JP2006165127A - Method for collecting component mounting information - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting information collecting device which can collect component mounting information which is required for a step for mounting components on a substrate, so as to easily analyze a problem occurring in the step for mounting components. <P>SOLUTION: The component mounting information device is used to collect component mounting information (logging information) which is required for a step for mounting components on a substrate. It is provided with a logging information colllector 84 which collect a logging information required for the mounting step for mounting parts on the substrate and a logging information storage 86 to store the collected logging information 86a. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounting information collecting method, and more particularly to a component mounting information collecting method related to a component mounting apparatus such as a bonding apparatus.

2. Description of the Related Art Conventionally, in a component mounting apparatus, there is a record of information about what kind of component is mounted at which position on which board (for example, see Patent Document 1). As a result, when a defect occurs in the substrate or the product after the inspection process of the substrate or the product shipment using the substrate, it is possible to identify the cause substrate or component. That is, so-called traceability was realized.
JP 2004-48044 A

  However, in the conventional traceability, it is only possible to trace the quality of the board or the component itself, and information on conditions and environment at the time of component mounting is not stored. For this reason, there is a problem that problems caused by mounting conditions, mounting environments, and the like, that is, problems that occur in the mounting process of components on the board cannot be easily analyzed. For example, when the mounting position of the component is shifted due to the displacement of the substrate positioning, it is difficult to determine the cause in the conventional traceability.

  The present invention has been made to solve the above-described problems, and component mounting information generated in the component mounting process on the substrate in order to easily analyze problems that occurred in the component mounting process on the substrate. An object of the present invention is to provide a component mounting information collecting method that can collect information.

  In order to achieve the above object, a component mounting information collecting method according to the present invention includes a component mounting information collecting step for collecting component mounting information generated in a component mounting process on a board by a component mounting apparatus, and the collected components. Storing the mounting information in a memory.

  According to this method, component mounting information generated in the mounting process on the board can be collected and stored in the memory. For this reason, by referring to the component mounting information stored in the memory afterwards, it is possible to easily analyze problems that occur in the component mounting process on the board.

  The component mounting information collecting method described above may further include a statistical analysis step for statistically analyzing the collected component mounting information.

  For example, if the average value of the measured values of the bonding head pressure is obtained and the average value and the set value of the bonding head pressure are significantly different, the cause of the abnormality in the bonding head pressure can be estimated. Can be done automatically.

  The present invention can be realized not only as a component mounting information collecting method including such characteristic steps, but also as a component mounting information collecting apparatus using the characteristic steps included in the component mounting information collecting method. Or as a program that causes a computer to execute the characteristic steps included in the component mounting information collection method. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM or a communication network such as the Internet.

  According to the present invention, there is provided a component mounting information collecting method capable of collecting component mounting information generated in a component mounting process on a substrate in order to easily analyze a problem occurring in the component mounting process on the substrate. can do.

  Hereinafter, a component mounting information collecting system according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an external view showing a configuration of a component mounting information collection system. The component mounting information collecting system 97 is a system for mounting components on a substrate and collecting component mounting information generated in the component mounting process on the substrate, and includes a bonding device 99 and a component mounting information collecting device 98. ing. The component mounting information collection device 98 is configured by a normal computer and a monitor device.

FIG. 2 is a side view showing an outline of the bonding apparatus.
A bonding apparatus 99 in the figure is an apparatus for mounting an electronic component A on a substrate B by ultrasonic vibration, and includes a bonding head 100 for applying vibration to the electronic component A, a bonding head mounting portion 101, and a bonding head 100. Is moved up and down to press the electronic component A held by the bonding head 100 against the substrate B, the substrate mounting unit 103 for mounting the substrate B, and the substrate mounting unit 103 together with the substrate B in the horizontal direction. An XY table 104 moved in the (xy direction), a camera 105 for recognizing the relative positional relationship between the board B and the electronic component A, and a camera drive unit 106 for moving the camera 105 in the horizontal direction (xy direction). A heater 108 for heating the bonding head 100 in order to promote the bonding between the electronic component A and the substrate B; And a thermocouple 109 for measuring the temperature of the bonding head 100 which is.

