JP2006225494A - Polypropylene resin, and oriented film made from the same - Google Patents
Polypropylene resin, and oriented film made from the same Download PDFInfo
- Publication number
- JP2006225494A JP2006225494A JP2005040204A JP2005040204A JP2006225494A JP 2006225494 A JP2006225494 A JP 2006225494A JP 2005040204 A JP2005040204 A JP 2005040204A JP 2005040204 A JP2005040204 A JP 2005040204A JP 2006225494 A JP2006225494 A JP 2006225494A
- Authority
- JP
- Japan
- Prior art keywords
- polypropylene
- polypropylene resin
- resin
- resin composition
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
本発明はフッ素系樹脂が添加されたポリプロピレン系樹脂組成物、および該ポリプロピレン系樹脂組成物を延伸してなる、絶縁破壊強度に優れたポリプロピレン延伸フィルムに関する。 The present invention relates to a polypropylene resin composition to which a fluororesin is added, and a polypropylene stretched film excellent in dielectric breakdown strength formed by stretching the polypropylene resin composition.
ポリプロピレンは優れた延伸特性を有することから均一な薄いフィルムとすることが可能であり、その優れた特性を活かして様々な分野で幅広く利用されている。また優れた電気的特性を有することからコンデンサー絶縁フィルムに広く用いられている。コンデンサー絶縁フィルムとしての優れた特性を有するポリプロピレンとしては、立体規則性を向上させるなどの検討(たとえば、特許文献1)がなされている。
コンデンサー絶縁フィルムの分野においては、高温での絶縁破壊電圧の高さが要求される。絶縁破壊は主に電流を運ぶ荷電粒子が、印加によりエネルギーを受けてポリプロピレン分子(原子)と衝突し、原子結合を破壊することによって起こる。原子結合が破壊されるにはある程度の電子密度が必要であるが、荷電粒子が原子と衝突することによって、原子から価電子が飛び出すこと(衝突電離)を繰り返すことにより、電子密度が高まっていく。そのためこれまでは、荷電粒子の発生源となりうる他樹脂を添加するようなことはほとんどなく、触媒残渣を可能な限り減らしたり、結合部分の破壊が起こり難いよう立体規則性を上げて結晶部を増やす等の検討が行われてきた。しかし触媒残渣の低減では、現状すでに30ppm以下とかなり低減されており、これ以上の低減は難しい状況にある。また立体規則性も高過ぎると延伸性が悪くなり、結果的に延伸フィルムの絶縁破壊電圧が低下するという問題があった。今回フッ素系樹脂をポリプロピレに少量添加することにより、ポリプロピレンの絶縁破壊強度が向上することを見出した。本発明の目的は、ポリプロピレンにフッ素系樹脂を添加することにより、絶縁破壊電圧の高いコンデンサー用ポリプロピレン延伸フィルムを提供することにある。 In the field of capacitor insulating films, high dielectric breakdown voltage at high temperatures is required. Dielectric breakdown mainly occurs when charged particles carrying current collide with polypropylene molecules (atoms) upon receiving energy by application and break atomic bonds. A certain amount of electron density is required to break the atomic bond, but the electron density increases by repeating valence electrons from the atom (impact ionization) when the charged particle collides with the atom. . For this reason, until now, there has been almost no addition of other resins that can be the source of charged particles, reducing the catalyst residue as much as possible, and increasing the stereoregularity so that the bond portion is less likely to break down. Consideration such as increasing has been performed. However, in the reduction of the catalyst residue, it has already been considerably reduced to 30 ppm or less at present, and it is difficult to further reduce it. If the stereoregularity is too high, the stretchability is deteriorated, resulting in a problem that the dielectric breakdown voltage of the stretched film is lowered. We have now found that the dielectric breakdown strength of polypropylene is improved by adding a small amount of fluororesin to polypropylene. An object of the present invention is to provide a polypropylene stretched film for a capacitor having a high dielectric breakdown voltage by adding a fluorine-based resin to polypropylene.
