JP2006210445A - Wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the happening of the situation where an exothermic component contacts a non-heat generating component or approaches excessively and the performance, etc. of the exothermic component is spoiled, even if it is the case where the exothermic component falls by assuming beforehand that the exothermic component falls. <P>SOLUTION: In a wiring board A having a thermistor 2 which is the exothermic component, and a cylindrical electrolytic capacitor 4 which is a non-heat generating component; the ring unit 61 of an exothermic component catching member 6 is engaged into the electrolytic capacitor 4, and its projecting piece 62 is made to dispose in face to face with the thermistor 2. When the thermistor 2 falls on the electrolytic capacitor 4 side, the projecting piece 62 catches the thermistor 2 so that it is made not to contact the electrolytic capacitor 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wiring board, particularly a wiring board used in a television receiver, in which a heating component such as a thermistor and a non-heating component such as an electrolytic capacitor are arranged close to each other. The present invention relates to a wiring board on which measures are taken to prevent the occurrence of a situation in which a component performance or the like is deteriorated due to falling to a heat generating component side.

  In this type of wiring board, the layout of heat-generating parts and non-heat-generating parts has been devised to ensure the required separation distance between the two parts. If the density of mounting is promoted, it is difficult to secure a necessary separation distance only with a layout. Therefore, there are cases where measures are taken such as arranging a connector having a partition function between the heat-generating component and the non-heat-generating component, and measures such as covering the heat-generating component with a rubber tube.

On the other hand, conventionally, various countermeasures have been proposed for making it difficult for electronic components mounted on a wiring board to fall over (for example, see Patent Documents 1 to 5). Among those proposed in Patent Documents 1 to 5, the one described in Patent Document 1 is to prevent direct contact between components by covering an insulating bush on a semiconductor device. The one described in 2 is to support the lead wire of the heat generating element with a fixture, and the one described in Patent Document 3 is to support the power IC with a metal fitting made of sheet metal. The described one holds the disciplined attitude of the electronic component by the electronic component base, and the one described in Patent Document 5 causes the projection of the chassis to which the printed circuit board is attached to protrude above the wiring substrate. Thus, the standing posture of the LED mounted on the wiring board is maintained.
Japanese Utility Model Publication No. 58-196849 Japanese Utility Model Publication No. 63-12873 Japanese Patent Laid-Open No. 5-67891 JP-A-8-83968 JP-A-8-191192

  However, it is necessary to change the circuit pattern of the wiring board in the case where a connector having a partition function is provided between the heat generating component and the non-heat generating component described above, and the rubber tube is compared in the case where the heat generating component is covered with the rubber tube. It is expensive because it is expensive. In addition, all of the measures described in each of the above patent documents are intended to prevent the electronic components from falling down by maintaining the standing posture of the electronic components.

  The present invention has been made under the above circumstances, and it is assumed in advance that the heat generating component falls, and even if the heat generating component falls, the heat generating component may come into contact with the non-heat generating component. It is an object of the present invention to provide a wiring board that makes it possible to prevent a situation in which component performance or the like is impaired due to excessive proximity without relying on means for changing the component layout.

  Another object of the present invention is to provide a wiring board that can achieve the above object without increasing the basic cost when the wiring board is attached to a resin chassis.

  In the wiring board according to the present invention, in the wiring board in which the heat-generating component and the non-heat-generating component are mixedly mounted, the heat-generating component is received by the non-heat-generating component of the heat-generating component and the non-heat-generating component that are disposed in close proximity. The heat generating component receiving means for preventing the heat generating component from falling to the non heat generating component side and coming into contact with the non heat generating component is attached to the non heat generating component.

  When this configuration is adopted, the heat-generating component that has fallen to the non-heat-generating component side is received by the heat-generating component receiving means mounted on the non-heat-generating component and is prevented from coming into contact with the non-heat-generating component. Therefore, even if the heat-generating component falls to the non-heat-generating component, there is no room for occurrence of a situation in which the heat-generating component contacts the non-heat-generating component and the component performance is impaired. Further, since it is only necessary to mount the heat generating component receiving means on the non-heat generating component, it is not necessary to change the component layout.

