JP2006187839A - Method for polishing sensor, method for manufacturing sensor chip, and polishing jig - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for polishing a sensor by which ridge lines 21i, 21j of a detection face 21a can be polished without polishing an electrode pad 26 provided on the detection face 21a, a method for manufacturing a sensor chip, and a polishing jig. <P>SOLUTION: The method for polishing a laminated substrate is used for polishing the ridge lines 21i, 21j of the detection face 21a of the laminated substrate (the sensor) 106. The laminated substrate 106 is provided with a body 30, which has the detection face 21a to be arranged oppositely to a detection target, detection elements 25, 25 provided in the body 30, and the electrode pad 26 electrically connected to the detection elements 25, 25 and provided on the detection face 21a. The ridge lines 21i, 21j are polished by relatively moving a wire 206 and the laminated substrate 106 in the extending direction of the wire 206 in a state of bringing the wire 206, in which an abrasive 230 is adhered to the surface, into contact with the ridge lines 21i, 21j in parallel with the ridge lines 21i, 21j. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a sensor polishing method, a sensor chip manufacturing method, and a polishing jig.

  A rotary magnetic encoder may be used to detect rotational displacement of a lens, a diaphragm, etc. in a camera. This rotary magnetic encoder includes a magnetic recording medium provided on one side and a magnetic sensor chip provided on the other side. Magnetic information is recorded in advance on the magnetic recording medium, and the magnetic sensor chip can read the magnetic information on the magnetic recording medium.

  As a magnetic sensor chip, a main body having a detection surface disposed opposite to a detection target, a magnetic detection element provided inside the detection surface in the main body, an electrode pad connected to the magnetic detection element, A columnar one having the following is known. The detection surface of such a magnetic sensor chip is disposed opposite to the magnetic recording medium, and when the magnetic recording medium moves relative to the magnetic sensor, the magnetic sensor is recorded on the magnetic recording medium. Information can be read and information such as rotational displacement can be obtained based on the magnetic information.

  By the way, in such a magnetic sensor chip, the ridgeline (edge) of the detection surface of the magnetic sensor chip is polished in order to prevent damage to the magnetic recording medium during driving such as detection of magnetic information. is required.

And as a method of grind | polishing the ridgeline of such a sensor chip, as described, for example in patent document 1, 2, etc., a polishing film is mounted on soft sheets, such as silicone rubber, and this grinding | polishing film A method is known in which a detection surface of a sensor chip (for example, a hard disk slider) is brought into contact with the sensor chip and the sensor chip is slid.
Japanese Patent Laid-Open No. 5-234048 JP 11-238214 A

  By the way, the present inventors are developing a sensor chip in which an electrode pad is provided on a detection surface. Such a sensor chip can be manufactured continuously using a thin film process, and there is an effect that a precise dimensional control in the in-plane direction is unnecessary and a yield can be essentially increased.

  And, in order to polish the ridgeline of the detection surface of such a magnetic sensor chip, as described above, when the sensor chip detection surface is arranged and slid with respect to the polishing film arranged on the soft sheet, It has been found that there is a problem that the electrode pad is polished. This defect was the same even when a wire or the like was placed under the soft sheet.

  The present invention has been made in view of the above problems, and a sensor polishing method and a sensor chip manufacturing method capable of polishing a ridge line of a detection surface without polishing an electrode pad provided on the detection surface, And it aims at providing a polishing jig.

  A method for polishing a sensor according to the present inventor includes: a main body having a detection surface to be disposed opposite to a detection target; a detection element provided in the main body; and a detection surface electrically connected to the detection element A sensor polishing method for polishing a ridge line on a detection surface of a sensor including an electrode pad provided on the upper surface. In this polishing method, the wire and the sensor are moved relative to each other in the direction in which the wire extends in a state in which the wire with the abrasive material attached to the surface is in contact with the ridge line in parallel with the ridge line. Grind.

  According to the present invention, a ridgeline can be polished without giving unnecessary polishing to other members such as electrode pads provided on the detection surface. Further, the ridgeline can be polished almost uniformly in the length direction.