(1)灰分含量が30ppm以下、塩素含量が3ppm以下のポリプロピレン系樹脂(A)に、フッ素系樹脂(B)を添加したポリプロピレン系樹脂組成物。
(2)前記ポリプロピレン系樹脂(A)100重量部に対して、前記フッ素系樹脂(B)が0.1〜10重量部添加された請求項1に記載のポリプロピレン系樹脂組成物。
(3)前記ポリプロピレン系樹脂(A)のメルトフローレート(ASTM D1238、230℃、荷重2.16kg)が0.1〜10g/10分、トータルエチレン量が2wt%以下、アイソタクチックインデックス(II)が90%以上である(1)または(2)に記載のポリプロピレン系樹脂組成物。
(4)前記フッ素系樹脂(B)が、フッ化ビニリデン樹脂、塩化3フッ化エチレン樹脂、4フッ化エチレン樹脂、6フッ化プロピレン樹脂からなる群より選ばれる少なくとも1種類を含んでいることを特徴とする(1)または(2)に記載のポリプロピレン系樹脂組成物。
(5)(1)〜(4)のいずれかに記載のポリプロピレン系樹脂組成物を、少なくとも一方向に延伸してなるポリプロピレン延伸フィルム。
(6)コンデンサー用途向けである、(5)に記載のポリプロピレン延伸フィルム。
(1) A polypropylene resin composition obtained by adding a fluorine resin (B) to a polypropylene resin (A) having an ash content of 30 ppm or less and a chlorine content of 3 ppm or less.
(2) The polypropylene resin composition according to claim 1, wherein 0.1 to 10 parts by weight of the fluorine resin (B) is added to 100 parts by weight of the polypropylene resin (A).
(3) Melt flow rate (ASTM D1238, 230 ° C., load 2.16 kg) of the polypropylene resin (A) is 0.1 to 10 g / 10 min, total ethylene amount is 2 wt% or less, isotactic index (II ) Is 90% or more, the polypropylene resin composition according to (1) or (2).
(4) The fluororesin (B) contains at least one selected from the group consisting of vinylidene fluoride resin, ethylene chloride trifluoride resin, tetrafluoroethylene resin, and hexafluoropropylene resin. The polypropylene resin composition as described in (1) or (2), which is characterized.
(5) A stretched polypropylene film obtained by stretching the polypropylene resin composition according to any one of (1) to (4) in at least one direction.
(6) The stretched polypropylene film according to (5), which is for use in a capacitor.
本発明のフッ素系樹脂を添加したポリプロピレン系樹脂組成物を延伸してなるポリプロピレン延伸フィルムを、コンデンサー絶縁フィルムとして使用した場合、優れた絶縁破壊強度が得られる。
When a polypropylene stretched film obtained by stretching a polypropylene resin composition to which the fluororesin of the present invention is added is used as a capacitor insulating film, excellent dielectric breakdown strength can be obtained.
本発明で用いられるポリプロピレン系樹脂(A)のメルトフローレート(ASTM D1238に準拠、測定温度230℃、荷重2.16kgにて測定した値)は0.1〜10g/10分の範囲である。
また、ポリプロピレン系樹脂(A)の灰分含量は好ましくは30ppm以下であり、さらに好ましくは20ppm以下である。またポリプロピレン樹脂(A)の塩素含量は好ましくは3ppm以下であり、さらに好ましくは2ppm以下である。灰分含量が30ppmを超えたり、または塩素含量が3ppmを超えたりすると、導電成分の増加により絶縁破壊強度が低下する恐れがある。
The melt flow rate of the polypropylene resin (A) used in the present invention (based on ASTM D1238, measured at a measurement temperature of 230 ° C. and a load of 2.16 kg) is in the range of 0.1 to 10 g / 10 minutes.