  In the present invention, it is desirable that the heat generating component receiving means is integrally formed so as to be separable with resin together with a resin chassis to which the wiring board is attached. According to this, when the resin chassis is molded, the heat generating component receiving means is simultaneously molded together with the resin chassis, and after the molding, the heat generating component receiving means is separated from the resin chassis and attached to the non-heat generating component. This eliminates the need to manufacture heat-generating parts receiving means and prevents the basic cost from increasing, preventing the heat-generating parts from contacting non-heat-generating parts and impairing the performance of the parts. It becomes possible.

  In the present invention, it is desirable that the heat generating component receiving means includes a ring portion fitted to the non-heat generating component and a projecting piece portion protruding from the ring portion toward the heat generating component side. Compared to the case where the entire part is formed in a large diameter and the protruding piece part is omitted, the space occupied by the heat generating part receiving means can be reduced, and the degree of freedom of layout of other parts is increased accordingly. There is an advantage that it is easy to further increase the mounting density.

  In the present invention, it is possible to adopt a configuration in which the heat generating component is a thermistor and the non-heat generating component is an electrolytic capacitor. In this configuration, a demagnetizing coil provided with a thermistor is interposed in the primary circuit, particularly as a wiring board used in a television receiver, and an electrolytic capacitor of the secondary circuit is provided close to the thermistor. This is useful for such a wiring board.

  In the wiring board according to the present invention, a thermistor that is a heat-generating component and a columnar electrolytic capacitor that is a non-heat-generating component are attached to a resin chassis in a wiring board in which a heat-generating component and a non-heat-generating component are mixedly mounted. The ring portion of the heat generating component receiving means that is disposed in proximity on the wiring board, and is integrally formed with the resin chassis so as to be separable by resin, and includes a ring portion and a protruding piece portion protruding from the ring portion. Is attached to the non-heat-generating component and the protruding piece is opposed to the heat-generating component, so that the heat-generating component that has fallen toward the non-heat-generating component is received by the protruding piece and the heat-generating component becomes a non-heat-generating component. It is configured to prevent contact, and the ring portion of the heat generating component receiving means is formed in a C shape having a notch portion and capable of holding the electrolytic capacitor. Effect of the present invention to be further embodied by adopting the cormorants configuration will be described in detail with reference to the embodiments described hereinafter.

  As described above, in the wiring board according to the present invention, the heat-generating component receiving means mounted on the non-heat-generating component such as an electrolytic capacitor receives the heat-generating component that has fallen toward the non-heat-generating component and contacts the non-heat-generating component. Since it has a function of preventing heat generation components from contacting non-heat generation components, component performance such as short-circuiting due to inability to maintain the insulation distance, destruction due to abnormal temperature rise of non-heat generation components, etc. To be prevented. Therefore, for the producer, it is possible to prevent the deterioration of the component performance due to the fall of the heat generating component without changing the component layout or the circuit pattern, and the user avoids the performance degradation and danger due to the fall of the heat generating component. As a result, the effect of improving safety can be obtained. Further, if the heat generating component receiving means is manufactured by being molded so as to be cut off integrally with the resin chassis, there is an advantage that a basic cost increase does not occur.

  1 is a partial perspective view of a wiring board A according to an embodiment of the present invention, FIG. 2 is a side view for explaining the operation of the present invention, and FIG. 3 is a view taken in the direction of arrow III in FIG.

  FIG. 1 shows a wiring board A used in an AV multifunction device such as a video integrated television receiver and a DVD integrated television receiver. The wiring board A in the example is superimposed on the resin chassis 5 and attached to the resin chassis 5 using mounting screws 51. The wiring board A includes a primary circuit and a secondary side. A circuit pattern (not shown) is formed. The primary circuit includes a thermistor 2 as a heat-generating component mounted on the wiring board A and a connector 3 to which a demagnetizing coil (not shown) is connected, whereas the secondary circuit An electrolytic capacitor 4 and the like mounted on the wiring board A are interposed.

  The thermistor 2 has the function of changing its electrical resistance value by raising the temperature to, for example, 185 ° C. or more when the power is turned on when the lead pin 21 is soldered to the primary circuit of the wiring board A. In the vicinity of the electrolytic capacitor 4 as a non-heat generating component, it is provided. This is because there is a demand for higher density of component mounting accompanying the reduction in size of the wiring board A. On the other hand, the electrolytic capacitor 4 has a cylindrical outer shape, and when the thermistor 2 comes into contact or is too close, the performance of the parts is impaired, and in some cases, the explosion is caused by abnormal temperature rise. There is a fear.

