JP2006186157A - Assembling structure of electronic appliance - Google Patents

Assembling structure of electronic appliance Download PDF

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JP2006186157A
JP2006186157A JP2004379246A JP2004379246A JP2006186157A JP 2006186157 A JP2006186157 A JP 2006186157A JP 2004379246 A JP2004379246 A JP 2004379246A JP 2004379246 A JP2004379246 A JP 2004379246A JP 2006186157 A JP2006186157 A JP 2006186157A
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chassis
wiring board
cover
electronic appliance
shaped
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JP4512484B2 (en
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Daisaku Ota
大作 太田
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Sato Corp
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Sato Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an assembling structure of an electronic appliance wherein any new component is not required, and the attaching of its wiring board to its chassis is made possible by simple working processes, and further, any screw is not required to attach its wiring board and its cover to its chassis, and moreover, its assembling and its disassembling can be performed easily. <P>SOLUTION: In the assembling structure of an electronic appliance, a wiring board 24 is inserted into a chassis 32 from the upper side of the chassis 32, and the wiring board 24 is brought into such a state that the upper and lower presser pieces of the chassis 32 sandwich it between them from its upper and lower sides, and further, the wiring board 24 is held in the intermediate position of the chassis 32. Consequently, the interactive insulating property and heat radiating property (ventilating property) of electronic components 23 can be so secured as not to require also the increase of the number of necessary components and tools for assembling the electronic appliance. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、金属製のシャーシに配線基板を取り付けてカバーで施蓋するための電子機器の組立構造に関する。   The present invention relates to an electronic device assembly structure for attaching a wiring board to a metal chassis and covering with a cover.

ラベルプリンタやシール・ラベル等の自動貼付機、ラベル巻取機、シール剥離機などの電子機器は、マイクロコンピュータ等の集積回路が実装された配線基板を筐体内に収納して構成されている。この筐体は、シャーシとカバーとが組合わせられて構成されており、前記配線基板はシャーシにねじ止めなどによって取付けられている。   Electronic devices such as label printers, automatic stickers such as labels and labels, label winders, and seal peelers are configured by housing a wiring board on which an integrated circuit such as a microcomputer is mounted in a casing. The casing is configured by combining a chassis and a cover, and the wiring board is attached to the chassis by screws or the like.

図6は、典型的な従来技術の取付構造を説明するための断面図である。筐体1は、シャーシ2と蓋3とを組合わせて構成されている。シャーシ2の隅角部4には、押型を用いて図7で拡大して示すように絞り加工が施されて、架台5が形成されている。この架台5にはねじ孔5aが形成されており、該ねじ孔5aには配線基板7の隅角部6に形成された挿通孔8を挿通したねじ9が螺着される。こうして配線基板7は、その裏面7aに形成された配線パターンや、該裏面7aから突出した電子部品10の端子10aが、シャーシ2と接触することなく保持される。   FIG. 6 is a cross-sectional view for explaining a typical prior art mounting structure. The housing 1 is configured by combining a chassis 2 and a lid 3. The corner portion 4 of the chassis 2 is drawn by using a pressing die as shown in FIG. A screw hole 5 a is formed in the gantry 5, and a screw 9 inserted through an insertion hole 8 formed in the corner portion 6 of the wiring board 7 is screwed into the screw hole 5 a. In this way, the wiring board 7 holds the wiring pattern formed on the back surface 7 a and the terminal 10 a of the electronic component 10 protruding from the back surface 7 a without contacting the chassis 2.

図8は、他の従来技術の取付構造を説明するための断面図である。この従来技術では、筐体11を構成するシャーシ12の隅角部14には、挿通孔13が形成されており、この挿通孔13にはスペーサ15の取付ねじ16が挿通される。こうして図9で示されるようにシャーシ12に固定されたスペーサ15には、そのねじ孔15bに配線基板7の挿通孔8を挿通したねじ9が螺着され、配線基板7がシャーシ12に取付けられている。   FIG. 8 is a cross-sectional view for explaining another conventional mounting structure. In this prior art, an insertion hole 13 is formed in the corner portion 14 of the chassis 12 constituting the housing 11, and a mounting screw 16 of the spacer 15 is inserted into the insertion hole 13. As shown in FIG. 9, the spacer 15 fixed to the chassis 12 is screwed into the screw hole 15 b with the screw 9 inserted through the insertion hole 8 of the wiring board 7, and the wiring board 7 is attached to the chassis 12. ing.