The ash content of the polypropylene resin (A) is preferably 30 ppm or less, and more preferably 20 ppm or less. The chlorine content of the polypropylene resin (A) is preferably 3 ppm or less, more preferably 2 ppm or less. If the ash content exceeds 30 ppm or the chlorine content exceeds 3 ppm, the dielectric breakdown strength may decrease due to an increase in the conductive component.
ポリプロピレン系樹脂(A)は、プロピレン単独重合体、またはプロピレン−エチレン共重合体であり、ポリプロピレン系樹脂(A)に含まれるトータルエチレン量は2wt%以下であり、また、ポリプロピレン系樹脂(A)のアイソタクチックインデックス(II)は90%以上である。トータルエチレン量が2wt%より多くなったり、IIが90%より低下したりすると、結晶性の低下により絶縁破壊強度が低下する恐れがある。 The polypropylene resin (A) is a propylene homopolymer or a propylene-ethylene copolymer, and the total amount of ethylene contained in the polypropylene resin (A) is 2 wt% or less, and the polypropylene resin (A) The isotactic index (II) is 90% or more. If the total ethylene amount is more than 2 wt% or II is less than 90%, the dielectric breakdown strength may be reduced due to the decrease in crystallinity.
本発明で用いられるフッ素系樹脂(B)の添加量は、ポリプロピレン系樹脂(A)100重量部に対して、0.1〜10重量部であり、好ましくは0.2〜10重量部、さらに好ましくは1〜10重量部である。フッ素系樹脂(B)としては、一般的にフッ素原子含有モノマーを重合してなる樹脂であれば何でもよいが、フッ化ビニリデン樹脂、塩化3フッ化エチレン樹脂、4フッ化エチレン樹脂、6フッ化プロピレン樹脂からなる群より選ばれる少なくとも1種類を含んでいることが好ましい。
さらに、本発明におけるポリプロピレン系樹脂組成物には必要に応じて、酸化防止剤や塩酸吸収剤などの安定剤を本発明の効果を損なわない範囲内で添加してもよい。
The addition amount of the fluororesin (B) used in the present invention is 0.1 to 10 parts by weight, preferably 0.2 to 10 parts by weight, more preferably 100 parts by weight of the polypropylene resin (A). Preferably it is 1-10 weight part. As the fluorine-based resin (B), any resin that is generally obtained by polymerizing a fluorine atom-containing monomer may be used, but vinylidene fluoride resin, chloroethylene fluoride resin, tetrafluoroethylene resin, hexafluoride resin. It preferably contains at least one selected from the group consisting of propylene resins.
Furthermore, you may add stabilizers, such as antioxidant and a hydrochloric acid absorber, to the polypropylene resin composition in this invention in the range which does not impair the effect of this invention.
本発明のポリプロピレン系樹脂(A)を得るためにはチタン、マグネシウム、ハロゲンおよび内部添加電子供与性化合物を含む固体状チタン触媒成分と周期律表の第I族、II族、III族から選ばれた金属を含む有機金属化合物および外部添加電子供与性化合物よりなる重合触媒の存在下にプロピレンを重合させて得たポリプロピレンを用いるのが望ましい。 In order to obtain the polypropylene resin (A) of the present invention, a solid titanium catalyst component containing titanium, magnesium, halogen and an internally added electron donating compound and a group I, II or III of the periodic table are selected. It is desirable to use polypropylene obtained by polymerizing propylene in the presence of a polymerization catalyst comprising an organometallic compound containing a metal and an externally added electron donating compound.
重合触媒としては、より具体的には、通常工業的にポリプロピレンを製造するために用いられている触媒が使用される。例えばハロゲン化マグネシウムなどの担体上に三塩化チタンや四塩化チタンを担持したものと有機アルミニウム化合物が用いられる。その中でも特に高活性でチタン成分のもともと少ない触媒を用いることが望ましい。 More specifically, as the polymerization catalyst, a catalyst usually used for industrially producing polypropylene is used. For example, a titanium trichloride or titanium tetrachloride supported on a carrier such as magnesium halide and an organoaluminum compound are used. Among them, it is desirable to use a catalyst having a particularly high activity and a low amount of titanium component.