  Here, when there are two ridge lines parallel to each other on the detection surface, two wires are prepared and each wire is in contact with each ridge line in parallel with each ridge line. It is preferable to polish each ridge line by relatively moving the sensor and the sensor in the direction in which the wire extends.

  This is preferable because two ridge lines parallel to each other can be polished at a time.

  In the above-described polishing, it is preferable to use a polishing jig in which a plurality of wires are fixed in parallel to each other on the pedestal and an abrasive is attached to the wires.

  When such a polishing jig is used, polishing can be performed easily and more uniformly.

  Specific examples of such a sensor include the following. That is, the main body is formed of a substrate and an insulating coating layer formed on one surface of the substrate, the detection element is formed on one surface of the substrate and covered with the insulating coating layer, and the electrode pads are formed on the insulating coating layer. The surface of the insulating coating layer is used as a detection surface.

  Here, when the detection element is a magnetic detection element such as a GMR element or a TMR element, a magnetic sensor that can be used for a magnetic rotary encoder or the like can be suitably obtained.

  By the way, as such a sensor, a sensor chip having a columnar outer shape is often used. As a method for manufacturing a sensor chip, a laminated substrate in which a large number of sensor components (sensor units) are arranged in a matrix is created, and this is divided into individual sensor chips.

  Therefore, the sensor chip manufacturing method according to the present invention is a sensor chip manufacturing method for manufacturing a sensor chip by dividing a multilayer substrate in which a large number of sensor units are provided in a matrix in the row direction and the column direction. Has a detection element provided in the multilayer substrate, and an electrode pad electrically connected to the detection element and provided on the surface of the multilayer substrate.

  And in this manufacturing method, the groove | channel formation which forms the mutually parallel groove | channel extended over from the one end of the surface of a laminated substrate to the other end so that a sensor part may be divided in either the direction of a row direction or a column direction, respectively. In a state where the wire having the polishing material attached to the surface is disposed along each groove, and each wire is in contact with two ridge lines formed by each groove and the surface of the laminated substrate. A polishing step of polishing each ridge line of each groove by relatively moving each wire and the laminated substrate in a direction along the groove; and a dividing step of dividing the laminated substrate having the polished ridge line into individual sensor chips; .

  According to the present invention, the ridge line can be polished without giving unnecessary polishing to other members such as electrode pads provided on the detection surface in the same manner as described above. Uniform polishing is possible.

  Here, when the groove is a V-groove, the ridge line has an obtuse angle from the beginning, and polishing can be performed quickly.

  At this time, the angle formed by the two surfaces of the V-groove is preferably 60 to 90 °.

  The wire diameter 2R is preferably larger than the opening width W of the V-groove. In this case, the wire can be easily brought into contact with the two ridge lines of the V groove.

  In particular, the wire diameter 2R is preferably 2.0 to 4.0 times the opening width W of the V-groove.

  In the dividing step, it is preferable to cut the laminated substrate along the V groove. In this case, there is an effect of suppressing chipping of the sensor chip.

  Here, in the polishing step, as described above, it is preferable to use a polishing jig in which a plurality of wires are fixed in parallel to each other on the pedestal.

  The detection element can be a magnetic detection element as described above.

  The polishing jig according to the present invention is a polishing jig including a pedestal, a plurality of wires fixed in parallel to each other on the pedestal, and an abrasive attached to the wires.

  According to such a polishing jig, the above-described manufacturing methods can be suitably realized.

  Here, it is preferable to further include a slider that holds the object to be polished having a ridge line so that the ridge line abuts in parallel with the wire and is supported on the pedestal in a reciprocating manner along the wire. .

  The slider is preferably provided with a position fine adjuster such as a micrometer for parallel alignment of the ridge line of the object to be polished and the wire.

  According to the present invention, a sensor chip polishing method, a sensor chip manufacturing method, and a polishing jig capable of polishing a ridge line of a detection surface without polishing an electrode pad provided on the detection surface are provided. Is done.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol shall be used for the same element and the overlapping description is abbreviate | omitted.