そして、特許文献1には、新たな部品を必要とすることなく、かつ簡便な加工工程でシャーシへの配線基板の取付けを可能とするために、シャーシの打抜き形成時に同時に切欠きを形成し、シャーシの隅角部近傍に複数の折曲片を切起こして、配線基板を支持するためのねじ孔を設ける技術が紹介されている。   And in patent document 1, in order to enable attachment of a wiring board to a chassis in a simple processing process without requiring a new part, a notch is formed at the same time as the punching formation of the chassis, A technique has been introduced in which a plurality of bent pieces are cut and raised near the corners of the chassis to provide screw holes for supporting the wiring board.

実開平5−69984号公報Japanese Utility Model Publication No. 5-69984

ところが、上述した特許文献1に示される技術においても、シャーシへの配線基板の取付おYびカバーの取付にはねじを用いて行われるため、電子機器の組立工程においては大小寸法やピッチの異なる多種多様のねじを必要とする。   However, even in the technique disclosed in Patent Document 1 described above, the mounting of the wiring board to the chassis and the mounting of the cover are performed using screws. Requires a wide variety of screws.

このため、組立時には部品点数と組立工数が増え、修理などの分解時にはねじを紛失し易いという問題がある。そして、電子機器を最終的に廃棄する場合には、ねじを外して有価金属と有害廃棄物などに分別する必要があり、廃棄時においても解体に手間数を要するという問題がある。   For this reason, the number of parts and assembly man-hours increase at the time of an assembly, and there exists a problem that a screw is easy to lose at the time of disassembly, such as repair. When the electronic device is finally discarded, it is necessary to remove the screw and separate it into valuable metal and hazardous waste, and there is a problem that it takes time and effort to dismantle even at the time of disposal.

本発明は上記従来技術の問題に鑑み成されたものであって、新たな部品を必要とすることなく、かつ簡便な加工でシャーシへの配線基板の取付けを可能とするとともに、配線基板のシャーシへの取付やカバーの取付にねじ締めやカシメ加工を不要とし、組立および分解を容易に行えるようにした電子機器の組立構造を提供することを目的とする。   The present invention has been made in view of the above-described problems of the prior art, and enables the wiring board to be attached to the chassis without requiring new parts and by simple processing, and the chassis of the wiring board. It is an object of the present invention to provide an assembly structure of an electronic device that can be easily assembled and disassembled without requiring screw tightening or caulking for attachment to a cover or cover.

上記課題を解決するため、本発明の電子機器の組立構造が採用する構成の特徴は、四角箱状の金属製シャーシの四側面の中間位置に、各対向面毎の組となるように上下の向きを違えて「コ」字状の切り込みを形成し、中央の金属片をシャーシ中央側に向け曲げ加工および撓み変形させてばね性を付与した上部押さえ片および下部押さえ片を形成すること、前記四角箱状のシャーシの中央に配線基板を挿入し、前記上部押さえ片および下部押さえ片にて配線基板の周辺を上下から挟み支持すること、および前記シャーシ側面の切り込み部に係合する凸部を備えたカバーで施蓋することにある。   In order to solve the above problems, the structure of the electronic device assembly structure according to the present invention is characterized in that the upper and lower sides are arranged in pairs at the middle positions of the four side surfaces of the rectangular box-shaped metal chassis. Forming a U-shaped cut in a different direction, bending and bending the central metal piece toward the center of the chassis to form an upper holding piece and a lower holding piece with springiness, A wiring board is inserted into the center of the square box-shaped chassis, and the periphery of the wiring board is sandwiched and supported by the upper pressing piece and the lower pressing piece from above and below, and a convex part that engages with the notch on the side surface of the chassis. It is to cover with the provided cover.