本発明で用いられるポリプロピレンは、コンデンサー絶縁フィルム用に使用するため、触媒の単位量当りのポリマーの取得量が低い場合には、後処理を行って触媒残渣を除去する必要がある。また、触媒の活性が高くてポリマーの取得量が多い場合でも、後処理を行って触媒残渣を除去することが望ましい。後処理方法としては、重合して得られたポリプロピレンを液状のプロピレン、ブタン、ヘキサンあるいはヘプタンなどで洗浄する。この時、水、アルコール化合物、ケトン化合物、エーテル化合物、エステル化合物、アミン化合物、有機酸化合物、無機酸化合物などを添加してチタンやマグネシウムなどの触媒成分を可溶化して抽出されやすくすることも行われる。さらに水やアルコールなどの極性化合物で洗浄することも好ましい。 Since the polypropylene used in the present invention is used for a capacitor insulating film, when the amount of polymer obtained per unit amount of the catalyst is low, it is necessary to perform post-treatment to remove the catalyst residue. Even when the catalyst activity is high and the amount of polymer obtained is large, it is desirable to perform post-treatment to remove the catalyst residue. As a post-treatment method, the polypropylene obtained by polymerization is washed with liquid propylene, butane, hexane, heptane or the like. At this time, water, alcohol compounds, ketone compounds, ether compounds, ester compounds, amine compounds, organic acid compounds, inorganic acid compounds, etc. may be added to solubilize catalyst components such as titanium and magnesium to facilitate extraction. Done. It is also preferable to wash with a polar compound such as water or alcohol.
さらに上記の重合方法で得られたポリプロピレンを脱ハロゲン処理することにより、特に好ましいポリプロピレン系樹脂(A)を得ることが出来る。 Furthermore, a particularly preferred polypropylene resin (A) can be obtained by dehalogenating the polypropylene obtained by the above polymerization method.
前記脱ハロゲン処理の中でも特にエポキシ化合物を用いた脱ハロゲン処理が好ましい。ここでエポキシ化合物としては、エチレンオキサイド、プロピレンオキサイド、ブテンオキサイド、シクロヘキセンオキサイドなどのアルキレンオキサイドやグリシジルアルコール、グリシジル酸、グリシジルエステルなどが好ましく用いられる。これらのエポキシ化合物を用いてポリマーの脱塩素処理を行う時には、エポキシ化合物と等モル以上のOH基を持った化合物を用いると非常に効果的である。ここでOH基を持った化合物としては、水、アルコール化合物が挙げられる。 Among the dehalogenation treatments, dehalogenation treatment using an epoxy compound is particularly preferable. Here, as the epoxy compound, alkylene oxide such as ethylene oxide, propylene oxide, butene oxide, and cyclohexene oxide, glycidyl alcohol, glycidyl acid, glycidyl ester, and the like are preferably used. When the polymer is dechlorinated using these epoxy compounds, it is very effective to use a compound having an OH group equal to or more than that of the epoxy compound. Examples of the compound having an OH group include water and alcohol compounds.
