JP2006209401A - Inlet formation, rolled inlet formation, noncontact data carrier, and noncontat data carrier formation - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inlet formation, a rolled inlet formation, a noncontact data carrier, and a noncontact data carrier formation capable of securing a wide printing area at the center and preventing a defective roll of the rolled inlet formation and damaged IC chips, thereby improving productivity than usual. <P>SOLUTION: A number of inlets 14 each having an antenna 12 and an IC chip 13 are formed on a tape-like flexible film 11 along the longitudinal direction of the flexible film 11 to form the inlet formation 15. The antenna 12 is formed in the shape of approximately rectangular multiple coils using a conductor pattern or the like and the IC chip 13 is provided to be located on the outside of the long side of the antenna 12. Consequently, the IC chip 13 does not overlap the conductor part of the antenna 12 when the inlet formation 15 is rolled. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an inlet forming body used for manufacturing a non-contact data carrier, a roll-shaped inlet forming body, a non-contact data carrier manufactured using the roll-shaped inlet forming body, and a non-contact data carrier forming body.

  Conventionally referred to as a non-contact IC card or a non-contact IC tag or the like, an antenna for performing external power supply and wireless communication, and electrically connected to the antenna to store information and wireless with the outside 2. Description of the Related Art A non-contact data carrier that includes an IC chip that performs communication and is configured to be able to read information from outside or read and write information from outside is known.

  FIG. 7 shows an example of the structure of such a non-contact data carrier. As shown in FIG. 2A, an antenna 2 and an IC chip 3 are provided on a flexible film 1 that is a base material. The antenna 2 is generally composed of a conductor pattern or the like and is formed in a substantially rectangular coil shape. The IC chip 3 is generally provided so as to be positioned inside the substantially rectangular antenna 2, and the antenna 2 and the IC chip 3 are electrically connected.

  The IC chip 3 is easily broken by bending or the like due to external force. For this reason, when an external force is applied to the base material (flexible film 1), it is arranged eccentrically at the end side (eccentric to the left in the case of FIG. 7) while avoiding the central portion in the longitudinal direction where there are many bends. . In order to further reduce the possibility of destruction of the IC chip due to an external force, for example, it is also known to provide an IC chip at the four corners such as above the corners of the antenna (for example, Patent Document 1 and Patent Document 1). 2).

  Note that the state shown in FIG. 7 is a semi-finished product state and is called an inlet or the like. A protective layer is formed, for example, by laminating a resin film on one or both surfaces of the inlet 4, and printing or the like is performed on the front and back surfaces of the resin film as necessary to complete a non-contact data carrier.

Further, as shown in FIG. 8, a large number of the above-described semi-finished inlets 4 are formed on one flexible film 1. In the manufacturing process of the non-contact data carrier, the tape-like inlet forming body 5 on which a large number of such semi-finished inlets 4 are formed is temporarily stored or transported, and in some cases, the inlet forming body. It may be necessary to ship in the state of 5. In such a case, in order to facilitate handling of the inlet forming body 5, a tape-shaped inlet forming body 5 on which a large number of inlets 4 are formed is wound in the longitudinal direction to form a roll-shaped inlet forming body. Things have been done.
Japanese Patent Laid-Open No. 10-203059 Japanese Patent Laid-Open No. 11-34550

  In the non-contact data carrier described above, for example, in the case of a non-contact IC tag or the like, the resin film on which the inlet is laminated may be thin. In this way, when the resin film is thin, when printing on the front and back surfaces of the resin film with a thermal transfer printer or the like, the print quality of the IC chip portion is impaired by the thickness of the IC chip, or the thermal head of the thermal transfer printer is used. The IC chip may be damaged. For this reason, the normal IC chip portion cannot be used as a print area, and there is a problem that the print area becomes narrow.

  In order to avoid such a problem, for example, it is conceivable to arrange the semiconductor chip 3 at the four corners of the antenna 2 as in the inlet 4a and the inlet forming body 5a shown in FIG.

  However, as shown in FIG. 7B, the inlet is partially thick due to the conductor of the antenna 2 formed on the flexible film 1 and the IC chip 3 mounted on the flexible film 1. Is different. As an example of specific numerical values, the thickness of the flexible film 1 is 25 to 30 μm, the thickness of the conductor of the antenna 2 is 10 to 50 μm, the thickness of the IC chip 3 is 500 to 900 μm for the bare chip, and the back-polished product 150 to 200 μm.

