JP2006172838A - Low thermal expansion linear body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low thermal expansion linear body of which the constitution is simpler, and which is less expensive. <P>SOLUTION: In the low thermal expansion linear body, a conductive linear body 1 of a positive coefficient of thermal expansion in which a groove 2 is formed in the length direction, and the linear body 3 which is inserted into the groove 2 and which has the lower positive coefficient of the thermal expansion than that of the conductive linear body of the positive coefficient of the thermal expansion or which has a negative coefficient of the thermal expansion are provided. Accordingly, the low thermal expansion linear body, which is simpler and more inexpensive, is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a low thermal expansion linear body.

Conventionally, the inventors of the present application can achieve a composite structure of a conductive material having a positive linear expansion characteristic and an organic material having a negative linear expansion characteristic as a low thermal expansion linear body, and can suppress thermal expansion as much as possible. A low thermal expansion linear body has been proposed (see Patent Document 1 below).
JP 2003-281942 A

  However, the conventional low thermal expansion linear body has a problem that it requires a device for its configuration and is inevitably expensive.

  In view of the above situation, an object of the present invention is to provide a low thermal expansion linear body that is simpler and less expensive.

In order to achieve the above object, the present invention provides
[1] In the low thermal expansion linear body, (a) a conductive linear body having a positive thermal expansion coefficient in which a groove is formed in the length direction, and (b) the positive thermal expansion coefficient disposed in the groove. A linear body having a positive low thermal expansion coefficient or a negative thermal expansion coefficient lower than that of the conductive linear body.

  [2] The low thermal expansion linear body according to [1], wherein a plurality of the grooves are formed, and the linear body is inserted into all of the plurality of grooves.

  [3] The low thermal expansion linear body according to [2], wherein the plurality of grooves are formed symmetrically with respect to a center line of the conductive linear body.

  [4] The low thermal expansion linear body according to [1], wherein the groove has a U-shape or a V-shape.

  [5] The low thermal expansion linear body according to [1] above, wherein a metal conductive material is formed on at least a part of the surface.

  [6] The low thermal expansion linear body according to [1], wherein the conductive linear body is a metal rod.

  [7] The low thermal expansion linear body according to the above [1], wherein the linear body in (b) is made of Zylon.

  [8] The low thermal expansion linear body according to [1], wherein the linear body in (b) is made of a dyneema.

  According to the present invention, the configuration of the low thermal expansion linear body can be simplified and the cost can be reduced.

  In addition, it is possible to push the fiber continuously into the groove formed in the conductive linear body having a positive thermal expansion coefficient from the outside, and keep pressing the fiber (yarn prepreg) in the groove at the time of bonding. It is possible to obtain a low thermal expansion linear body with improved adhesion and improved fiber density, and a conductive layer is secured on the surface while drawing out the effect of low thermal expansion. Can do.

  The low thermal expansion linear body of the present invention includes a conductive linear body having a positive thermal expansion coefficient in which a groove is formed in a length direction, and a conductive linear body having a positive thermal expansion coefficient that is inserted into the groove. A linear body having a lower positive low thermal expansion coefficient or a negative thermal expansion coefficient. Therefore, it is possible to provide a low thermal expansion linear body having a simpler configuration and lower cost.

  Hereinafter, embodiments of the present invention will be described in detail.

  FIG. 1 is an exploded perspective view of a low thermal expansion linear body according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a conductive linear body having a positive thermal expansion coefficient of the low thermal expansion linear body, and FIG. FIG. 4 is a perspective view of the low thermal expansion linear body.

  In these drawings, 1 is a conductive linear body (for example, a copper rod) having a positive thermal expansion coefficient, and 2 is a groove (here, four U-shaped grooves) formed in the conductive linear body 1. 3 is a rod-like linear member having a negative coefficient of thermal expansion (for example, Zyron, which is a PBO fiber manufactured by Toyobo Co., Ltd.). Usually, an adhesive is applied in the groove 2 and the linear body 3 is fixed by the adhesive. However, you may make it fix by strong fitting, without using an adhesive agent.