<Magnetic sensor chip, magnetic rotary encoder and camera>
First, a magnetic sensor chip (sensor chip, sensor) created in the present embodiment, a magnetic rotary encoder and a camera using the magnetic sensor chip will be described. FIGS. 1A to 1C are exploded perspective views of the single-lens reflex camera 10. As shown in FIG. 1A, the single-lens reflex camera 10 includes a camera body 1 and a lens barrel 11. As shown in FIG. 1B, the lens barrel 11 includes a focus ring 12, a front lens barrel 13 having a focus lens group 12g, a rear lens barrel 14 having a zoom lens group 14g, and a zoom. A ring 15 and a mount ring 16 are provided. As shown in FIGS. 1B and 1C, a magnetic rotary encoder 17 is attached to the rear lens barrel 14.

  The magnetic rotary encoder 17 includes a tape-like magnetic recording medium (detection target) 17a fixed with an adhesive or the like along the outer periphery of the rotary cylinder 14a of the rear lens barrel 14, and a fixed cylinder 14b of the rear lens barrel 14. And a sensor assembly 17b fixed by eyelets or the like.

  2A is a perspective view of the magnetic rotary encoder 17 of FIG. 1, FIGS. 2B and 2C are partial perspective views of the sensor assembly 17b, and FIG. FIG. 3B is an exploded perspective view of the magnetic sensor chip 21, and FIG. 4 is an end view of the magnetic sensor chip 21 in FIG.

  As shown in FIG. 2A, the magnetic rotary encoder 17 coats a magnetic layer in the form of a tape-like resin film, and magnetically coats the magnetic layer with a predetermined magnetization pitch Δ (for example, 20 μm in this embodiment). A magnetic recording medium 17a on which information is recorded and a sensor assembly 17b attached so that the sliding surface of the magnetic sensor chip can come into contact with and slide on the magnetic recording medium 17a coated with a lubricant.

  As shown in FIGS. 2B and 2C, the sensor assembly 17b includes a suspension 20 formed of a metal plate and a magnetic sensor chip (fixed to the surface of the tip of the suspension 20 with an adhesive or the like). Sensor) 21 and a flexible printed circuit (FPC) member 22 fixed to the suspension 20 with an adhesive or the like and provided with a connection conductor. The FPC member 22 is a wiring member having flexibility by patterning connection conductors and connection pads on a resin film and covering the connection conductor portions with a resin layer. The FPC member 22 is fixed along the back surface of the suspension 20, is folded at the tip of the suspension 20, and the tip is fixed to the surface of the suspension 20. A connection pad 22p provided at the tip of the FPC member 22 and an electrode pad 26 formed on the magnetic sensor chip 21 are electrically connected by wire bonding using a wire 23.

  As shown in FIGS. 3A and 3B, the magnetic sensor chip 21 according to the present embodiment has a substantially prismatic outer shape, and is on the substrate 24 and the surface (upper surface) 24a of the substrate 24. For example, two magnetic detection elements 25, 25, and a lead conductor 27 and a via-hole conductor 28, which are formed on the surface 24a and electrically connect the magnetic detection element 25 and the electrode pad 26; The surface 24a of the substrate 24, the magnetic detection element 25 and the lead conductor 27 are covered, and the via-hole conductor 28 is mainly composed of an insulating coating film (coating layer) 29 which is a protective film penetrating the inside.

  The surface of the insulating coating film 29 constitutes a sliding surface (detection surface) 21a, and a part thereof is a region in contact with the magnetic recording medium 17a. The electrode pad 26 is formed and exposed on the surface of the insulating coating film 29. The substrate 24 and the insulating coating film 29 form the main body 30 of the magnetic sensor chip.

  Specifically, the two magnetic detection elements 25 and 25 are respectively provided on one side in the longitudinal direction (the front left side in the drawing) of the surface 24a of the substrate 24, while the electrode pads 26 are respectively provided on the sliding surface 21a. It is provided on the other side in the longitudinal direction (the right back side in the figure). The left front side of the sliding surface 21a, that is, the facing portion of the magnetic detection elements 25 and 25 on the sliding surface 21a is in contact with the magnetic recording medium 17a.