  For this reason, when the semiconductor chip 3 is disposed at the four corners of the antenna 2 as shown in FIG. 9, when the tape-like flexible film 1 (inlet forming body 5a) is wound into a roll shape, the antenna 2 The problem is that the conductor and the IC chip 3 overlap each other, the difference in thickness is accumulated, and the winding collapses, and particularly the portion of the thick IC chip 3 is directly subjected to the tightening force, and the IC chip 3 is damaged. Problems arise.

  The present invention has been made in response to such a conventional situation, and can secure a wide printing area in the center portion, and can cause the roll-shaped inlet formed body to collapse and the IC chip to break. It is an object of the present invention to provide an inlet formed body, a roll-shaped inlet formed body, a non-contact data carrier, and a non-contact data carrier formed body that can be suppressed and can improve the productivity as compared with the prior art.

  In order to achieve the above object, an inlet forming body according to claim 1 of the present invention comprises a coiled antenna made of a conductor and an IC chip electrically connected to the antenna to constitute a non-contact data carrier. An inlet forming body in which a large number of inlets are formed along the longitudinal direction of the flexible film, and the inlet forming body is wound up along the longitudinal direction of the flexible film to form a roll In the area outside the antenna and excluding the position in the width direction of the flexible film where the value obtained by integrating the thickness of the conductor along the longitudinal direction of the flexible film is maximized, The IC chip is mounted.

  Here, “accumulating the thickness of the conductor along the longitudinal direction (winding direction)” means integrating the thickness. If the thickness of the conductor is constant, the “longitudinal direction (winding direction)” Equal to the value obtained by integrating the conductor length along the direction) and multiplying by the conductor thickness.

  Further, an inlet forming body according to claim 2 of the present invention includes an inlet for constituting a non-contact data carrier having a coiled antenna made of a conductor and an IC chip electrically connected to the antenna. A plurality of inlet forming bodies formed along the longitudinal direction of the flexible film, wherein the inlet forming body is wound along the longitudinal direction of the flexible film to form a roll. In addition, in the region excluding the position in the width direction of the flexible film where the value obtained by integrating the thicknesses of the conductor and the IC chip along the longitudinal direction of the flexible film is maximum, It is characterized by mounting a chip.

  The inlet formed body according to claim 3 of the present invention is the inlet formed body according to claim 1, wherein the integrated value of the thickness of the conductor along the longitudinal direction of the flexible film is minimized. The IC chip is mounted in a region including a position in the width direction of the flexible film.

  According to a fourth aspect of the present invention, there is provided the inlet formed body according to the third aspect, wherein the IC chip is mounted between the antenna and an end in the width direction of the flexible film. It is characterized by.

  Further, an inlet formed body according to claim 5 of the present invention is the inlet formed body according to claim 1, wherein the thickness is adjusted in a region excluding the position in the width direction of the flexible film on which the IC chip is mounted. A conductor is formed.

  Moreover, the roll-shaped inlet formation body which concerns on Claim 6 of this invention is characterized by making the inlet formation body which concerns on Claims 1 thru | or 5 into the shape of a winding roll.

  A non-contact data carrier according to claim 7 of the present invention is manufactured using the roll-shaped inlet forming body according to claim 6.

  A non-contact data carrier forming body according to claim 8 of the present invention is manufactured using the roll-shaped inlet forming body according to claim 6.

  According to the present invention, it is possible to secure a wide printing area in the central portion, and to suppress the occurrence of roll collapse and damage to the IC chip in the roll-shaped inlet forming body, which is produced in comparison with the prior art. It is possible to improve the performance.

  Hereinafter, the details of the present invention will be described with reference to the drawings.

  FIG. 1 is an enlarged view of a main part configuration of an inlet forming body in the present embodiment. As shown in the figure, an antenna 12 and an IC chip 13 are provided on a flexible film 11, and one inlet 14 is constituted by these. The antenna 12 is composed of a conductor pattern or the like, and is formed in a substantially rectangular multi-coil shape. The IC chip 13 is provided outside the long side of the substantially rectangular antenna 12, that is, between the antenna 12 and the width direction end portion of the flexible film 11. It is connected to the.

  As shown in FIG. 2, a large number (for example, 5000) of inlets 14 including the antenna 12 and the IC chip 13 are formed along the longitudinal direction of the flexible film 11 formed in a tape shape. Is configured. The inlet formed body 15 (flexible film 11) is wound along the longitudinal direction to form a roll-shaped inlet formed body. Then, a protective layer is formed on one or both surfaces of the inlet 14 by laminating a resin film, etc., and printing or the like is applied to the front and back surfaces of the resin film as necessary. IC tag).

