JP2006216773A5 - - Google Patents

Download PDF

Info

Publication number
JP2006216773A5
JP2006216773A5 JP2005027837A JP2005027837A JP2006216773A5 JP 2006216773 A5 JP2006216773 A5 JP 2006216773A5 JP 2005027837 A JP2005027837 A JP 2005027837A JP 2005027837 A JP2005027837 A JP 2005027837A JP 2006216773 A5 JP2006216773 A5 JP 2006216773A5
Authority
JP
Japan
Prior art keywords
ultraviolet
adhesive layer
sensitive adhesive
curing
curable pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005027837A
Other languages
Japanese (ja)
Other versions
JP2006216773A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005027837A priority Critical patent/JP2006216773A/en
Priority claimed from JP2005027837A external-priority patent/JP2006216773A/en
Publication of JP2006216773A publication Critical patent/JP2006216773A/en
Publication of JP2006216773A5 publication Critical patent/JP2006216773A5/ja
Pending legal-status Critical Current

Links

Claims (2)

基材とその上に形成された紫外線硬化型粘着剤層とからなり、
該紫外線硬化型粘着剤層の紫外線硬化前の粘着力が１０，０００ｍＮ／２５ｍｍ以上であり、
該紫外線硬化型粘着剤層の粘着力において、被着体に未貼付状態で紫外線硬化した後被着体に貼付して測定した粘着力が１００〜１，０００ｍＮ／２５ｍｍであり、
該紫外線硬化型粘着剤層の紫外線硬化後の２３℃における貯蔵弾性率が１．０×１０8
Ｐａ以上であるダイシングシート。 It consists of a base material and an ultraviolet curable pressure-sensitive adhesive layer formed thereon,
The adhesive force before ultraviolet curing of the ultraviolet curable pressure-sensitive adhesive layer is 10,000 mN / 25 mm or more,
In the adhesive force of the ultraviolet curable pressure-sensitive adhesive layer, the adhesive force measured by being ultraviolet-cured in an unattached state on the adherend and then sticking to the adherend is 100 to 1,000 mN / 25 mm,
The ultraviolet-curing pressure-sensitive adhesive layer has a storage elastic modulus of 1.0 × 10 8 at 23 ° C. after ultraviolet curing.
A dicing sheet that is Pa or higher. 請求項１のダイシングシートを、高低差１００μｍ以上のバンプを有する電子部品集合体のバンプ形成面に貼付し、個別の電子部品にダイシングを行う電子部品の製造方法。   An electronic component manufacturing method in which the dicing sheet according to claim 1 is attached to a bump forming surface of an electronic component assembly having bumps having a height difference of 100 μm or more, and dicing is performed on individual electronic components.
JP2005027837A 2005-02-03 2005-02-03 Dicing sheet and manufacturing method of electronic component Pending JP2006216773A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005027837A JP2006216773A (en) 2005-02-03 2005-02-03 Dicing sheet and manufacturing method of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005027837A JP2006216773A (en) 2005-02-03 2005-02-03 Dicing sheet and manufacturing method of electronic component

Publications (2)

Publication Number Publication Date
JP2006216773A JP2006216773A (en) 2006-08-17
JP2006216773A5 true JP2006216773A5 (en) 2007-12-27

Family

ID=36979728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005027837A Pending JP2006216773A (en) 2005-02-03 2005-02-03 Dicing sheet and manufacturing method of electronic component

Country Status (1)

Country Link
JP (1) JP2006216773A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066336A (en) * 2006-09-04 2008-03-21 Lintec Corp Sheet for machining wafer
CN101506948B (en) * 2006-09-12 2012-12-12 日东电工株式会社 Dicing/die bonding film
JPWO2008132852A1 (en) * 2007-04-19 2010-07-22 積水化学工業株式会社 Dicing die bonding tape and semiconductor chip manufacturing method
JP5324114B2 (en) * 2008-03-27 2013-10-23 リンテック株式会社 Manufacturing method of light emitting module sheet, light emitting module sheet
JP5434747B2 (en) * 2010-03-31 2014-03-05 住友ベークライト株式会社 Dicing film
JP2016192488A (en) * 2015-03-31 2016-11-10 リンテック株式会社 Pressure-sensitive adhesive sheet for semiconductor processing
JP6839925B2 (en) * 2016-03-16 2021-03-10 リンテック株式会社 Semiconductor processing sheet
JP7059553B2 (en) * 2017-10-04 2022-04-26 昭和電工マテリアルズ株式会社 Adhesive tape for stealth dicing, dicing die bonding integrated tape, and method for manufacturing semiconductor devices

Similar Documents

Publication Publication Date Title
JP2006216773A5 (en)
JP2020041119A5 (en) Manufacturing method of reinforcing film and device with reinforcing film
JP2010199541A5 (en)
JP2010199542A5 (en)
JP2008512271A5 (en)
JP2019123884A5 (en)
JP2011228450A5 (en)
JP2015120877A5 (en)
JP2018524425A5 (en)
JP2009035602A5 (en)
WO2008152956A1 (en) Photocurable pressure-sensitive adhesive composition
JP2007197659A5 (en)
JP2010526910A5 (en)
WO2006026665A3 (en) Increasing adhesion in an imprinting procedure
JP2008141026A5 (en)
TW201731137A (en) Bonding layer having discrete adhesive patches
JP2008516121A5 (en)
WO2008076390A3 (en) Dry adhesives and methods for making dry adhesives
JP2006274007A5 (en)
TW200727446A (en) Stack type semiconductor device manufacturing method and stack type electronic component manufacturing method
JP2018009049A5 (en)
JP2010235856A5 (en)
JP2015513599A5 (en)
JP2006216773A (en) Dicing sheet and manufacturing method of electronic component
WO2008088068A1 (en) Fine structure body manufacturing method, fine structure body and micro device