forming optical waveguide can be manufactured at a level of several millimeters, and the spacer thickness can be adjusted as appropriate, so that the height of the VCSEL wire does not matter.

In order to solve the above-mentioned problem, the present invention according to claim 2 is the method of manufacturing an optical connection device according to claim 1, wherein the hole array has a hole diameter of an optical fiber built in the optical connector to be connected. It is characterized by being the same as or smaller than the core size.
Since the core diameter of the optical waveguide formed by the hole array is the same as or smaller than the core diameter of the optical fiber built in the optical connector, the light from the VCSEL is propagated to the optical fiber included in the optical connector without loss. .

In order to solve the above-mentioned problem, the present invention described in claim 3 is the method of manufacturing an optical connection device according to claim 1 or 2, wherein the alignment of the light emitting element and the hole array is performed by adjusting the light emitting surface of the light emitting element. It is performed by monitoring.
An optical waveguide is formed between the hole and the light emitting portion of the VCSEL by accurately aligning the holes of the hole array and the light emitting portion of the VCSEL.

  In order to solve the above-mentioned problem, the present invention according to claim 4 is the method of manufacturing an optical connection device according to claim 1 or 2, wherein the alignment of the light emitting element and the hole array is performed by a guide pin. It is characterized by.

In order to solve the above-mentioned problem, according to a fifth aspect of the present invention, in the method for manufacturing an optical connecting device according to any one of the first to fourth aspects, a transparent cover member is removed from the upper surface of the hole array. The cover member is removed after the light path is formed by irradiating light including light having a wavelength necessary for curing the photosensitive medium.
The surface tension and liquid sag of the photosensitive medium are suppressed, and the end face of the formed optical connecting device is flattened.

In order to solve the above-mentioned problem, the present invention described in claim 6 is the method for manufacturing an optical connection device according to any one of claims 1 to 5, wherein the optical waveguide is connected to the optical connector from the end face side. It is characterized in that the core diameter is gradually increased toward the light emitting element side.
By allowing the positional deviation between the light emitting portion of the light emitting element and the optical waveguide and widening the positional accuracy, the light is guided into the optical waveguide without loss and propagated to the optical connector to be connected.

  In order to solve the above problems, the present invention according to claim 7 is an optical connection device for enabling a light emitting element mounted on a substrate to be optically connected to an optical connector. A hole array having a height that does not hinder and having holes formed on the upper surface thereof, and an optical waveguide formed inside the hole array, the length extending from the light emitting portion of the light emitting element to the holes It is characterized by comprising positioning means for aligning the formed optical waveguide and the optical connector to be connected.

  The VCSEL and the hole array are coupled without optical loss by an optical waveguide. Light from the VCSEL propagates in the waveguide without being diffused by the optical waveguide. As a result, since the optical connector and the self-forming optical waveguide are directly coupled, high coupling efficiency can be expected. The optical connecting device and the optical connector are aligned by guide pins. The hole diameter should be smaller than the core size of the optical connector. An existing optical connector is sufficient.

  According to the method of manufacturing an optical connecting device and the optical connecting device according to the present invention, the VCSEL and the optical connector are coupled by the self-forming optical waveguide, so that a stable high coupling efficiency is always obtained regardless of the height of the wire. Can do. Since the hole array can be manufactured in the range of μm to several hundreds of μm by an existing processing technique, POF, SMF, or an optical waveguide having a rectangular core diameter can also be used.

  In addition, according to the method for manufacturing an optical connecting device and the optical connecting device according to the present invention, there is an effect that the material cost is much lower and the structure is simpler than using a lens. Also, from the viewpoint of coupling efficiency, it is considered that optical cores are optically the same (or the self-forming optical waveguide side is small) and optical wires are directly coupled to each other. Can be obtained. In the optical coupling between the optical connection device according to the present invention and the VCSEL, there is no problem in positional accuracy because the light emitting surface of the VCSEL is about 5 μm. Furthermore, if the self-formed optical waveguide has a taper angle, the positional accuracy can be further increased.

  An optical connection device manufacturing method and an optical connection device according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a flowchart in an embodiment of a method for manufacturing an optical connecting device according to the present invention.

  First, the illustrated inventive method is generally performed according to the following procedure. That is, the UV curable resin 9 as the photosensitive medium is covered so as to cover the entire VCSEL 10 as the light emitting element (step S1). Then, the hole array 20 including the spacer 27 having a height that does not hinder the mounting without contacting the wire 10a of the VCSEL 10 is placed on the VCSEL 10 so as to enclose the ultraviolet curable resin 9 (step S2). Then, after alignment (step S3), an optical waveguide is formed in the ultraviolet curable resin 9 by irradiating ultraviolet rays from above the hole array 20 (step S4). Finally, the upper surface plate 21 of the hole array 20 is removed (step S5). Thereby, an optical connection device for optically coupling the VCSEL 10 and the optical connector 5 is formed. Here, when the head is swung (tilted) while obliquely irradiating the ultraviolet light irradiated from the hole portion 23, an optical waveguide in which the core diameter is gradually expanded from the hole portion 23 toward the light emitting portion 10b is formed. can do. Thereby, since the core diameter of the self-forming optical waveguide 24 gradually increases from the connection end face side to the optical connector 5 toward the VCSEL 10 side, it is possible to increase the positional accuracy in optical coupling with the optical connector 5.