  As described above, when the long-shaped (for example, 500 m) inlet formed body 15 formed in a tape shape is wound along the longitudinal direction to form a roll-shaped inlet formed body, in this embodiment, an IC is formed. Since the chip 13 is provided so as to be located outside the long side of the antenna 12, the IC chip 13 and the conductor portion of the antenna 12 do not overlap when wound up. For this reason, the thickness of the conductor of the antenna 12 and the thickness of the IC chip 13 are added to prevent the uneven thickness from being accumulated.

  As a result, it is possible to prevent the difference in thickness from being integrated and prevent the winding from collapsing, and also to prevent the IC chip 13 from being damaged by directly applying a tightening force to the IC chip 13 portion. It is possible to improve productivity compared to the prior art.

  In the present embodiment, since the IC chip 13 is disposed at the end of the inlet 14 so as to be located outside the antenna 12, a wide print area can be secured in the central portion.

  FIG. 3 shows the configuration of another embodiment. The inlet forming body 15a of this embodiment is outside the short side of the antenna 12, and when the inlet forming body 15a is wound up, The IC chip 13 is arranged in a region that does not overlap with the conductor on the long side.

  When the inlet forming body 15a having a large number of inlets 14a (for example, 5000) is wound, the integrated value of the thickness is maximized so that the long side of the rectangular conductor and the IC chip 13 overlap. It is a case where it arrange | positions. That is, the maximum value obtained by integrating the conductor thickness along the longitudinal direction of the flexible film 11 is the position in the width direction of the flexible film 11 where the long side of the antenna 12 is located. When the IC chip 13 is disposed at the position, the integrated value of the thickness becomes maximum. Therefore, if the IC chip 13 is arranged in a region that does not overlap with the conductor on the long side of the antenna 12 as shown in FIG. Therefore, it is possible to prevent the collapse of the roll when the roll is formed, and the IC chip 13 can be prevented from being damaged due to the direct tightening force applied to the portion of the IC chip 13.

  FIG. 4 shows the configuration of another embodiment. The inlet forming body 15b of this embodiment is outside the short side of the antenna 12, and when the inlet forming body 15b is wound up, the antenna 12 The IC chip 13 is disposed in a region that does not overlap with the conductor on the long side, and the portion of the antenna 12 where the IC chip 13 is disposed is bent inward so that the IC chip 13 is A region to be arranged is formed.

  By adopting the above configuration, as in the embodiment shown in FIG. 3, it is possible to suppress the difference in thickness when it is formed into a roll shape, and the occurrence of winding collapse, It is possible to prevent the IC chip 13 from being damaged by directly applying the tightening force to the portion, and to suppress the increase in the size of the inlet 14b, so that the outer shape of the entire non-contact data carrier of the finished product can be reduced. An increase in size can be suppressed.

  FIG. 5 shows the configuration of still another embodiment. In the inlet forming body 15c of this embodiment, each inlet 14c is arranged on the outer side of the short side of the antenna 12, as in the embodiment shown in FIG. Then, when the flexible film 11 is wound up, the IC chip 13 is arranged in a region that does not overlap with the conductor on the long side of the antenna 12, and the difference in thickness is further integrated. In order to suppress this, a thickness adjusting conductor 16 is disposed in addition to the antenna 12. FIG. 5 shows a region where the thickness adjusting conductor 16 is arranged. In practice, the thickness adjusting conductor 16 has less influence on the function of the antenna, and therefore, the generation of eddy current is reduced. It is formed from finely divided dot-shaped or striped conductors.

  The thickness adjusting conductor 16 has a position in the width direction of the flexible film 11 at which the value obtained by integrating the thickness of the conductor of the antenna 12 along the longitudinal direction of the flexible film 11 is the maximum (the long side of the antenna 12). Is disposed in the region excluding the position in the width direction of the flexible film 11 in which the IC chip 13 is disposed, and the inlet forming body 15c is wound up. In this case, the entire thickness is made uniform. Such a thickness adjusting conductor 16 can be formed at the same time when the conductor pattern of the antenna 12 is formed by photolithography or the like.

  By adopting the above-described configuration, it is possible to further suppress the accumulation of the difference in thickness when the roll is formed, and the collapse of the roll occurs or the tightening force is directly applied to the IC chip 13 portion. It is possible to prevent the IC chip 13 from being damaged.

  Next, referring to FIG. 6, the width of the flexible film in which the value obtained by integrating the thickness of the conductor and the thickness of the IC chip along the longitudinal direction (winding direction) of the flexible film is the maximum value. An embodiment in which an IC chip is arranged in a region excluding the direction position will be described. As described above, the thickness of the conductor constituting the antenna is about 10 to 50 μm, and the thickness of the IC chip is 500 to 900 μm for the bare chip and 150 to 200 μm for the back-polished product.

