JP2006210801A - Laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated electronic component which increases the adhesion of a terminal electrode to an electronic component element, while maintaining the number of leading electrodes less to attain a high(ESR)equivalent series resistance, and in addition, can prevent defects of short circuiting between internal electrodes and dummy electrodes. <P>SOLUTION: The electrode layers 121-128 of the electronic component element 1 include inner electrodes A1-A8, leading electrodes B1-B8, and dummy electrodes D11-D83, respectively. One end of the leading electrode B1 is connected with the inner electrode A1 of the same layer, and the other electrode of it is led to the side of the electro component element 1, to be connected to a terminal electrode 21. The other leading electrodes B2-B8 are the same as the electrode B1 is. The dummy electrode D1 is located apart from the inner electrode A1 and leading electrode B1 of the same layer, and one end of the dummy electrode D1 is introduced to the side of the electrode component element 1, to be connected with a terminal electrode 23 and has the same polarity to the inner electrode A1 of the same layer, and likewise for the other dummy electrodes D12-D83. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a laminated electronic component having a plurality of terminal electrodes.

  In a power supply for a central processing unit (CPU) mounted on a digital electronic device, the load current is increasing while the voltage is lowered. Accordingly, it has become very difficult to keep the fluctuation of the power supply voltage within an allowable value with respect to a sudden change in the load current, so that a multilayer capacitor called a decoupling capacitor has been connected to the power supply. When the load current changes transiently, a current is supplied from the multilayer capacitor to the CPU to suppress fluctuations in the power supply voltage.

  In recent years, as the operating frequency of the CPU is further increased, the load current is increased at a higher speed. Therefore, a multilayer capacitor used as a decoupling capacitor is required to increase the equivalent series resistance (ESR).

  In the multi-terminal multilayer capacitor disclosed in Patent Document 1, the internal electrodes of each layer of the ceramic body are provided with lead electrodes for connection to the terminal electrodes, and these lead electrodes are provided on the side surfaces of the ceramic base body. Has been derived. The terminal electrode is formed on the side surface of the ceramic body by plating or the like, and is joined to the lead electrode.

  In this type of multilayer capacitor, in order to obtain a high ESR, it is necessary to reduce the number of layers and the number of extraction electrodes provided in each layer.

  In the multilayer capacitor, it is also necessary to increase the adhesion of the terminal electrode to the multilayer capacitor body from the viewpoint of preventing the terminal electrode from peeling off due to thermal shock. As the technique, a structure in which a plurality of extraction electrodes are provided on one internal electrode to increase the number of extraction electrodes and the number of junctions of the extraction electrodes with respect to each terminal electrode is increased as in the technique described in Patent Document 1. Can be considered.

  However, with this structure, the number of extraction electrodes increases, which prevents high ESR.

Furthermore, the multilayer capacitor disclosed in Patent Document 1 includes a structure in which an internal electrode and a dummy electrode having a different polarity with respect to the internal electrode are provided in the same layer. For this reason, there is a possibility that a short circuit failure may occur between the internal electrode and the dummy electrode of the same layer and different polarity.
Japanese Patent Laid-Open No. 2004-40084

  An object of the present invention is to increase the adhesion of a terminal electrode to an electronic component element body while maintaining a small number of lead electrodes in order to achieve a high ESR, and to prevent a short circuit failure between an internal electrode and a dummy electrode. It is to provide a laminated electronic component that can be prevented.

  In order to solve the above-described problems, a multilayer electronic component according to the present invention includes an electronic component element body and terminal electrodes provided on side surfaces of the electronic component element body.

  The electronic component body includes a plurality of electrode layers stacked with a ceramic layer interposed therebetween, and the electrode layer includes an internal electrode, a lead electrode, and a dummy electrode.

  One end of the lead electrode is connected to the internal electrode of the same layer, and the other end is led out to the side surface of the electronic component element body and connected to the terminal electrode.

  The dummy electrode is disposed at a distance from the internal electrode and the extraction electrode of the same layer, and one end is led out to the side surface of the electronic component element body and connected to the terminal electrode, and the relationship with the internal electrode of the same layer It is the same polarity.