  As shown in FIGS. 3A, 3B, and 4, the magnetic sensor chip 21 according to this embodiment includes a sliding surface 21a, a bottom surface 21b opposite to the sliding surface 21a, and the sliding surface. Side surfaces 21c and 21d orthogonal to the moving surface 21a and extending in the longitudinal direction, an end surface 21e on the magnetic detection element 25 side, an end surface 21f on the electrode pad 26 side, and a slope 21g connecting the sliding surface 21a and the side surface 21c, It has a slope 21h connecting the sliding surface 21a and the side surface 21d.

  A ridge line 21i formed by the sliding surface 21a and the inclined surface 21g, a ridge line 21j formed by the sliding surface 21a and the inclined surface 21h, and a ridge line 21k formed by the sliding surface 21a and the end surface 21e are respectively shown. Polished and rounded. Here, the ridge lines 21 i and 21 j are ridge lines that are parallel to each other and extend in the longitudinal direction of the magnetic sensor chip 21. The radius of curvature of the cross section of each ridge line 21i, 21j, 21k is preferably 50 to 200 μm.

The substrate 24 is made of, for example, AlTiC (Al ₂ O ₃ —TiC), and the insulating coating film 29 is made of, for example, an insulating nonmagnetic material such as alumina. The electrode pad 26, the lead conductor 27, and the via-hole conductor 28 are made of a conductive material such as Cu, for example. As each magnetic detection element 25, a general multilayered GMR element, a TMR element, or the like can be used.

The insulating coating film 29 may be a single-layer film, but is preferably a multilayer film, more preferably an alumina (Al ₂ O ₃ ) film and a diamond-like carbon (DLC) film from the substrate side. A two-layer structure, most preferably a three-layer structure of an alumina film, a silicon (Si) film, and a DLC film from the substrate side. The thickness of each of the silicon film and the DLC film is preferably 1/10 or less of the thickness of the alumina film. By adopting such a multilayer film structure, it is possible to reduce the frictional resistance and the wear amount.

  In the present embodiment, the two magnetic detection elements 25 and 25 are arranged at a predetermined interval in the same direction as the moving direction of the sensor assembly 17b relative to the magnetic recording medium 17a, that is, the magnetization pitch direction of the magnetic recording medium 17a, for example, They are arranged in parallel with each other at an interval of 20 μm. Although not shown, each of the magnetic detection elements 25 and 25 has a straight strip shape in which two straight portions are folded back into a U shape. The reason for this folding is to increase the output and sensitivity of the magnetic detection element 25.

  The length of the magnetic detection element 25 is, for example, about 180 μm, and the tip thereof is not exposed at the tip surface 21 e of the substrate 24, and is formed at a position retracted by about 100 μm from this tip surface.

  In this embodiment, for example, the width W of the sliding surface 21a in the magnetization pitch direction is about 0.15 mm, the height H of the magnetic sensor chip 21 is about 0.3 mm, and the length L is about 2 mm.

<Method of manufacturing magnetic sensor chip>
Then, the manufacturing method of a magnetic sensor chip is demonstrated.

  First, as shown in FIG. 5A, a magnetic detection element 25, a lead conductor 27, a via-hole conductor 28, an insulating coating film 29, and an electrode pad are included on a substrate 24 such as Altic by a known method. A large number of sensor units 100 are formed in a matrix to obtain a substrate SB, and then the substrate SB is divided into a plurality of rectangular shapes, whereby the sensor unit 100 is arranged in a matrix as shown in FIG. A laminated substrate (sensor) 106 formed in the above is created. For simplicity, the lead conductor 27 and the via-hole conductor 28 are omitted from FIG. Here, the surface of the insulating coating film 29 becomes a sliding surface (detection surface) 21a to be opposed (contacted) to the magnetic recording medium after the magnetic sensor chip 21 is completed. Here, the substrate 24 and the insulating coating film 29 constitute the main body 30. The size of the laminated substrate is, for example, about 30 × 40 mm.