本発明で用いるポリプロピレン系樹脂組成物を製造するには、原料ポリプロピレン系樹脂、フッ素系樹脂および必要に応じて他の添加剤とを、リボンブレンダー、タンブラーブレンダー、ヘンシェルブレンダー等で混合する。
混合された原料ポリプロピレン系樹脂、フッ素系樹脂および必要に応じて添加されるその他の添加材料は次いで溶融混練することにより、ポリプロピレン系樹脂組成物を得ることが出来る。溶融混練の装置としては、コニーダー、バンバリーミキサー、ブラベンダー、単軸押出機、2軸押出機などの混練機、2軸表面更新機、2軸多円板装置などの横型かく攪拌機またはダブルヘリカルリボン攪拌機などの縦型攪拌機などを採用することが出来る。
溶融混練時の加熱温度が170〜270℃、好ましくは180〜240℃である。この温度範囲で溶融混練すると、原料ポリプロピレン系樹脂が充分に溶融し、フッ素系樹脂との混ざりも良くなり、更に得られるポリプロピレン系樹脂組成物の性状を変化させることがないため好ましい。また溶融混練の時間は、一般に10秒間〜5分間、好ましくは30秒〜60秒間である。
In order to produce the polypropylene resin composition used in the present invention, a raw material polypropylene resin, a fluorine resin, and other additives as necessary are mixed with a ribbon blender, a tumbler blender, a Henschel blender, or the like.
The mixed raw material polypropylene-based resin, fluorine-based resin, and other additive materials added as necessary can then be melt-kneaded to obtain a polypropylene-based resin composition. The melt-kneading equipment includes kneaders, Banbury mixers, Brabenders, single-screw extruders, twin-screw extruders and other kneading machines, twin-screw surface renewal machines, double-shaft multi-disk devices and other horizontal stirrers or double helical ribbons. A vertical stirrer such as a stirrer can be employed.
The heating temperature at the time of melt kneading is 170 to 270 ° C, preferably 180 to 240 ° C. Melting and kneading in this temperature range is preferable because the raw material polypropylene resin is sufficiently melted and mixed with the fluorine resin, and the properties of the resulting polypropylene resin composition are not changed. The melt kneading time is generally 10 seconds to 5 minutes, preferably 30 seconds to 60 seconds.
本発明におけるポリプロピレン系樹脂組成物を少なくとも一方向に延伸してポリプロピレン延伸フィルムを製造する方法としては、特に制限はなく通常のポリプロピレンの延伸フィルムを製造する方法を用いることが出来る。 There is no restriction | limiting in particular as a method of extending | stretching the polypropylene resin composition in this invention at least to one direction, and the method of manufacturing a normal polypropylene stretched film can be used.
このような方法として例えば、まず30mmφの2層Tダイを用い、250℃で厚さ500μmのシートを作成する。こうして得られたシートを154℃で1分間予熱した後、154℃で、延伸速度6m/sで、縦方向に5倍、横方向に7倍の延伸を行い、厚さ15μmのフィルムを得るような方法が挙げられる。
このようにして得られたポリプロピレン延伸フィルムは、絶縁破壊強度に優れており、例えばコンデンサー用途向けに好ましく用いることができる。コンデンサー用途向けに用いる場合には、ポリプロピレン延伸フィルムの絶縁破壊電圧の値は少なくとも600V/μmであることが望ましい。
As such a method, for example, a sheet having a thickness of 500 μm is first prepared at 250 ° C. using a two-layer T die having a diameter of 30 mm. The sheet thus obtained is preheated at 154 ° C. for 1 minute, and then stretched 5 times in the longitudinal direction and 7 times in the transverse direction at a stretching speed of 6 m / s at 154 ° C. to obtain a film having a thickness of 15 μm. The method is mentioned.
The polypropylene stretched film thus obtained is excellent in dielectric breakdown strength and can be preferably used for, for example, a capacitor application. When used for capacitor applications, it is desirable that the value of the dielectric breakdown voltage of the polypropylene stretched film is at least 600 V / μm.
〔実施例〕
絶縁破壊電圧(V/μm)の測定は、23℃または80℃においてJIS−2330に準拠して行った。
〔Example〕
The dielectric breakdown voltage (V / μm) was measured at 23 ° C. or 80 ° C. according to JIS-2330.