また、上記凸部は、カバーを施蓋した状態において、少なくとも上部または押さえ片の一方をシャーシ中央方向へ押圧するようにできる。   Further, the convex part can press at least one of the upper part and the pressing piece toward the center of the chassis in a state where the cover is applied.

上記構成によれば、配線基板をシャーシの上部からはめ込むだけで各上部押さえ片および下部押さえ片にて上下から挟んだ状態としてシャーシの中間位置に保持できる。従って、電子部品相互間の絶縁や放熱性(通気性)を確保でき、組立に必要な部品点数も工具も増加を要しない。   According to the said structure, it can hold | maintain in the intermediate | middle position of a chassis as the state pinched | interposed from the upper and lower sides with each upper pressing piece and the lower holding piece only by inserting the wiring board from the upper part of a chassis. Therefore, insulation between electronic components and heat dissipation (breathability) can be secured, and the number of parts and tools required for assembly do not need to be increased.

一方、分解する際には、上部押さえ片の一つをシャーシの外方向に弾性変形させるだけで、上部押さえ片および下部押さえ片間の力のバランスが崩れ、配線基板は簡単に取り外すことができる。   On the other hand, when disassembling, the balance between the force between the upper pressing piece and the lower pressing piece is lost by simply elastically deforming one of the upper pressing pieces outwardly of the chassis, and the wiring board can be easily removed. .

また、カバーの凸部が、カバーを施蓋した状態において、少なくとも上部または下部押さえ片の一方をシャーシ中央方向へ押圧するようにすれば、配線基板を鞍型に変形させようとするストレスが緩和され、上部または下部押さえ片のすくなくともいずれかがシャーシ内側へと拡がるので、基板を支持する面積が拡がり安定した構造となる。   In addition, if the convex part of the cover presses at least one of the upper or lower pressing pieces toward the center of the chassis in the state where the cover is applied, the stress of deforming the wiring board into a bowl shape is alleviated. In addition, since at least one of the upper and lower pressing pieces expands toward the inside of the chassis, the area for supporting the substrate is expanded and a stable structure is obtained.

本発明によれば、配線基板およびシャーシへの孔開け加工、ねじやスペーサなど部品、ねじ締め工程やカシメ加工および工具等が省略でき、組立性およびリサイクル性(分解しやすさ)に優れた設計が可能となる。   According to the present invention, it is possible to omit the drilling process on the wiring board and the chassis, parts such as screws and spacers, the screw tightening process and the caulking process and the tool, and the design excellent in assemblability and recyclability (easiness of disassembly). Is possible.

以下、本発明の実施の形態について説明する。
図1は、本発明の一実施の形態を説明するための分解斜視図である。電子部品23が実装された配線基板24は、筐体31内に収納される。該筐体31は、大略的に、四角箱状のシャーシ32と、箱型のカバー33とを含んで構成されており、塑性変形可能な鉄やアルミなどの金属材料によって形成されている。そして、配線基板24を取り付けたシャーシ32にカバー33が施蓋され、シャーシ32の切り込み41,42にカバー33の凸部43、44を係合して一体化するようになっている。
Embodiments of the present invention will be described below.
FIG. 1 is an exploded perspective view for explaining an embodiment of the present invention. The wiring board 24 on which the electronic component 23 is mounted is housed in the housing 31. The casing 31 generally includes a rectangular box-shaped chassis 32 and a box-shaped cover 33, and is formed of a metal material such as iron or aluminum that can be plastically deformed. A cover 33 is applied to the chassis 32 to which the wiring board 24 is attached, and the protrusions 43 and 44 of the cover 33 are engaged with the notches 41 and 42 of the chassis 32 so as to be integrated.

図2はシャーシ32の展開図、図3ないし図5は配線基板のシャーシへの取付および取り外し方法の説明図である。   FIG. 2 is a development view of the chassis 32, and FIGS. 3 to 5 are explanatory views of a method of attaching and removing the wiring board to / from the chassis.