  Subsequently, a large number of V grooves 110 as shown in FIG. 6 are formed on the surface of the laminated substrate 106 using a diamond wheel or the like. Specifically, the V-groove 110 extends in either the row direction or the column direction from one end to the other end of the surface of the multilayer substrate 106. Each V-groove 110 is formed in parallel to each other so as to partition the plurality of sensor units 100 in the column direction or the row direction.

  Here, the opening width W1 of the V groove 110 is preferably about 60 to 100 μm, for example. Moreover, it is preferable that the angle R formed by the two surfaces 110a and 110b of the V-groove is 60 to 90 °.

  Thereby, the ridge line 21i formed by the surface 110a of the V groove 110 and the surface of the multilayer substrate 106 (surface of the insulating coating film 29), the surface 110b of the V groove 110 and the surface of the multilayer substrate 106 (insulating coating film 29). Are formed in the respective grooves.

  Subsequently, a polishing jig 200 as shown in FIGS. 7A and 7B and FIG. 8 is prepared. The polishing jig 200 includes a surface plate 202, a pedestal 204 provided on the surface plate 202, a plurality of wires 206 fixed in parallel to each other on the pedestal 204, and the laminated substrate described above above the wires 206. And a slider 210 that supports the reciprocating motion of the wire 106 in the extending direction of the wire 206.

  The pedestal 204 has a rectangular flat plate on its upper surface, and a number of wires 206 are stretched in parallel on the upper surface. The interval between the wires 206 is set so as to correspond to the arrangement interval of the V grooves 110 described above.

  These wires 206 are made of, for example, chemical fibers such as nylon. Further, as shown in FIG. 8, an abrasive 230 is attached to the surfaces of these wires 206. Examples of the abrasive 230 include diamond particles. The particle size of the abrasive 230 is, for example, about 0.1 to 5 μm. Here, for example, an abrasive can be attached to the surface of the wire 206 by applying a paste containing diamond particles or the like to the surface of the wire 206.

  As shown in FIGS. 7A and 7B, the pedestal 204 is fixed on the surface plate 202 via a horizontal micrometer 205. The horizontal micrometer 205 can slightly reciprocate the pedestal 204 in a direction orthogonal to the wire 206.

  On the surface plate 202, a pair of rails 212 extending along the extending direction of the wire 206 with the base 204 interposed therebetween are further provided.

  The pair of rails 212 supports a pedestal 216 that traverses above the pedestal 204. The gantry 216 includes wheels 214 and 214 that can run on a pair of rails 212, and can reciprocate in the extending direction of the wire 206 above the pedestal 204. In addition, the mount 216 is provided with a jig rotation frame 217 having a rectangular opening 217h formed at the center. The jig rotation frame 217 is supported on the mount 216 so as to be rotatable about the vertical axis 220 on the mount 216, and the opening 217 h faces the upper surface of the pedestal 204.

  A substrate fixing jig 218 having a rectangular cross section with the laminated substrate 106 fixed downward is inserted into the opening 217h of the jig rotating frame 217 from above. The laminated substrate 106 is fixed downward with respect to the lower surface of the substrate fixing jig 218 with an adhesive or the like, that is, with the V groove 110 facing downward.

  Further, the gantry 216 is provided with a parallel micrometer (position fine adjuster) 219 for fixing the jig rotation frame 217 at a predetermined angle. When the jig rotation frame 217 is rotated around the vertical axis 220 by the parallel micrometer 219, the substrate fixing jig 218 that fixes the laminated substrate 106 is rotated around the vertical axis 220. Here, the substrate fixing jig 218, the jig rotation frame 217, the mount 216, and the wheels 214 constitute the slider 210.

  In such a polishing jig 200, the laminated substrate 106 is fixed to the lower surface of the substrate fixing jig 218 so that the sliding surface (detection surface) 21a becomes the lower surface, and the substrate fixing jig 218 is fixed to the jig. Since the laminated substrate 106 is inserted into the opening 217h of the rotating frame 217 so as to face downward, the horizontal direction of the laminated substrate 106 and the wire 206 by the horizontal micrometer 205 (in FIGS. 7A and 7B). By finely adjusting the position in the left-right direction and parallel alignment of the extending direction of the V-groove 110 and the extending direction of the wire 206 by the parallel micrometer 219, as shown in FIG. The laminated substrate 106 and the wire 206 can be brought into contact with each other along the groove 110. At this time, the ridgelines 21i and 21j of the laminated substrate are respectively connected to the wire 206. On the other hand, the electrode pad 26 does not come into contact with the wire 206. Further, the laminated substrate 106 is pressed against the wire 206 with a predetermined load by the weight of the substrate fixing jig 218 and the laminated substrate 106. It becomes.