灰分含量の定量方法としては、まず100gの試料を磁製の坩堝に入れ、試料を燃焼させた後、さらに電気炉の中で生成した炭素を800℃で完全に燃焼させて、坩堝が恒量となった後、残った灰分の重量を求めて、試料に対する重量百分率によって算出した。 As a method for quantifying the ash content, first, a 100 g sample is put in a magnetic crucible, and the sample is burned, and then the carbon produced in the electric furnace is completely burned at 800 ° C. After that, the weight of the remaining ash was obtained and calculated by the weight percentage with respect to the sample.
アイソタクチックインデックス(II)の測定方法としては、まず1gの試料をソックスレー抽出器に入れ、沸騰n−ヘプタンで10時間抽出する。次にこの試料をアセトンで洗浄後、120℃で6時間乾燥した後その重量を求め、初期の試料量に対する重量百分率によって算出した。 As a method for measuring the isotactic index (II), first, a 1 g sample is put into a Soxhlet extractor and extracted with boiling n-heptane for 10 hours. Next, this sample was washed with acetone and then dried at 120 ° C. for 6 hours, and then its weight was determined and calculated by the weight percentage with respect to the initial sample amount.
塩素含量の定量方法としては、試料をアルゴンガスと酸素ガスの混合気流中で燃焼した後、生成した塩素イオンをイオンクロマトグラフで定量するイオンクロマトグラフ法を使用した。
As a method for quantifying the chlorine content, an ion chromatographic method was used in which the sample was burned in a mixed gas stream of argon gas and oxygen gas, and then the generated chlorine ions were quantified by ion chromatography.
MFRが3g/10分、IIが98%、灰分含量が17ppm、塩素含量が1ppmのプロピレン単独重合体であるポリプロピレン系樹脂Aに、フッ素系樹脂(3M製 ダイナマー FX−5911X;フッ化ビニリデン樹脂、4フッ化エチレン樹脂、および6フッ化プロピレン樹脂の混合物)が0.2phr添加されたポリプロピレン系樹脂組成物を、30mmφの2層Tダイにより、250℃で厚さ500μmのシートを作成した。得られたシートをブルックナー社製2軸延伸機(KARO IV)を用いて、154℃で1分間予熱した後、154℃で延伸速度6m/sで縦方向に5倍、横方向に7倍延伸を行い、厚さ15μmの2軸延伸フィルムを作成した。 Polypropylene resin A, which is a propylene homopolymer having an MFR of 3 g / 10 min, II of 98%, an ash content of 17 ppm, and a chlorine content of 1 ppm, is added to a fluororesin (3M Dynamer FX-5911X; vinylidene fluoride resin, A polypropylene resin composition to which 0.2 phr of a mixture of a tetrafluoroethylene resin and a hexafluoropropylene resin) was added to a sheet having a thickness of 500 μm at 250 ° C. using a 30 mmφ two-layer T die. The obtained sheet was preheated at 154 ° C. for 1 minute using a biaxial stretching machine (KARO IV) manufactured by Bruckner, and then stretched 5 times in the longitudinal direction and 7 times in the transverse direction at a stretching speed of 6 m / s at 154 ° C. And a biaxially stretched film having a thickness of 15 μm was prepared.
上記の方法で得た2軸延伸フィルムの23℃および80℃での絶縁破壊電圧を測定した。結果を表1に示す。 The dielectric breakdown voltage at 23 ° C. and 80 ° C. of the biaxially stretched film obtained by the above method was measured. The results are shown in Table 1.
実施例1で使用したポリプロピレン系樹脂Aに、フッ素系樹脂(3M製 ダイナマー FX−5911X)が0.5phr添加されたポリプロピレン系樹脂組成物を、実施例1と同様の方法で厚さ15μmの2軸延伸フィルムを作成し、この2軸延伸フィルムの23℃および80℃での絶縁破壊電圧を測定した。結果を表1に示す。 A polypropylene resin composition obtained by adding 0.5 phr of a fluororesin (3M Dynamer FX-5911X) to the polypropylene resin A used in Example 1 was prepared in the same manner as in Example 1, but with a thickness of 15 μm. An axial stretched film was prepared, and the dielectric breakdown voltage of this biaxially stretched film at 23 ° C. and 80 ° C. was measured. The results are shown in Table 1.