  Now, as shown in FIG. 2, the hole array 20 used in the method of the present invention is roughly obtained by attaching a spacer 27 having a predetermined height H to an upper surface plate 21 having a hole portion 23 of a predetermined size. Is formed. As long as at least the upper surface plate 21 of the hole array 20 is formed of a material that does not transmit ultraviolet rays, the type of the material is not limited. For example, it may be made of an opaque synthetic resin or a metal material. The hole portion 23 is formed by drilling holes in the upper surface plate 21 in accordance with the pitch between the light emitting portions 10b of the VCSEL 10 that is a light emitting element with a laser or a drill. In addition, the hole portion 23 can be formed by attaching a photomask having holes through which ultraviolet rays pass in accordance with the pitch between the light emitting portions 10b of the VCSEL 10. However, the upper surface plate 21 in this case needs to be formed of a material that transmits ultraviolet rays. On the other hand, insertion holes 25 into which the positioning pins 5a of the optical connector 5 to be fitted are inserted are provided in the vicinity of both end portions of the upper surface plate 21, respectively.

  Here, when the self-forming optical waveguide 24 is manufactured using a photomask, various optical waveguides can be formed by appropriately changing the shape of the hole of the photomask. For example, an optical waveguide having a prismatic core can be made by making the shape of the hole of the photomask square, and an optical waveguide having a cylindrical core shape can be made by making it circular. Similarly, if the aperture diameter of the photomask is changed, not only conventional multimode optical fibers but also large core diameter POFs (plastic optical fibers) and single mode optical fibers can be supported. it can. Therefore, a desired optical waveguide can be manufactured simply by changing the shape of the photomask in accordance with the core shape of the optical fiber to be coupled, leading to improvement in versatility and coupling efficiency.

  The spacer 27 is a rectangular tube-like member having a space formed therein, and is attached to the lower portion of the upper surface plate 21 described above. The spacer 27 is formed to have a height higher than the height of the wire 10 a of the VCSEL 10 wire-bonded on the substrate 1. Thus, when the hole array 20 is placed so as to cover the VCSEL 10, the wire 10a is not contacted, and the mounting state of the VCSEL 10 is not hindered. Specifically, it has a height of about 500 μm. The height of the spacer 27 may be adjusted as appropriate according to the height of the wire 10a of the attached VCSEL 10. Further, the material for forming the spacer 27 is not particularly limited, but it is preferable to form the spacer 27 using a material that does not transmit ultraviolet rays, like the top plate 21. On the other hand, on the bottom surface of the spacer 27, a guide pin 27a to be inserted into the mounting hole 1a provided in the substrate 1 is provided.

  A cover member 30 is detachably disposed on the upper surface plate 21. The cover member 30 is removed after irradiating the ultraviolet curable resin 9 contained in the hole array 20 with ultraviolet rays to form a light path. Thereby, the surface tension and liquid dripping of the ultraviolet curable resin 9 are suppressed, and the end face is made flat. As a result, the connection with the optical connector 5 can be performed with high accuracy.

The method of the present invention for manufacturing an optical connecting device using the above-described hole array 20 will be specifically described with reference to the drawings.
First, as shown in FIG. 4A, the ultraviolet curable resin 9 is coated so as to cover the entire VCSEL 10 mounted on the substrate 1 (step S1). The ultraviolet curable resin 9 is cured by irradiating ultraviolet rays, and depending on the ultraviolet curable resin 9, the refractive index may be adjusted by changing the irradiation time of the ultraviolet rays.

  Next, the hole array 20 is attached according to the light emitting part 10b of the VCSEL 10 (step S2). The alignment between the hole array 20 and the VCSEL 10 at this time is performed so that the hole portion 23 is positioned directly above the light emitting portion 10b while monitoring the light emitting portion 10b of the VCSEL 10 from the hole with a camera (step S3). . In addition, the alignment of the hole array 20 and the VCSEL 10 can be performed using, for example, a guide pin. That is, a mounting hole 1a is provided at a predetermined position of the substrate 1 on which the VCSEL 10 is mounted, and the hole portion 23 is positioned directly above the light emitting portion 10b when the guide pins 27a of the hole array 20 are inserted into the mounting hole 1a. It can also be performed by forming in advance. In addition, when the hole array 20 is placed on the VCSEL 10 by providing a hole in a part of the spacer 27, the extra ultraviolet curable resin 9 contained in the spacer 27 can be discharged. Then, such extra UV curable resin 9 is appropriately removed.