  Here, in order to efficiently contact the wire 206 and the ridge lines 21i and 21j, the diameter 2R of the wire 206 is preferably larger than the opening width W of the V groove 110, and is 2.0 to 4.0 times W. For example, it is preferable that it is 120-400 micrometers.

  In this state, the slider 210 is reciprocated in the direction of the arrow in FIG. 7, that is, in the extending direction of the wire 206 (the extending direction of the V groove 110).

  As a result, the ridge lines 21i and 21j are polished by the wire 206 to which the abrasive 230 is attached, and as shown in FIGS. 9 and 10, each of the ridge lines 21i and 21j is rounded, that is, chamfered by a curved surface. (R beveled).

  In addition, it is preferable that the area | region of the part which should be grind | polished in ridgeline 21i, 21j is set to the grade from which the grinding | polishing width D when the laminated substrate 106 is seen from the direction perpendicular | vertical to the surface is about 5-10 micrometers.

  Next, the laminated substrate 106 whose ridgelines 21i and 21j are polished in this way is cut along the alternate long and short dash line in FIG. 10, in other words, the laminated substrate 106 is cut in a direction perpendicular to the V-groove 110. 11 to obtain a laminated substrate 107 in which the sensor units 100 are arranged in a line. Then, the ridgeline 21k of the multilayer substrate 107 is polished by a known method, and then the multilayer substrate 107 is cut along the surface L in FIG. 11 and separated into each sensor unit 100, as shown in FIG. The magnetic sensor chip 21 is obtained.

  According to this embodiment, since the wire 206 to which the polishing material 230 is adhered is brought into contact with the ridgelines 21i and 21j in parallel and polished, the electrode pad 26 is not polished during this polishing. Furthermore, since the wires 206 arranged along the ridge lines 21i and 21j are translated with respect to the ridge lines 21i and 21j, the ridge lines 21i and 21j can be polished almost uniformly in the length direction.

  Further, the surface of the laminated substrate 106 has a large number of ridge lines 21i and 21j parallel to each other, and each wire 206 and the ridge lines 21i and 21j are in contact with each ridge line in parallel with each ridge line. Are relatively moved, so that a large number of ridgelines 21i, 21j of the laminated substrate 106 can be polished simultaneously, which is efficient.

  Further, since the groove is the V groove 110, the ridge lines 21i and 21j are obtuse from the beginning, and the polishing amount and the polishing time can be reduced, which is effective.

  Furthermore, since the laminated substrate 106 after polishing the ridge lines 21i and 21j is cut along the V-groove 110 to form the laminated substrate 107, there is an effect of suppressing chipping of the laminated substrate 107 at the time of cutting.

  In the above-described polishing, the polishing jig 200 in which a plurality of wires 206 are fixed in parallel to each other on the pedestal 204 and the abrasive 230 is attached to the wires 206 is used. It can be performed more uniformly.

  In particular, polishing is facilitated by the slider 210, and alignment of the V-shaped groove 110 and the wire 206 is facilitated by the parallel micrometer 219 and the horizontal micrometer 205.

  In addition, a large number of V grooves 110 are formed on the multilayer substrate 106 including the plurality of sensor units 100, and the ridge lines 21 i and 21 j are polished before the multilayer substrate 106 is separated into individual sensor units 100. Therefore, when the ridge lines 21i and 21j are polished after being separated into individual pieces, each sensor chip 21 must be fixed to the substrate fixing jig 218 or the like, whereas in this embodiment, the laminated substrates 106 are fixed together as a substrate. Since it only has to be fixed to the jig 218, it does not take time and effort. In particular, when the magnetic sensor chip 21 is small or when the height H is larger than the width W of the magnetic sensor chip 21, it is difficult to reliably fix the substrate to the substrate fixing jig 218 in the separated state. There is a higher probability that it will sometimes fall. Therefore, the effect by this embodiment is great.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation aspect is possible.