  Therefore, in this embodiment, it is assumed in advance that the lead pin 21 of the thermistor 2 as a heat generating component is bent and falls to the electrolytic capacitor 4 side as a non-heat generating component. Even so, the electrolytic capacitor 4 is protected by taking measures such that the thermistor 2 does not come into contact with or too close to the electrolytic capacitor 4 so that the component performance of the electrolytic capacitor 4 is not impaired or ruptured. It is.

  That is, as shown in FIG. 1, a resin heat-generating component that integrally includes a ring portion 61 and a protruding piece portion 62 protruding from one circumferential direction of the ring portion 61 on the electrolytic capacitor 4 having a cylindrical outer shape. A ring portion 61 of a receiving member (an example of a heat generating component receiving means) 6 is mounted, and the protruding piece portion 62 faces the thermistor 2. In this way, even if the lead pin 21 of the thermistor 2 is bent and the thermistor 2 falls to the electrolytic capacitor 4 side, as shown by the phantom line in FIG. 62, the position of the thermistor 2 is restricted or too close to the electrolytic capacitor 4, so that the performance of the parts of the electrolytic capacitor 4 is impaired or the electrolytic capacitor 4 is heated abnormally. The situation of bursting is prevented in advance. That is, safety is ensured.

  As shown in FIG. 3, the ring portion 61 of the heat generating component receiving member 6 is formed in a C shape having a missing circle portion at one place in the circumferential direction, and the ring portion 61 has a cylindrical outer shape. When fitted into the electrolytic capacitor 4, the ring portion 61 holds the electrolytic capacitor 4 in an elastic state. The heat generating component receiving member 6 is integrally formed so as to be separable together with the resin chassis 5 shown in FIG. 1 or FIG. It is divided and attached to the electrolytic capacitor 4.

  In this embodiment, the thermistor 2 is selected as the heat generating component, and the electrolytic capacitor 4 is selected as the non-heat generating component. However, this point is that a resistance element other than the thermistor 2 is selected as the heat generating component and the non-heat generating component is selected. It is also possible to select the electrolytic capacitor 4 and other electronic elements.

It is a fragmentary perspective view of the wiring board which concerns on embodiment of this invention. It is a side view for demonstrating the effect | action of this invention. FIG. 3 is a view taken in the direction of arrow III in FIG. 2.

Explanation of symbols

A Wiring board 2 Thermistor (heat generating component)
4 Electrolytic capacitors (Non-heating parts)
5 Resin chassis 6 Heating part receiving member (heating part receiving means)
61 Ring 62 Projection piece

Claims (5)

In the wiring board in which the heat generating component and the non-heat generating component are mixedly mounted,
A thermistor, which is a heat-generating component, and a cylindrical electrolytic capacitor, which is a non-heat-generating component, are placed close together on the wiring board attached to the resin chassis, and are integrally molded with the resin chassis so that they can be divided by resin. By fitting the ring portion of the heat generating component receiving means including the ring portion and the protruding piece portion protruding from the ring portion to the non-heat generating component and making the protruding piece portion face the heat generating component, The heat generating component that has fallen to the non-heat generating component side is received by the protruding piece portion to prevent the heat generating component from coming into contact with the non-heat generating component, and the ring portion of the heat generating component receiving means is A wiring board comprising a cutout portion and formed in a C-shape capable of holding the electrolytic capacitor. In the wiring board in which the heat generating component and the non-heat generating component are mixedly mounted,
Receiving a heat-generating component from a heat-generating component and a non-heat-generating component that are located close to each other to receive the heat-generating component and prevent the heat-generating component from falling into the non-heat-generating component and contacting the non-heat-generating component A wiring board characterized in that the means is mounted on a non-heat generating component. The wiring board according to claim 2, wherein the heat generating component receiving means is integrally formed so as to be separable by a resin together with a resin chassis to which the wiring board is attached. 4. The wiring board according to claim 2, wherein the heat generating component receiving means includes a ring portion fitted to the non-heat generating component and a protruding piece portion protruding from the ring portion toward the heat generating component. The wiring board according to claim 2, wherein the heat generating component is a thermistor and the non-heat generating component is an electrolytic capacitor.

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