  In addition, the bonding apparatus 99 includes a control unit 110, a display unit 111 that displays a control state, a set value of control content, and the like, and an input unit 112 that inputs various data.

  The control unit 110 is a processing unit that comprehensively controls each device provided in the bonding apparatus 99, and is obtained from data stored in a storage element 204 described later and an input unit 112 that also functions as an amplitude setting unit. It also functions as a bonding condition setting means for setting the bonding condition from the amplitude value obtained.

  In addition, the bonding apparatus 99 includes a load cell (not shown) for measuring the pressure of the bonding head 100, a motor (not shown) for moving the bonding head 100, a substrate and a substrate attached to each component. An image recognition device (not shown) for recognizing the recognition mark and the component recognition mark and positioning the board and the component is provided.

FIG. 3 is a side view showing the bonding head 100 in detail.
The bonding head 100 shown in the figure is a component that holds the electronic component A and generates vibration to be applied to the electronic component A, and includes a bonding tool 201, a vibrator 202, a holding tool 203, and a storage element 204. I have.

  The bonding tool 201 is a tool that receives the vibration generated by the vibrator 202 and generates a standing wave inside. The bonding tool 201 applies vibration to the electronic component A between the substrate B and the electronic component A. Join. A contact hole 210 where the bonding tool 201 contacts the electronic component A is provided with a through hole 211 extending to the back side of the bonding tool 201. By connecting the through hole 211 to a vacuum system, the contact part 210 The electronic component A in contact with 210 is sucked.

  The vibrator 202 is made of a piezoelectric element or the like, and vibrates itself when a high frequency voltage is applied, and applies the vibration to the bonding tool 201.

  The holding tool 203 is bonded to a protruding mounting portion 212 provided integrally with the bonding tool 201 and holds the bonding tool 201. The holding tool 203 includes a holding projection 231 for detachably holding the mounting portion 101 provided in the bonding apparatus 99.

  The storage element 204 is a solid-state storage element that can read and write information such as a so-called flash memory, and is attached to the holding tool 203 via a heat insulating material. Further, the storage element 204 is provided with a lead wire 241 for exchanging information, and a detachable male connector 242 at the tip of the lead wire 241. The male connector 242 is connected to the female connector 120 included in the bonding apparatus 99 when the bonding head 100 is attached to the bonding apparatus 99, and establishes communication between the storage element 204 and the bonding apparatus 99. In addition, it is arbitrary to replace the male and female of the connector.

  4A and 4B are diagrams showing the bonding tool 201 in more detail. FIG. 4A is a side view of the bonding tool, and FIG. 4B is a view of the bonding tool 201 viewed from the contact portion 210 side. Further, (c) is a graph schematically showing a vibration wave generated in the bonding tool 201 in correspondence with the positional relationship of the bonding tool 201 shown in (b).

  As shown in FIG. 4B, the bonding tool 201 is integrally provided with a thin plate-like bridge plate 213 at a portion corresponding to a node C of a standing wave of vibration generated inside. Further, a projecting mounting portion 212 is integrally provided at the tip of the bridging plate 213. Then, by attaching the holding tool 203 to the protruding attachment portion 212 with a screw, even if the bonding tool 201 vibrates, the holding tool 203 can hold the bonding tool 201 with almost no vibration.

FIG. 5 is a view showing another embodiment of the bonding head 100.
In the figure, a bonding head 100 is configured such that a bonding nozzle 702 is detachable with a screw in order to make the wearable contact portion 210 replaceable. 702, a vibrator 202, a holding tool 203, and a storage element 204 are provided. Further, the storage element 204 includes a second storage element 243 that is detachable from the holding tool 203.

Note that description of the same components as those of the above-described bonding head 100 is omitted.
The bonding horn 701 is a component that receives a vibration from the vibrator 202 and generates a standing wave of vibration inside.

  The bonding nozzle 702 is a part as a contact part that is detachable from the bonding horn 701 as described above, and a screw hole 703 for attachment and detachment is provided at the center, and is communicated with the screw hole 703 and vacuum suctioned. A through hole 704 is provided.