実施例1で使用したポリプロピレン系樹脂Aに、フッ素系樹脂(3M製 ダイナマー FX−5911X)が1.0phr添加されたポリプロピレン系樹脂組成物を、実施例1と同様の方法で厚さ15μmの2軸延伸フィルムを作成し、この2軸延伸フィルムの23℃および80℃での絶縁破壊電圧を測定した。結果を表1に示す。 A polypropylene resin composition obtained by adding 1.0 phr of a fluororesin (3M Dynamer FX-5911X) to the polypropylene resin A used in Example 1 was prepared in the same manner as in Example 1, but with a thickness of 15 μm. An axial stretched film was prepared, and the dielectric breakdown voltage of this biaxially stretched film at 23 ° C. and 80 ° C. was measured. The results are shown in Table 1.
〔比較例1〕
実施例1で使用したポリプロピレン系樹脂Aに、フッ素系樹脂を添加せずに、実施例1と同様の方法で厚さ15μmの2軸延伸フィルムを作成し、この2軸延伸フィルムの23℃および80℃での絶縁破壊電圧を測定した。結果を表1に示す。
[Comparative Example 1]
A biaxially stretched film having a thickness of 15 μm was prepared in the same manner as in Example 1 without adding a fluororesin to the polypropylene resin A used in Example 1, and this biaxially stretched film was subjected to 23 ° C. and The breakdown voltage at 80 ° C. was measured. The results are shown in Table 1.
フッ素系樹脂が添加されたポリプロピレン系樹脂組成物では、フッ素系樹脂無添加の場合に比べて、絶縁破壊強度の高いポリプロピレン延伸フィルムを得ることができた。またフッ素系樹脂添加量が多い程、絶縁破壊強度も上昇した。
In the polypropylene resin composition to which the fluororesin was added, a polypropylene stretched film having a high dielectric breakdown strength could be obtained as compared with the case where the fluororesin was not added. Moreover, the dielectric breakdown strength increased as the amount of fluorine resin added increased.
Claims (6)
A polypropylene resin composition comprising a fluorine resin (B) added to a polypropylene resin (A) having an ash content of 30 ppm or less and a chlorine content of 3 ppm or less.
The polypropylene resin composition according to claim 1, wherein 0.1 to 10 parts by weight of the fluororesin (B) is added to 100 parts by weight of the polypropylene resin (A).
The polypropylene resin (A) has a melt flow rate (ASTM D1238, 230 ° C., load 2.16 kg) of 0.1 to 10 g / 10 minutes, a total ethylene amount of 2 wt% or less, and an isotactic index (II) of 90. The polypropylene resin composition according to claim 1 or 2, which is at least%.
The fluororesin (B) contains at least one selected from the group consisting of vinylidene fluoride resin, chloroethylene trifluoride resin, tetrafluoroethylene resin, and hexafluoropropylene resin. The polypropylene resin composition according to claim 1 or 2.
A polypropylene stretched film obtained by stretching the polypropylene resin composition according to claim 1 in at least one direction.