  For example, in the above embodiment, the polishing is performed using the polishing jig 200, but it goes without saying that the polishing may be performed using a polishing jig other than this.

  Moreover, in the said embodiment, although the ridgelines 21i and 21j are grind | polished simultaneously, even if grind | polishing one by one, implementation is possible.

  Further, in the above-described embodiment, the ridge lines 21i and 21j of the multilayer substrate are polished before the multilayer substrate is divided into magnetic sensor chips, but each ridge line is separated after the multilayer substrate 106 is separated into the magnetic sensor chip 21. Even if 21i and 21j are polished by the polishing jig 200 or the like, the embodiment can be implemented. Therefore, the sensor in the present application is a concept including a laminated substrate having a sensor portion and a sensor chip.

  In the above embodiment, the V-shaped groove 110 having a V-shaped cross section is used. However, the present invention can also be implemented using a rectangular groove having a rectangular cross section or a U-shaped groove having a U-shaped cross section.

  The magnetic sensor chip according to the above embodiment relates to a magnetic rotary encoder that detects the rotational displacement of the lens barrel of a single-lens reflex camera. However, the present invention is not limited to this, for example, the rotational displacement of any cylinder. The present invention can be applied to a magnetic rotary encoder for detection, and can also be applied to a linear magnetic encoder that detects linear displacement instead of rotational displacement.

  In the above-described embodiment, the sliding surface 21a of the magnetic sensor chip is directly in contact with the detection target. However, like the slider of the hard disk, the magnetic sensor chip 21a floats with a small distance from the detection target. It may be a thing.

  Moreover, in the said embodiment, although the magnetic sensor chip 21 using a magnetic detection element is illustrated as a detection element, it can implement also about sensors other than this. For example, a detection element such as a light detection element or an element that detects capacitance may be used.

1 is a perspective view of a single-lens reflex camera using a magnetic sensor chip according to an embodiment of the present invention, wherein (a) is an exploded perspective view schematically showing the configuration of the single-lens reflex camera, and (b) is an exploded perspective view of a lens mirror and the like. FIG. 4C is an exploded perspective view of the rear lens mirror and the like. It is a figure which shows the structure of the magnetic rotary encoder of (c) of FIG. 1 in detail, (a) is a perspective view of a magnetic rotary encoder, (b) is a perspective view of a sensor assembly, (c) is a front-end | tip of a sensor assembly. FIG. FIG. 3 is an explanatory diagram of the magnetic sensor chip of FIG. 2, (a) is a perspective view of the magnetic sensor chip, and (b) is an exploded perspective view of the magnetic sensor chip. It is the end elevation which looked at the magnetic sensor chip of Drawing 3 from IV direction. It is a figure explaining the manufacturing method of a magnetic sensor chip, (a) is a perspective view which shows the state in which many sensor parts were formed on the board | substrate, (b) is a perspective view which shows the laminated substrate which has a sensor part in a matrix form. FIG. It is a figure following FIG.5 (b) explaining the manufacturing method of a magnetic sensor chip. It is a figure which shows the grinding | polishing jig | tool used in manufacture of a magnetic sensor chip, (a) is a top view of a grinding | polishing jig, (b) is a side view of a grinding | polishing jig. It is sectional drawing in the wire vicinity of the grinding | polishing jig | tool of FIG.7 (b). It is a figure which shows the cross section of the laminated substrate after grinding | polishing with a grinding | polishing jig | tool. It is a perspective view of the laminated substrate after grinding | polishing with a grinding | polishing jig | tool. It is a perspective view which shows the state after further cut | disconnecting the laminated substrate of FIG. 10, and grind | polishing the ridgeline 21k.