  The laminated electronic component according to the present invention described above includes an electronic component element body and terminal electrodes provided on the side surfaces of the electronic component element body. The electronic component body includes a plurality of electrode layers stacked with a ceramic layer interposed therebetween. Therefore, the basic structure of the laminated electronic component can be obtained.

  The electrode layer includes an internal electrode and a lead electrode. One end of the extraction electrode is connected to the internal electrode of the same layer, and the other end is led out to the side surface of the electronic component element body and connected to the terminal electrode. Therefore, a basic electric circuit from the terminal electrode on the side surface of the electronic component body to the internal electrode through the extraction electrode can be obtained.

  The electrode layer further includes a dummy electrode, and one end of the dummy electrode is led out to the side surface of the electronic component element body and connected to the terminal electrode. Therefore, in addition to the connection structure with the lead electrode, the terminal electrode is provided with a connection structure with the dummy electrode, and the terminal electrode is brought into close contact with the electronic component body through the connection structure with the dummy electrode. The Therefore, it is possible to increase the adhesion of the terminal electrode to the electronic component element body while maintaining a small number of extraction electrodes in order to achieve high ESR.

  In addition, since the dummy electrode has the same polarity in relation to the internal electrode in the same layer, a short circuit failure between the internal electrode and the dummy electrode is prevented. The polarity of the dummy electrode is determined according to the polarity of the terminal electrode connected to the dummy electrode.

  Preferably, at least one of the electrode layers is provided with a plurality of dummy electrodes, the dummy electrodes are arranged at a distance from the internal electrode and the extraction electrode of the same layer, and one end is led out to the side surface of the electronic component element body. Are connected to the terminal electrode and have the same polarity in relation to the internal electrode in the same layer. According to this configuration, it is possible to prevent a short circuit failure between the internal electrode and the dummy electrode while further increasing the adhesion of the terminal electrode to the electronic component element body.

  Preferably, a plurality of the terminal electrodes are provided on the side surface of the electronic component element body, and adjacent terminal electrodes on the side surface of the electronic component element body have different polarities. According to such a configuration, ESL (equivalent series inductance) can be reduced.

  Preferably, the electronic component element body includes a dummy electrode layer on an outer layer as viewed from the electrode layers laminated with a ceramic layer interposed therebetween. The dummy electrode layer includes a second dummy electrode, and one end of the second dummy electrode is led out to a side surface of the electronic component element body and connected to the terminal electrode. According to this configuration, the terminal electrode is provided with a connection structure with the second dummy electrode in addition to the connection structure with the dummy electrode, thereby further increasing the adhesion of the terminal electrode to the electronic component body. Can be made.

  More preferably, at least one of the dummy electrode layers includes a plurality of second dummy electrodes, and one end of each of the second dummy electrodes is led out to a side surface of the electronic component element body and connected to the terminal electrode. And have the same polarity. According to this configuration, it is possible to prevent a short circuit failure between the second dummy electrodes while further increasing the adhesion of the terminal electrode to the electronic component element body.

  As described above, according to the present invention, the adhesion of the terminal electrode to the electronic component body is increased while maintaining a small number of lead electrodes so as to achieve a high ESR, and the internal electrode, the dummy electrode, It is possible to provide a laminated electronic component that can prevent a short circuit failure between the two.

  FIG. 1 is an external perspective view showing an embodiment of a multilayer electronic component according to the present invention. As illustrated, the multilayer electronic component according to the present invention includes a multilayer electronic component element body 1 and terminal electrodes 21 to 28. In the illustrated embodiment, the present invention is applied to a multilayer ceramic capacitor, but can also be applied to other multilayer electronic components such as a multilayer inductor.

  The terminal electrodes 21 to 28 are provided on the side surface of the multilayer electronic component body 1. More specifically, the multilayer electronic component element body 1 has a substantially rectangular parallelepiped shape, and the terminal electrodes 21 to 24 are provided on one side surface 101 of the multilayer electronic component element body 1. These terminal electrodes 21 to 24 are arranged on the side surface 101 at intervals in the length direction X, and adjacent terminal electrodes have different polarities. Specifically, the terminal electrodes 21 and 23 are negative electrodes, and the terminal electrodes 22 and 24 are positive electrodes.