The stretched polypropylene film according to claim 5, which is for use in a capacitor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005040204A JP2006225494A (en) | 2005-02-17 | 2005-02-17 | Polypropylene resin, and oriented film made from the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005040204A JP2006225494A (en) | 2005-02-17 | 2005-02-17 | Polypropylene resin, and oriented film made from the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006225494A true JP2006225494A (en) | 2006-08-31 |
Family
ID=36987146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005040204A Pending JP2006225494A (en) | 2005-02-17 | 2005-02-17 | Polypropylene resin, and oriented film made from the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2006225494A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984923A (en) * | 1982-11-04 | 1984-05-16 | Furukawa Electric Co Ltd:The | Production of thermoplastic resin composition containing polytetrafluoroethylene |
JPS62295941A (en) * | 1986-06-16 | 1987-12-23 | Toray Ind Inc | Polypropylene film |
JPH06236709A (en) * | 1992-06-15 | 1994-08-23 | Mitsui Toatsu Chem Inc | High polymer insulating material and molding body using same |
JPH09302036A (en) * | 1996-05-20 | 1997-11-25 | Mitsui Toatsu Chem Inc | Polypropylene and oriented film prepared therefrom |
-
2005
- 2005-02-17 JP JP2005040204A patent/JP2006225494A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984923A (en) * | 1982-11-04 | 1984-05-16 | Furukawa Electric Co Ltd:The | Production of thermoplastic resin composition containing polytetrafluoroethylene |
JPS62295941A (en) * | 1986-06-16 | 1987-12-23 | Toray Ind Inc | Polypropylene film |
JPH06236709A (en) * | 1992-06-15 | 1994-08-23 | Mitsui Toatsu Chem Inc | High polymer insulating material and molding body using same |
JPH09302036A (en) * | 1996-05-20 | 1997-11-25 | Mitsui Toatsu Chem Inc | Polypropylene and oriented film prepared therefrom |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5877879B2 (en) | Polypropylene for film capacitor, polypropylene sheet for film capacitor, production method thereof, and use thereof | |
JP2012521632A (en) | Non-crosslinked polyethylene composition for power cables | |
EP3650497B1 (en) | Fluororubber composition, production method therefor, and molded crosslinked fluororubber article | |
KR20140125727A (en) | Wax content controlled polyethylene, its chlorinated polyethylene and product thereof | |
KR20140125726A (en) | Low particle size polyethylene, its chlorinated polyethylene and pvc composition containing the same | |
CN112574496B (en) | Low-smoke halogen-free flame-retardant cable material and preparation method and application thereof | |
JP5275681B2 (en) | Cable composition and coated cable | |
WO1993021272A1 (en) | Fluoroelastomer-containing resin composition | |
EP2865710A1 (en) | Ionic liquids as catalysts for vulcanising fluororubbers as a substitute for conventional but toxic vulcanisation additives | |
JP5742896B2 (en) | Fluororesin composition containing fluorinated nanodiamond | |
JP2006225494A (en) | Polypropylene resin, and oriented film made from the same | |
JP2015034278A (en) | Fluororesin composition, molten and kneaded material, electric cable, manufacturing method of molten and kneaded material, and manufacturing method of covering material for electric cable | |
JP5429008B2 (en) | Composition, pellet, resin molded article and electric wire, and method for producing composition | |
JP6918734B2 (en) | An uncrosslinked rubber composition, a rubber product produced using the uncrosslinked rubber composition, and a method for producing the same. | |
JPS59184237A (en) | Propylene polymer composition | |
JP2006083253A (en) | Stretched polypropylene film | |
CN113429734A (en) | Novel flame-retardant ABS material and preparation method thereof | |
CN104098790A (en) | Method for improving antioxidant efficiency of antioxidants for polymer materials | |
JP3171612B2 (en) | Biaxially oriented polypropylene film with excellent high-temperature electrical properties | |
JP2011032376A (en) | Flame resistant polyester resin and method for producing the same | |
JPS5966442A (en) | Fluororubber composition | |
US3089860A (en) | Stabilized polyolefin compositions | |
JPS6268843A (en) | Impact-resistant resin composition | |
JP3902025B2 (en) | Method for reclaiming crosslinked polyolefin | |
JP5362312B2 (en) | Conductive resin molding |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20060530 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080215 |
|
RD02 | Notification of acceptance of power of attorney |
Effective date: 20090817 Free format text: JAPANESE INTERMEDIATE CODE: A7422 |
|
A977 | Report on retrieval |
Effective date: 20101105 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101116 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110419 |