Explanation of symbols

  17a ... magnetic recording medium (detection target), 21 ... magnetic sensor chip (sensor chip, sensor), 21a ... sliding surface (detection surface), 21i, 21j ... ridge line, 24 ... substrate, 25 ... magnetic detection element (detection element) , 26 ... Electrode pads, 29 ... Insulating coating layer (coating film), 30 ... Main body, 100 ... Sensor unit, 106 ... Multilayer substrate (sensor), 110 ... V groove, 200 ... Polishing jig, 204 ... Pedestal, 206 ... wire, 210 ... slider, 219 ... parallel micrometer (position fine adjuster), 230 ... abrasive.

Claims (16)

A main body having a detection surface to be opposed to the detection target, a detection element provided in the main body, and an electrode pad electrically connected to the detection element and provided on the detection surface; For a sensor comprising: a sensor polishing method for polishing a ridge line on the detection surface,
With the wire having an abrasive material attached to the surface in contact with the ridge line in parallel with the ridge line, the wire and the sensor are moved relative to each other in the extending direction of the wire to polish the ridge line. Sensor polishing method. The detection surface has two ridge lines parallel to each other,
Two wires are prepared, and the wires and the sensor are moved relative to each other in the direction in which the wires extend in a state where the wires are in contact with the ridge lines in parallel with the ridge lines. The method for polishing a sensor according to claim 1, wherein each of the ridge lines is polished.   The method for polishing a sensor according to claim 2, wherein, in the polishing, a plurality of wires are fixed on the pedestal in parallel with each other, and a polishing jig in which an abrasive is attached to the wires is used.   The main body is formed of a substrate and an insulating coating layer formed on one surface of the substrate, the detection element is formed on one surface of the substrate and covered with the insulating coating layer, and the electrode pads are The method for polishing a sensor according to claim 1, wherein the sensor is formed on the insulating coating layer, and a surface of the insulating coating layer is used as the detection surface.   The method for polishing a sensor according to claim 1, wherein the detection element is a magnetic detection element. A sensor chip manufacturing method for manufacturing a sensor chip by dividing a multilayer substrate in which a plurality of sensor portions are provided in a matrix in the row direction and the column direction,
The sensor unit includes a detection element provided in the multilayer substrate, and an electrode pad electrically connected to the detection element and provided on the surface of the multilayer substrate,
The manufacturing method of the sensor chip is as follows:
A groove forming step for forming parallel grooves extending from one end to the other end of the surface of the multilayer substrate so as to partition the sensor unit in either the row direction or the column direction;
Wires with abrasives attached to the surface are arranged along the grooves, and the wires are in contact with two ridge lines formed by the grooves and the surface of the laminated substrate. Then, a polishing step of polishing each ridge line of each groove by relatively moving each wire and the laminated substrate in a direction along the groove;
A dividing step of dividing the laminated substrate whose ridgeline is polished into individual sensor chips;
A method of manufacturing a sensor chip comprising:   The method of manufacturing a sensor chip according to claim 6, wherein the groove is a V-groove.   The method for manufacturing a sensor chip according to claim 7, wherein an angle formed by the two surfaces of the V-groove is 60 to 90 °.   The method of manufacturing a sensor chip according to claim 7 or 8, wherein a diameter of the wire is larger than an opening width of the V groove.   The method of manufacturing a sensor chip according to claim 9, wherein the diameter of the wire is 2.0 to 4.0 times the opening width of the V-groove.   The method for manufacturing a sensor chip according to claim 7, wherein in the dividing step, the laminated substrate is cut along the V groove.   The method for manufacturing a sensor chip according to claim 6, wherein in the polishing step, a polishing jig in which a plurality of the wires are fixed in parallel to each other on a pedestal is used.   The method of manufacturing a sensor chip according to claim 6, wherein the detection element is a magnetic detection element.   A polishing jig comprising: a pedestal; a plurality of wires fixed in parallel to each other on the pedestal; and an abrasive attached to the wires.   The object further comprising a slider that holds the object to be polished having a ridge line so that the ridge line abuts in parallel with the wire and is supported by the pedestal in a reciprocating manner along the wire. 14. The polishing jig according to 14.   The polishing jig according to claim 15, wherein the slider is provided with a position fine adjuster for performing parallel alignment between the ridge line of the object to be polished and the wire.

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