  Similarly, the terminal electrodes 25 to 28 are provided on the other side surface 102 of the multilayer electronic component body 1. These terminal electrodes 25 to 28 are arranged on the side surface 102 at intervals in the length direction X, and adjacent terminal electrodes have different polarities. Specifically, the terminal electrodes 25 and 27 are negative electrodes, and the terminal electrodes 26 and 28 are positive electrodes.

  The terminal electrodes 21 to 28 can be formed of a single layer or a multilayer plating film on a base film obtained by applying and baking a conductive paste on the multilayer electronic component element body 1. The base film is composed mainly of Cu or Ag, for example, and the plating film is composed of, for example, a Ni / Sn multilayer plating film.

  FIG. 2 is a schematic view showing a cross section taken along line 2-2 of FIG. As illustrated, the multilayer electronic component body 1 includes a plurality of electrode layers 121 to 128 that are stacked with a ceramic layer interposed therebetween. More specifically, the multilayer electronic component element body 1 includes an inner layer portion 12, a first outer layer portion 11 located above the inner layer portion 12, and a second outer layer portion 13 located below the inner layer portion 12. The electrode layers 121 to 128 are disposed on the inner layer portion 12 of the multilayer electronic component body 1. The ceramic layer is made of, for example, a dielectric layer mainly composed of barium titanate, and the electrode layers 121 to 128 are made of, for example, Ni.

  FIG. 3 is a schematic diagram illustrating the configuration of the electrode layers 121 to 128. As illustrated, the electrode layers 121 to 128 include internal electrodes A1 to A8, lead electrodes B1 to B8, and dummy electrodes D11 to D83. Hereinafter, the electrode layers 121 to 128 will be sequentially described.

  First, the electrode layer 121 will be described. The electrode layer 121 includes an internal electrode A1 and an extraction electrode B1. The internal electrode A1 is provided so as to face the internal electrode A2 of the electrode layer 122 with the ceramic layer interposed therebetween, and functions as a capacitance electrode. One end of the extraction electrode B1 is connected to the internal electrode A1 in the same layer, and the other end is led out to one side surface of the electronic component element body and connected to the terminal electrode 21. Therefore, the internal electrode A1 is electrically connected to the terminal electrode 21 via the lead electrode B1, and has the same polarity as the terminal electrode 21, that is, a negative electrode.

  The electrode layer 121 further includes dummy electrodes D11 to D13. The dummy electrodes D11 to D13 are respectively arranged at an interval from the internal electrode A1 and the extraction electrode B1 in the same layer. Further, these dummy electrodes D11 to D13 are connected to a terminal electrode selected from among the terminal electrodes 21 to 28 so as to have the same polarity in relation to the internal electrode A1 in the same layer. More specifically, the internal electrode A1 is a negative electrode, and one end of the dummy electrode D11 is led out to one side surface of the electronic component body and is connected to the negative terminal electrode 23. One end of each of the dummy electrodes D12 and D13 is led out to the other side surface of the electronic component body, and is connected to the negative terminal electrodes 25 and 27, respectively.

  Next, the electrode layer 122 will be described. The electrode layer 122 includes an internal electrode A2 and a lead electrode B2. The internal electrode A2 is provided so as to face the internal electrode A1 of the electrode layer 121 and the internal electrode A3 of the electrode layer 123 with the ceramic layer interposed therebetween, and functions as a capacitance electrode. One end of the extraction electrode B2 is connected to the internal electrode A2 in the same layer, and the other end is led out to one side surface of the electronic component element body and connected to the terminal electrode 22. Therefore, the internal electrode A2 is electrically connected to the terminal electrode 22 via the lead electrode B2, and has the same polarity as the terminal electrode 22, that is, a positive electrode.