図2において、シャーシ32となる金属板34は、折り曲げ部位を点線で、切り離し部位を実線で示している。四側面となる部位の中間位置に、各対向面毎の組となるように、上下の向きを違えて「コ」字状の切り込み41,42が一組ずつ形成されている。そして、四角箱状のシャーシ32を形成した状態で、各切り込み41,42の中央の金属片がシャーシ32の中央側を向くように曲げ加工および撓み変形させてばね性を付与した上部押さえ片45および下部押さえ片46を形成する。   In FIG. 2, the metal plate 34 to be the chassis 32 has a bent part indicated by a dotted line and a cut-off part indicated by a solid line. A pair of “U” -shaped cuts 41 and 42 are formed at different positions on the four side surfaces so as to form a set for each opposed surface. Then, in the state in which the rectangular box-shaped chassis 32 is formed, the upper pressing piece 45 imparted with a spring property by bending and bending the metal piece at the center of each of the notches 41 and 42 so as to face the center side of the chassis 32. And the lower pressing piece 46 is formed.

次いで、図1に示すように、電子機器31を組み立てる。このとき、図3に示すように、配線基板24の周辺を、上部押さえ片45および下部押さえ片46にて上下から挟み支持するようになる。そして、シャーシ32側面の各切り込み部41,42にカバー33の凸部43,44を係合させて施蓋する構造となる。   Next, as shown in FIG. 1, the electronic device 31 is assembled. At this time, as shown in FIG. 3, the periphery of the wiring board 24 is sandwiched and supported by the upper pressing piece 45 and the lower pressing piece 46 from above and below. And it becomes a structure where the convex parts 43 and 44 of the cover 33 are engaged with each notch part 41 and 42 of the chassis 32 side surface, and it covers.

ここで、凸部43は、カバー33を施蓋した状態において、上部押さえ片45をシャーシ32の中央方向へ押圧するので、配線基板24に鞍型の歪み変形が加えられるのを緩和できるのと共に、配線基板24を支持する部分を拡大できる。   Here, since the convex portion 43 presses the upper pressing piece 45 toward the center of the chassis 32 in the state where the cover 33 is applied, it is possible to alleviate the saddle-shaped distortion deformation applied to the wiring board 24. The portion that supports the wiring board 24 can be enlarged.

一方、シャーシ32から配線基板24を取り出すには、図4に示すように、上部押さえ片45の一つをシャーシ32の外方向に弾性変形させることにより、上部押さえ片45同士および下部押さえ片46との間のバランスが崩れ、配線基板24は簡単に取り外すことができる(図5)。

以上のように本発明によれば、配線基板およびシャーシへの孔開け加工、ねじやスペーサなど部品、ねじ締め工程やカシメ加工および工具等が省略でき、組立性およびリサイクル性(分解しやすさ)に優れた設計が可能となる。

なお、上記実施の形態に示したのはあくまで例示であり、限定ではない。実施の形態は特許請求の範囲に記載した範囲内で自由に変形できることは言うまでもない。
On the other hand, in order to take out the wiring board 24 from the chassis 32, as shown in FIG. 4, one of the upper pressing pieces 45 is elastically deformed outward of the chassis 32, so The wiring board 24 can be easily removed (FIG. 5).

As described above, according to the present invention, it is possible to omit the drilling process for wiring boards and chassis, parts such as screws and spacers, screw tightening process, caulking process and tools, etc., and assembling and recyclability (easy to disassemble) This makes it possible to design excellently.

In addition, what was shown in the said embodiment is an illustration to the last, and is not limitation. Needless to say, the embodiments can be freely modified within the scope of the claims.