And the integrated value of the thickness, if the thickness is constant, the range up to the repetitive pitch of winding imposition is the evaluation unit,
Integrated value of conductor thickness = conductor winding direction integrated length × conductor thickness IC chip thickness integrated value = IC chip winding direction integrated length × IC chip thickness added to winding direction Become. FIGS. 6A to 6C show the positional relationship between these values and the antenna and IC chip. FIG. 6A is the same as the case of the embodiment shown in FIGS. 1 and 2, and in this case, the integrated value of the thickness is not the maximum value at the mounting position of the IC chip (semiconductor chip). On the other hand, in FIG. 6B, the integrated value of the thickness is the maximum value at the mounting position of the IC chip (semiconductor chip).

  In addition, when the antenna is substantially circular as shown in FIG. 6C, if the IC chip (semiconductor chip) is mounted at the position indicated by the solid line, the integrated value of the thickness becomes the maximum value at the position of the IC chip, and the dotted line When an IC chip (semiconductor chip) is mounted at the position indicated by, the integrated thickness value does not reach the maximum value at the IC chip position. Therefore, it is necessary to mount an IC chip (semiconductor chip) at a position indicated by a dotted line.

  If the roll-shaped inlet forming body of the present invention is used, a resin film is laminated on both sides or one side of the inlet 14, printing or the like is performed on the front and back surfaces of the resin film as necessary, cutting and outer shape processing, non-contact data carrier Will be the finished product. In addition, as another form of the finished product, after laminating a resin film on the inlet, after performing printing as necessary, after pressing and sticking to a separately prepared flexible support film having adhesiveness, A flexible support film is cut and shaped so as not to be cut, and a non-contact data carrier forming body in which a large number of non-contact data carriers are stuck on the flexible support film is obtained. Such a non-contact data carrier forming body is used, for example, for mounting on a printing apparatus and printing on the surface of the non-contact data carrier.

The figure which shows the structure of the inlet which concerns on one Embodiment of this invention. The figure which shows the structure of the inlet formation body of embodiment of FIG. The figure which shows the structure of the inlet formation body of other embodiment. The figure which shows the structure of the inlet formation body of other embodiment. The figure which shows the structure of the inlet formation body of other embodiment. The figure for demonstrating the integrated value of the thickness of a conductor and IC chip. The figure which shows the structural example of the inlet of the conventional non-contact data carrier. The figure which shows the inlet formation body in which many inlets of FIG. 7 were formed. The figure for demonstrating the problem in a roll-shaped inlet formation body.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Flexible film, 12 ... Antenna, 13 ... IC chip, 14 ... Inlet, 15 ... Inlet formation body.

Claims (8)

An inlet having a coiled antenna made of a conductor and an IC chip electrically connected to the antenna, and a plurality of inlets for forming a non-contact data carrier along the longitudinal direction of the flexible film In the inlet formed body which is a formed body and is wound along the longitudinal direction of the flexible film to form a roll,
In the region outside the antenna and excluding the position in the width direction of the flexible film where the value obtained by integrating the thicknesses of the conductors along the longitudinal direction of the flexible film is maximum. An inlet formed body having a chip mounted thereon. An inlet having a coiled antenna made of a conductor and an IC chip electrically connected to the antenna, and a plurality of inlets for forming a non-contact data carrier along the longitudinal direction of the flexible film In the inlet formed body which is a formed body and is wound along the longitudinal direction of the flexible film to form a roll,
An area outside the antenna and excluding the position in the width direction of the flexible film that maximizes the value obtained by integrating the thicknesses of the conductor and the IC chip along the longitudinal direction of the flexible film. And the IC chip is mounted thereon. The inlet forming body according to claim 1,
The IC chip is mounted in a region including a position in the width direction of the flexible film where a value obtained by integrating the thicknesses of the conductors along the longitudinal direction of the flexible film is minimized. Inlet former. The inlet forming body according to claim 3,
An inlet formed body in which the IC chip is mounted between the antenna and an end portion in the width direction of the flexible film. The inlet forming body according to claim 1,
An inlet forming body, wherein a thickness adjusting conductor is formed in a region excluding a position in a width direction of the flexible film on which the IC chip is mounted.   6. A roll-shaped inlet forming body, wherein the inlet forming body according to claim 1 is formed into a winding roll shape.   A non-contact data carrier manufactured using the roll-shaped inlet forming body according to claim 6.   A non-contact data carrier forming body manufactured using the roll-shaped inlet forming body according to claim 6.

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