  The electrode layer 122 further includes dummy electrodes D21 to D23, and the dummy electrodes D21 to D23 are disposed at a distance from the internal electrode A2 and the extraction electrode B2 in the same layer, respectively. Furthermore, these dummy electrodes D21 to D23 are connected to a terminal electrode selected from among the terminal electrodes 21 to 28 so as to have the same polarity in relation to the internal electrode A2 in the same layer. More specifically, the internal electrode A2 is a positive electrode, and one end of the dummy electrode D21 is led out to one side surface of the electronic component element body and connected to the positive terminal electrode 24. One end of each of the dummy electrodes D22 and D23 is led out to the other side surface of the electronic component element body, and is connected to the positive terminal electrodes 26 and 28, respectively.

  Hereinafter, the same applies to the electrode layers 123 to 128, and in the description thereof, redundant description is omitted as much as possible.

  The electrode layer 123 will be described. The internal electrode A3 is electrically connected to the terminal electrode 23 via the lead electrode B3, and has the same polarity as the terminal electrode 23, that is, a negative electrode. The dummy electrodes D31 to D33 are respectively connected to the negative terminal electrodes 21, 25, and 27 so as to have the same polarity in relation to the internal electrode A3 in the same layer.

  Next, the electrode layer 124 will be described. The internal electrode A4 is electrically connected to the terminal electrode 24 through the extraction electrode B4, and has the same polarity as the terminal electrode 24, that is, a positive electrode. The dummy electrodes D41 to D43 are respectively connected to the positive terminal electrodes 22, 26, and 28 so as to have the same polarity in relation to the internal electrode A4 in the same layer.

  Next, the electrode layer 125 will be described. The internal electrode A5 is electrically connected to the terminal electrode 25 through the extraction electrode B5, and has the same polarity as the terminal electrode 25, that is, a negative electrode. The dummy electrodes D51 to D53 are respectively connected to the negative terminal electrodes 21, 23 and 27 so as to have the same polarity in relation to the internal electrode A5 in the same layer.

  Next, the electrode layer 126 will be described. The internal electrode A6 is electrically connected to the terminal electrode 26 via the extraction electrode B6, and has the same polarity as the terminal electrode 26, that is, a positive electrode. The dummy electrodes D61 to D63 are respectively connected to the positive terminal electrodes 22, 24, and 28 so as to have the same polarity in relation to the internal electrode A6 in the same layer.

  Next, the electrode layer 127 will be described. The internal electrode A7 is electrically connected to the terminal electrode 27 via the lead electrode B7, and has the same polarity as the terminal electrode 27, that is, a negative electrode. The dummy electrodes D71 to D73 are respectively connected to the negative terminal electrodes 21, 23 and 25 so as to have the same polarity in relation to the internal electrode A7 in the same layer.

  Finally, the electrode layer 128 will be described. The internal electrode A8 is electrically connected to the terminal electrode 28 via the extraction electrode B8, and has the same polarity as the terminal electrode 28, that is, a positive electrode. The dummy electrodes D81 to D83 are respectively connected to the positive terminal electrodes 22, 24, and 26 so as to have the same polarity in relation to the internal electrode A8 in the same layer.

  As described with reference to FIGS. 1 and 2, the multilayer electronic component according to the present invention includes the multilayer electronic component element body 1 and terminal electrodes 21 to 28 provided on the side surfaces of the electronic component element body 1. It is out. The electronic component body 1 includes a plurality of electrode layers 121 to 128 stacked with a ceramic layer interposed therebetween. Therefore, the basic structure of the laminated electronic component can be obtained.

  Further, as described with reference to FIG. 3, the electrode layers 121 to 128 include internal electrodes A1 to A8 and lead electrodes B1 to B8. Each of these lead electrodes has one end connected to the internal electrode of the same layer, and the other end led out to the side surface of the electronic component body 1 and connected to the selected terminal electrode. For example, one end of the extraction electrode B1 is connected to the internal electrode A1 in the same layer, and the other end is led out to the side surface of the electronic component element body 1 and connected to the terminal electrode 21. The same applies to the other lead electrodes B2 to B8. Therefore, basic electric circuits are obtained from the terminal electrodes 21 to 28 on the side surfaces of the electronic component body to the internal electrodes A1 to A8 via the extraction electrodes B1 to B8, respectively.