As shown in FIG. 4B, when the hole array 20 is placed so as to cover the VCSEL 10, uniform ultraviolet light is incident on the upper surface plate 21 and the self-formed optical waveguide 24 is formed on the ultraviolet curable resin 9. Form (step S4). Thereby, it is possible to dispose an optical connection device that connects the VCSEL and the optical connector. Irradiation with ultraviolet light takes several seconds to several tens of seconds, depending on the type of propagating light. Even if the self-forming optical waveguide 24 is formed by irradiation with ultraviolet light, the UV-curing resin 9 may be removed because the parts other than the self-forming optical waveguide 24 are uncured, and the uncured portion is cured as it is to form a clad. Also good. However, it is preferable to solidify the clad portion for strength reinforcement. The method for producing the clad does not matter.
Finally, as shown in FIG. 4C, when the self-forming optical waveguide 24 is formed, the cover member 30 is removed (step S5).

  On the other hand, the optical waveguide 24 may be formed directly by a laser beam in addition to the ultraviolet light. For example, a continuous self-forming optical waveguide 24 is formed in a photosensitive medium used instead of the ultraviolet curable resin 9 by irradiating a specific fine laser beam from the hole portion 23. This molding is performed one by one with a laser beam. The self-formed optical waveguide 24 can be formed even with coherent light. By using this method, the waveguide can be locally manufactured. These are expected to reduce the number of parts, share them, and share the manufacturing process.

  In the optical connecting device manufactured as described above, as shown in FIG. 3, the spacer 27 is formed so as to be higher than the wire 10a of the VCSEL 10 mounted on the substrate 1, so that the VCSEL 10 is surrounded. Even if it is attached to, it will not hinder its mounting. A self-forming optical waveguide 24 is formed so as to connect the hole portion 23 formed in the upper surface plate 21 of the hole array 20 and the light emitting portion 10b of the VCSEL 10. Further, in the vicinity of both end portions of the upper surface plate 21, there are provided insertion holes 25 into which positioning pins 5a protruding from the connection surface of the optical connector 5 are inserted. Therefore, when the optical connector 5 is fitted, a self-forming optical waveguide is formed. 24 and the core 7a of the optical fiber 7 of the optical connector 5 are optically optically coupled while being positioned. Thereby, optical coupling can be performed without causing loss of light. Note that the fitting state of the optical connecting device and the optical connector 5 can be maintained, for example, by appropriately providing clips and engaging means.

It is a flowchart in one Embodiment of the manufacturing method of the optical connection apparatus which concerns on this invention. It is a schematic perspective view of a hole array. It is explanatory drawing which shows the coupling | bonding state of an optical connection apparatus and an optical connector. (A)-(c) is explanatory drawing for demonstrating the manufacturing method of the optical connection apparatus which concerns on this invention. It is explanatory drawing which shows the relationship between a light emitting element and an optical connector.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 1a Mounting hole 5 Optical connector 5a Locating pin 7 Optical fiber 7a Core 7b Clad 9 UV curable resin 10 VCSEL
10a wire 10b light emitting portion 20 hole array 21 upper surface plate 23 hole portion 24 self-forming optical waveguide 25 insertion hole 27 spacer 27a guide pin 30 cover member

Claims (7)

In a method for manufacturing an optical connection device for enabling optical connection of a light emitting element mounted on a substrate with an optical connector,
Coating the photosensitive medium so as to cover the entire light emitting element;
A spacer having a height capable of enclosing the light emitting element and not hindering the mounting is provided, and a hole array having a hole portion of a predetermined size on the upper surface side is included in the photosensitive medium. Placing the light emitting element on the light emitting element, and
Forming an optical waveguide in the photosensitive medium by irradiating light including light having a wavelength necessary for curing the photosensitive medium from above the hole array;
A method for manufacturing an optical connecting device, comprising: In the manufacturing method of the optical connection device according to claim 1,
The method of manufacturing an optical connection device, wherein a hole diameter of the hole array is equal to or smaller than a core size of an optical fiber built in an optical connector to be connected. In the manufacturing method of the optical connection device according to claim 1 or 2,
The method of manufacturing an optical connection device, wherein the alignment of the light emitting element and the hole array is performed by monitoring a light emitting surface of the light emitting element. In the manufacturing method of the optical connection device according to claim 1 or 2,
The method of manufacturing an optical connection device, wherein the alignment of the light emitting element and the hole array is performed by a guide pin. In the manufacturing method of the optical connection device given in any 1 paragraph of Claims 1-4,
A transparent cover member is detachably disposed on the upper surface of the hole array, and a light path is formed by irradiating light containing light having a wavelength necessary for curing the photosensitive medium. A method for manufacturing an optical connection device, comprising: removing a member. In the manufacturing method of the optical connection device according to any one of claims 1 to 5,
The method of manufacturing an optical connection device, wherein the optical waveguide is formed so that a core diameter gradually increases from a connection end face side to the optical connector toward the light emitting element side. In the optical connection device for enabling the light emitting element mounted on the substrate to be optically connected to the optical connector,
A hole array that includes a spacer that can surround the light emitting element and has a height that does not hinder its mounting, and has holes formed on its upper surface side;
An optical waveguide formed inside the hole array, the optical waveguide formed in a length from the light emitting portion of the light emitting element to the hole; and
Positioning means for aligning with the optical connector to be connected;
An optical connection device comprising:

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