  In the above embodiment, a rod-shaped xylon is shown as the linear body 3 having a negative thermal expansion coefficient. However, instead of this, a yarn prepreg, a fiber wrapped around a sheet prepreg, or the like may be used.

  In FIG. 2, the diameter X of the copper rod 1 is 16.93 mm, the diameter Y of the copper rod 1 is 16.93 mm, the groove width is 5.18 to 5.25 mm, and the groove depth is 4.86 to 5. .56 mm, roundness R is 2.5 to 2.6.

  Further, when a plurality of grooves 2 are arranged in the above-described conductive linear body 1, it is symmetrical with respect to the center line of the conductive linear body 1 so as to improve the balance of heat shrinkage. It is desirable to form.

  In addition, as a new material of the linear body 3 having a negative linear expansion coefficient, ultrahigh molecular weight polyethylene fiber “Dyneema”, PBO fiber “Zylon”, and the like can be given.

In particular, xylon exhibits a negative expansion with a linear expansion coefficient of around -6 × 10 ^-6 / K near room temperature, and has characteristics such as high strength, high elastic modulus, high impact resistance, and low specific gravity. It is an organic material. Table 1 summarizes the characteristics of Zylon.

同様に負の線膨張係数を有するダイニーマと比べると、負の線膨張係数としては小さいが、引張強度、引張弾性率が大きく、分解温度も高いなどの特徴があり、応用を考えた場合には、より有用な材料と見ることができる。密度は１．５６ｇ／ｃｍ³ で、鋼線（スチール）の比重７．８ｇ／ｃｍ³ と比べて１／５程度と軽量である。

Similarly, compared with a dynea having a negative linear expansion coefficient, the negative linear expansion coefficient is small, but there are features such as high tensile strength, high tensile modulus of elasticity, and high decomposition temperature. Can be seen as a more useful material. Density is 1.56 g / cm ^3, a 1/5 degree and lighter than the specific gravity of 7.8 g / cm ³ of the steel wire (steel).

  In addition, as shown in FIG. 5, the groove | channel formed in a conductive linear body forms the one groove | channel 12 in the conductive linear body 11, and inserts the one linear body 13 there. It may be. Further, as shown in FIG. 6, two grooves 22 may be formed in the conductive linear body 21, and the two linear bodies 23 may be inserted therein. Also in the case of these two grooves 22, it is desirable to form them symmetrically with respect to the center line of the conductive linear body 21.

  In the above embodiment, the linear body having a negative thermal expansion coefficient has been described. However, the present invention is not limited thereto, and a linear body having a low thermal expansion coefficient may have a negative thermal expansion. It does not have to have a coefficient. Examples of such a linear body having a low coefficient of thermal expansion include metal bodies such as invar, carbon, and the like. However, it is a condition that the thermal expansion coefficient of the linear body having a low thermal expansion coefficient is smaller than the thermal expansion coefficient of the conductive linear body.

  Further, the shape of the groove may be V-shaped instead of U-shaped. Furthermore, you may form the groove | channel of other various shapes according to the objective. Moreover, even if it has a shape in which a gap is provided in a part of a conductive linear body such as copper and fibers (yarn prepreg) as a linear body having a negative thermal expansion coefficient can be continuously pushed in from there. Good.

  Further, when such a low thermal expansion linear body is used for a trolley wire, a metal conductive material is formed on at least the surface of the conductive linear body 1 so as to perform a sufficient current collecting function. It is important to.

  7 is a sectional view of a low thermal expansion linear body (part 1) showing another embodiment of the present invention, FIG. 8 is a sectional view of the low thermal expansion linear body (part 2), and FIG. 9 is a low thermal expansion linear body thereof. It is sectional drawing of a body (the 3).