  The electrode layers 121 to 128 further include dummy electrodes D11 to D83. One end of each of these dummy electrodes is led out to the side surface of the electronic component body 1 and connected to the selected terminal electrode. . For example, each of the dummy electrodes D31, D51, and D71 has one end led out to the side surface of the electronic component body 1 and connected to the terminal electrode 21. Accordingly, the terminal electrode 21 is provided with a connection structure with the dummy electrodes D31, D51, and D71 in addition to the connection structure with the extraction electrode B1, and the terminal electrode 21 is provided with a connection structure with the dummy electrode. To the electronic component body 1. The same applies to the other terminal electrodes 22 to 28. Therefore, it is possible to increase the adhesion of the terminal electrode to the electronic component element body while maintaining a small number of extraction electrodes in order to achieve high ESR.

  Moreover, the dummy electrodes D11 to D83 have the same polarity in relation to the internal electrodes in the same layer. For example, the dummy electrodes D11 to D13 have the same polarity, that is, the negative electrode in view of the relationship with the internal electrode A1 (negative electrode) in the same layer. Therefore, a short circuit failure between the internal electrode A1 and the dummy electrodes D11 to D13 is prevented. The same applies to the other internal electrodes A2 to A8.

  In the illustrated embodiment, eight terminal electrodes 21 to 28 and eight electrode layers 121 to 128 are provided. However, the present invention is not limited to such a configuration. The number and the number of electrode layers can each be any number of 2 or more. This will be clear from the fact that, for example, even in a configuration including only two terminal electrodes and two electrode layers, the same effect can be obtained.

  In the illustrated embodiment, each of the electrode layers 121 to 128 includes an internal electrode, a lead electrode, and a dummy electrode. However, the present invention is not limited to such a configuration. This will be apparent from the fact that, for example, even in a configuration in which at least one of the electrode layers 121 to 128 does not include a dummy electrode, the same effect can be obtained.

  Further, as described with reference to FIG. 1, the terminal electrodes 21 to 24 provided on the one side surface 101 of the multilayer electronic component element body 1 have adjacent terminal electrodes having different polarities. The same applies to the terminal electrodes 25 to 28 provided on the other side surface 102. According to such a configuration, ESL (equivalent series inductance) can be reduced.

  The description will be continued with reference to FIGS. 1 and 2 again. The multilayer electronic component element body 1 includes two sets of dummy electrode layers 111 to 11n and 131 to 13n on the outer layer as viewed from the electrode layers 121 to 128 laminated with the ceramic layer interposed therebetween. Specifically, one set of dummy electrode layers 111 to 11n is disposed on the first outer layer portion 11 located in an upper layer as viewed from the inner layer portion 12, and another set of dummy electrode layers 131 to 13n is disposed on the inner layer portion 12. The second outer layer portion 13 is positioned in the lower layer when viewed from the side. The dummy electrode layer is made of, for example, Ni, and is laminated with a ceramic layer interposed therebetween. Hereinafter, the dummy electrode layers 111 to 11n arranged in the first outer layer portion 11 will be representatively described.

  FIG. 4 is a schematic diagram showing the configuration of the dummy electrode layers 111 to 11n. As illustrated, the dummy electrode layers 111 to 11n include second dummy electrodes E11 to En4.

  First, the dummy electrode layer 111 will be described. The dummy electrode layer 111 includes second dummy electrodes E11 to E14. One end of each of the second dummy electrodes E11 to E14 is led out to the side surface of the electronic component body 1, and the terminal electrodes 21 to 28 are connected to each other. It is connected to the selected terminal electrode. Preferably, the second dummy electrodes E11 to E14 are configured to have the same polarity. As an example of such a configuration, the second dummy electrodes E11 and E12 are led out to one side surface of the electronic component body 1 and connected to the positive terminal electrodes 22 and 24, respectively, and the second dummy electrodes E13 and E14 are connected. Is led out to the other side surface of the electronic component body 1 and connected to the positive terminal electrodes 26 and 28, respectively.