  The male screw that joins the bonding horn 701 and the bonding nozzle 702 has a cylindrical shape with one end closed to connect the through hole 704 and a vacuum hole (not shown) provided in the bonding horn 701. Furthermore, the peripheral wall is provided with a communication hole that communicates the internal space with the outside.

  The storage element 204 includes a first storage element 244 fixed to the holding tool 203 and a second storage element 243 that is detachable from the holding tool 203 and can be connected to the first storage element 244. The second storage element 243 can store data related to the detachable bonding nozzle 702.

FIG. 6 is a functional block diagram of the component mounting information collection device 98.
The component mounting information collection device 98 is a device that collects component mounting information generated in the component mounting process on the substrate by the bonding device 99, and includes a logging information setting unit 82, a logging information collection unit 84, and a logging information storage unit 86. And a logging information analysis unit 88.

  The logging information setting unit 82 is a processing unit that receives the type of component mounting information (hereinafter referred to as “logging information”) that is a collection target input by the user. The logging information collection unit 84 is a processing unit that collects the logging information collected by the logging information setting unit 82 from the bonding apparatus 99. The logging information storage unit 86 is a storage device that stores the logging information 86 a collected by the logging information collection unit 84. The logging information analysis unit 88 is a processing unit that analyzes the logging information 86a by performing various statistical processes such as obtaining an average value and obtaining a variance for the logging information 86a.

  FIG. 7 is a flowchart of the component mounting information collection process performed by the component mounting information collection device 98. The logging information setting unit 82 receives the type of logging information to be collected input by the user using the keyboard or mouse of the component mounting information collection device 98, and sets it as logging information to be collected (S2).

  Specifically, a logging information setting screen 70 as shown in FIG. 8 is displayed on the monitor device of the component mounting information collection device 98. The logging information setting screen 70 shows a list of logging information that can be selected as a collection target. The user can select a check box 70a corresponding to what he wants to collect as logging information from the displayed list of logging information. Add a check. For example, in FIG. 7, “mounting condition” is a collection target of logging information, and among the “mounting condition”, “head position”, “head pressure”, “head temperature”, and “impedance” are collected. It is indicated that “head humidity” is not a collection target.

  Next, the logging information collection unit 84 collects the logging information set as the collection target set in the logging information setting process (S2 in FIG. 6) from the bonding apparatus 99 (S4). The logging information collection unit 84 stores the collected logging information 86a in the logging information storage unit 86.

  FIG. 9 is a diagram illustrating an example of collected logging information 86a. Here, the following 11 pieces of logging information are collected as the logging information 86a.

1. Mounting board number 2. Component mounting position Mounted component name Mounting conditions Mounting profile Recognition result (board)
7). Recognition result (parts)
8). Correction amount (substrate)
9. Correction amount (parts)
10. Ultrasonic profile 11. The number of times the tool is used The fourth mounting condition is roughly divided into the following four.

4-1. Head position 4-2. Head pressure 4-3. Head temperature 4-4. Impedance Further, the fifth mounting profile is roughly divided into the following three.

5-1. Head position 5-2. Head pressure 5-3. Head temperature Each logging information will be described in detail below.

1. Mounted board number Indicates the number of the board on which the component is mounted (such as 387059H52).

2. Component mounting position Indicates a number (M001 or the like) associated with a position where a component is mounted.

3. Mounted component name Indicates the type name (A, B, C, etc.) of the component mounted on the board.

4). Mounting conditions Indicates the set value or target value for component mounting, and is provided for each type of component.

4-1. Head position A set value of the position of the bonding head 100 is shown.

4-2. Head pressure A set value of the pressure of the bonding head 100 is shown.

4-3. Head temperature A set value of the temperature of the bonding head 100 is shown.

4-4. Impedance Indicates the amplitude of ultrasonic waves when the parts are ultrasonically bonded by the bonding head 100, and the voltage, current, voltage, and the like of the bonding head 100.

5. Mounting profile Shows the measured values related to component mounting and is measured for each component.

5-1. Head position A time change of a value indicating a position of the bonding head 100 at the time of component mounting is shown. A value indicating the position of the bonding head 100 can be measured from an encoder output of a motor for moving the bonding head 100.