本発明の電子機器の組立構造を説明するための全体斜視図である。It is a whole perspective view for demonstrating the assembly structure of the electronic device of this invention. シャーシの展開図である。It is an expanded view of a chassis. シャーシと配線基板およびカバーの固定部位を示す拡大断面図である。It is an expanded sectional view which shows the fixing | fixed part of a chassis, a wiring board, and a cover. 配線基板の取り外し方法を示す説明図である。It is explanatory drawing which shows the removal method of a wiring board. 配線基板の取り外し方法を示す説明図である。It is explanatory drawing which shows the removal method of a wiring board. 従来技術による電子機器の配線基板をシャーシに取付ける構造を示す断面図である。It is sectional drawing which shows the structure which attaches the wiring board of the electronic device by a prior art to a chassis. 図8の要部を示す拡大斜視図である。It is an expansion perspective view which shows the principal part of FIG. 他の従来技術による電子機器の配線基板とシャーシの取付構造を示す断面図である。It is sectional drawing which shows the attachment structure of the wiring board and chassis of an electronic device by another prior art. 図8の要部を示す拡大斜視図である。It is an expansion perspective view which shows the principal part of FIG.

符号の説明Explanation of symbols

24…配線基板、32…シャーシ、33…カバー、41,42…切り込み、43,44…凸起、45…上部押さえ片、46…下部押さえ片

24 ... Wiring board, 32 ... Chassis, 33 ... Cover, 41, 42 ... Cut, 43, 44 ... Projection, 45 ... Upper pressing piece, 46 ... Lower pressing piece

Claims (2)

四角箱状の金属製シャーシの四側面の中間位置に、各対向面毎の組となるように上下の向きを違えて「コ」字状の切り込みを形成し、中央の金属片をシャーシ中央側に向け曲げ加工および撓み変形させてばね性を付与した上部押さえ片および下部押さえ片を形成すること、前記四角箱状のシャーシの中央に配線基板を挿入し、前記上部押さえ片および下部押さえ片にて配線基板の周辺を上下から挟み支持すること、および前記シャーシ側面の切り込み部に係合する凸部を備えたカバーで施蓋することを特徴とする電子機器の組立構造。   In the middle position of the four sides of the rectangular box-shaped metal chassis, a “U” -shaped cut is formed in a different shape so that each pair faces each other. Forming an upper presser piece and a lower presser piece that are bent and deformed toward the end to provide spring properties, inserting a wiring board into the center of the square box-shaped chassis, and An assembly structure of an electronic apparatus, wherein the periphery of the wiring board is sandwiched and supported from above and below, and the cover is covered with a cover provided with a convex portion that engages with the cut portion on the side surface of the chassis. 前記凸部は、カバーを施蓋した状態において、少なくとも上部または下部押さえ片の一方をシャーシ中央方向へ押圧することを特徴とする、請求項1に記載の電子機器の組立構造。
The electronic device assembly structure according to claim 1, wherein the convex portion presses at least one of the upper and lower pressing pieces toward the center of the chassis when the cover is applied.
JP2004379246A 2004-12-28 2004-12-28 Assembly structure of electronic equipment Expired - Fee Related JP4512484B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010046737A1 (en) * 2008-10-24 2010-04-29 Clipper Windpower, Inc. Printed circuit board packaging system
CN104509225A (en) * 2012-08-03 2015-04-08 三菱电机株式会社 Chassis assembly structure
CN111432582A (en) * 2020-03-03 2020-07-17 赵立燕 Heat dissipation protection device of electromechanical device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6390891U (en) * 1986-12-04 1988-06-13
JPS63106197U (en) * 1986-12-26 1988-07-08
JPH0383984U (en) * 1989-12-13 1991-08-26
JPH0621663A (en) * 1992-06-30 1994-01-28 Nec Kansai Ltd Housing structure of electronic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6390891U (en) * 1986-12-04 1988-06-13
JPS63106197U (en) * 1986-12-26 1988-07-08
JPH0383984U (en) * 1989-12-13 1991-08-26
JPH0621663A (en) * 1992-06-30 1994-01-28 Nec Kansai Ltd Housing structure of electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010046737A1 (en) * 2008-10-24 2010-04-29 Clipper Windpower, Inc. Printed circuit board packaging system
CN104509225A (en) * 2012-08-03 2015-04-08 三菱电机株式会社 Chassis assembly structure
CN104509225B (en) * 2012-08-03 2016-03-30 三菱电机株式会社 Bracket assembling structure
CN111432582A (en) * 2020-03-03 2020-07-17 赵立燕 Heat dissipation protection device of electromechanical device

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