  Next, the dummy electrode layer 112 will be described. The dummy electrode layer 112 includes second dummy electrodes E21 to E24. One end of each of the second dummy electrodes E21 to E24 is led out to the side surface of the electronic component body 1, and the terminal electrodes 21 to 28 are connected to each other. It is connected to the selected terminal electrode. Preferably, the second dummy electrodes E21 to E24 are configured to have the same polarity. As an example of such a configuration, the second dummy electrodes E21 and E22 are led out to one side surface of the electronic component element body 1 and connected to the negative terminal electrodes 21 and 23, respectively, and the second dummy electrodes E23 and E24 are connected. Is led out to the other side surface of the electronic component body 1 and connected to the negative terminal electrodes 25 and 27, respectively.

  Hereinafter, the dummy electrode layers 113 to 11n can have the same configuration. For example, of the dummy electrode layers 113 to 11n, an odd reference layer may have the same configuration as the dummy electrode layer 111, and an even reference layer may have the same configuration as the dummy electrode layer 112.

  Further, the dummy electrode layers 131 to 13n of the second outer layer portion 13 can also have the same configuration as the dummy electrode layers 111 to 11n of the first outer layer portion 11. For example, the dummy electrode layers 131 to 13n can have the same configuration as the dummy electrode layers 11n to 111, respectively, and a symmetrical configuration can be secured with the electrode layers 121 to 128 of the inner layer portion 12 interposed therebetween.

  Further, the number of dummy electrode layers arranged in the first outer layer portion 11 and the number of dummy electrode layers arranged in the second outer layer portion 13 can each take any number.

  In the illustrated embodiment, each of the dummy electrode layers has a configuration in which only the second dummy electrodes having the same polarity are provided, but the present embodiment is not limited to such a configuration. For example, one layer of the dummy electrode layer may include both the positive second dummy electrode and the negative second dummy electrode. That is, one layer of the dummy electrode layer may include both the second dummy electrode connected to the positive terminal electrode and the second dummy electrode connected to the negative terminal electrode.

  Although the contents of the present invention have been specifically described with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.

1 is an external perspective view showing an embodiment of a multilayer electronic component according to the present invention. It is a schematic diagram which shows the cross section along the 2-2 line of FIG. It is a schematic diagram which shows the structure of an electrode layer. It is a schematic diagram which shows the structure of a dummy electrode layer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laminated electronic component element body 121-128 Electrode layer 21-28 Terminal electrode

Claims (5)

A laminated electronic component including an electronic component element body and a terminal electrode provided on a side surface of the electronic component element body,
The electronic component body includes a plurality of electrode layers stacked with a ceramic layer in between, and the electrode layer includes an internal electrode, a lead electrode, and a dummy electrode,
One end of the lead electrode is connected to the internal electrode of the same layer, and the other end is led to the side surface of the electronic component element body and connected to the terminal electrode.
The dummy electrode is disposed at a distance from the internal electrode and the extraction electrode of the same layer, and one end is led out to the side surface of the electronic component element body and connected to the terminal electrode, and the relationship with the internal electrode of the same layer It ’s the same polarity,
Laminated electronic components. The multilayer electronic component according to claim 1,
In at least one of the electrode layers, a plurality of dummy electrodes are provided, and these dummy electrodes are arranged at a distance from the internal electrode and the extraction electrode of the same layer, and one end is led out to the side surface of the electronic component element body, It is connected to the terminal electrode and has the same polarity in relation to the internal electrode in the same layer.
Laminated electronic components. A laminated electronic component according to claim 1 or 2,
A plurality of the terminal electrodes are provided on the side surface of the electronic component element body, and adjacent terminal electrodes on the side surface of the electronic component element body are different from each other.
Laminated electronic components. The multilayer electronic component according to any one of claims 1 to 3,
The electronic component body includes a dummy electrode layer on an outer layer as viewed from the electrode layer laminated with a ceramic layer in between,
The dummy electrode layer includes a second dummy electrode, and one end of the second dummy electrode is led out to a side surface of the electronic component element body and connected to the terminal electrode.
Laminated electronic components. The multilayer electronic component according to claim 3,
At least one of the dummy electrode layers includes a plurality of second dummy electrodes. One end of each of the second dummy electrodes is led out to the side surface of the electronic component element body and connected to the terminal electrode. The same polarity,
Laminated electronic components.

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