5-2. Head pressure The time change of the pressure of the bonding head 100 at the time of component mounting is shown. The pressure of the bonding head 100 can be measured from the output of the load cell that measures the pressure of the bonding head 100.

5-3. Head temperature The time change of the temperature of the bonding head 100 at the time of component mounting is shown. The temperature of the bonding head 100 can be measured by the thermocouple 109.

6). Recognition result (board)
An image including a substrate recognition mark 72 attached to the substrate for positioning the substrate and a substrate recognition position mark 74 indicating a recognition result of image recognition of the substrate recognition mark 72 is shown.

7). Recognition result (parts)
An image including a component recognition mark 62 attached to a component for positioning the component and a component recognition position mark 64 indicating a recognition result of image recognition of the component recognition mark 62 is shown.

8). Correction amount (substrate)
The offset value of the component mounting position obtained based on the board recognition position mark 74 is shown. Component mounting is performed in consideration of the offset value.

9. Correction amount (parts)
The offset value of the mounting position of the component obtained based on the component recognition position mark 64 is shown. Component mounting is performed in consideration of the offset value.

10. Ultrasonic Profile Shows the time change of impedance, the amplitude of ultrasonic waves, the voltage, current, and voltage of the bonding head 100 when ultrasonic bonding of components by the bonding head 100 is performed.

11. Tool usage count Indicates the number of times the bonding head 100 is used.

As described above, roughly 11 types of logging information are collected.
For example, the substrate recognition mark 72 and the substrate recognition position mark 74 in the “recognition result (substrate)” match, but the substrate recognition mark 75 and the substrate recognition position mark 76 do not match. This is because the image recognition has failed because the substrate recognition mark 75 is missing.

  Further, the component recognition mark 62 and the component recognition position mark 64 in the “recognition result (component)” match, but the component recognition mark 66 and the component recognition position mark 68 do not match. This is because image recognition failed because the component recognition mark 66 was darkly imaged due to the influence of shading when the component recognition mark 66 was imaged.

  Furthermore, the bonding head 100 deteriorates and the bonding quality changes every time mounting is repeated. For this reason, it is possible to examine whether or not there is an abnormality in the joining quality by examining the “number of times the tool is used”.

  Such cause pursuit can be performed afterwards by referring to various values of the logging information 86a.

  Finally, the logging information analysis unit 88 performs analysis by applying predetermined statistical processing to various values of 86a (S6 in FIG. 7). For example, an average value of actually measured pressure values of the bonding head 100 is obtained, and if the average value and the set pressure value of the bonding head 100 are significantly different, the cause of the abnormality in the pressure of the bonding head 100 Estimation can be done afterwards.

  As described above, according to the present embodiment, the cause of the failure can be determined by examining the logging information afterwards. For example, a defect can be investigated by comparing the mounting conditions described above with a mounting profile. Further, by collecting the logging information in real time, if it is greatly different from the logging information collected so far, it is possible to perform processing such as issuing a warning or stopping the equipment.

  The component mounting information collection system according to the embodiment of the present invention has been described above, but the present invention is not limited to this embodiment.

  For example, values indicating the environment in which the bonding apparatus is placed may be collected as logging information. For example, the room temperature, the room humidity, the mounting time, etc. at the time of component mounting may be collected. It is also possible to collect information such as the degree of cleanness of the ambient air at the time of component mounting, information for identifying the tray pocket from which the component was removed, and information for identifying the position of the wafer from which the component was removed. good.

  The present invention can be applied to a component mounting information collecting apparatus in a component mounting apparatus, and in particular, can be applied to a component mounting information collecting apparatus that collects component mounting information related to a component mounting apparatus such as a bonding apparatus.