  In this embodiment, as shown in FIG. 7, four U-shaped grooves 32 are formed in the conductive linear body 31, and yarn prepregs (linear with a negative thermal expansion coefficient) are formed in the four grooves 32. Body) 33 is filled to form a low thermal expansion linear body. In other words, a semi-cured yarn prepreg impregnated with an epoxy resin in a xylon fiber is filled into the four grooves 32 of the conductive linear body 31, and the epoxy resin impregnated in the yarn prepreg is heated and cured to form a composite. Turn into.

  Further, as shown in FIG. 8, one U-shaped groove 42 is formed in the conductive linear body 41, and a yarn prepreg (linear body having a negative thermal expansion coefficient) 43 is formed in the single groove 42. As shown in FIG. 9, two U-shaped grooves 52 are formed in the conductive linear body 51, and yarn prepregs (linear shapes having a negative thermal expansion coefficient) are formed in the two grooves 52. Body) 53 may be filled.

  Since it is configured in this way, it is possible to continuously and uniformly push the fiber (yarn prepreg) into the groove from the outside, and by making a structure that can keep pressing the fiber in the groove during bonding, It is possible to obtain a low thermal expansion linear body with improved adhesion and increased density of fibers having low thermal expansion characteristics, and a conductive layer can be secured on the surface while further exerting the effect of low thermal expansion.

  In addition, this invention is not limited to the said Example, Based on the meaning of this invention, a various deformation | transformation is possible and these are not excluded from the scope of the present invention.

  Since the low thermal expansion linear body of the present invention can suppress thermal expansion as much as possible, it is suitable for a trolley wire for supplying power to a railway vehicle.

It is a disassembled perspective view of the low thermal expansion linear body which shows the Example of this invention. It is sectional drawing of the electroconductive linear body of the positive thermal expansion coefficient of the low thermal expansion linear body which shows the Example of this invention. It is sectional drawing of the low thermal expansion linear body which shows the Example of this invention. It is a perspective view of the low thermal expansion linear body which shows the Example of this invention. It is a perspective view of the low thermal expansion linear body which inserted one linear body which shows the Example of this invention. It is a perspective view of the low thermal expansion linear body which inserted the two linear bodies which show the Example of this invention. It is sectional drawing of the low thermal expansion linear body (the 1) which shows the other Example of this invention. It is sectional drawing of the low thermal expansion linear body (the 2) which shows the other Example of this invention. It is sectional drawing of the low thermal expansion linear body (the 3) which shows the other Example of this invention.

Explanation of symbols

1,11,21,31,41,51 Conductive linear body with positive thermal expansion coefficient 2,12,22,32,42,52 Groove 3,13,23 Rod-shaped linear with negative thermal expansion coefficient Body 33, 43, 53 Yarn prepreg (Linear body with negative thermal expansion coefficient)

Claims (8)

(A) a conductive linear body having a positive coefficient of thermal expansion in which grooves are formed in the length direction;
(B) A low thermal expansion line comprising a linear body having a positive low thermal expansion coefficient or a negative thermal expansion coefficient which is disposed in the groove and lower than the conductive linear body having a positive thermal expansion coefficient. The state.   2. The low thermal expansion linear body according to claim 1, wherein a plurality of the grooves are formed, and the linear body is inserted into all of the plurality of grooves.   3. The low thermal expansion linear body according to claim 2, wherein the plurality of grooves are formed symmetrically with respect to a center line of the conductive linear body.   2. The low thermal expansion linear body according to claim 1, wherein the shape of the groove is U-shaped or V-shaped.   2. The low thermal expansion linear body according to claim 1, wherein a metal conductive material is formed on at least a part of the surface.   2. The low thermal expansion linear body according to claim 1, wherein the conductive linear body is a metal rod.   2. The low thermal expansion linear body according to claim 1, wherein the linear body in (b) is made of Zylon. 3.   2. The low thermal expansion linear body according to claim 1, wherein the linear body in (b) is made of Dyneema. 3.

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