JP2006213887A5 - - Google Patents

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Publication number
JP2006213887A5
JP2006213887A5 JP2005030451A JP2005030451A JP2006213887A5 JP 2006213887 A5 JP2006213887 A5 JP 2006213887A5 JP 2005030451 A JP2005030451 A JP 2005030451A JP 2005030451 A JP2005030451 A JP 2005030451A JP 2006213887 A5 JP2006213887 A5 JP 2006213887A5
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JP
Japan
Prior art keywords
polymer
metal
chain
fixed
metal ion
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Application number
JP2005030451A
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Japanese (ja)
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JP4026647B2 (en
JP2006213887A (en
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Priority to JP2005030451A priority Critical patent/JP4026647B2/en
Priority claimed from JP2005030451A external-priority patent/JP4026647B2/en
Publication of JP2006213887A publication Critical patent/JP2006213887A/en
Publication of JP2006213887A5 publication Critical patent/JP2006213887A5/ja
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Publication of JP4026647B2 publication Critical patent/JP4026647B2/en
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Claims (1)

ポリアルキレンイミン鎖(a)と、親水性ポリマー鎖(b)と、疎水性ポリマー鎖(c)とを有する三元共重合体(X)からなる高分子会合体が分散した水性媒体中に、金属(Y)の塩又はイオン溶液を加えて、前記高分子会合体中のポリアルキレンイミン鎖(a)に金属イオン(Y’)を配位させ、金属イオン(Y’)の自発還元により還元させて金属(Y)を固定化することを特徴とする金属固定高分子会合体の製造方法。 In an aqueous medium in which a polymer aggregate composed of a terpolymer (X) having a polyalkyleneimine chain (a), a hydrophilic polymer chain (b), and a hydrophobic polymer chain (c) is dispersed, adding salt or ionic solution of the metal (Y), the polyalkyleneimine chain (a) a metal ion of the polymer meeting in polymer (Y ') is coordinated to the metal ion (Y' spontaneous - reducing the) A method for producing a metal-fixed polymer aggregate, wherein the metal (Y) is fixed by further reduction.
JP2005030451A 2005-02-07 2005-02-07 Metal-fixed polymer aggregate and method for producing the same Active JP4026647B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005030451A JP4026647B2 (en) 2005-02-07 2005-02-07 Metal-fixed polymer aggregate and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005030451A JP4026647B2 (en) 2005-02-07 2005-02-07 Metal-fixed polymer aggregate and method for producing the same

Publications (3)

Publication Number Publication Date
JP2006213887A JP2006213887A (en) 2006-08-17
JP2006213887A5 true JP2006213887A5 (en) 2007-03-01
JP4026647B2 JP4026647B2 (en) 2007-12-26

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Family Applications (1)

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JP2005030451A Active JP4026647B2 (en) 2005-02-07 2005-02-07 Metal-fixed polymer aggregate and method for producing the same

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JP (1) JP4026647B2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007099930A (en) * 2005-10-05 2007-04-19 Dainippon Ink & Chem Inc Triblock copolymer and method for producing the same
JP4026662B1 (en) * 2006-08-01 2007-12-26 大日本インキ化学工業株式会社 Metal nanoparticle dispersion and method for producing the same
JP4026664B1 (en) * 2006-08-03 2007-12-26 大日本インキ化学工業株式会社 Metal nanoparticle dispersion and method for producing the same
JP2008081545A (en) * 2006-09-26 2008-04-10 Dainippon Ink & Chem Inc Water-based coloring material and powdery coloring material
WO2008143061A1 (en) 2007-05-16 2008-11-27 Dic Corporation Method for production of silver-containing nano-structure, and silver-containing nano-structure
US20110020170A1 (en) * 2008-03-19 2011-01-27 Basf Se Metal nanoparticles stabilized with derivatized polyethyleneimines or polyvinylamines
WO2009157393A1 (en) * 2008-06-23 2009-12-30 Dic株式会社 Electrically conductive ink for reverse printing
JP5553516B2 (en) * 2009-02-24 2014-07-16 ライオン株式会社 Metal ultrafine particle dispersion and method for producing the same
CN102549675B (en) 2009-12-22 2017-06-09 Dic株式会社 conductive paste for screen printing
DE112010004973T5 (en) * 2009-12-22 2013-02-28 Dic Corp. Conductive paste for screen printing
CN102199407B (en) * 2011-03-18 2012-11-28 中科院广州化学有限公司 High-dispersing nanometer silver and high-performance conductive adhesive
WO2014172856A1 (en) 2013-04-24 2014-10-30 Dic Corporation Metal nanoparticle-protecting polymer and metal colloidal solution, and method for producing the same
WO2016093223A1 (en) 2014-12-11 2016-06-16 Dic株式会社 Silver paste, and conductive molded article obtained using same
JP6748999B2 (en) * 2016-08-26 2020-09-02 国立大学法人横浜国立大学 Adhesive composition
JP6811275B2 (en) * 2018-03-22 2021-01-13 富士フイルム株式会社 Compositions for magnetic recording media, magnetic recording / playback devices and magnetic recording media
CN114520066B (en) * 2022-03-29 2024-02-06 衡阳思迈科科技有限公司 Weather-resistant conductive silver paste and preparation method thereof

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