It is an external view which shows the structure of a component mounting information collection system. It is a side view which shows the outline | summary of a bonding apparatus. It is a side view which shows a bonding head in detail. It is a figure which shows a bonding tool in detail, (a) is a side view of a bonding tool, (b) is the figure which looked at the bonding tool from the contact part side. Further, (c) is a graph schematically showing the vibration wave generated in the bonding tool in correspondence with the positional relationship of the bonding tool shown in (b). It is a figure which shows other embodiment of a bonding head. It is a functional block diagram of a component mounting information collection device. It is a flowchart of the component mounting information collection process which a component mounting information collection apparatus performs. It is a figure which shows an example of a logging information setting screen. It is a figure which shows an example of the collected logging information.

Explanation of symbols

62, 66 Parts recognition mark 64, 68 Parts recognition position mark 70a Check box 70 Logging information setting screen 72, 75 Board recognition mark 74, 76 Board recognition position mark 82 Logging information setting section 84 Logging information collection section 86 Logging information storage section 86a Logging information 88 Logging information analysis unit 97 Component mounting information collecting system 98 Component mounting information collecting device 99 Bonding device 100 Bonding head 101 Mounting portion 102 Lifting press mechanism 103 Substrate placing portion 104 XY table 105 Camera 106 Camera driving portion 108 Heater 109 Thermoelectric Pair 110 Control unit 111 Display unit 112 Input unit 120 Female connector 201 Bonding tool 202 Vibrator 203 Holding tool 204 Storage element 210 Contact portion 211 Through hole 212 Projection Mounting portion 213 Cross-linking plate 231 Holding projection 241 Lead wire 242 Male connector 243 Second memory element 244 First memory element 701 Bonding horn 702 Bonding nozzle 703 Screw hole 704 Through hole

Claims (10)

A component mounting information collection method,
A component mounting information collection step for collecting component mounting information generated in a component mounting process on a substrate by a component mounting apparatus;
And a storage step for storing the collected component mounting information in a memory. The component mounting information collecting method according to claim 1, wherein in the component mounting information collecting step, the component mounting information is collected by measuring a state of a bonding head when the component is mounted. The component mounting information includes the board number, the mounting position of the component, the component name of the component, the mounting condition of the component, a predetermined measured value at the time of mounting the component, and the board for positioning the board. An image including a board recognition mark attached and a recognition position of the board recognition mark, an image including a part recognition mark attached to the part for positioning the part and a recognition position of the part recognition mark, and the board recognition mark Correction amount for board positioning based on the recognition result of the component, correction amount for component positioning based on the recognition result of the component recognition mark, cleanliness of the ambient air at the time of mounting the component, the component was taken out It includes at least one of information for specifying the tray pocket and information for specifying the position of the wafer from which the part is taken out. The component mounting information collecting method according to claim 1, wherein the component mounting information is collected. The mounting conditions of the component include a head position setting value, a head pressure setting value, a head temperature setting value, a head ultrasonic amplitude value, a head voltage value, and a head used when mounting the component. 4. The component mounting information collecting method according to claim 3, wherein at least one of the current value and the power value of the head is included. The predetermined actual measurement value when mounting the component includes an actual measurement value of the head position of the bonding head used when mounting the component, an actual measurement value of the head pressure, an actual measurement value of the head temperature, an actual measurement value of the impedance, and a voltage value of the head. 5. The component mounting information collecting method according to claim 3, wherein at least one of a current value of the head and a power value of the head is included. Furthermore, a collection target information receiving step for receiving the type of component mounting information to be collected is included,
The component mounting information collecting method according to claim 1, wherein in the component information collecting step, the component mounting information of the type received in the collection target information receiving step is collected. The component mounting information collecting method according to claim 1, further comprising a statistical analysis step of statistically analyzing the collected component mounting information. A component mounting information collection program that collects component mounting information generated in a component mounting process on a board,
A component mounting information collecting program that causes a computer to execute the steps described in the component mounting information collecting method according to any one of claims 1 to 7. A computer-readable recording medium recording a component mounting information collection program for collecting component mounting information generated in a component mounting process on a board,
A computer-readable recording medium in which the component mounting information collecting program according to claim 8 is recorded. A component mounting information collection device,
Component mounting information collecting means for collecting component mounting information generated in a component mounting process on a board by a component mounting apparatus;
A component mounting information collecting apparatus comprising: storage means for storing the collected component mounting information.

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